CN111751034A - Device for determining whether terminal crimping state is qualified or not, and terminal crimping processing device - Google Patents
Device for determining whether terminal crimping state is qualified or not, and terminal crimping processing device Download PDFInfo
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- CN111751034A CN111751034A CN201910248305.7A CN201910248305A CN111751034A CN 111751034 A CN111751034 A CN 111751034A CN 201910248305 A CN201910248305 A CN 201910248305A CN 111751034 A CN111751034 A CN 111751034A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
- G01L5/0061—Force sensors associated with industrial machines or actuators
- G01L5/0076—Force sensors associated with manufacturing machines
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/04—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for forming connections by deformation, e.g. crimping tool
- H01R43/058—Crimping mandrels
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Abstract
Even if there is a deviation in the time axis direction between the pressure waveform and the reference waveform, the pressure-bonding acceptance determination is performed as appropriately as possible. A device for judging whether a terminal is in a pressure-bonding state is provided, which judges whether a terminal is in a pressure-bonding state or not, determines a physical quantity corresponding to a pressure change speed based on a pressure waveform detected with the pressure-bonding of the terminal, and judges whether the terminal is in a pressure-bonding state or not based on the physical quantity.
Description
Technical Field
The present invention relates to a technique for determining whether or not a terminal is in a crimped state when crimping the terminal to an electric wire.
Background
As a method of detecting a failure in the terminal crimping state, there is a method disclosed in patent document 1. In patent document 1, an output waveform from a pressure sensor at the time of pressure bonding is compared with a reference waveform, and when the difference exceeds a predetermined tolerance, it is determined that the pressure bonding is defective.
Documents of the prior art
Patent document
Patent document 1: japanese patent laid-open publication No. 2005-135820
Disclosure of Invention
However, in the technique disclosed in patent document 1, if the output waveform from the pressure sensor and the reference waveform are shifted in the time axis direction, the accuracy of the pressure acceptance determination becomes poor.
Therefore, an object of the present invention is to perform pressure-bonding acceptance determination as appropriately as possible even if there is a deviation in the time axis direction between the pressure waveform and the reference waveform.
To solve the above problems, a terminal crimping state acceptance/rejection determination device according to claim 1 is a terminal crimping state acceptance/rejection determination device that performs terminal crimping acceptance/rejection determination, and includes: a pressure waveform input unit that inputs a pressure waveform detected in association with crimping of the terminal; and a quality determination unit for determining a physical quantity corresponding to the pressure change speed based on the pressure waveform and performing pressure welding quality determination based on the physical quantity.
The pressure-bonding acceptance determination unit performs pressure-bonding acceptance determination by comparing a reference physical quantity obtained based on a predetermined reference waveform as a value that varies according to a pressure change rate in a predetermined pressure range in a pressure-bonding intermediate period with a physical quantity obtained based on the pressure waveform as a value that varies according to a pressure change rate in the predetermined pressure range in the pressure-bonding intermediate period.
A device according to claim 2 is the device according to claim 1, wherein the pressure-bonding-state-of-acceptability determining unit determines whether or not the pressure is acceptable based on a degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined initial pressure-bonding period, and determines whether or not the pressure is acceptable based on a degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined final pressure-bonding period.
The 3 rd means is a terminal crimping state qualification determination device for performing a determination of whether or not crimping of a terminal is qualified, comprising: a pressure waveform input unit that inputs a pressure waveform detected in association with crimping of the terminal; and a pressure waveform determination unit that determines a physical quantity corresponding to a pressure change speed based on the pressure waveform, performs pressure acceptance determination based on the physical quantity, performs pressure acceptance determination based on a degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined pressure initial period, performs pressure acceptance determination based on a degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined pressure final period, and further compares a reference physical quantity determined as an inclination value corresponding to the pressure change speed in a predetermined pressure range between a pressure range of the reference waveform in the predetermined pressure initial period and a pressure range of the reference waveform in the predetermined pressure final period with the physical quantity determined as an inclination value corresponding to the pressure change speed in the predetermined pressure range based on the pressure waveform, thereby, whether the pressure welding is qualified or not is judged.
The terminal crimping device according to claim 4 includes: a pair of crimping dies for crimping the terminals; a crimping drive section that relatively moves the pair of crimping dies toward or away from each other; a pressure detection unit provided in the pair of crimping dies and detecting a pressure waveform accompanying crimping of the terminal; the device for determining whether or not a terminal pressure-bonded state is acceptable according to any one of claims 1 to 3.
