JP2001035629A - Method and device for judging terminal crimped condition and method for detecting worn condition of crimping die - Google Patents

Method and device for judging terminal crimped condition and method for detecting worn condition of crimping die

Info

Publication number
JP2001035629A
JP2001035629A JP11208739A JP20873999A JP2001035629A JP 2001035629 A JP2001035629 A JP 2001035629A JP 11208739 A JP11208739 A JP 11208739A JP 20873999 A JP20873999 A JP 20873999A JP 2001035629 A JP2001035629 A JP 2001035629A
Authority
JP
Japan
Prior art keywords
crimping
terminal
waveform
characteristic
state
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP11208739A
Other languages
Japanese (ja)
Other versions
JP3627212B2 (en
Inventor
Teruyuki Ishibashi
輝之 石橋
Kazuyoshi Tomikawa
和芳 富川
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yazaki Corp
Original Assignee
Yazaki Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yazaki Corp filed Critical Yazaki Corp
Priority to JP20873999A priority Critical patent/JP3627212B2/en
Priority to TR2000/02112A priority patent/TR200002112A2/en
Priority to EP20000115749 priority patent/EP1071173B1/en
Priority to PT00115749T priority patent/PT1071173E/en
Priority to CZ20002697A priority patent/CZ298822B6/en
Priority to DE2000620304 priority patent/DE60020304T2/en
Publication of JP2001035629A publication Critical patent/JP2001035629A/en
Application granted granted Critical
Publication of JP3627212B2 publication Critical patent/JP3627212B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048Crimping apparatus or processes
    • H01R43/0488Crimping apparatus or processes with crimp height adjusting means
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R43/00Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
    • H01R43/04Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
    • H01R43/048Crimping apparatus or processes
    • H01R43/0486Crimping apparatus or processes with force measuring means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Manufacturing Of Electrical Connectors (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)

Abstract

PROBLEM TO BE SOLVED: To ensure detection of fine defects while stably judging whether the crimped condition of a terminal crimping device is acceptable or not. SOLUTION: A crimping failure detector is used for sampling the characteristic waveform (A) of a characteristic value such as a load and displacement generated in a terminal crimping device. The waveform (B) of the increments of the characteristic value in the characteristic waveform is found. A, B, C and D points are found as particular points from the waveform of the increments. Crimping failure is decided in accordance with the characteristic waveform in each of split areas in A-B, B-C and C-D. A threshold is set in each of the split areas. The ratio of a difference between the characteristic waveform and a reference waveform to a reference waveform for a is found. Decision for acceptance or not is made to the degree that the ratio is beyond the threshold. The reference waveform of a new product in a crimping die is stored to be compared with the reference waveform in production for detection of the worn condition of the crimping die. A plurality of crimping failure detectors constitute a network system. The reference waveform can be controlled and transferred.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、ワイヤハーネス等
を構成する端子付電線をつくる端子圧着装置に係わり、
該端子圧着装置で圧着された端子の圧着状態を判別する
端子圧着状態判別方法および装置、並びに端子圧着装置
の加締め型の摩耗状態を検出する加締め型の摩耗状態検
出装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a terminal crimping apparatus for producing a terminal-attached electric wire constituting a wire harness or the like.
The present invention relates to a terminal crimping state determining method and apparatus for determining a crimping state of a terminal crimped by the terminal crimping apparatus, and a crimping type wear state detecting device for detecting a crimping type wear state of the terminal crimping apparatus.

【0002】[0002]

【従来の技術】従来、端子圧着装置において、端子と電
線は端子の加締め足部を電線の芯線に加締めることで圧
着されるが、この圧着工程で圧着不良が生じることがあ
る。そこで、圧着された端子の圧着不良を検出する圧着
不良検出装置が用いられている。この装置は、例えば圧
着過程の荷重値等の特性値を時系列にサンプリングして
特性波形を求め、この特性波形と、良品について予め求
められた特性波形である基準波形とを比較することで良
否を判定している。これは、例えば図21に示したよう
に正常圧着時と不良圧着時とで特性値(荷重値)の変化
の仕方が異なること、すなわち基準波形と特性波形とで
波形が異なることにより良否の判定ができるというもの
である。
2. Description of the Related Art Conventionally, in a terminal crimping apparatus, a terminal and an electric wire are crimped by crimping a crimping foot portion of the terminal to a core wire of the electric wire, but a crimping failure may occur in this crimping step. Therefore, a crimping failure detection device that detects a crimping failure of a crimped terminal is used. This device obtains a characteristic waveform by sampling a characteristic value such as a load value in a crimping process in a time series, and compares the characteristic waveform with a reference waveform which is a characteristic waveform previously obtained for a non-defective product. Is determined. This is because, for example, as shown in FIG. 21, whether the characteristic value (load value) changes in the normal crimping process or the bad crimping process is different, that is, the quality is determined by the difference between the reference waveform and the characteristic waveform. Can be done.

【0003】[0003]

【発明が解決しようとする課題】しかしながら、不良の
程度により基準波形と特性波形との波形の違いの程度に
も差がある。例えば、図22(A) のように電線の芯線の
部分が皮剥きされておらずに絶縁被覆部が加締め足部で
加締められた場合は、図22(B) のように基準波形と特
性波形の差が大きくなる。また、図23(A) のように芯
線が皮剥き開始位置で切断された状態で加締め足部が加
締められた場合も、図23(B) のように基準波形と特性
波形の差が大きくなる。このような重欠陥不良では良否
の判定が容易であるが、図24(A) のように芯線が例え
ば1本欠落しているなど芯線不足のような不良の場合で
は、図24(B) のように基準波形と特性波形の差が小さ
くなり、良品と区別がつきにくいものがある。
However, there is a difference in the difference between the reference waveform and the characteristic waveform depending on the degree of the defect. For example, as shown in FIG. 22 (A), when the core portion of the electric wire is not peeled and the insulating coating portion is crimped with the crimped feet, the reference waveform is changed as shown in FIG. 22 (B). The difference between the characteristic waveforms increases. Also, when the caulking foot is swaged with the core wire cut at the peeling start position as shown in FIG. 23 (A), the difference between the reference waveform and the characteristic waveform is reduced as shown in FIG. 23 (B). growing. It is easy to judge the quality of such a heavy defect defect. However, in the case of a defect such as a missing core wire such as one missing core wire as shown in FIG. As described above, the difference between the reference waveform and the characteristic waveform is small, and it is difficult to distinguish the non-defective product from the non-defective product.

【0004】また、良品と不良品の区別の仕方は、特性
波形で構成される領域の面積を求め、基準波形で構成さ
れる領域の面積と比較する方法などがあるが、この方法
では面積差が大きく出る重欠陥不良は検出されやすい
が、特性波形の高さが圧着初期は基準波形より高く後期
は低く出るような不良時には面積差が出にくく不良が検
出されないという不具合もあった。
As a method of distinguishing a non-defective product from a defective product, there is a method of obtaining an area of a region constituted by a characteristic waveform and comparing the area with an area of a region constituted by a reference waveform. Although a heavy defect in which the size of the defect is large is easy to detect, there is also a problem that the area difference is hard to occur when the characteristic waveform has a height higher than the reference waveform in the initial stage of the pressure bonding and lower in the latter stage, and the defect is not detected.

【0005】そこで、検出能力を上げるため、波形の比
較に使用する領域を制限したり、波形をいくつかの領域
に分割したりして工夫していた。これにより、検出能力
は少し向上するが、ある程度の限界があった。また、こ
の領域の制限や分割の仕方などの判定条件の設定は経験
から導き出された例が多く、設定する人の職能の程度に
大きく左右される性格のものである。さらに、このよう
な設定の仕方は、端子の種類や電線サイズ(種類)との
組合せによっても異なる。
[0005] Therefore, in order to improve the detection capability, the area used for comparing the waveforms is limited, or the waveform is divided into several areas. As a result, the detection ability is slightly improved, but there are some limitations. In many cases, the setting of the determination conditions such as the limitation of the area and the division method is derived from experience, and has a characteristic that is greatly influenced by the skill of the person who sets the area. Further, such a setting method differs depending on a combination with a type of a terminal and a wire size (type).

【0006】すなわち、これらの判定条件の設定の仕方
は試行錯誤で探し出しており、例えば、ある基準値を決
めておき、不良状態で圧着してそれを検出できるかどう
かを見ながら調整する。また、別の不良状態や良品を圧
着しながら修正する、という具合であり、かなりの手間
と熟練を要する。このことは、検出能力にバラツキが存
在することと、判定条件の設定の困難さを意味してい
る。また、生産効率を考慮して、設定を容易にするため
に領域の制限や分割の仕方を一律で決めたり、判定基準
を緩めることもあるが、検出能力の向上が望めなくな
る。
That is, the method of setting these judgment conditions is found by trial and error. For example, a certain reference value is determined, and adjustment is made while checking whether or not it can be detected by pressing in a defective state. In addition, another defective state or a non-defective product is corrected while being pressed, which requires considerable labor and skill. This means that there is variation in the detection capability and it is difficult to set the determination conditions. Further, in consideration of the production efficiency, the method of limiting or dividing the area may be determined uniformly or the determination criteria may be loosened in order to facilitate the setting, but the improvement of the detection capability cannot be expected.

【0007】このように、従来の圧着不良検出装置ある
いは圧着状態判別方法では、細かな不良まで確実に検出
できる決めてに欠けており、実際の工程での運用は、重
欠陥不良の検出に重点を置いて使用されることが多かっ
た。このため、端子の圧着状態の良好な製品を効率よく
製造するのが困難であった。
As described above, the conventional crimping failure detecting device or crimping state discriminating method lacks a method of reliably detecting even a small defect, and the operation in the actual process focuses on the detection of a heavy defect. Often used with For this reason, it has been difficult to efficiently manufacture a product having a good crimped state of the terminal.

【0008】一方、端子の加締め足部やこの加締め足部
を芯線に加締めるための加締め型(クリンパとアンビ
ル)の設計は設計基準に基づき行われるが、その評価は
圧着結果としての機械的特性評価および電気的特性評価
が主流を占めている。圧着過程の端子と電線の変形挙動
は図面上で再現しにくく、動的な評価はほとんど行われ
なかった。加締め型の磨耗が大きくなると、一般に背バ
リが大きくなり、ある程度を超えると加締め部にクラッ
クが生じ、電気的・機械的特性を損なうことが知られて
いる。
On the other hand, the design of the crimping feet of the terminals and crimping dies (crimper and anvil) for crimping the crimping feet to the core wire is performed based on design criteria. Mechanical and electrical characterization is dominant. The deformation behavior of the terminals and wires during the crimping process was difficult to reproduce on the drawing, and almost no dynamic evaluation was performed. It is known that, when the abrasion of the crimping type increases, the back burr generally increases, and when the wear exceeds a certain degree, cracks occur in the crimping portion, which impairs electrical and mechanical characteristics.

【0009】また、加締め型の磨耗具合を直接測定する
ことは困難であり、TPM(技術的パフォーマンス測
定)管理としてカウンターによる圧着数把握や、圧着部
のバリの大きさにより判断していた。しかし、圧着数と
磨耗の関係は、端子の種類や電線サイズとの組合せ等に
より一様ではなく、それだけでは単独に機能しにくい。
また、背バリの大きさもどこまでが許容できるのか明確
な基準が設定できにくく、圧着部をカットし、断面の顕
微鏡観察等により、クロックラックの有無を調べてい
た。この方法は手間がかかり、リアルタイムの判定はで
きなかった。
Further, it is difficult to directly measure the degree of wear of the caulking type, and the TPM (technical performance measurement) management is based on grasping the number of crimps by a counter and judging by the size of burrs at the crimping portion. However, the relationship between the number of crimps and the wear is not uniform depending on the combination of the type of terminal and the size of the electric wire, etc., and it is difficult to function alone by itself.
In addition, it is difficult to set a clear standard as to how large the back burr can be. Therefore, the crimped portion is cut, and the presence or absence of a clock rack is checked by microscopic observation of the cross section. This method was troublesome and did not allow real-time determination.

