KR101537797B1 - Light-emitting device - Google Patents

Light-emitting device Download PDF

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Publication number
KR101537797B1
KR101537797B1 KR1020080061074A KR20080061074A KR101537797B1 KR 101537797 B1 KR101537797 B1 KR 101537797B1 KR 1020080061074 A KR1020080061074 A KR 1020080061074A KR 20080061074 A KR20080061074 A KR 20080061074A KR 101537797 B1 KR101537797 B1 KR 101537797B1
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KR
South Korea
Prior art keywords
light emitting
contact surface
emitting device
lead frames
emitting chip
Prior art date
Application number
KR1020080061074A
Other languages
Korean (ko)
Other versions
KR20100003334A (en
Inventor
박병열
김방현
이상철
조재호
Original Assignee
서울반도체 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 서울반도체 주식회사 filed Critical 서울반도체 주식회사
Priority to KR1020080061074A priority Critical patent/KR101537797B1/en
Publication of KR20100003334A publication Critical patent/KR20100003334A/en
Application granted granted Critical
Publication of KR101537797B1 publication Critical patent/KR101537797B1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Led Device Packages (AREA)

Abstract

The present invention relates to a light emitting device having a lead frame which is easy to form a contact surface without a trimming and forming process and has improved adhesiveness, and a light emitting device according to the present invention comprises: a light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; A mounting surface electrically connected to the light emitting chip is formed inside the opening, a contact surface for the electrical contact is formed outside the package main body, and a groove is formed in at least a part of the contact surface And a first lead frame and a second lead frame.

Light emitting device, light emitting diode, lead frame, trimming, foaming

Description

[0001] LIGHT-EMITTING DEVICE [0002]

The present invention relates to a light emitting device, and more particularly, to a light emitting device having a lead frame which is easy to form a contact surface and has improved adhesion without a trimming and forming process.

2. Description of the Related Art Generally, various light emitting chips are used for a light emitting device. For example, a light emitting diode (Light) using a pn junction structure of semiconductors and a light emitting diode Emitting Diode, LED) is used. Examples of the light emitting diode include a red light emitting diode using GaAsP or the like, a green light emitting diode using GaP or the like, and a blue light emitting diode using an InGaN / AlGaN double hetero structure.

The light emitting device is manufactured in various forms depending on the type of chip, the shape of the package, or the direction of light emission. For example, a chip type, a lamp type, a top view type, a side view type, and the like have been manufactured and used. In recent years, slimmer and lower power consumption of LCD (Liquid Crystal Display) There is an increasing demand for a side view light emitting device used as a backlight unit light source of an LCD.

A general side view light emitting device includes a package body formed of a housing and a reflector, first and second lead frames spaced apart from each other on the housing, a second lead frame mounted on the first lead frame, And a molding part formed inside the reflector to seal the light emitting chip.

At this time, the first and second lead frames are provided with contact surfaces which are electrical contact portions for mounting the light emitting device on a separate printed circuit board. The first and second lead frames are prepared in a plate shape and are preliminarily manufactured through a trimming process. Then, the lead frame is coupled to the package body, and the lead frame exposed to the outside of the package body is bent upward or downward A forming process is performed to form a contact surface. However, cracks are generated in the lead frame and the package main body during the trimming and forming process to form the contact surface, or a bonding failure occurs at the interface between the lead frame and the package main body.

Further, the contact surface of the lead frame is formed in a plane, and the area thereof is very narrow, resulting in poor solderability. Thus, when the light emitting device is mounted on a separate printed circuit board, there are many problems such that the light emitting device is twisted or short-circuited on the printed circuit board.

In addition, since the package body made by injection molding uses a thermoplastic PPA-based resin having a relatively low thermal characteristic, when a solder reflow process is performed to mount the light emitting device on a separate printed circuit board, The package main body and the molding part are deformed due to thermal damage.

SUMMARY OF THE INVENTION The present invention has been conceived to solve the problems as described above, and it is an object of the present invention to provide a light emitting device and a method of manufacturing the same, which are capable of increasing the area of a contact surface formed on a lead frame of a light emitting device, And to provide a light emitting device capable of improving the adhesion of the adhesive layer.

Further, since the package main body constituting the light emitting device is manufactured by the transfer molding method, a material excellent in thermal characteristics can be used, thereby preventing the lead frame and the package body from being damaged during the reflow process in which the light emitting device is mounted on the printed circuit board There is another purpose of providing a light emitting device which can be used as a light emitting device.

According to an aspect of the present invention, there is provided a light emitting device including: a light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; A mounting surface electrically connected to the light emitting chip is formed inside the opening, a contact surface for the electrical contact is formed outside the package main body, and a groove is formed in at least a part of the contact surface And a first lead frame and a second lead frame.

