JP2001068738A - Semiconductor light-emitting device - Google Patents
Semiconductor light-emitting deviceInfo
- Publication number
- JP2001068738A JP2001068738A JP23683299A JP23683299A JP2001068738A JP 2001068738 A JP2001068738 A JP 2001068738A JP 23683299 A JP23683299 A JP 23683299A JP 23683299 A JP23683299 A JP 23683299A JP 2001068738 A JP2001068738 A JP 2001068738A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- light emitting
- emitting semiconductor
- circuit board
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Led Device Packages (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、回路基板に形成さ
れた貫通孔に投光部を位置させて回路基板に装着する発
光半導体装置に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting semiconductor device mounted on a circuit board with a light projecting portion positioned in a through hole formed in the circuit board.
【０００２】[0002]
【従来の技術】発光半導体装置は、典型的には図６（平
面図）および図７（図６のＡーＡ断面図）に示す発光素
子をセラミック基板に搭載するもの（以下、基板型とい
う。）と、図９（平面図）および図１０（図９のＢーＢ
断面図）に示す発光素子をエポキシ樹脂などでモールド
したもの（以下、モールド型という。）とある。図６お
よび図７に示す基板型の発光半導体装置は、基板１の長
手方向両側に分けてその表面中央部から端部側面および
裏面にまたがって電極２および３が形成されており、一
方の電極２の表面中央部側の端部に発光素子４の一方の
電極が接続固定（ダイボンド）され、他方の電極３の表
面中央部側の端部と発光素子４の他方の電極とがワイヤ
（導線）５により電気的に接続されている。2. Description of the Related Art A light emitting semiconductor device typically has a light emitting element shown in FIG. 6 (plan view) and FIG. 7 (a sectional view taken along line AA of FIG. 6) mounted on a ceramic substrate (hereinafter referred to as a substrate type). ), FIG. 9 (plan view) and FIG. 10 (BB of FIG. 9).
(A cross-sectional view) molded from an epoxy resin or the like (hereinafter, referred to as a mold type). In the substrate-type light emitting semiconductor device shown in FIGS. 6 and 7, electrodes 2 and 3 are formed on both sides in the longitudinal direction of the substrate 1 so as to extend from the center of the front surface to the end side surface and the back surface. One electrode of the light-emitting element 4 is connected and fixed (die-bonded) to an end of the light-emitting element 4 at the center of the surface of the light-emitting element 2. 5) are electrically connected.
【０００３】そして、発光素子４の周囲には、発光素子
４が発する光を図示の上方に向けて投光するように反射
体６が設置されている。反射体６で囲まれ発光素子４が
位置する空間には透明のエポキシ樹脂７が充填されてい
る。基板１に形成された各電極２および３は、発光素子
４、反射体６および透明の樹脂層７からなる投光部８か
ら延出されており、延出された電極部は回路基板に装着
する際のはんだ付け部となる。A reflector 6 is provided around the light emitting element 4 so as to project the light emitted from the light emitting element 4 upward in the figure. A space surrounded by the reflector 6 and in which the light emitting element 4 is located is filled with a transparent epoxy resin 7. Each of the electrodes 2 and 3 formed on the substrate 1 extends from a light projecting portion 8 composed of a light emitting element 4, a reflector 6, and a transparent resin layer 7, and the extended electrode portion is mounted on a circuit board. It becomes a soldering part when performing.
【０００４】また、図９および図１０に示すモールド型
の発光半導体装置は、一対のリード（電気引込線）１２
および１３の一方のリード１２の一端部表面に発光素子
４の一方の電極が接続固定（ダイボンド）され、他方の
リード１３の一端部表面に発光素子４の他方の電極とが
ワイヤ（導線）５により電気的に接続されている。そし
て発光素子４の周りは透明のエポキシ樹脂１４でモール
ドされている。モールド体１４の図示の上面には上方に
向けて投光する光が集光するようにレンズ部、つまり投
光部１５とされている。各リード１２および１３の他端
はこのモールド体１４から延出されており、延出された
リード部は回路基板に装着する際のはんだ付け部とな
る。[0004] The mold type light emitting semiconductor device shown in FIGS. 9 and 10 has a pair of leads (electric leads) 12.