【0010】さらに、圧着不良検出装置は、生産開始前
に実際の圧着過程から特性波形をサンプリングして、良
否判定用の基準波形として用い、そのロットの生産が終
わった時点で、基準波形は不要となり、次の生産の新た
な基準波形に置き換えられていた。つまり、圧着不良検
出装置は、生産途中の突発異常による加締め型へのダメ
ージは検出できるが、型の異常に気付かず基準波形を採
って生産すると、不良が流出する危険が伴う。
Further, the crimping failure detecting device samples a characteristic waveform from an actual crimping process before starting the production and uses it as a reference waveform for judging pass / fail. When the lot is finished, the reference waveform is unnecessary. And was replaced with a new reference waveform for the next production. In other words, the crimping failure detection device can detect damage to the crimping die due to a sudden abnormality during production. However, if the crimping die is produced using the reference waveform without noticing the abnormality of the die, there is a danger that the defect will flow out.

【0011】そこで、本発明は、圧着状態の良否の判別
を安定して検出するとともに細かな不良まで確実に検出
し、また、加締め型の磨耗状態を効率よく、かつ、確実
に把握することで、端子の圧着状態の良好な製品を効率
よく製造できるようにすることを課題とする。
Accordingly, the present invention provides a method for stably detecting the quality of a crimping condition, reliably detecting even a small defect, and efficiently and surely grasping the state of wear of a crimping die. Accordingly, it is an object of the present invention to efficiently manufacture a product having a good crimped state of a terminal.

【0012】[0012]

【課題を解決するための手段】請求項1の端子圧着状態
判別方法は、端子圧着装置で電線の芯線に端子を圧着す
る圧着過程で得られる特性値の特性波形に基づいて、該
端子の圧着状態を判別する端子圧着状態判別方法におい
て、正常に圧着されたときの前記特性波形から基準波形
を求めるとともに、該基準波形の増分値から該基準波形
の特異点を求め、該基準波形を該特異点で分割し、該分
割した領域で前記圧着過程で得られる特性値の特性波形
に基づいて端子の圧着状態を判別することを特徴とす
る。
According to a first aspect of the present invention, there is provided a terminal crimping state determining method for crimping a terminal based on a characteristic waveform of a characteristic value obtained in a crimping process of crimping the terminal to a core wire of an electric wire by a terminal crimping device. In the terminal crimping state determining method for determining a state, a reference waveform is obtained from the characteristic waveform when crimping is performed normally, and a singular point of the reference waveform is obtained from an increment value of the reference waveform. The terminal is divided at points, and the crimping state of the terminal is determined based on a characteristic waveform of a characteristic value obtained in the crimping process in the divided region.

【0013】端子圧着装置での圧着過程では、端子が変
形する過程で力が上昇から下降に代わる点、端子が芯線
に触れ始めて力が上昇に代わる点、芯線を加締める過程
において力が上昇から下降に代わる点、力が加えられな
くなる点など、荷重値や端子圧着装置の構成部品の変形
量などの特性値の変化に特徴があり、これが特性波形上
で特異点として現れることが判った。この特異点は基準
波形の増分値から求めることができる。
In the crimping process by the terminal crimping device, the point where the force changes from rising to falling in the process of deforming the terminal, the point where the terminal starts to touch the core wire and the force changes, and the force increases in the process of caulking the core wire. It is characterized by changes in characteristic values such as a load value and a deformation amount of a component part of the terminal crimping device, such as a point replacing the descent and a point where no force is applied, and it is found that this appears as a singular point on the characteristic waveform. This singular point can be obtained from the increment value of the reference waveform.

【0014】上記特異点で分割される領域は、圧着過程
の細分化された一連の過程に対応するので、請求項1の
ように、この分割された領域で特性波形に基づいて端子
の圧着状態の判別を行うことにより、端子の圧着状態の
良否の判別を安定して行うことができ、細かな圧着不良
まで検出できる。
Since the area divided by the singular point corresponds to a series of subdivided steps of the crimping process, the crimped state of the terminal based on the characteristic waveform in the divided area is defined as in claim 1. , The quality of the crimped state of the terminal can be determined stably, and even a fine crimping failure can be detected.

【0015】請求項2の端子圧着状態判別方法は、端子
圧着装置で電線の芯線に端子を圧着する圧着過程で得ら
れる特性値の特性波形に基づいて、該端子の圧着状態を
判別する端子圧着状態判別方法において、正常に圧着さ
れたときの前記特性波形から基準波形を求めるととも
に、該基準波形の増分値から該基準波形の特異点を求
め、該基準波形のうち、前記特異点から検出される特性
値のピーク近傍より前半の領域で、前記圧着過程で得ら
れる特性値の特性波形に基づいて端子の圧着状態を判別
することを特徴とする。
According to a second aspect of the present invention, there is provided a terminal crimping state judging method for judging a crimping state of a terminal based on a characteristic waveform of a characteristic value obtained in a crimping process of crimping a terminal to a core wire of an electric wire by a terminal crimping device. In the state determination method, a reference waveform is obtained from the characteristic waveform when the pressure bonding is normally performed, and a singular point of the reference waveform is obtained from an increment value of the reference waveform, and the singular point of the reference waveform is detected from the singular point. In the first half region from the vicinity of the peak of the characteristic value, the crimping state of the terminal is determined based on the characteristic waveform of the characteristic value obtained in the crimping process.

【0016】請求項2の端子圧着状態判別方法によれ
ば、圧着状態を判別するための特性波形を求める際に、
特性値のピーク近傍より前半の領域差異だけを求めれば
よいので、全特性波形を求める場合よりも、特性値のサ
ンプリング点の分解能を高くすることができ、判別精度
が高まる。
According to the terminal crimping state determining method of claim 2, when determining the characteristic waveform for determining the crimping state,
Since only the region difference in the first half from the vicinity of the peak of the characteristic value needs to be obtained, the resolution of the sampling point of the characteristic value can be made higher than in the case of obtaining the entire characteristic waveform, and the discrimination accuracy is improved.

【0017】請求項3の端子圧着状態判別方法は、請求
項1の構成を備え、前記基準波形と前記圧着過程で得ら
れる特性値の特性波形との差を該基準波形の割合で捉
え、該割合を前記分割した領域に予め設定されたしきい
値と比較して端子の圧着状態を判別することを特徴とす
る。
According to a third aspect of the present invention, there is provided a method for judging a crimped state of a terminal, comprising: The crimping state of the terminal is determined by comparing the ratio with a threshold value preset in the divided area.

【0018】請求項3の端子圧着状態判別方法によれ
ば、請求項1と同様な作用効果が得られるとともに、特
性波形と基準波形の比較に、特性値の特性波形との差の
基準波形に対する割合を用いるので、判定基準となるし
きい値の値を分割した領域内で一定の値とすることがで
き、演算等が容易になる。
According to the third aspect of the present invention, the same operation and effect as those of the first aspect can be obtained, and the difference between the characteristic waveform of the characteristic value and the characteristic waveform of the reference waveform is compared with the characteristic waveform. Since the ratio is used, the value of the threshold value as a criterion can be set to a constant value in the divided region, and the calculation and the like become easy.

【0019】請求項4の端子圧着状態判別方法は、請求
項3の構成を備え、前記分割した領域についての前記割
合が前記しきい値を超過する程度に基づいて端子の圧着
状態を判別することを特徴とする。
According to a fourth aspect of the present invention, there is provided a method for judging a crimped state of a terminal, comprising the step of judging the crimped state of a terminal based on the extent that the ratio of the divided area exceeds the threshold value. It is characterized by.

【0020】請求項4の端子圧着状態判別方法によれ
ば、請求項3と同様な作用効果が得られるとともに、特
性値の特性波形との差の基準波形に対する割合がしきい
値を超過する程度で判別するので、特性値のノイズ等に
よる検出誤り等を防止でき安定した判別を行うことがで
きる。
According to the terminal crimping state determination method of the fourth aspect, the same operation and effect as those of the third aspect can be obtained, and the ratio of the difference between the characteristic value and the characteristic waveform to the reference waveform exceeds the threshold value. , It is possible to prevent a detection error or the like due to noise or the like of the characteristic value, and to perform a stable determination.

【0021】請求項5の端子圧着状態判別方法は、請求
項3または4の構成を備え、コンピュータで判定基準設
定用プログラムと端子圧着状態判別プログラムとを実行
し、前記判定基準設定用プログラムの実行により前記基
準波形および前記しきい値を設定するとともに、前記端
子圧着状態判別プログラムの実行により、前記設定され
た基準波形およびしきい値に基づいて端子の圧着状態を
判別することを特徴とする。
According to a fifth aspect of the present invention, there is provided a method of determining a terminal crimping state, comprising the steps of executing the program for determining a criterion setting and the program for determining a terminal crimping state on a computer. The terminal crimping state is determined based on the set reference waveform and threshold value by executing the terminal crimping state determination program.

【0022】請求項5の端子圧着状態判別方法によれ
ば、請求項3または4と同様な作用効果が得られるとと
もに、端子圧着状態判別装置としてコンピュータを利用
し、判定基準設定用プログラムと端子圧着状態判別プロ
グラムとを実行することで、基準波形およびしきい値の
設定作業、圧着工程での圧着不良検出等の作業性が向上
する。
According to the fifth aspect of the present invention, the same operation and effect as those of the third and fourth aspects can be obtained, and a computer is used as a terminal crimping state judging apparatus, and a judgment criterion setting program and a terminal crimping state can be obtained. By executing the state determination program, the workability of setting reference waveforms and thresholds, and detecting crimping failures in the crimping process is improved.

【0023】請求項6の端子圧着状態判別装置は、端子
圧着装置で電線の芯線に端子を圧着する圧着過程で得ら
れる特性値の特性波形に基づいて、該端子の圧着状態を
判別する端子圧着状態判別装置において、正常に圧着さ
れたときの前記特性波形から求めた基準波形の増分値か
ら該基準波形の特異点を求める特異点検出手段と、該基
準波形を該特異点で分割し、該分割した領域で前記圧着
過程で得られる特性値の特性波形に基づいて端子の圧着
状態を判別する判別手段と、を備えたことを特徴とし、
この請求項6の端子圧着状態判別装置によれば、請求項
1と同様な作用効果が得られる。
According to a sixth aspect of the present invention, there is provided a terminal crimping state judging device for judging a crimping state of a terminal based on a characteristic waveform of a characteristic value obtained in a crimping process of crimping the terminal to the core wire of the electric wire by the terminal crimping device. In the state determination device, a singular point detecting means for obtaining a singular point of the reference waveform from an increment value of the reference waveform obtained from the characteristic waveform when the crimping is performed normally, dividing the reference waveform by the singular point, Determining means for determining a crimping state of the terminal based on a characteristic waveform of a characteristic value obtained in the crimping process in the divided region,
According to the terminal crimp state determination device of the sixth aspect, the same operation and effect as those of the first aspect can be obtained.

【0024】請求項7の端子圧着状態判別装置は、端子
圧着装置で電線の芯線に端子を圧着する圧着過程で得ら
れる特性値の特性波形に基づいて、該端子の圧着状態を
判別する端子圧着状態判別装置において、正常に圧着さ
れたときの前記特性波形から求めた基準波形を増分値か
ら該基準波形の特異点を求める特異点検出手段と、該基
準波形のうち、前記特異点から検出される特性値のピー
ク近傍より前半の領域で、前記圧着過程で得られる特性
値の特性波形に基づいて端子の圧着状態を判別する判別
手段と、を備えたことを特徴とし、この請求項7の端子
圧着状態判別装置によれば、請求項2と同様な作用効果
が得られる。する。
According to a seventh aspect of the present invention, there is provided a terminal crimping state judging device for judging a crimping state of a terminal based on a characteristic waveform of a characteristic value obtained in a crimping process of crimping the terminal to the core wire of the electric wire by the terminal crimping device. In the state discriminating device, a singular point detecting means for obtaining a singular point of the reference waveform from an increment value with respect to a reference waveform obtained from the characteristic waveform at the time of normal pressure bonding, and the singular point of the reference waveform detected from the singular point. Determining means for determining a crimping state of the terminal based on a characteristic waveform of the characteristic value obtained in the crimping process in an area in the first half of the vicinity of the peak of the characteristic value. According to the terminal crimping state determination device, the same operation and effect as those of the second aspect can be obtained. I do.