Wherein the contact surface is formed on one or both surfaces of the upper surface and the lower surface of the portion of the first and second lead frames projecting outwardly of the package body and the groove portion is recessed in the vertical direction on the contact surface .

At this time, it is preferable that the groove portion is formed at the edge of the contact surface, and the cross-sectional shape of the groove portion is a square having a right angle or a predetermined radius of curvature.

Wherein the package body comprises: a housing having the first and second lead frames installed on one side thereof and having a length longer than the thickness of the first and second lead frames on the other side; And a reflector formed at one side of the housing to form an opening through which light emitted from the light emitting chip is emitted.

The reflector is arranged to face each other on the upper side and the lower side of the front face of the housing and a pair of reflecting faces projecting in the front direction are formed.

Further, the reflector is further formed with a pair of auxiliary reflecting surfaces protruding forward in both sides of the housing front surface.

And a molding unit molded inside the reflector to seal the light emitting chip.

Wherein the package body is formed by a transfer molding method using a thermosetting resin.

According to the present invention, the area of the contact surface of the lead frame is widened, and in particular, a groove for improving the solderability is formed on the contact surface to improve the adhesion between the printed circuit board and the light emitting device. There is an effect that can be prevented.

In addition, since the block-shaped lead frame is used, the conventional processes such as trimming and forming can be omitted, thereby simplifying the manufacturing process.

Further, since the housing of the package main body is formed to extend, the balance with the reflector can be maintained, thereby ensuring stable mounting of the light emitting device.

In addition, since the package body is molded by the transfer molding method using a thermosetting resin having excellent thermal characteristics, the reflow process for mounting the light emitting device on the printed circuit board is performed at a temperature lower than the melting point of the package body and the molding portion, The thermal damage of the main body and the molding part can be prevented.

Hereinafter, a light emitting device package and a method of manufacturing the same according to the present invention will be described in detail with reference to the accompanying drawings.

2 is a perspective view showing a light emitting device according to another embodiment of the present invention, FIG. 3 is a perspective view showing a lead frame according to the present invention, and FIG. 4 is a perspective view showing a light emitting device according to another embodiment of the present invention. Fig. 6 is a perspective view showing a modification of the lead frame according to the invention.

1, the light emitting device according to the present invention includes a light emitting chip 110; A package body (120) having an opening through which light emitted from the light emitting chip (110) is emitted; The mounting surfaces 131 and 141 are electrically connected to the light emitting chip 110 at the inside of the opening and the contact surfaces 133 and 143 for the electrical contact are formed outside the package body 120 And first and second lead frames 130 and 140 having grooves 135 and 145 formed on at least part of the contact surfaces 133 and 143.

The light emitting chip 110 is a means for generating light by application of an external power source, and can be selectively adopted among chips that emit light in the ultraviolet region from the infrared region. For example, a vertical type light emitting diode may be used.

The package body 120 includes the housing 121 having the first and second lead frames 130 and 140 installed on one side and the length of which is longer than the thickness t of the first and second lead frames 130 and 140, and; And a reflector 123 formed at one side of the housing 121 and forming an opening through which light emitted from the light emitting chip 110 is emitted. The package body 120 is manufactured by transfer molding using an epoxy molding compound (EMC) to which a white pigment is added to a thermosetting resin, for example, an epoxy resin. Thus, the housing 121 and the reflector 123 are integrally formed.

The shape of the housing 121 and the reflector 123 may be variously modified depending on the use of the light emitting device. Particularly, in this embodiment, the opening direction of the opening formed in the reflector 123 is formed in front of the package body 120. The term "forward" refers to the direction of light emission in the side view light emitting device, and refers to the Z direction shown in the figure. Hereinafter, in order to clarify the components to be described later, the X direction is the upper direction, the -X axis direction is the lower side, the Y axis direction and the -Y axis direction are the side parts, the Z axis direction is the forward direction, .

The housing 121 extends rearward beyond the thickness t of the first and second lead frames 130 and 140. The light emitting device is extended to have a weight corresponding to the weight of the reflector 123 so that the light emitting device can be mounted in a stable posture without being inclined toward the reflector 123 when the light emitting device is mounted on the printed circuit board.

The reflector 123 includes a pair of reflecting surfaces 123a and 123b which are arranged to face each other on the upper side and the lower side of the front surface of the housing 121 and protrude in the forward (Z-axis) direction. Therefore, the angle at which the light emitted from the light emitting chip 110 is irradiated can be made 180 degrees in the horizontal direction ahead. Of course, the shape of the reflector 123 is not limited to this, and may be variously changed in order to control the emitting range of the light emitted from the light emitting chip 110 according to the use of the light emitting device. For example, as shown in FIG. 2, the reflector 123 includes reflecting surfaces 123a and 123b disposed to face each other at the upper side and the lower side of the front surface of the housing 121 and projecting in the forward direction, A pair of auxiliary reflecting surfaces 123c and 123d protruding in the forward direction can be formed on both side portions of the auxiliary reflecting surfaces 123a and 123b. By controlling the protruding lengths of the auxiliary reflecting surfaces 123c and 123d, the range of light emitted can be adjusted.