One electrode of the light emitting element 4 is connected and fixed (die-bonded) to one end surface of one lead 12 of the other lead 13, and a wire (conductor) 5 is connected to the other electrode of the light emitting element 4 to one end surface of the other lead 13. Are electrically connected to each other. The periphery of the light emitting element 4 is molded with a transparent epoxy resin 14. A lens portion, that is, a light projecting portion 15 is formed on the upper surface of the mold body 14 in the drawing so that light projected upward is collected. The other ends of the leads 12 and 13 extend from the molded body 14, and the extended lead portions serve as soldering portions when mounted on a circuit board.
【０００５】ところで、以上のように構成された発光半
導体装置は、回路基板に装着するに際し、回路基板にた
とえば光点の配列を考慮した複数の貫通孔を形成し、各
貫通孔毎に発光半導体装置の投光部を位置させ、発光半
導体装置自体は回路基板の裏面に装着する場合がある。
この場合、基板型の発光半導体装置にあっては、図８に
示すように回路基板１６に形成した貫通孔１６ａに発光
半導体装置の投光部８を位置させ、回路基板１６の導体
回路１７に連接するはんだパターン部に予めはんだを設
けたはんだ層１８に発光半導体装置の基板１に形成され
ている電極２および３を当接させ、リフロー装置などで
はんだ層１８を溶かして接続固定するようにしている。In the light emitting semiconductor device configured as described above, a plurality of through holes are formed in the circuit board in consideration of the arrangement of light spots, for example, when the light emitting semiconductor device is mounted on the circuit board. There is a case where the light emitting portion of the device is positioned and the light emitting semiconductor device itself is mounted on the back surface of the circuit board.
In this case, in the case of the substrate type light emitting semiconductor device, the light projecting portion 8 of the light emitting semiconductor device is positioned in the through hole 16a formed in the circuit board 16 as shown in FIG. The electrodes 2 and 3 formed on the substrate 1 of the light emitting semiconductor device are brought into contact with the solder layer 18 provided with solder in advance on the solder pattern portion to be connected, and the solder layer 18 is melted and fixed by a reflow device or the like. ing.
【０００６】また、モールド型の発光半導体装置におい
ても、図１１に示すように回路基板１６に形成した貫通
孔１６ａに発光半導体装置の投光部１５を位置させ、回
路基板１６の導体回路１７に連接するはんだランド部に
予めはんだを設けたはんだ層１８の上に発光半導体装置
のリード１２および１３を当接させ、リフロー装置など
ではんだ１８を溶かして接続固定するようにしている。In the light emitting semiconductor device of a mold type as well, the light projecting portion 15 of the light emitting semiconductor device is positioned in a through hole 16a formed in the circuit board 16 as shown in FIG. The leads 12 and 13 of the light emitting semiconductor device are brought into contact with the solder layer 18 on which solder is previously provided on the connected solder lands, and the solder 18 is melted and fixed by a reflow device or the like.
【０００７】[0007]
【発明が解決しようとする課題】ところで、製品の製造
工程などの都合により、回路基板の裏面に発光半導体装
置を装着する場合でも、はんだ付けをディップはんだ付
けあるいはフローはんだ付けで行ないたいという要望が
ある。このようなはんだ付けでは発光半導体装置の電極
やリードのはんだ付け部を回路基板のはんだランド部に
位置決めし、はんだ付けが終わるまでその位置を回路基
板上で保持する必要がある。しかし、上記の従来の発光
半導体装置ではこの位置を保持することが極めて困難で
あるという問題がある。By the way, even when a light emitting semiconductor device is mounted on the back surface of a circuit board due to the manufacturing process of a product or the like, there is a demand that the soldering be performed by dip soldering or flow soldering. is there. In such soldering, it is necessary to position the soldered portions of the electrodes and leads of the light emitting semiconductor device on the solder lands of the circuit board, and hold the positions on the circuit board until the soldering is completed. However, there is a problem that it is extremely difficult to maintain this position in the above-described conventional light emitting semiconductor device.