【0025】請求項8の端子圧着状態判別装置は、請求
項6の構成を備え、前記判別手段は、前記基準波形と前
記圧着過程で得られる特性値の特性波形との差を該基準
波形の割合で捉え、該割合を前記分割した領域に予め設
定されたしきい値と比較して端子の圧着状態を判別する
ことを特徴とし、この請求項8の端子圧着状態判別装置
によれば、請求項6および請求項3と同様な作用効果が
得られる。
An eighth aspect of the present invention provides the terminal crimping state determining apparatus according to the sixth aspect, wherein the determining means determines a difference between the reference waveform and a characteristic waveform of a characteristic value obtained in the crimping process. The terminal crimping state judging device according to claim 8, wherein the crimping state of the terminal is determined by comparing the ratio with a threshold value set in advance in the divided area. The same functions and effects as in the sixth and third aspects are obtained.

【0026】請求項9の端子圧着状態判別装置は、請求
項8の構成を備え、前記判別手段は、前記分割した領域
についての前記割合が前記しきい値を超過する程度に基
づいて端子の圧着状態を判別することを特徴とし、この
請求項9の端子圧着状態判別装置によれば、請求項8お
よび請求項4と同様な作用効果が得られる。
In a ninth aspect of the present invention, there is provided a terminal crimping state determining apparatus comprising the configuration of the eighth aspect, wherein the determining means determines whether or not the terminal has been crimped based on the extent that the ratio of the divided area exceeds the threshold value. The state is determined. According to the terminal crimp state determining apparatus of the ninth aspect, the same operation and effect as those of the eighth and fourth aspects can be obtained.

【0027】請求項10の加締め型の摩耗状態検出方法
は、端子圧着装置で正常な加締め型を用いて電線の芯線
に端子を圧着する圧着過程で得られる特性値の基準波形
を求めて該基準波形を記憶しておき、前記端子圧着装置
で正常に圧着されたときの特性波形と前記記憶しておい
た基準波形とを比較することにより、前記加締め型の摩
耗状態を検出するようにしたことを特徴とする。
According to a tenth aspect of the present invention, in the crimping type wear state detecting method, a reference waveform of a characteristic value obtained in a crimping process of crimping a terminal to a core wire of an electric wire using a normal crimping type by a terminal crimping device is obtained. The reference waveform is stored, and by comparing the characteristic waveform when the terminal crimping device is normally crimped and the stored reference waveform, the wear state of the crimping type is detected. It is characterized by the following.

【0028】端子圧着装置で、生産を開始するとき、端
子圧着装置で正常に圧着されたときの特性波形から基準
波形を前もって設定しておき、圧着工程で得られる特性
波形と基準波形を比較して圧着不良を検出する。しか
し、端子圧着装置の加締め型が摩耗すると新たに設定し
た基準波形も変化してくる。したがって、請求項10の
加締め型の摩耗状態検出方法によれば、加締め型の摩耗
状態は時には端子圧着装置で正常に圧着されたときの特
性波形が記憶しておいた基準波形からずれるので、加締
め型の摩耗状態を検出することができ、異常発生前に型
の交換が可能になる。
When starting production with the terminal crimping device, a reference waveform is set in advance from a characteristic waveform when crimping is normally performed by the terminal crimping device, and the characteristic waveform obtained in the crimping process is compared with the reference waveform. To detect crimping failure. However, when the crimping die of the terminal crimping device wears, the newly set reference waveform also changes. Therefore, according to the crimping type wear state detecting method of the tenth aspect, the crimping type wear state sometimes deviates from the reference waveform in which the characteristic waveform when normally crimped by the terminal crimping device is stored. In addition, it is possible to detect the state of wear of the caulking mold, and the mold can be replaced before an abnormality occurs.

【0029】請求項11の加締め型の摩耗状態検出方法
は、複数の端子圧着装置の各々に圧着不良検出装置を設
けるとともに、該各々の圧着不良検出装置とコンピュー
タによりネットワークを形成し、前記各々の圧着不良検
出装置に請求項10の加締め型の摩擦状態検出方法を適
用し、各圧着不良検出装置にそれぞれ記憶されている前
記基準波形を前記コンピュータにより管理することによ
り、各圧着不良検出装置で他の圧着不良検出装置の基準
波形を参照できるようにし、各圧着不良検出装置におい
て前記参照した基準波形と前記記憶している基準波形と
を比較することにより加締め型の摩耗状態を検出するよ
うにしたことを特徴とする。
[0029] In the crimping type wear state detecting method according to the eleventh aspect, a crimping failure detecting device is provided for each of the plurality of terminal crimping devices, and a network is formed by each of the crimping failure detecting devices and a computer. The crimping type friction state detecting method according to claim 10 is applied to the crimping failure detecting device, and the reference waveform stored in each crimping failure detecting device is managed by the computer. The reference waveform of another crimping failure detecting device can be referred to, and the crimping type wear state is detected by comparing the referenced reference waveform and the stored reference waveform in each crimping failure detecting device. It is characterized by doing so.

【0030】請求項11の加締め型の摩耗状態検出方法
によれば、複数の端子圧着装置間で基準波形の授受が可
能となり、生産側では、現在の基準波形の可否を知るこ
とができ、加締め型の摩耗状態を検出することができ、
異常発生前に型の交換が可能になる。さらに、コンピュ
ータ側では例えば基準波形の詳細な分析が可能となる。
According to the crimping type wear state detecting method of the eleventh aspect, it is possible to transmit and receive the reference waveform between the plurality of terminal crimping apparatuses, and the production side can know whether or not the current reference waveform is available. The crimping type wear state can be detected,
The mold can be exchanged before an abnormality occurs. Further, for example, the computer can perform detailed analysis of the reference waveform.

【0031】[0031]

【発明の実施の形態】以下、図面を参照して本発明の一
実施形態について説明する。図1は本発明を適用した端
子圧着装置の正面図、図2は同端子圧着装置の側面図で
ある。図において、1は端子圧着装置Aのケーシングで
あって、基板2とその両側の側板3,3とから成り、両
側板3,3の上部後方には減速機5を備えたサーボモー
タ4が固定されている。減速機5の出力軸6には偏心ピ
ン(クランク軸)8を有する円板7が軸装され、偏心ピ
ン8にはスライドブロック9が枢着されている。スライ
ドブロック9の上面および下面はラム11に取付けられ
た受座10および10′間に摺動自在に装着されてお
り、円板7に回転によりスライドブロック9は受座1
0,10′間を左右方向にスライドするとともにラム1
1が上下方向に移動する。このラム11は両側板3,3
の内面に設けたラムガイド12,12に上下摺動自在に
装着されており、円板7、スライドブロック9、受座1
0,10′、ラム11およびラムガイド12がピストン
−クランク機構を構成している。
DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. FIG. 1 is a front view of a terminal crimping apparatus to which the present invention is applied, and FIG. 2 is a side view of the terminal crimping apparatus. In the figure, reference numeral 1 denotes a casing of the terminal crimping device A, which is composed of a substrate 2 and side plates 3 and 3 on both sides thereof, and a servomotor 4 having a speed reducer 5 is fixed to the upper rear of the both plates 3 and 3. Have been. A disk 7 having an eccentric pin (crankshaft) 8 is mounted on the output shaft 6 of the speed reducer 5, and a slide block 9 is pivotally mounted on the eccentric pin 8. The upper surface and the lower surface of the slide block 9 are slidably mounted between seats 10 and 10 ′ attached to the ram 11.
Slide between 0 and 10 'in the left and right direction and ram 1
1 moves up and down. This ram 11 has both side plates 3, 3
Are mounted slidably up and down on ram guides 12 provided on the inner surface of the disk, a disk 7, a slide block 9, and a seat 1
0, 10 ', the ram 11 and the ram guide 12 constitute a piston-crank mechanism.

【0032】ラム11は下端部に係合凹部13を有し、
該係合凹部13にはクリンパ14を取付けたクリンパホ
ルダ15の係合凸部16が着脱自在に装着され、クリン
パ14の直下にはこれと対向してアンビル17が基板2
上のアンビル取付台24に固定されている。図3に示し
たように、ラム11には水平方向に切欠き部11aが形
成され、このラム11に加わる荷重に応じて、下ブロッ
ク11Aは連結部11Cの弾性により上ブロック11B
に対して荷重に応じた量だけ上下方向(図の矢印の方
向)に変動する。また、上ブロック11Bに固定された
位置検出装置100のプローブ100aが下ブロック1
1Aの上面11A−1に当接されており、この位置検出
装置100は圧着不良検出装置Bに接続されている。そ
して、位置検出装置100の出力により圧着不良検出装
置Bで下ブロック11Aの上下方向の変位量(すなわち
ラム11の変形量)が検出され、この検出された変位量
が、圧着過程での特性値として処理される。
The ram 11 has an engagement recess 13 at the lower end,
An engaging projection 16 of a crimper holder 15 to which a crimper 14 is attached is detachably mounted in the engaging recess 13, and an anvil 17 is provided immediately below the crimper 14 in opposition thereto.
It is fixed to the upper anvil mount 24. As shown in FIG. 3, a notch 11a is formed in the ram 11 in a horizontal direction, and in response to a load applied to the ram 11, the lower block 11A is elastically connected to the upper block 11B by the elasticity of the connecting portion 11C.
In the vertical direction (the direction of the arrow in the figure) by an amount corresponding to the load. The probe 100a of the position detecting device 100 fixed to the upper block 11B is
The position detecting device 100 is in contact with the upper surface 11A-1 of 1A. The displacement of the lower block 11A in the vertical direction (ie, the amount of deformation of the ram 11) is detected by the crimping failure detecting device B based on the output of the position detecting device 100, and the detected displacement is a characteristic value in the crimping process. Is processed as

【0033】なお、図1において、18は既知の構成の
端子供給装置であり、図示しない連鎖状端子を支持する
端子ガイド19、端子押さえ20、先端に端子送り爪2
1を有する端子送りアーム22および該アーム22を進
退させる揺動リンク23等を備え、揺動リンク23は前
記ラム11の降下、上昇に合わせて前後に揺動し、端子
送り爪21により端子(図示せず)を一個ずつアンビル
17上に送り込むようになっている。また、アンビル1
7はアンビル取付台24のハンドル25の操作によりク
リンパ14に対する位置調整や撤去、交換等を容易にで
きるようになっている。
In FIG. 1, reference numeral 18 denotes a terminal supply device having a known configuration, which includes a terminal guide 19 for supporting a chain-like terminal (not shown), a terminal retainer 20, and a terminal feed claw 2 at the end.
1 and a swing link 23 for moving the arm 22 forward and backward. The swing link 23 swings back and forth in accordance with the descent and rise of the ram 11, and a terminal ( (Not shown) are fed onto the anvil 17 one by one. Also, anvil 1
Numeral 7 allows the position adjustment with respect to the crimper 14, removal, replacement, etc., by operating the handle 25 of the anvil mount 24.

【0034】サーボモータ4は正逆回転を行い、前記ピ
ストン−クランク機構によりラム11、即ちクリンパ1
4を降下および上昇させるものであり、該モータ4の駆
動を制御するドライバ32に接続されている。そして、
クリンパ14の下降および上昇により、このクリンパ1
4とアンビル17との間に配置された、端子および電線
の圧着が行われる。なお、ドライバ32には基準データ
入力部33が接続されて、端子規格(又はサイズ)、対
応する電線サイズ、クリンプハイトおよびサーボモータ
4にかかる負荷(電流)などの基準データを入力するよ
うになっている。また、サーボモータ4の図示しない出
力軸にはエンコーダ31が付設されており、その回転数
に基いてクリンパ14の位置を検出してドライバ32に
フィードバックしている。
The servomotor 4 rotates forward and backward, and the ram 11, that is, the crimper 1, is driven by the piston-crank mechanism.
4 is lowered and raised, and is connected to a driver 32 for controlling the driving of the motor 4. And
Due to the lowering and rising of the crimper 14, this crimper 1
The crimping of the terminal and the electric wire arranged between the 4 and the anvil 17 is performed. A reference data input unit 33 is connected to the driver 32 to input reference data such as a terminal standard (or size), a corresponding wire size, a crimp height, and a load (current) applied to the servomotor 4. ing. An encoder 31 is attached to an output shaft (not shown) of the servo motor 4, and detects the position of the crimper 14 based on the rotation speed and feeds it back to the driver 32.