The package body 120 is formed with a molding part 160 formed at an opening formed in the reflector 123 and sealing a part of the light emitting chip 110 and the first and second lead frames 130 and 140 .

The molding part 160 is used for sealing and protecting a part of the light emitting chip 110 and the first and second lead frames 130 and 140. The forming method and shape can be variously implemented. Usually, the molding part 160 is formed of a transparent silicone resin or an epoxy resin, which is a thermosetting resin. In this case, when the molding part 160 is formed in the reflector 123 having both side parts shown in FIG. 1, it is preferable that the molding part 160 is formed by a transfer molding method. In the case where both sides are formed in the closed reflector 123 When it is formed, it can be formed by a transfer molding method or a dipping molding method. As described above, the molding part 160 When the molding body 160 is formed by the transfer molding method, the package body 120 and the molding part 160 are formed to prevent thermal deformation or damage of the package body 120 during molding of the molding part 160. [ It may be preferable to be formed of a thermosetting resin. However, the present invention is not limited thereto, and any material may be used as long as it is transparent enough to transmit light according to the use of the light emitting device, and various molding techniques for molding each material may be used. In order to realize the white light, the phosphor may be mixed in the molding part.

The first and second lead frames 130 and 140 are used to apply external power to the light emitting chip 110 as the light emitting chip 110 is mounted or electrically connected through the wire 150, And the reflector 123, as shown in Fig. At this time, the first and second lead frames 130 and 140 are formed in a block shape instead of a plate shape, and the mounting surfaces 131 and 141 electrically connected to the light emitting chip 110 are formed on one side, Contact surfaces 133 and 143 are formed and grooves 135 and 145 are formed on at least a part of the contact surfaces 133 and 143. At this time, as shown in FIG. 3, the contact surfaces 133, 143 and By the mounting (131 141) only teokbu (137 147) to form a single teokbu (137 147) between the by increasing the first and second lead frames (130 140) and the package area that the body 120 is joined the first And the second lead frames 130 and 140 and the package body 120 are improved. The thickness of the package body 120 is set to be greater than that of the first and second lead frames 130 and 140 Since the contact surface (133 143) formed to a thickness corresponding to the width (w) of the point where the forming of the first and second widths of the lead frame (130 140), in particular the contact surface width of the point at which the (133 143) is formed ( the light emitting device may be formed to be slim as a whole .

The light emitting chip 110 is mounted on the mounting surface 131 of the first lead frame 130 and the wire 150 connected to the light emitting chip 110 is mounted on the mounting surface of the second lead frame 140 Lt; / RTI >

Particularly, in order to omit the trimming or forming process, the length L of the protruding portion of the package body 120 is sufficiently long and the thickness t of the first and second lead frames 130 and 140 The solder can be sufficiently bonded to the substrate on which the light emitting device is mounted at the contact surfaces 133 and 143 corresponding to the upper and lower surfaces of the portion protruding outside the package body 120 It is preferable to have an area (L x t).

In order to improve the adhesiveness of the contact surfaces 133 and 143, the contact surfaces 133 and 143 are formed with recesses 135 and 145 that are recessed in the vertical direction to extend the contact area. At this time, the grooves 135 and 145 are formed at the corners of the contact surfaces 133 and 143, and the grooves 135 and 145 are formed at right angles. However, the number, position, and cross-sectional shape of the grooves 135 and 145 are not limited thereto, and can be variously modified as long as the area of the contact surfaces 133 and 143 can be extended. For example, as shown in Fig. 4, the cross section of the trenches 135 and 145 may be a foil having a predetermined radius of curvature.

The grooves 135 and 145 may be formed by various forming methods according to the shape and number of the grooves 135 and 145. For example, the grooves 135 and 145 may be formed by etching a part of the contact surfaces 133 and 143 of the first and second lead frames 130 and 140.

A state in which the light emitting device having the above configuration is mounted on a printed circuit board will be described with reference to the drawings.

5A and 5B are views showing a mounting state of a light emitting device according to the present invention, wherein FIG. 5A is a sectional view taken along line A-A of FIG. 1, and FIG. 5B is a side view of FIG.

5A, a light emitting device according to the present invention includes a first lead frame 130 and a second lead frame 140 protruding outward from a package body 120. The first and second lead frames 130 and 140 are soldered to a printed circuit board 1 ). Precisely, the contact surfaces 133 and 143 of the first and second lead frames 130 and 140 are mounted so as to face the solder pattern 2 of the printed circuit board 1 as shown in FIG. 5B. At this time, the solder patterns 2 of the first and second lead frames 130 and 140 and the solder patterns 2 of the printed circuit board 1 are electrically connected to each other by soldering. Since the first and second lead frames 130 and 140 have at least the length L protruding to the outside of the package body 120 and the contact surfaces 133 and 143 corresponding to the thickness t thereof, The contact area (L x t) is provided. Accordingly, it is possible to omit the trimming or forming process, which has conventionally been carried out separately for the formation of the contact surfaces 133 and 143.