【０００８】本発明は、このような問題に鑑みなされた
もので、回路基板の裏面に発光半導体装置を装着する場
合においても、リフローはんだ付けはもとよりディップ
はんだ付けあるいはフローはんだ付けを容易に行なうこ
とのできる発光半導体装置を提供することを目的とす
る。SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and is intended to facilitate not only reflow soldering but also dip soldering or flow soldering even when a light emitting semiconductor device is mounted on the back surface of a circuit board. It is an object of the present invention to provide a light emitting semiconductor device capable of performing the following.
【０００９】[0009]
【課題を解決するための手段】請求項１に係る本発明
は、回路基板に形成された貫通孔に投光部を位置させて
前記回路基板に装着される発光半導体装置において、前
記発光半導体装置に前記回路基板に仮止めする仮止め用
の突部を設けたことを特徴とする。According to a first aspect of the present invention, there is provided a light emitting semiconductor device mounted on a circuit board with a light projecting portion positioned in a through hole formed in the circuit board. And a projection for temporary fixing is provided on the circuit board.
【００１０】請求項２に係る本発明は、発光半導体装置
が基板型である場合に、その基板に仮止め用の突部を形
成することを特徴とし、請求項３に係る本発明は、発光
半導体装置がモールド型である場合に、仮止め用の突部
をモールド体に一端を埋設し、他端が前記モールド体か
ら延出する金属片で形成することを特徴とする。According to a second aspect of the present invention, when the light-emitting semiconductor device is of a substrate type, a projection for temporary fixing is formed on the substrate. In the case where the semiconductor device is a mold type, the protrusion for temporary fixing is formed such that one end is embedded in the mold body and the other end is formed of a metal piece extending from the mold body.
【００１１】本発明では、発光半導体装置に仮止め用の
突部を設けているので、発光半導体装置を回路基板に装
着する場合には、この突部を利用して回路基板の所定の
位置に接着剤などで固定することができ、この固定によ
ってディップはんだ付けあるいはフローはんだ付けに際
してもはんだ付けが終わるまで発光半導体装置の電極や
リードのはんだ付け部を回路基板のはんだランド部に位
置決め保持することが可能になる。In the present invention, since the light-emitting semiconductor device is provided with a projection for temporary fixing, when the light-emitting semiconductor device is mounted on the circuit board, the projection is used to place the light-emitting semiconductor device at a predetermined position on the circuit board. It can be fixed with an adhesive etc., and by this fixing, even when dip soldering or flow soldering, the soldering part of the electrodes and leads of the light emitting semiconductor device is positioned and held on the solder land part of the circuit board until soldering is completed Becomes possible.
【００１２】[0012]
【発明の実施の形態】以下、図１ないし図５を参照して
本発明に係る実施形態について説明する。図１は一実施
形態に係る発光半導体装置の回路基板への装着を示す斜
視図、図２は図１に示す発光半導体装置の平面図、図３
は他の実施形態に係る発光半導体装置の回路基板への装
着を示す斜視図、図４は図３に示す発光半導体装置の平
面図、図５は図４のＣーＣ断面図である。なお、図７な
いし図１１に示すものと同一部分および対応する部分に
は同一の符号を付している。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment according to the present invention will be described below with reference to FIGS. FIG. 1 is a perspective view showing a light emitting semiconductor device according to one embodiment mounted on a circuit board, FIG. 2 is a plan view of the light emitting semiconductor device shown in FIG.
FIG. 4 is a perspective view showing a light emitting semiconductor device according to another embodiment mounted on a circuit board, FIG. 4 is a plan view of the light emitting semiconductor device shown in FIG. 3, and FIG. 5 is a cross-sectional view taken along line CC of FIG. The same parts as those shown in FIGS. 7 to 11 and corresponding parts are denoted by the same reference numerals.