【0035】図4は実施形態に係わる圧着不良検出装置
Bのブロック図であり、圧着不良検出装置Bは位置検出
装置100の出力を増幅するアンプ41、アンプ41か
ら出力されるアナログ電圧信号をデジタルの電圧データ
に変換するA/D変換器42、入力部43、CPU4
4、ROM45、RAM46、表示部47および通信イ
ンターフェース48を備えており、入力部43、CPU
44、ROM45、RAM46、表示部47および通信
インターフェース48はマイクロコンピュータを構成し
ている。CPU44はROM45に格納された制御プロ
グラムに基づいてRAM46のワーキングエリアを使用
して制御を行う。具体的には、A/D変換器42で得ら
れる位置検出装置100による変位量のデータを特性値
としてサンプリングする。また、CPU44は、サンプ
リングした特性値に基づいて演算を行い、基準波形の生
成処理、基準波形の特異点の検出処理、しきい値(しき
い線の値)および許容限度の入力処理、圧着不良の検出
処理、加締め型(クリンパ14とアンビル17)の摩耗
状態の検出処理等を行い、検出結果を表示部47に表示
する。
FIG. 4 is a block diagram of the crimping failure detecting device B according to the embodiment. The crimping failure detecting device B amplifies the output of the position detecting device 100 and converts the analog voltage signal output from the amplifier 41 into a digital signal. A / D converter 42, input unit 43, CPU 4 for converting voltage data into
4, a ROM 45, a RAM 46, a display unit 47, and a communication interface 48.
The 44, the ROM 45, the RAM 46, the display unit 47 and the communication interface 48 constitute a microcomputer. The CPU 44 performs control using the working area of the RAM 46 based on the control program stored in the ROM 45. Specifically, the data of the amount of displacement by the position detection device 100 obtained by the A / D converter 42 is sampled as a characteristic value. Further, the CPU 44 performs an operation based on the sampled characteristic values to generate a reference waveform, detect a singular point of the reference waveform, input a threshold value (threshold value) and an allowable limit, and perform crimping failure. , A process of detecting a worn state of the caulking type (crimper 14 and anvil 17), and the like, and the detection result is displayed on the display unit 47.

【0036】端子の圧着時には、位置検出装置100に
よる変位量のデータである特性値が得られ、例えば図5
(A) に示したような特性波形が得られる。この図5(A)
の特性波形は正常に圧着されたときの特性波形であり、
このように正常に圧着されたときの特性波形を複数求め
て所定のフォーマットでRAM46に記憶しておく。な
お、A/D変換器42は所定の変換サイクルでデジタル
データが確定する毎にそのデータを出力するので、CP
U44は、例えばこのデータの出力タイミングをタイム
ベースとして特性値を時系列にサンプリングすることが
でき、特性波形のデータを時系列なデータとしてRAM
46に記憶しておくことができる。そして、圧着状態が
正常であった複数の特性波形のデータの平均等により基
準波形のデータをRAM46内に生成する。なお、以下
の説明では図5(A) の特性波形を基準波形として説明す
る。また、「特性波形」という用語は正常に圧着された
場合と正常に圧着されなかった場合の何れの場合にも使
用し、「基準波形」という用語は正常に圧着された場合
の特性波形から得た波形について使用する。
At the time of crimping of the terminal, a characteristic value which is data of a displacement amount by the position detecting device 100 is obtained.
A characteristic waveform as shown in FIG. This FIG. 5 (A)
The characteristic waveform of is the characteristic waveform when crimped normally,
In this manner, a plurality of characteristic waveforms at the time of normal pressure bonding are obtained and stored in the RAM 46 in a predetermined format. The A / D converter 42 outputs the digital data every time the digital data is determined in a predetermined conversion cycle.
U44 can sample characteristic values in time series using, for example, the output timing of the data as a time base.
46. Then, reference waveform data is generated in the RAM 46 by averaging data of a plurality of characteristic waveforms in which the crimping state is normal. In the following description, the characteristic waveform of FIG. 5A will be described as a reference waveform. The term “characteristic waveform” is used in both cases where crimping is performed normally and when crimping is not performed normally, and the term “reference waveform” is obtained from the characteristic waveform when crimping is performed normally. Used for waveforms

【0037】図5(A) のような基準波形が得られると、
CPU44は、この基準波形のデータから特性値の単位
時間当たりの増分値を求め、図5(B) のような増分値の
波形のデータを得る。次に、この増分値の波形のデータ
から極値やゼロクロス点となる位置(時間軸上の位置)
を検出し、この位置を端子圧着過程におけるいくつかの
特別な点となるA点、B点、C点、D点を特異点とす
る。なお、増分値の極値となる位置は上記4点以外にも
あるが、上記の4点は、圧着過程の1サイクル中での以
下のような特別な点であり予め大まかな位置が既知であ
るので、上記4点を抽出することができる。
When a reference waveform as shown in FIG.
The CPU 44 obtains the increment value of the characteristic value per unit time from the data of the reference waveform, and obtains the waveform data of the increment value as shown in FIG. Next, from the waveform data of this increment value, the position that becomes the extreme value or the zero crossing point (the position on the time axis)
Is detected, and points A, B, C, and D, which are some special points in the terminal crimping process, are defined as singular points. There are other positions where the extreme value of the increment value is other than the above four points. The above four points are the following special points in one cycle of the crimping process, and the rough positions are known in advance. Therefore, the above four points can be extracted.

【0038】図6はクリンパ14、アンビル17、端子
の加締め足部50および芯線60の圧着過程の断面図で
ある。なお、見やすくするために斜線を一部省略してあ
る。同図(A) 〜(D) は上記4つの特異点における状態を
示し、同図(E) は圧着開始直前の状態を示している。4
つの特異点は以下のような点である。 A点:図6(A) のように加締め足部50がクリンパ14
上部のアール(曲面部分)により変形する過程におい
て、力が上昇から下降に代わる点。 B点:図6(B) のように加締め足部50が芯線60に触
れ始め、力が上昇に代わる点。 C点:図6(C) のように加締め足部50により芯線60
を加締める過程において、力が上昇から下降に代わる
点。 D点:図6(D) のように加締め足部50により芯線60
が完全に加締められて特性値がピークになる点。
FIG. 6 is a cross-sectional view of the crimping process of the crimper 14, the anvil 17, the crimping foot portion 50 of the terminal, and the core wire 60. It should be noted that some of the oblique lines are omitted for easy viewing. FIGS. 7A to 7D show states at the above-mentioned four singular points, and FIG. 7E shows a state immediately before the start of crimping. 4
One singularity is as follows. Point A: As shown in FIG.
The point where the force changes from rising to falling in the process of being deformed by the upper radius (curved portion). Point B: A point at which the crimped foot portion 50 starts to touch the core wire 60 as shown in FIG. Point C: As shown in FIG.
The point where the force changes from rising to falling in the process of caulking. Point D: As shown in FIG.
Is the point at which the characteristic value peaks due to complete crimping.

【0039】なお、基準波形のデータおよび増分値の波
形のデータも、特性波形のデータと同様なタイムベース
によりに時系列なデータとして扱うことができることは
いうまでもない。また、上記特異点の位置もこれらの時
系列なデータに対応付けてタイミングのデータとして記
憶しておくことができる。
It goes without saying that the data of the reference waveform and the data of the waveform of the increment value can be handled as time-series data on the same time base as the data of the characteristic waveform. The position of the singular point can also be stored as timing data in association with the time-series data.

【0040】次に、これらの特異点で基準波形を分割
し、A−B間、B−C間、C−D間を分割領域として設
定し、この分割領域毎に特性波形に基づいて圧着不良の
判定を行う。このように分割領域毎に判定を行うとそれ
ぞれの分割領域での特性波形の状態により、正常圧着
(良品)と異常圧着(不良品)が判別し易くなる。例え
ば、絶縁被覆部を噛み込むような異常圧着(絶縁噛み)
の場合は、図7(A) に示したようにA−B間とB−C間
で特性波形は基準波形より高く、C−D間では特性波形
は基準波形より低くなる。また、これとは対照的に、芯
線が絶縁皮剥き位置で切断されていたり切断芯線が少な
い異常圧着(芯線切れ)の場合は、図7(B)に示したよ
うにA−B間では特性波形と基準波形には差が無く、B
−C間とC−D間では特性波形は基準波形より低くな
る。このように、特異点で分割した分割領域で特性波形
を調べれば、各不良の特徴が顕著に現れ、圧着不良の検
出能力が高まる。なお、図7に示したようにD点に代え
て機械的に予め判っている下死点を使ってもよいが、以
下の例ではD点を特異点とした場合について説明する。
Next, the reference waveform is divided at these singular points, and a section between AB, BC, and CD is set as a divided area. Is determined. When the determination is performed for each of the divided areas in this manner, it is easy to determine whether the pressure bonding is normal (non-defective) or abnormally bonded (defective) based on the state of the characteristic waveform in each divided area. For example, abnormal crimping such as biting the insulation coating (insulation bite)
In the case of (1), the characteristic waveform between AB and BC is higher than the reference waveform, and the characteristic waveform between CD is lower than the reference waveform as shown in FIG. In contrast, in the case where the core wire is cut at the insulating stripping position or in the case of abnormal crimping (cut core wire) with a small number of cut core wires, as shown in FIG. There is no difference between the waveform and the reference waveform.
The characteristic waveform is lower than the reference waveform between -C and CD. As described above, if the characteristic waveform is examined in the divided area divided at the singular point, the characteristic of each failure appears remarkably, and the detection capability of the pressure bonding failure is enhanced. As shown in FIG. 7, a mechanically known bottom dead center may be used in place of point D, but the following example describes the case where point D is a singular point.

【0041】なお、A−B間、B−C間、C−D間の分
割領域毎に特性波形に基づいて圧着不良の判定を行うこ
とは、請求項2に対応して特性値のピーク(D点)近傍
より前半の波形に基づいて圧着不良の判定を行うことに
なる。このため、圧着過程での特性値はこの前半(A−
D間)だけサンプリングすればよいので、例えば、ラム
46に設定された特性値の記憶領域の容量が一定(すな
わちサンプリング可能なポイント数が一定)とすると、
全特性波形にわたって特性値をサンプリングする場合よ
りも、細かくサンプリングすることができる。したがっ
て、判定精度を高めることができる。また、逆に、サン
プリングの間隔が固定であれば、全特性波形にわたって
特性値をサンプリングする場合よりも少ない記憶容量で
よい。
It should be noted that the judgment of the pressure-bonding failure based on the characteristic waveform for each of the divided areas A-B, B-C, and C-D corresponds to the characteristic value peak ( The judgment of the pressure bonding failure is made based on the waveform in the first half from the vicinity of (D point). For this reason, the characteristic value in the crimping process is the first half (A-
Since sampling only needs to be performed during (D interval), for example, if the capacity of the storage area of the characteristic value set in the ram 46 is constant (that is, the number of points that can be sampled is constant),
Sampling can be performed more finely than when sampling characteristic values over the entire characteristic waveform. Therefore, the determination accuracy can be improved. Conversely, if the sampling interval is fixed, a smaller storage capacity is required than when sampling characteristic values over all characteristic waveforms.

【0042】次に、請求項3、4、8および9の具体例
として、各分割領域での圧着不良の検出方法について説
明する。まず、検出した特性値の各サンプリング点につ
いて、その特性値と基準波形における同じサンプリング
点の特性値との差を求め、この差のそのサンプリング点
の基準波形の特性値に対する第1の割合を演算する。な
お、基準波形の特性値の方が特性波形の特性値より大き
ければ、この第1の割合は負の値となるので、この第1
の割合を±のパーセンテージで表現する。こうして各サ
ンプリング点毎に得られた第1の割合を一旦RAM46
に記憶する。
Next, as a specific example of the third, fourth, eighth and ninth aspects, a method of detecting a press-fit defect in each divided area will be described. First, for each sampling point of the detected characteristic value, a difference between the characteristic value and the characteristic value of the same sampling point in the reference waveform is obtained, and a first ratio of this difference to the characteristic value of the reference waveform at the sampling point is calculated. I do. If the characteristic value of the reference waveform is larger than the characteristic value of the characteristic waveform, the first ratio becomes a negative value.
Is expressed as a percentage of ±. The first ratio obtained for each sampling point is temporarily stored in the RAM 46.
To memorize.