Further, by forming the trenches 135 and 145 on the contact surfaces 133 and 143 to extend the contact area with the solder 3, the adhesiveness of the light emitting device can be further improved.

In addition, since the solder 3 is inserted into the groove portions 135 and 145, the light emitting device serves as a stopper to prevent the light emitting device from being twisted or biased on the printed circuit board 1. [

As the length of the housing 121 increases to correspond to the weight of the reflector 123, the package body 120 can assume a stable posture without being inclined toward the reflector 123.

It will be apparent to those skilled in the art that various modifications and variations can be made in the present invention without departing from the spirit or scope of the present invention as defined by the appended claims. You will understand.

1 is a perspective view showing a light emitting device according to the present invention,

2 is a perspective view showing a light emitting device according to another embodiment of the present invention,

3 is a perspective view showing a lead frame according to the present invention,

4 is a perspective view showing a modification of the lead frame according to the present invention,

5A and 5B are views showing the mounting state of the light emitting device according to the present invention.

Description of the Related Art

110: light emitting chip 120: package body

130: first lead frame 140: second lead frame

135, 145: groove portion 150: wire

160: Molding part

Claims (8)

A light emitting chip; A package body having an opening through which light emitted from the light emitting chip is emitted; A mounting surface electrically connected to the light emitting chip is formed inside the opening, a contact surface for the electrical contact is formed outside the package main body, and a groove is formed in at least a part of the contact surface And first and second lead frames in block form, Wherein the first and second lead frames have a step portion between the mounting surface and the contact surface, Wherein the mounting surface is formed on a front surface of the first and second lead frames, Wherein the contact surface is formed on one or both surfaces of the upper surface and the lower surface of the portion of the first and second lead frames projecting outwardly of the package body and the groove portion is recessed in the vertical direction on the contact surface And, And the width of the lead frame in the vertical direction of the point where the groove is formed is smaller than the width of the lead frame in the vertical direction at the point where the contact surface is formed. delete The method according to claim 1, Wherein the groove portion is formed at a corner of a contact surface, and the cross-sectional shape of the groove portion is a right angle or a radius having a predetermined radius of curvature. The method according to claim 1, The package body A housing having the first and second lead frames installed on one side thereof and having a length longer than the thickness of the first and second lead frames on the other side; And a reflector formed at one side of the housing to form an opening through which light emitted from the light emitting chip is emitted. The method of claim 4, Wherein the reflector is disposed to face each other at an upper side and a lower side of a front side of the housing and a pair of reflecting surfaces protruding in a front direction are formed. The method of claim 5, Wherein the reflector is further formed with a pair of auxiliary reflecting surfaces protruding forward in both sides of the front side of the housing. The method according to any one of claims 4 to 6, And a molding part molded inside the reflector to seal the light emitting chip. The method according to claim 1, Wherein the package body is formed by a transfer molding method using a thermosetting resin.
KR1020080061074A 2008-06-26 2008-06-26 Light-emitting device KR101537797B1 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170064898A (en) * 2015-12-02 2017-06-12 엘지이노텍 주식회사 Light emitting device package

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6236999B2 (en) * 2013-08-29 2017-11-29 日亜化学工業株式会社 Light emitting device
KR101694374B1 (en) * 2015-02-24 2017-01-24 주식회사 세미콘라이트 Semiconductor light emitting device, method of manufacturing the same, and light source module having the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1044180A (en) * 1996-08-07 1998-02-17 Rohm Co Ltd Transfer resin sealing method and resin sealing with the method
JP2001068738A (en) * 1999-08-24 2001-03-16 Rohm Co Ltd Semiconductor light-emitting device
JP2008053726A (en) * 2006-08-23 2008-03-06 Seoul Semiconductor Co Ltd Light emitting diode package

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH1044180A (en) * 1996-08-07 1998-02-17 Rohm Co Ltd Transfer resin sealing method and resin sealing with the method
JP2001068738A (en) * 1999-08-24 2001-03-16 Rohm Co Ltd Semiconductor light-emitting device
JP2008053726A (en) * 2006-08-23 2008-03-06 Seoul Semiconductor Co Ltd Light emitting diode package

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20170064898A (en) * 2015-12-02 2017-06-12 엘지이노텍 주식회사 Light emitting device package
KR102426861B1 (en) 2015-12-02 2022-07-29 쑤저우 레킨 세미컨덕터 컴퍼니 리미티드 Light emitting device package

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