【００１３】図１および図２において、９は一実施形態
の発光半導体装置で、１は基板、２および３は電極、８
は投光部であり、電極２および３並びに投光部８は、図
７に示すものと同様に構成されている。基板１には、長
手方向の中央部の両側に弧状（矩形状であってもよ
い。）に張り出した突出部１ａが一体的に形成されてい
る。突出部１ａは、回路基板１６に装着する際の仮止め
固定部となる。In FIGS. 1 and 2, reference numeral 9 denotes a light emitting semiconductor device according to an embodiment, 1 denotes a substrate, 2 and 3 denote electrodes,
Denotes a light projecting unit, and the electrodes 2 and 3 and the light projecting unit 8 are configured similarly to those shown in FIG. The substrate 1 is integrally formed with protruding portions 1a that protrude in an arc shape (may be rectangular shape) on both sides of a central portion in the longitudinal direction. The protruding portion 1a serves as a temporary fixing portion when mounted on the circuit board 16.
【００１４】すなわち、発光半導体装置９を回路基板１
６に形成された貫通孔１６ａに投光部８を位置させて、
発光半導体装置９自体を回路基板１６の裏面に装着する
場合に回路基板１６の所定の位置、つまり発光半導体装
置９を図示しない吸引チャックなどのマウンタにより発
光半導体装置９の電極２および３を回路基板１６のはん
だランド部１８ａに合わせて搭載するとき、突出部１ａ
の表面と対向する回路基板１６の位置に接着剤１９を塗
布しておき、その接着力によって発光半導体装置９を回
路基板１６に仮止め固定する。この固定によりディップ
はんだ付けあるいはフローはんだ付けに際しても発光半
導体装置９の位置ずれを防止することができる。That is, the light emitting semiconductor device 9 is mounted on the circuit board 1.
6, the light projecting portion 8 is positioned in the through hole 16a formed in
When the light-emitting semiconductor device 9 itself is mounted on the back surface of the circuit board 16, the electrodes 2 and 3 of the light-emitting semiconductor device 9 are mounted on a predetermined position of the circuit board 16, that is, a mounter such as a suction chuck (not shown). When mounting along the 16 solder land portions 18a, the protrusions 1a
An adhesive 19 is applied to the position of the circuit board 16 facing the surface of the light emitting device, and the light emitting semiconductor device 9 is temporarily fixed to the circuit board 16 by the adhesive force. This fixation also prevents the light emitting semiconductor device 9 from being displaced during dip soldering or flow soldering.
【００１５】図１および図２に示す実施形態の発光半導
体装置９は基板型であるが、モールド型の発光半導体装
置では、図３ないし図５に示すように構成するとよい。
すなわち、図３ないし図５において、１０は他の実施形
態の発光半導体装置で、４は発光素子、１２および１３
はリード、１４はモールド体、１５はレンズ部からなる
投光部であり、これらは図１０に示すものと同様に構成
されている。Although the light emitting semiconductor device 9 of the embodiment shown in FIGS. 1 and 2 is a substrate type, a light emitting semiconductor device of a mold type may be configured as shown in FIGS.
That is, in FIGS. 3 to 5, reference numeral 10 denotes a light emitting semiconductor device of another embodiment, 4 denotes a light emitting element, and 12 and 13.
Is a lead, 14 is a molded body, and 15 is a light projecting portion composed of a lens portion, which are configured in the same manner as those shown in FIG.
【００１６】２０はリード１２および１３と同様の金属
片で、リード１２および１３を形成したリードフレーム
に形成されており、発光素子４の周囲をエポキシ樹脂で
モールドする際に、その一端部はリード１２および１３
とともにモールド体１４中に埋め込まれ、他端はモール
ド体１４から延出させている。金属片２０のモールド体
１４から延出している突出部は、回路基板１６に装着す
る際の仮止め固定部となる。Reference numeral 20 denotes a metal piece similar to the leads 12 and 13, which is formed on a lead frame on which the leads 12 and 13 are formed. When the periphery of the light emitting element 4 is molded with epoxy resin, one end thereof is formed of a lead. 12 and 13
Together with the mold body 14, and the other end extends from the mold body 14. The protruding portion of the metal piece 20 extending from the molded body 14 serves as a temporary fixing portion when the metal piece 20 is mounted on the circuit board 16.