【0043】一方、各分割領域には予め上記第1の割合
に対するしきい線が設定されており、各分割領域におい
て第1の割合の絶対値がしきい線で示すしきい値の絶対
値を越えるか否かを判定する。そして、各分割領域にお
いてつぎのような処理を行う。第1の割合の絶対値がし
きい値の絶対値を越えるようなサンプリング点(以後、
「異常候補点」という。)の数を求める。一方、分割領
域内の全サンプリング点の数は分割領域を決定したとき
に決まるので、分割領域内の上記異常候補点の数と分割
領域内の全サンプリング点の数の割合(以後、「第2の
割合」という。)を求める。次に、この第2の割合と当
該分割領域に予め設定されている許容限度(パーセンテ
ージのしきい値で、例えば50%とする。)とを比較す
る。そして、全分割領域について、第2の割合が許容限
度を越える領域が一つでもあれば、圧着不良と判定す
る。上記しきい線のしきい値は、各種不良による割合波
形の現れ方と上記許容度との兼ね合いにより決定する。
なお、各しきい線の値が請求項における「しきい値」に
対応している。
On the other hand, a threshold line for the first ratio is previously set in each divided region, and the absolute value of the first ratio in each divided region is the absolute value of the threshold indicated by the threshold line. It is determined whether it exceeds. Then, the following processing is performed in each divided area. Sampling points where the absolute value of the first ratio exceeds the absolute value of the threshold
It is called “abnormal candidate point”. ). On the other hand, since the number of all sampling points in the divided area is determined when the divided area is determined, the ratio of the number of abnormal candidate points in the divided area to the number of all sampling points in the divided area (hereinafter, “second Ratio). Next, the second ratio is compared with an allowable limit (a threshold of percentage, for example, 50%) set in advance for the divided area. Then, if there is at least one region where the second ratio exceeds the allowable limit for all the divided regions, it is determined that the pressure bonding is defective. The threshold value of the threshold line is determined based on a balance between the appearance of the ratio waveform due to various defects and the tolerance.
The value of each threshold line corresponds to the “threshold” in the claims.

【0044】次に、図8〜図12に基づいて各分割領域
での判定基準となるしきい線の設定について説明する。
特性波形の各サンプリング点における前記第1の割合の
時系列データにより、図8〜図12のような第1の割合
に対応する波形が得られる。図8は良品についての波
形、図9は1/3の絶縁噛みの不良の場合の波形、図1
0は1/2の絶縁噛みの不良の場合の波形、図11は1
/7本の芯線切れの不良の場合の波形、図12は1/3
の芯線引込みの不良の場合の波形をそれぞれ示してい
る。このような割合の波形はプラス側とマイナス側に現
れるが、不良の場合には、A−B間では図9,図10の
ように主にプラス側に振れ、B−C間では、図9,図1
0のようにプラス側に振れる場合と、図11,図12の
ようにマイナス側に振れる場合がある。さらに、C−D
間では、図10,図12のように主にマイナス側に振れ
る。
Next, the setting of a threshold line as a criterion in each divided area will be described with reference to FIGS.
From the time-series data of the first ratio at each sampling point of the characteristic waveform, a waveform corresponding to the first ratio as shown in FIGS. 8 to 12 is obtained. 8 is a waveform for a non-defective product, FIG. 9 is a waveform for a case where the insulation bite is 1/3 defective, and FIG.
0 is a waveform in the case of a defective insulation bit of 1/2, and FIG.
Waveform in case of / 7 broken core wire, FIG. 12 shows 1/3
5 shows waveforms in the case of a core wire drawing failure. The waveforms having such a ratio appear on the plus side and the minus side. In the case of a failure, the waveform mainly swings to the plus side between AB and B as shown in FIGS. , FIG.
There are cases where the image swings to the plus side like 0, and cases where the image swings to the minus side as shown in FIGS. Furthermore, CD
In between, it swings mainly to the minus side as shown in FIGS.

【0045】そこで、分割領域A−B間で横軸の上側に
しきい線を設定し、分割領域B−C間は上側と下側に
しきい線,′を設定し、分割領域C−D間は下側に
しきい線を設定する。このしきい線,,′,
の4箇所を監視すれば、ほぼ全ての種類の不良が高い精
度で検出できる。また、はずれ方の組合せで不良の内容
や原因の絞り込みができる。なお、上記のような割合の
波形を以後「割合波形」という。
Therefore, a threshold line is set on the upper side of the horizontal axis between the divided areas AB, a threshold line, 'is set on the upper side and the lower side between the divided areas BC, and a threshold line is set between the divided areas CD. Set the threshold line at the bottom. This threshold line ,, ',
By monitoring these four locations, almost all types of defects can be detected with high accuracy. Further, it is possible to narrow down the content and the cause of the defect by the combination of the deviations. The waveform having the above ratio is hereinafter referred to as “ratio waveform”.

【0046】上記のようなしきい線の決定の仕方として
は、例えば次のような方法がある。圧着不良検出装置B
で制御プログラムを実行し、一種類の圧着不良について
複数回のサンプリングを行って割合波形を一つのグラフ
に重ねてプリントアウトする。これを良品と前記のよう
な各種の圧着不良について行い、例えば図16のような
プリント結果を得る。図16(A) は3本の良品の端子の
割合波形の例、図16(B) は3本の絶縁噛み端子の割合
波形の例、図16(C) は3本の芯線切れ端子の割合波形
(C) をそれぞれ示しているが、この割合波形は図16以
外のものもサンプル取りする。そして、許容度(例えば
50%)を考慮しながら各プリントアウトされたグラフ
を見比べることにより、各分割領域のしきい値を決め
る。なお、このようなしきい線を決める処理は、割合波
形のデータに対して統計処理等を行うことで、演算によ
り自動的に設定することもできる。
As a method of determining the threshold line as described above, for example, there is the following method. Crimp failure detection device B
To execute a control program, perform sampling a plurality of times for one kind of pressure-bonding failure, and print out the ratio waveform overlaid on one graph. This is performed for non-defective products and the above-described various pressure-bonding failures, and a print result such as that shown in FIG. 16 is obtained. 16 (A) is an example of a ratio waveform of three non-defective terminals, FIG. 16 (B) is an example of a ratio waveform of three insulating bit terminals, and FIG. 16 (C) is a ratio of three core broken terminals. Waveform
(C) is shown, but the ratio waveform is also sampled in a manner other than that shown in FIG. Then, the threshold value of each divided area is determined by comparing the graphs printed out while considering the allowance (for example, 50%). The processing for determining such a threshold line can be automatically set by calculation by performing statistical processing or the like on the data of the ratio waveform.

【0047】なお、特性波形の特性値の増分を示すグラ
フの特徴と、特異点の出方を知ることにより、端子の加
締め足部や加締め型の設計の良否や、お互いの適合具合
を評価することができる。例えば、図5(B) に示したよ
うに、好ましい状態は、A、B、C点が明確に現れ、波
形もなめらかである。一方、加締め足部や加締め型が好
ましくない場合は、例えば図13に示したように、A、
B点付近で山谷の数が多く出ている。
By knowing the characteristics of the graph showing the increment of the characteristic value of the characteristic waveform and how to find the singular point, it is possible to determine whether the crimped foot portion and the crimping type of the terminal are good or not, and whether they are compatible with each other. Can be evaluated. For example, as shown in FIG. 5B, the preferred state is that points A, B and C clearly appear and the waveform is smooth. On the other hand, when the caulked foot portion or the caulked type is not preferable, for example, as shown in FIG.
There are many peaks and valleys near point B.

【0048】図14および図15は圧着不良検出装置B
で実行される実施形態の制御プログラムのフローチャー
トであり、図14は判定基準設定用プログラムのフロー
チャート、図15は端子圧着状態判別プログラムのフロ
ーチャートである。圧着不良検出装置Bは、図示しない
メインフローのプログラムの実行により使用者が動作モ
ードを選択できるようになっており、圧着作業(生産)
の前段階の動作モードとしての判定基準設定モードが選
択されると判定基準設定用プログラムが実行され、圧着
作業時の動作モードとして端子圧着状態判別モードが選
択されると端子圧着状態判別プログラムが実行される。
FIG. 14 and FIG.
Is a flowchart of the control program of the embodiment executed in the step (a), FIG. 14 is a flowchart of a program for setting a criterion, and FIG. The crimping failure detecting device B allows the user to select an operation mode by executing a main flow program (not shown), and the crimping operation (production)
When the criterion setting mode is selected as the operation mode of the previous stage, the criterion setting program is executed. When the terminal crimping state determination mode is selected as the operation mode during the crimping operation, the terminal crimping state determination program is executed. Is done.

【0049】まず、図14の判定基準設定用プログラム
が起動されると、ステップS11で基準波形の取込み処
理を行う。この基準波形の取込み処理では、複数の良品
を圧着して、各々の特性波形から各サンプリング点にお
ける特性値の平均等により基準波形のデータを求めてR
AM46に記憶する。次に、ステップS12で、所定の
状態(代表的な不良状態または良状態のうち選択した一
つの状態)で圧着を実行するとともに、そのときの特性
値をサンプリングして特性波形のデータをRAM46に
記憶する。次に、ステップS13で、サンプリングした
特性値と基準波形の特性値との差(同じサンプリング
点)の基準波形の特性値に対する割合(第1の割合)を
演算し、割合波形のデータをRAM46に記憶する。
First, when the judgment criterion setting program of FIG. 14 is started, a reference waveform fetching process is performed in step S11. In this reference waveform capturing process, a plurality of non-defective products are crimped, and the data of the reference waveform is obtained from each characteristic waveform by averaging the characteristic values at each sampling point.
Store it in AM46. Next, in step S12, the crimping is performed in a predetermined state (a state selected from a representative defective state or a good state), and the characteristic value at that time is sampled and the characteristic waveform data is stored in the RAM 46. Remember. Next, in step S13, the ratio (first ratio) of the difference (same sampling point) between the sampled characteristic value and the reference waveform characteristic value to the reference waveform characteristic value is calculated, and the ratio waveform data is stored in the RAM 46. Remember.

【0050】そして、ステップS14で、現在の圧着状
態についての上記同様な割合波形のサンプリングを続行
するか否かを判定し、入力部43で続行の入力操作があ
ればステップS12に戻り、終了の入力操作があればス
テップS15に進む。ステップS15では、現在の圧着
状態についてサンプル取りした割合波形を同一グラフ上
にプリントアウトする。次に、ステップS16で別の圧
着状態について上記同様な割合波形のサンプリングを続
行するか否かを判定し、続行の入力操作があればステッ
プS12に戻り、終了の入力操作があれば処理を終了す
る。
Then, in step S14, it is determined whether or not to continue sampling of the same ratio waveform for the current crimping state, and if there is an input operation to continue in the input unit 43, the process returns to step S12 and ends. If there is an input operation, the process proceeds to step S15. In step S15, the percentage waveform sampled for the current compression state is printed out on the same graph. Next, in step S16, it is determined whether or not to continue sampling of the same ratio waveform for another crimping state. If there is an input operation to continue, the process returns to step S12, and if there is an input operation to end, the process ends. I do.

【0051】以上の処理により、良状態および複数の不
良状態について、それぞれ複数の割合波形をプリントア
ウトした結果が得られ、これらの割合波形から前述のよ
うにしきい線および許容度の決定を行う。
With the above processing, a result of printing out a plurality of ratio waveforms for the good state and a plurality of defective states is obtained, and the threshold line and the tolerance are determined from these ratio waveforms as described above.

【0052】次に、図15の端子圧着状態判別プログラ
ムが起動されると、ステップS21で、基準波形の設定
処理を行う。この基準波形の設定処理では、判定基準設
定用プログラムのステップS11の基準波形の取込み処
理でRAM46に記憶した基準波形のデータを判定処理
用として設定する。次に、ステップS22で、前記のよ
うに決定したしきい線のしきい値および許容度を判定基
準としてオペレータが入力するための入力処理を行う。
Next, when the terminal crimping state determination program shown in FIG. 15 is started, in step S21, a reference waveform setting process is performed. In the reference waveform setting process, the data of the reference waveform stored in the RAM 46 in the reference waveform acquisition process in step S11 of the determination reference setting program is set for the determination process. Next, in step S22, an input process is performed for the operator to input the threshold value and the tolerance of the threshold line determined as described above as criteria.