【００１７】すなわち、発光半導体装置１０を回路基板
１６に形成された貫通孔１６ａに投光部８を位置させ
て、発光半導体装置１０自体を回路基板１６の裏面に装
着する場合に回路基板１６の所定の位置、つまり発光半
導体装置１０を図示しない吸引チャックなどのマウンタ
により発光半導体装置１０のリード１２および１３を回
路基板１６のはんだランド部１８ａに合わせて搭載する
とき、金属片２０の表面と対向する回路基板１６の位置
に接着剤１９を塗布しておき、その接着力によって発光
半導体装置１０を回路基板１６に仮止め固定する。この
固定によりディップはんだ付けあるいはフローはんだ付
けに際しても発光半導体装置１０の位置ずれを防止する
ことができる。That is, when the light emitting semiconductor device 10 is mounted on the back surface of the circuit board 16 by positioning the light emitting portion 8 in the through hole 16 a formed in the circuit board 16, When the leads 12 and 13 of the light emitting semiconductor device 10 are mounted at predetermined positions, that is, the mounters such as a suction chuck (not shown) so as to match the solder lands 18 a of the circuit board 16, the light emitting semiconductor device 10 faces the surface of the metal piece 20. An adhesive 19 is applied to the position of the circuit board 16 to be formed, and the light emitting semiconductor device 10 is temporarily fixed to the circuit board 16 by the adhesive force. By this fixing, it is possible to prevent the light emitting semiconductor device 10 from being displaced even during dip soldering or flow soldering.
【００１８】なお、この実施形態では金属片２０をモー
ルド体１４から突出するようにしているが、モールド体
に突出部を形成するようにしてもよい。In this embodiment, the metal piece 20 protrudes from the mold body 14. However, a protruding portion may be formed on the mold body.
【００１９】[0019]
【発明の効果】以上、詳述したように本発明によれば、
発光半導体装置に回路基板に当接する突出部を形成して
いるので、発光半導体装置を回路基板の裏面に装着する
場合においても、はんだ付け時に回路基板に仮止めする
スペースが確保され、このスペースによって接着剤など
の固着手段の利用が図れ、ディップはんだ付けあるいは
フローはんだ付けに容易に対応することができる。また
その突出部を発光半導体装置の基板やリードフレームに
より形成すると、格別な装置を要することなく簡単に形
成することができる。As described in detail above, according to the present invention,
Since the light emitting semiconductor device is formed with a protruding portion that comes into contact with the circuit board, even when the light emitting semiconductor device is mounted on the back surface of the circuit board, a space for temporarily fixing to the circuit board at the time of soldering is secured. Utilization of a fixing means such as an adhesive can be achieved and dip soldering or flow soldering can be easily performed. Further, when the protruding portion is formed by a substrate or a lead frame of the light emitting semiconductor device, it can be easily formed without requiring a special device.
【図１】本発明の一実施形態に係る発光半導体装置（基
板型）の回路基板への装着を示す斜視図である。FIG. 1 is a perspective view showing a light emitting semiconductor device (substrate type) according to an embodiment of the present invention mounted on a circuit board.
【図２】図１に示す発光半導体装置の平面図である。FIG. 2 is a plan view of the light emitting semiconductor device shown in FIG.
【図３】本発明の他の実施形態に係る発光半導体装置
（モールド型）の回路基板への装着を示す斜視図であ
る。FIG. 3 is a perspective view showing a light emitting semiconductor device (mold type) according to another embodiment of the present invention mounted on a circuit board.
【図４】図３に示す発光半導体装置の平面図である。FIG. 4 is a plan view of the light emitting semiconductor device shown in FIG.
【図５】図４のＣーＣ断面図である。FIG. 5 is a sectional view taken along line CC of FIG. 4;
【図６】従来の一例の発光半導体装置（基板型）の平面
図である。FIG. 6 is a plan view of a conventional light-emitting semiconductor device (substrate type).
【図７】図６のＡーＡ断面図である。FIG. 7 is a sectional view taken along the line AA of FIG. 6;
【図８】従来の発光半導体装置（基板型）の回路基板へ
の装着の一例を示す斜視図である。FIG. 8 is a perspective view showing an example of mounting a conventional light emitting semiconductor device (substrate type) on a circuit board.
【図９】従来の他の例の発光半導体装置（モールド型）
の平面図である。FIG. 9 shows another conventional light emitting semiconductor device (mold type).
FIG.
【図１０】図９のＢーＢ断面図である。FIG. 10 is a sectional view taken along the line BB of FIG. 9;
【図１１】従来の発光半導体装置（モールド型）の回路
基板への装着の他の例を示す斜視図である。FIG. 11 is a perspective view showing another example of mounting a conventional light emitting semiconductor device (mold type) on a circuit board.
１ 基板 １ａ 突出部 ２、３ 電極 ４ 発光素子 ５ ワイヤ（導線） ６ 反射体 ８、１５ 投光部 ９、１０ 発光半導体装置 １２、１３ リード １４ モールド体 １６ 回路基板 １６ａ 貫通孔 １７ 回路導体 １８ａ はんだランド部 １９ 接着剤 ２０ 金属片（突出部） DESCRIPTION OF SYMBOLS 1 Substrate 1a Projection part 2, 3 electrode 4 Light emitting element 5 Wire (conductive wire) 6 Reflector 8, 15 Light emitting part 9, 10 Light emitting semiconductor device 12, 13 Lead 14 Mold body 16 Circuit board 16a Through hole 17 Circuit conductor 18a Solder Land 19 Adhesive 20 Metal piece (projection)
Claims (3)
位置させて前記回路基板に装着される発光半導体装置に
おいて、前記発光半導体装置に前記回路基板に仮止めす
る仮止め用の突部を設けたことを特徴とする発光半導体
装置。1. A light emitting semiconductor device mounted on a circuit board with a light projecting portion positioned in a through hole formed in the circuit board, wherein a projection for temporarily fixing the light emitting semiconductor device to the circuit board is provided. A light-emitting semiconductor device comprising: a light-emitting device;
基板に装着された発光素子を備え、前記突部は前記基板
に形成してなる請求項１に記載の発光半導体装置。2. The light-emitting semiconductor device according to claim 1, wherein the light-emitting semiconductor device includes a light-emitting element mounted on a substrate on which electrodes are formed, and the protrusion is formed on the substrate.
ードを延出してなり、前記突部は前記モールド体に一端
を埋設し、他端が前記モールド体から延出する金属片で
ある請求項１に記載の発光半導体装置。3. The light emitting semiconductor device according to claim 1, wherein a lead extends from a molded body, and the protrusion is a metal piece having one end embedded in the molded body and the other end extending from the molded body. 3. The light emitting semiconductor device according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23683299A JP3864263B2 (en) | 1999-08-24 | 1999-08-24 | Light emitting semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23683299A JP3864263B2 (en) | 1999-08-24 | 1999-08-24 | Light emitting semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2001068738A true JP2001068738A (en) | 2001-03-16 |
| JP3864263B2 JP3864263B2 (en) | 2006-12-27 |
Family
ID=17006454
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23683299A Expired - Fee Related JP3864263B2 (en) | 1999-08-24 | 1999-08-24 | Light emitting semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3864263B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004266124A (en) * | 2003-03-03 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device |
| US6825894B2 (en) | 2001-05-30 | 2004-11-30 | Hitachi, Ltd. | Liquid crystal display device |
| US7737462B2 (en) | 2003-02-28 | 2010-06-15 | Citizen Electronics Co., Ltd | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
| US8474439B2 (en) | 2009-05-21 | 2013-07-02 | Aisan Kogyo Kabushiki Kaisha | Fuel vapor processors |
| KR101509230B1 (en) * | 2013-08-30 | 2015-04-10 | 서울반도체 주식회사 | Light-emitting device |
| KR101537797B1 (en) * | 2008-06-26 | 2015-07-22 | 서울반도체 주식회사 | Light-emitting device |
-
1999
- 1999-08-24 JP JP23683299A patent/JP3864263B2/en not_active Expired - Fee Related
Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6825894B2 (en) | 2001-05-30 | 2004-11-30 | Hitachi, Ltd. | Liquid crystal display device |
| US7202920B2 (en) | 2001-05-30 | 2007-04-10 | Hitachi, Ltd. | Liquid crystal display device |
| KR100850400B1 (en) * | 2001-05-30 | 2008-08-04 | 가부시키가이샤 히타치세이사쿠쇼 | Liquid crystal display device |
| US7486348B2 (en) | 2001-05-30 | 2009-02-03 | Hitachi, Ltd. | Liquid crystal display device |
| US7714954B2 (en) | 2001-05-30 | 2010-05-11 | Hitachi, Ltd | Liquid crystal display device |
| US7737462B2 (en) | 2003-02-28 | 2010-06-15 | Citizen Electronics Co., Ltd | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
| US7745835B2 (en) | 2003-02-28 | 2010-06-29 | Citizen Electronics Co., Ltd. | Light emitting diode and light emitting diode device including the light emitting diode element and method for manufacturing the light emitting diode |
| JP2004266124A (en) * | 2003-03-03 | 2004-09-24 | Matsushita Electric Ind Co Ltd | Semiconductor light emitting device |
| KR101537797B1 (en) * | 2008-06-26 | 2015-07-22 | 서울반도체 주식회사 | Light-emitting device |
| US8474439B2 (en) | 2009-05-21 | 2013-07-02 | Aisan Kogyo Kabushiki Kaisha | Fuel vapor processors |
| KR101509230B1 (en) * | 2013-08-30 | 2015-04-10 | 서울반도체 주식회사 | Light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3864263B2 (en) | 2006-12-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US5670797A (en) | Compact light-emitting device with sealing member and light-transmitting resin seal | |
| US9455384B2 (en) | Semiconductor light-emitting device | |
| JP5933959B2 (en) | Semiconductor optical device | |
| JPH11163419A (en) | Light-emitting device | |
| JP4023723B2 (en) | Surface mount type light emitting diode | |
| KR970024132A (en) | CIRCUIT DEVICE AND METHOD OF FABRICATING SAME | |
| JP2000252393A (en) | Chip-type electronic component | |
| JP2004356506A (en) | Glass sealed type light emitting diode | |
| JP3642823B2 (en) | Side light emitting device | |
| JP2020515068A (en) | Mounting the LED element on a flat carrier | |
| JP3696021B2 (en) | Light irradiation device | |
| JP3907145B2 (en) | Chip electronic components | |
| JP2009194319A (en) | Surface-mounted led | |
| JP4010424B2 (en) | Electrode structure of side surface type electronic component and manufacturing method thereof | |
| JPH1050734A (en) | Chip type semiconductor | |
| JP2001068738A (en) | Semiconductor light-emitting device | |
| JP2000031545A (en) | Semiconductor light emitting element and its manufacture | |
| JP2006156643A (en) | Surface-mounted light-emitting diode | |
| JP2001352105A (en) | Surface mounting light emitting element | |
| JPH06310763A (en) | Led lamp | |
| JP4746767B2 (en) | Light emitting diode | |
| JP4833421B2 (en) | Light emitting device and mounting board | |
| JP2002280479A (en) | Surface mounting semiconductor device | |
| JP2506452Y2 (en) | Side emitting display | |
| KR100765714B1 (en) | Lead frame , light emitting device package using the same and fabricating method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040316 |
|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20060515 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060523 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060718 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20060912 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060913 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20091013 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101013 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111013 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121013 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131013 Year of fee payment: 7 |
|
| LAPS | Cancellation because of no payment of annual fees |