【0053】次に、ステップS23で、圧着を実行する
とともにそのときの特性値をサンプリングしてRAM4
6に記憶し、ステップS24で前記のように基準波形と
特性波形および特異点等に基づいて圧着の良否の判定を
行い、不良(NG)の場合はステップS25で不良品発
生の信号を出力してステップS26で特性波形と判定結
果を表示する。なお、不良品発生の信号は例えば図示し
ない装置により警報を発生する場合等に用いる。良品
(OK)の場合はそのままステップS26で特性波形と
判定結果を表示する。そして、ステップS27で、圧着
を続行するか否かを判定し、続行の入力操作があればス
テップS23に戻り、終了の入力操作があれば処理を終
了する。
Next, in step S23, the compression bonding is executed, and the characteristic value at that time is sampled.
6 and the quality of crimping is determined in step S24 based on the reference waveform, characteristic waveform, singular point, etc. as described above, and if defective (NG), a signal indicating defective product is output in step S25. In step S26, the characteristic waveform and the determination result are displayed. Note that the defective product generation signal is used, for example, when an alarm is generated by a device (not shown). In the case of a non-defective product (OK), the characteristic waveform and the determination result are displayed in step S26. Then, in step S27, it is determined whether or not to continue the crimping. If there is an input operation to continue, the process returns to step S23, and if there is an input operation to end, the process ends.

【0054】以上のように、判定基準設定用プログラム
と端子圧着状態判別プログラムとを備えているので、判
定基準の設定作業も容易になり、圧着状態の良否の判別
を安定して検出することができる。
As described above, since the program for setting the criterion and the program for judging the crimping state of the terminal are provided, the work for setting the criterion is also facilitated, and the judgment of the quality of the crimping condition can be stably detected. it can.

【0055】以上説明した圧着不良検出装置Bは前記通
信インターフェース48を用いてネットワークシステム
を構成することもできる。例えば図17のように、複数
の端子圧着装置Aのそれぞれに備えられた複数の圧着不
良検出装置BをネットワークNを介してパーソナルコン
ピュータCに接続する。各圧着不良検出装置Bで設定し
た基準波形のデータをパーソナルコンピュータCに転送
し、パーソナルコンピュータCに内蔵されたハードディ
スク等に各基準波形のデータを記憶しておく。そして、
このパーソナルコンピュータCで各圧着不良検出装置B
における基準波形を管理する。
The above-described crimping failure detecting device B can also constitute a network system using the communication interface 48. For example, as shown in FIG. 17, a plurality of crimping failure detecting devices B provided in a plurality of terminal crimping devices A are connected to a personal computer C via a network N. The data of the reference waveform set by each pressure-bonding failure detecting device B is transferred to the personal computer C, and the data of each reference waveform is stored in a hard disk or the like built in the personal computer C. And
With this personal computer C, each crimping failure detecting device B
Manages the reference waveform at.

【0056】また、各圧着不良検出装置Bにおいて、対
応する端子圧着装置の加締め型(クリンパ14やアンビ
ル17)の摩耗具合を判定することもできる。すなわ
ち、加締め型を新品の部品と交換したときに、複数の良
品の圧着によって前記のように基準波形を求めておき、
この基準波形のデータをネットワークNを介してパーソ
ナルコンピュータCに転送しパーソナルコンピュータC
のハードディスクに記憶しておく。そして、圧着不良検
出装置B側では、随時行われる圧着作業の前段階で基準
波形を設定したとき、パーソナルコンピュータC側に前
に記憶しておいた、加締め型が新品の部品のときの基準
波形のデータを読み出し、この読み出した基準波形と現
在設定した基準波形とを比較する。
In each of the crimping failure detecting devices B, the degree of wear of the crimping type (crimper 14 or anvil 17) of the corresponding terminal crimping device can be determined. That is, when the crimping die is replaced with a new part, the reference waveform is obtained as described above by crimping a plurality of non-defective products,
The data of this reference waveform is transferred to the personal computer C via the network N and the personal computer C
On the hard disk. Then, when the crimping failure detecting device B sets the reference waveform in a stage prior to the crimping operation that is performed as needed, the personal computer C stores the reference waveform when the crimping die is a new part. The waveform data is read, and the read reference waveform is compared with the currently set reference waveform.

【0057】これにより、加締め型の磨耗具合を判定す
ることこができる。加締め型が古い場合と新しい場合と
では、例えば図18のように基準波形に差が生じるの
で、両基準波形を表示部47に重ねて表示することによ
り摩耗具合を容易に判定することができ、手間がかから
ずリアルタイムで判定することができる。したがって、
加締め型の磨耗状態を効率よく、かつ、確実に把握する
ことができ、端子の圧着状態の良好な製品を効率よく製
造できる
Thus, it is possible to determine the degree of wear of the caulking type. Since a difference occurs in the reference waveform between the case where the crimping type is old and the case where the crimping type is new, as shown in FIG. 18, for example, the degree of wear can be easily determined by superimposing and displaying both reference waveforms on the display unit 47. The determination can be made in real time without any hassle. Therefore,
The wear state of the crimping type can be efficiently and reliably grasped, and a product with good crimped state of the terminal can be efficiently manufactured.

【0058】また、ネットワークNを介して各圧着不良
検出装置B間で基準波形のデータを相互に授受したり、
パーソナルコンピュータCで、生産側(端子圧着装置A
および圧着不良検出装置B側)では、現波形の可否を知
ることができ、管理側(パーソナルコンピュータC側)
では詳細分析が可能となる。したがって、例えば端子の
種類や電線サイズとの組合せ等による、圧着数、摩耗、
バリ、波形の関係を調べ、データベースを構築すること
により、異常発生前に加締め型の交換が可能になる。
Further, data of reference waveforms can be exchanged between the crimping failure detecting devices B via the network N,
On the personal computer C, the production side (terminal crimping device A
And the crimping failure detecting device B) can determine whether or not the current waveform is available, and the management side (the personal computer C side).
Now, a detailed analysis is possible. Therefore, the number of crimps, abrasion,
By examining the relationship between burrs and waveforms and building a database, it becomes possible to replace the caulking mold before an abnormality occurs.

【0059】以上の実施形態では圧着時の特性値とし
て、ラム11の下ブロック11Aの上下方向の変位量す
なわちラム11の変形量を検出するようにしているが、
例えば、図19に示したように、端子圧着装置Aの上下
のフレームであるケーシング1と側板3の間に位置検出
装置100を設けるようにしてもよい。すなわち、端子
を圧着する端子圧着装置は、圧着時の反力を受けてフレ
ームが変形する。その変形量はフレームの構造により剛
性が異なるので端子圧着装置の種類により違いがある。
つまり、変形量が大きい端子圧着装置や小さい端子圧着
装置等が存在する。変形量がほとんどゼロに等しい端子
圧着装置も考えられるが、実用的ではない。つまり、実
用される端子圧着装置は、基本的に変形するので、この
変形量を特性として用いることができる。このことは、
フレームの変形量を測定するだけでなく、実施形態のラ
ムと同様にピストン−クランク機構に切欠き部をつけバ
ネ性を持たせるなどすれば、この検出部を内蔵させるこ
とが可能となる。
In the above embodiment, the amount of vertical displacement of the lower block 11A of the ram 11, that is, the amount of deformation of the ram 11, is detected as the characteristic value during crimping.
For example, as shown in FIG. 19, the position detection device 100 may be provided between the casing 1 which is the upper and lower frames of the terminal crimping device A and the side plate 3. That is, in the terminal crimping device for crimping the terminal, the frame is deformed by receiving the reaction force at the time of crimping. The amount of deformation varies depending on the type of terminal crimping device because the rigidity varies depending on the structure of the frame.
That is, there are a terminal crimping device and a terminal crimping device having a large deformation amount. Although a terminal crimping device whose deformation amount is almost equal to zero is conceivable, it is not practical. That is, a practical terminal crimping device is basically deformed, and thus the amount of deformation can be used as a characteristic. This means
In addition to measuring the amount of deformation of the frame, if the piston-crank mechanism is provided with a notch to provide spring properties, as in the case of the ram of the embodiment, it is possible to incorporate this detection unit.

【0060】また、位置検出装置に限らず、フレームが
変形する過程等を加速度センサで測定し、その測定値で
圧着時の特性波形を取っても良品と不良品を識別するの
に十分なデータを得ることができる。
In addition to the position detecting device, even if a process such as deformation of the frame is measured by an acceleration sensor and the measured value is used to obtain a characteristic waveform at the time of crimping, sufficient data for discriminating a good product from a defective product can be obtained. Can be obtained.

【0061】さらに、本発明において、特性値は実施形
態のように圧着時のラムやフレーム等の変形量に限ら
ず、圧力(荷重)を特性値としてもよいことはいうまで
もない。例えば、アンビルに加わる圧力、クリンパに加
わる圧力、ラムに加わる圧力などを圧力センサで検出し
て、これを特性値としてするようにしてもよい。
Further, in the present invention, the characteristic value is not limited to the deformation amount of the ram or the frame at the time of crimping as in the embodiment, and it goes without saying that the pressure (load) may be used as the characteristic value. For example, the pressure applied to the anvil, the pressure applied to the crimper, the pressure applied to the ram, or the like may be detected by a pressure sensor and used as a characteristic value.

【0062】また、特性値を検出するセンサ等の種類に
よっては特性値の出方が異なることから増分値の波形も
図5(B) と異なることもあり、例えば図20のような波
形となることもある。この場合でも、特性値のゼロクロ
ス点やピーク点により、図6と同様な圧着過程の1サイ
クル中での特別な点としてA点〜D点を求めることがで
きる。
Further, the waveform of the increment value may be different from that of FIG. 5B because the way of outputting the characteristic value differs depending on the type of the sensor or the like for detecting the characteristic value. For example, the waveform is as shown in FIG. Sometimes. Also in this case, the points A to D can be obtained as special points in one cycle of the crimping process similar to FIG. 6 based on the zero cross points and peak points of the characteristic values.

【0063】また、実施形態では、各分割領域において
圧着不良を検出する際に、前記異常候補点の数と分割領
域内の全サンプリング点の数の割合すなわち第2の割合
を求め、この第2の割合が許容限度を越えるか否かで良
不良を検出しているが、これに限らず他の外の方法で良
不良を検出するようにしてもよい。例えば、上記第1の
割合としきい値との差分を求め、その差分をその分割領
域内について加算し、差分の総和を求める。また、その
分割領域内の各サンプリング点での第1の割合を全て加
算して第1の割合の総和を求める。そして、差分の総和
の第1の割合の総和に対する割合を求め、この割合が当
該分割領域に予め設定されている許容限度を越えるか否
かで良不良を検出するようにしてもよい。
Further, in the embodiment, when detecting a compression failure in each divided area, a ratio between the number of the abnormal candidate points and the number of all sampling points in the divided area, that is, a second ratio is obtained. Is detected based on whether or not the ratio exceeds the allowable limit. However, the present invention is not limited to this, and another method may be used to detect the defective. For example, a difference between the first ratio and the threshold value is obtained, and the difference is added in the divided area to obtain a total sum of the differences. Further, the sum of the first ratios is obtained by adding all the first ratios at each sampling point in the divided area. Then, a ratio of the sum of the differences to the sum of the first ratio may be obtained, and the pass / fail may be detected based on whether or not the ratio exceeds an allowable limit set in advance for the divided area.

【0064】さらに、本発明における圧着不良の判定は
実施形態のものに限らず、基準波形から特異点を求め、
この特異点で分割した分割領域で判定を行うものであれ
ばよい。例えば、圧着過程における特性値を、分割領域
内で加算し、その分割領域内での基準波形の特性値の加
算値(予め求めておくことができる。)と、上記圧着過
程における特性値の加算値とを比較し、この加算値のず
れの程度によって良不良を判定するようにしてもよい。
なお、このような方法は、特性波形あるいは基準波形で
囲まれる部分の面積を比較することに相当する。
Further, the judgment of the pressure-bonding failure in the present invention is not limited to the embodiment, but a singular point is obtained from the reference waveform.
What is necessary is just to make a determination in the divided area divided at the singular point. For example, the characteristic value in the crimping process is added in the divided region, and the sum of the characteristic value of the reference waveform in the divided region (which can be obtained in advance) and the characteristic value in the crimping process are added. The values may be compared with each other, and the quality may be determined based on the degree of deviation of the added value.
Note that such a method corresponds to comparing the area of a portion surrounded by the characteristic waveform or the reference waveform.

【0065】また、実施形態で対象としている端子圧着
装置はサーボモータの駆動により端子圧着を行うもので
あるが、本発明はどのような圧着機構であってもよいこ
とはいうまでもない。
Further, the terminal crimping apparatus targeted in the embodiment performs the terminal crimping by driving a servomotor, but it goes without saying that the present invention may be any crimping mechanism.

【0066】[0066]

【発明の効果】以上説明したように、本発明の請求項1
の端子圧着状態判別方法または請求項6の端子圧着状態
判別装置によれば、圧着過程の特性値の基準波形の増分
値から該基準波形の特異点を求め、該基準波形を該特異
点で分割し、該分割した領域で特性波形に基づいて端子
の圧着状態を判別するようにしたので、端子の圧着状態
の良否の判別を安定して行うことができ、細かな圧着不
良まで検出できる。したがって、端子の圧着状態の良好
な製品を効率よく製造できる。
As described above, according to the first aspect of the present invention,
According to the terminal crimping state determining method or the terminal crimping state determining apparatus of claim 6, a singular point of the reference waveform is obtained from an increment of the reference waveform of the characteristic value in the crimping process, and the reference waveform is divided by the singular point. Since the crimped state of the terminal is determined based on the characteristic waveform in the divided area, the quality of the crimped state of the terminal can be stably determined, and even a fine crimping failure can be detected. Therefore, it is possible to efficiently manufacture a product having a good crimped state of the terminal.

【0067】請求項2の端子圧着状態判別方法または請
求項7の端子圧着状態判別装置によれば、圧着状態を判
別するための特性波形を求める際に、特性値のピーク近
傍より前半の領域差異だけを求めればよいので、全特性
波形を求める場合よりも、特性値のサンプリング点の分
解能を高くすることができ、判別精度が高まる。
According to the terminal crimping state determining method of the second aspect or the terminal crimping state determining apparatus of the seventh aspect, when determining the characteristic waveform for determining the crimping state, the area difference in the first half from the vicinity of the peak of the characteristic value. , The resolution of the sampling points of the characteristic values can be made higher than in the case of obtaining all the characteristic waveforms, and the discrimination accuracy increases.

【0068】請求項3の端子圧着状態判別方法または請
求項8の端子圧着状態判別装置によれば、請求項1と同
様な作用効果が得られるとともに、特性波形と基準波形
の比較に、特性値の特性波形との差の基準波形に対する
割合を用いるので、判定基準となるしきい値の値を分割
した領域内で一定の値とすることができ、演算等が容易
になる。
According to the terminal crimp state determining method of the third aspect or the terminal crimp state determining apparatus of the eighth aspect, the same operation and effect as those of the first aspect can be obtained, and the characteristic value is compared with the reference waveform by the characteristic value. Since the ratio of the difference from the characteristic waveform to the reference waveform is used, the threshold value serving as the determination reference can be set to a constant value within the divided region, and the calculation and the like are facilitated.

【0069】請求項4の端子圧着状態判別方法または請
求項9の端子圧着状態判別装置によれば、請求項3と同
様な作用効果が得られるとともに、特性値の特性波形と
の差の基準波形に対する割合がしきい値を超過する程度
で判別するので、特性値のノイズ等による検出誤り等を
防止でき安定した判別を行うことができる。したがっ
て、端子の圧着状態の良好な製品を効率よく製造でき
る。
According to the terminal crimping state determining method of the fourth aspect or the terminal crimping state determining apparatus of the ninth aspect, the same operation and effect as those of the third aspect are obtained, and the reference waveform of the difference between the characteristic value and the characteristic waveform is obtained. Is determined only when the ratio with respect to the threshold value exceeds the threshold value, so that a detection error or the like due to noise or the like in the characteristic value can be prevented, and stable determination can be performed. Therefore, it is possible to efficiently manufacture a product having a good crimped state of the terminal.

【0070】請求項5の端子圧着状態判別方法によれ
ば、請求項3または4と同様な作用効果が得られるとと
もに、端子圧着状態判別装置としてコンピュータを利用
し、判定基準設定用プログラムと端子圧着状態判別プロ
グラムとを実行することで、基準波形およびしきい値の
設定作業、圧着工程での圧着不良検出等の作業性が向上
する。したがって、端子の圧着状態の良好な製品を効率
よく製造できる。
According to the terminal crimping state determining method of claim 5, the same operation and effect as in claim 3 or 4 can be obtained, and a computer is used as a terminal crimping state determining device, and a judgment reference setting program and a terminal crimping state are determined. By executing the state determination program, the workability of setting reference waveforms and thresholds, and detecting crimping failures in the crimping process is improved. Therefore, it is possible to efficiently manufacture a product having a good crimped state of the terminal.

【0071】請求項10の加締め型の摩耗状態検出方法
によれば、加締め型の摩耗状態は時には端子圧着装置で
正常に圧着されたときの特性波形が記憶しておいた基準
波形からずれるので、加締め型の摩耗状態を検出するこ
とができ、異常発生前に型の交換が可能になる。したが
って、端子の圧着状態の良好な製品を効率よく製造でき
る。
According to the crimping type wear state detecting method of the tenth aspect, the crimping type wear state sometimes deviates from the reference waveform in which the characteristic waveform when the terminal crimping device is normally crimped is stored. Therefore, the state of wear of the crimping die can be detected, and the die can be replaced before an abnormality occurs. Therefore, it is possible to efficiently manufacture a product having a good crimped state of the terminal.

【0072】請求項11の加締め型の摩耗状態検出方法
によれば、複数の端子圧着装置間で基準波形の授受が可
能となり、生産側では、現在の基準波形の可否を知るこ
とができ、加締め型の摩耗状態を検出することができ、
異常発生前に型の交換が可能になる。さらに、コンピュ
ータ側では例えば基準波形の詳細な分析が可能となる。
したがって、端子の圧着状態の良好な製品を効率よく製
造できる。
According to the crimping type wear state detecting method of the eleventh aspect, it is possible to transmit and receive a reference waveform between a plurality of terminal crimping devices, so that the production side can know whether or not the current reference waveform is available. The crimping type wear state can be detected,
The mold can be exchanged before an abnormality occurs. Further, for example, the computer can perform detailed analysis of the reference waveform.
Therefore, it is possible to efficiently manufacture a product having a good crimped state of the terminal.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明を適用した端子圧着装置の正面図であ
る。
FIG. 1 is a front view of a terminal crimping device to which the present invention is applied.

【図2】同端子圧着装置の側面図である。FIG. 2 is a side view of the terminal crimping apparatus.

【図3】実施形態における位置検出装置の取付状態を示
す図である。
FIG. 3 is a diagram illustrating an attached state of the position detecting device according to the embodiment.

【図4】実施形態に係わる圧着不良検出装置Bのブロッ
ク図である。
FIG. 4 is a block diagram of a pressure-bonding failure detection device B according to the embodiment.

【図5】実施形態に係わる基準波形と増分値の波形およ
び特異点の例を示す図である。
FIG. 5 is a diagram illustrating an example of a reference waveform, a waveform of an increment value, and a singular point according to the embodiment.

【図6】実施形態におけるクリンパ、アンビル、端子の
加締め足部および芯線の圧着過程の断面図である。
FIG. 6 is a cross-sectional view of a crimping process of the crimper, the anvil, the crimping foot portion of the terminal, and the core wire in the embodiment.

【図7】実施形態に関わる特異点で分割した領域と不良
状態の種類に応じた特性波形との関係の一例を示す図で
ある。
FIG. 7 is a diagram illustrating an example of a relationship between a region divided by a singular point and a characteristic waveform according to a type of a defective state according to the embodiment;

【図8】実施形態における良品についての割合波形とし
きい線を示す図である。
FIG. 8 is a diagram showing a ratio waveform and a threshold line for non-defective products in the embodiment.

【図9】実施形態における1/3の絶縁噛みの不良の場
合の割合波形としきい線を示す図である。
FIG. 9 is a diagram showing a ratio waveform and a threshold line in the case of a failure of 1/3 of the insulating bit in the embodiment.

【図10】実施形態における1/2の絶縁噛みの不良の
場合の割合波形としきい線を示す図である。
FIG. 10 is a diagram showing a ratio waveform and a threshold line in the case of a defective insulation bite of に お け る in the embodiment.

【図11】実施形態における1/7本の芯線切れの不良
の場合の割合波形としきい線を示す図である。
FIG. 11 is a diagram showing a ratio waveform and a threshold line in the case of a failure of 1/7 core wire in the embodiment.

【図12】実施形態における1/3の芯線引込みの不良
の場合の割合波形としきい線を示す図である。
FIG. 12 is a diagram showing a ratio waveform and a threshold line in the case of a 1/3 core wire drawing failure in the embodiment.

【図13】実施形態における加締め足部や加締め型が好
ましくない場合の増分値の波形および特異点の例を示す
図である。
FIG. 13 is a diagram showing an example of a waveform of an increment value and a singular point when a crimping foot or a crimping type is not preferable in the embodiment.

【図14】実施形態における判定基準設定用プログラム
のフローチャートである。
FIG. 14 is a flowchart of a determination criterion setting program in the embodiment.

【図15】実施形態における端子圧着状態判別プログラ
ムのフローチャートである。
FIG. 15 is a flowchart of a terminal crimping state determination program in the embodiment.

【図16】実施形態における判定基準設定用の割合波形
のプリントアウト結果の一例を示す図である。
FIG. 16 is a diagram illustrating an example of a printout result of a ratio waveform for determination criterion setting in the embodiment.

【図17】実施形態における複数の圧着不良検出装置と
パーソナルコンピュータで構成したネットワークシステ
ムの概念図である。
FIG. 17 is a conceptual diagram of a network system including a plurality of pressure-bonding failure detection devices and a personal computer according to the embodiment.

【図18】実施形態における加締め型が古い場合と新し
い場合との基準波形の差を示す図である。
FIG. 18 is a diagram showing a difference in reference waveform between a case where the crimping type is old and a case where the crimping type is new according to the embodiment.

【図19】実施形態における端子圧着装置のフレームの
変形を特性値として検出する場合の構成の一例を示す図
である。
FIG. 19 is a diagram illustrating an example of a configuration in a case where deformation of a frame of the terminal crimping device according to the embodiment is detected as a characteristic value.

【図20】実施形態における他の増分値の波形および特
異点の例を示す図である。
FIG. 20 is a diagram illustrating an example of a waveform of another increment value and a singular point according to the embodiment.

【図21】正常圧着時および不良圧着時の特性波形の違
いの例を示す図である。
FIG. 21 is a diagram illustrating an example of a difference between characteristic waveforms at the time of normal pressure bonding and at the time of defective pressure bonding.

【図22】絶縁噛みの不良状態とそのときの基準波形と
特性波形の差を示す図である。
FIG. 22 is a diagram illustrating a defective state of an insulation bite and a difference between a reference waveform and a characteristic waveform at that time.

【図23】芯線切れの不良状態とそのときの基準波形と
特性波形の差を示す図である。
FIG. 23 is a diagram illustrating a defective state of a broken core wire and a difference between a reference waveform and a characteristic waveform at that time.

【図24】芯線不足の不良状態とそのときの基準波形と
特性波形の差を示す図である。
FIG. 24 is a diagram illustrating a defect state in which a core line is insufficient, and a difference between a reference waveform and a characteristic waveform at that time.

【符号の説明】[Explanation of symbols]

11 ラム 11a 切欠き部 14 クリンパ 17 アンビル 41 アンプ 42 A/D変換器 43 入力部 44 CPU 45 ROM 46 RAM 47 表示部 48 通信インターフェース 50 加締め足部 60 芯線 100 位置検出装置 A 端子圧着装置 B 圧着不良検出装置 C パーソナルコンピュータ N ネットワーク 11 Ram 11a Notch 14 Crimper 17 Anvil 41 Amplifier 42 A / D Converter 43 Input 44 CPU 45 ROM 46 RAM 47 Display 48 Communication Interface 50 Crimped Foot 60 Core 100 Position Detector A Terminal Crimping Device B Crimping Failure detection device C Personal computer N Network

Claims (11)

【特許請求の範囲】[Claims] 【請求項1】 端子圧着装置で電線の芯線に端子を圧着
する圧着過程で得られる特性値の特性波形に基づいて、
該端子の圧着状態を判別する端子圧着状態判別方法にお
いて、 正常に圧着されたときの前記特性波形から基準波形を求
めるとともに、該基準波形の増分値から該基準波形の特
異点を求め、該基準波形を該特異点で分割し、該分割し
た領域で前記圧着過程で得られる特性値の特性波形に基
づいて端子の圧着状態を判別することを特徴とする端子
圧着状態判別方法。
A terminal crimping device crimps a terminal to a core of an electric wire based on a characteristic waveform of a characteristic value obtained in a crimping process.
In a terminal crimping state determining method for determining a crimping state of the terminal, a reference waveform is obtained from the characteristic waveform when the terminal is crimped normally, and a singular point of the reference waveform is obtained from an increment value of the reference waveform. A method of determining a terminal crimping state, comprising: dividing a waveform at the singular point; and determining a crimping state of the terminal in the divided region based on a characteristic waveform of a characteristic value obtained in the crimping process.
【請求項2】 端子圧着装置で電線の芯線に端子を圧着
する圧着過程で得られる特性値の特性波形に基づいて、
該端子の圧着状態を判別する端子圧着状態判別方法にお
いて、 正常に圧着されたときの前記特性波形から基準波形を求
めるとともに、該基準波形の増分値から該基準波形の特
異点を求め、 該基準波形のうち、前記特異点から検出される特性値の
ピーク近傍より前半の領域で、前記圧着過程で得られる
特性値の特性波形に基づいて端子の圧着状態を判別する
ことを特徴とする端子圧着状態判別方法。
2. A method for crimping a terminal to a core wire of an electric wire by a terminal crimping device based on a characteristic waveform of a characteristic value obtained in a crimping process.
In a terminal crimping state determining method for determining a crimping state of the terminal, a reference waveform is obtained from the characteristic waveform when the terminal is crimped normally, and a singular point of the reference waveform is obtained from an increment value of the reference waveform. In the first half of the waveform, near the peak of the characteristic value detected from the singular point, the terminal crimping state is determined based on the characteristic waveform of the characteristic value obtained in the crimping process. State determination method.
【請求項3】 前記基準波形と前記圧着過程で得られる
特性値の特性波形との差を該基準波形の割合で捉え、該
割合を前記分割した領域に予め設定されたしきい値と比
較して端子の圧着状態を判別することを特徴とする請求
項1記載の端子圧着状態判別方法。
3. A difference between the reference waveform and a characteristic waveform of a characteristic value obtained in the crimping process is detected as a ratio of the reference waveform, and the ratio is compared with a threshold value preset in the divided area. 2. The method for judging a crimped state of a terminal according to claim 1, further comprising judging a crimped state of the terminal by using a terminal.
【請求項4】 前記分割した領域についての前記割合が
前記しきい値を超過する程度に基づいて端子の圧着状態
を判別することを特徴とする請求項3記載の端子圧着状
態判別方法。
4. The terminal crimping state determination method according to claim 3, wherein the crimping state of the terminal is determined based on a degree of the ratio of the divided area exceeding the threshold value.
【請求項5】 コンピュータで判定基準設定用プログラ
ムと端子圧着状態判別プログラムとを実行し、 前記判定基準設定用プログラムの実行により前記基準波
形および前記しきい値を設定するとともに、前記端子圧
着状態判別プログラムの実行により、前記設定された基
準波形およびしきい値に基づいて端子の圧着状態を判別
することを特徴とする請求項3または4記載の端子圧着
状態判別方法。
5. A computer for executing a criterion setting program and a terminal crimping state determination program, setting the reference waveform and the threshold value by executing the criterion setting program, and determining the terminal crimping state. 5. The method according to claim 3, wherein a crimping state of the terminal is determined based on the set reference waveform and the threshold value by executing the program.
【請求項6】 端子圧着装置で電線の芯線に端子を圧着
する圧着過程で得られる特性値の特性波形に基づいて、
該端子の圧着状態を判別する端子圧着状態判別装置にお
いて、 正常に圧着されたときの前記特性波形から求めた基準波
形の増分値から該基準波形の特異点を求める特異点検出
手段と、 該基準波形を該特異点で分割し、該分割した領域で前記
圧着過程で得られる特性値の特性波形に基づいて端子の
圧着状態を判別する判別手段と、を備えたことを特徴と
する端子圧着状態判別装置。
6. A method for crimping a terminal to a core wire of an electric wire by a terminal crimping device based on a characteristic waveform of a characteristic value obtained in a crimping process.
A terminal crimping state determining device for determining a crimping state of the terminal; a singular point detecting means for determining a singular point of the reference waveform from an increment value of the reference waveform obtained from the characteristic waveform when the terminal is crimped normally; Determining a terminal crimping state based on a characteristic waveform of a characteristic value obtained in the crimping process in the divided region by dividing the waveform at the singular point; Discriminator.
【請求項7】 端子圧着装置で電線の芯線に端子を圧着
する圧着過程で得られる特性値の特性波形に基づいて、
該端子の圧着状態を判別する端子圧着状態判別装置にお
いて、 正常に圧着されたときの前記特性波形から求めた基準波
形を増分値から該基準波形の特異点を求める特異点検出
手段と、 該基準波形のうち、前記特異点から検出される特性値の
ピーク近傍より前半の領域で、前記圧着過程で得られる
特性値の特性波形に基づいて端子の圧着状態を判別する
判別手段と、を備えたことを特徴とする端子圧着状態判
別装置。
7. Based on a characteristic waveform of a characteristic value obtained in a crimping process of crimping a terminal to a core wire of an electric wire by a terminal crimping device,
A terminal crimping state determining device for determining a crimping state of the terminal; a singular point detecting means for determining a singular point of the reference waveform from an increment value of a reference waveform obtained from the characteristic waveform when the terminal is crimped normally; Discriminating means for judging the crimping state of the terminal based on the characteristic waveform of the characteristic value obtained in the crimping process in a region in the first half of the vicinity of the peak of the characteristic value detected from the singular point in the waveform. A terminal crimping state determination device, characterized in that:
【請求項8】 前記判別手段は、前記基準波形と前記圧
着過程で得られる特性値の特性波形との差を該基準波形
の割合で捉え、該割合を前記分割した領域に予め設定さ
れたしきい値と比較して端子の圧着状態を判別すること
を特徴とする請求項6記載の端子圧着状態判別装置。
8. The method according to claim 1, wherein the determining unit captures a difference between the reference waveform and a characteristic waveform of a characteristic value obtained in the crimping process as a ratio of the reference waveform, and sets the ratio in the divided area in advance. 7. The terminal crimping state judging device according to claim 6, wherein the crimping state of the terminal is judged by comparing with a threshold value.
【請求項9】 前記判別手段は、前記分割した領域につ
いての前記割合が前記しきい値を超過する程度に基づい
て端子の圧着状態を判別することを特徴とする請求項8
記載の端子圧着状態判別装置。
9. The terminal according to claim 8, wherein the determining unit determines the crimping state of the terminal based on a degree of the ratio of the divided area exceeding the threshold value.
A terminal crimping state determination device as described in the above.
【請求項10】 端子圧着装置で正常な加締め型を用い
て電線の芯線に端子を圧着する圧着過程で得られる特性
値の基準波形を求めて該基準波形を記憶しておき、前記
端子圧着装置で正常に圧着されたときの特性波形と前記
記憶しておいた基準波形とを比較することにより、前記
加締め型の摩耗状態を検出するようにしたことを特徴と
する加締め型の摩耗状態検出方法。
10. A terminal crimping device obtains a reference waveform of a characteristic value obtained in a crimping process of crimping a terminal to a core wire of an electric wire using a normal crimping die and stores the reference waveform, and stores the reference waveform. The crimping type wear is characterized by detecting a state of wear of the crimping type by comparing a characteristic waveform when the device is crimped normally with the reference waveform and the stored reference waveform. State detection method.
【請求項11】 複数の端子圧着装置の各々に圧着不良
検出装置を設けるとともに、該各々の圧着不良検出装置
とコンピュータによりネットワークを形成し、前記各々
の圧着不良検出装置に請求項10の加締め型の摩擦状態
検出方法を適用し、各圧着不良検出装置にそれぞれ記憶
されている前記基準波形を前記コンピュータにより管理
することにより、各圧着不良検出装置で他の圧着不良検
出装置の基準波形を参照できるようにし、各圧着不良検
出装置において前記参照した基準波形と前記記憶してい
る基準波形とを比較することにより加締め型の摩耗状態
を検出するようにしたことを特徴とする加締め型の摩耗
状態検出方法。
11. A crimping failure detecting device is provided for each of the plurality of terminal crimping devices, and a network is formed by the respective crimping failure detecting devices and a computer, and each of the crimping failure detecting devices is caulked. By applying the mold friction state detection method and managing the reference waveforms stored in each of the crimping failure detection devices by the computer, each crimping failure detection device refers to the reference waveform of another crimping failure detection device. A crimping type of crimping type, wherein the crimping failure detecting device detects the worn state of the crimping type by comparing the referenced reference waveform with the stored reference waveform in each of the crimping failure detection devices. Wear state detection method.
JP20873999A 1999-07-23 1999-07-23 Terminal crimping state discriminating method and apparatus, and caulking die wear state detecting method Expired - Lifetime JP3627212B2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
JP20873999A JP3627212B2 (en) 1999-07-23 1999-07-23 Terminal crimping state discriminating method and apparatus, and caulking die wear state detecting method
TR2000/02112A TR200002112A2 (en) 1999-07-23 2000-07-21 Terminal connection closure quality decision method / device and detection method of friction wear of the connection closure mold
EP20000115749 EP1071173B1 (en) 1999-07-23 2000-07-21 Terminal crimping quality decision method/device and frictional wear state detection method of crimping die
PT00115749T PT1071173E (en) 1999-07-23 2000-07-21 DETERMINATION METHOD / DEVICE FOR CRIMPING OF TERMINALS AND METHODS OF DETECTION OF STATE OF WEAR BY FRICTION OF CRUSHING PUNCH
CZ20002697A CZ298822B6 (en) 1999-07-23 2000-07-21 Terminal crimping quality decision method/device
DE2000620304 DE60020304T2 (en) 1999-07-23 2000-07-21 Arrangement and method for checking the crimp quality of contacts and method for determining the friction wear of the Crimpmatritze

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20873999A JP3627212B2 (en) 1999-07-23 1999-07-23 Terminal crimping state discriminating method and apparatus, and caulking die wear state detecting method

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JP3627212B2 JP3627212B2 (en) 2005-03-09

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JP (1) JP3627212B2 (en)
CZ (1) CZ298822B6 (en)
DE (1) DE60020304T2 (en)
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TR (1) TR200002112A2 (en)

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JP2017220417A (en) * 2016-06-10 2017-12-14 新明和工業株式会社 Quality judging apparatus of terminal crimping and method of judging quality
WO2017212809A1 (en) * 2016-06-10 2017-12-14 新明和工業株式会社 Terminal crimp quality evaluation device and quality evaluation method
JP2020518094A (en) * 2017-04-25 2020-06-18 コマツクス・ホールデイング・アー・ゲー Method for aligning a crimper of a first tool of a crimping press with an anvil of a second tool of the crimping press and a crimping press device
JP2020518093A (en) * 2017-04-25 2020-06-18 コマツクス・ホールデイング・アー・ゲー Method for aligning a crimper of a first tool of a crimping press with an anvil of a second tool of the crimping press and a crimping press device
US11128095B2 (en) 2017-04-25 2021-09-21 Komax Holding Ag Method for aligning a crimper of a first tool of a crimping press relative to an anvil of a second tool of the crimping press and a crimping press device
US11329441B2 (en) 2017-04-25 2022-05-10 Komax Holding Ag Method for aligning a crimper of a first tool of a crimping press relative to an anvil of a second tool of the crimping press

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CZ298822B6 (en) 2008-02-13
EP1071173A2 (en) 2001-01-24
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PT1071173E (en) 2005-09-30
DE60020304T2 (en) 2006-05-04

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