According to the aspect 1, since the pressure acceptance/rejection determination is performed based on the physical quantity corresponding to the pressure change speed, the pressure acceptance/rejection determination can be performed as appropriately as possible even if there is a deviation in the time axis direction between the pressure waveform and the reference waveform.
According to the aspect 1, the physical quantity corresponding to the pressure change speed can be compared in the pressure range of the same degree using the reference waveform and the pressure waveform, and the pressure acceptance or rejection can be determined with higher accuracy.
Generally, the pressure change is small in the initial stage and the final stage of the pressure bonding. Therefore, the influence of the deviation in the time axis direction of the pressure waveform and the reference waveform is small. Therefore, as in claim 2, it is possible to perform more appropriate pressure welding acceptance determination based on the degree of correlation between the pressure waveform and the predetermined reference waveform in the initial pressure welding period and the final pressure welding period.
In addition, generally, the pressure change is small in the initial stage and the final stage of the pressure bonding, and the pressure change is large between the initial stage and the final stage of the pressure bonding. Therefore, as in claim 3, it is possible to perform more appropriate pressure welding acceptance determination based on the degree of correlation between the pressure waveform and the predetermined reference waveform in the initial pressure welding period and the final pressure welding period. Further, by comparing the reference physical quantity obtained as a value corresponding to the pressure change rate in the predetermined pressure range between the pressure range of the reference waveform in the predetermined initial pressure bonding period and the pressure range of the reference waveform in the predetermined final pressure bonding period with the physical quantity obtained as a value corresponding to the pressure change rate in the predetermined pressure range based on the pressure waveform, even if there is a deviation in the time axis direction between the pressure waveform and the reference waveform, the physical quantity corresponding to the pressure change rate can be compared in the pressure range of the same degree, and the pressure bonding acceptability can be determined with higher accuracy.
Further, according to the 4 th aspect, since the pressure acceptance/rejection determination is performed based on the physical quantity corresponding to the pressure change speed, the pressure acceptance/rejection determination can be performed as appropriately as possible even if there is a deviation in the time axis direction between the pressure waveform and the reference waveform.
Drawings
Fig. 1 is a schematic front view showing a terminal crimping device.
Fig. 2 is a schematic side view showing the terminal crimping mechanism device.
Fig. 3 is a block diagram showing a hardware configuration of the terminal crimping state qualification determination device.
Fig. 4 is a functional block diagram of the terminal crimping state acceptance/rejection determination device.
Fig. 5 is a flowchart showing a process of setting the reference waveform and setting the determination range.
Fig. 6 is a diagram illustrating an example of a crimping waveform.
Fig. 7 is a diagram showing an example of a reference waveform.
Fig. 8 is a flowchart showing the pressure-contact acceptance determination process.
Fig. 9 is a diagram showing a relationship between a reference waveform example and a pressure waveform example.
(description of reference numerals)
10: a terminal crimping device; 12: an electric wire; 14: a terminal; 20: a terminal crimping mechanism device; 22. 25: crimping a die; 24: a pressure detection unit; 26: a crimping drive section; 30: a device for judging whether the terminal crimping state is qualified or not; 32c, the ratio of: a reference waveform processing unit; 32 d: a pressure welding qualification judging part; 32d 1: a 1 st discrimination processing section; 32d 2: a 2 nd discrimination processing section; 32d 3: a 3 rd discrimination processing section; 35: an external storage device; 35 a: judging a program; 35 b: a reference waveform; 35 c: judging a range setting parameter; 35 d: judging a threshold parameter; 36: a pressure waveform input circuit section; PW: crimping a waveform; sr, Sd: the speed of pressure change; t1: an initial crimping period; t3: during the final stage of crimping; xa, Xb: a reference time; xe: judging the end time; ya, Yb: and (4) partitioning the pressure.
Detailed Description
Hereinafter, a terminal crimping device according to an embodiment will be described.
Fig. 1 is a schematic front view showing a terminal crimping device 10, and fig. 2 is a schematic side view showing a terminal crimping mechanism device 20.
The terminal crimping device 10 includes a terminal crimping mechanism device 20 and a terminal crimping state acceptance/rejection determination device 30. The terminal crimping mechanism device 20 is a device that performs a terminal crimping process for crimping the terminal 14 to the end of the wire 12, and the terminal crimping state qualification determination device 30 is a device that performs a terminal crimping qualification determination.
<1. terminal crimping mechanism device >
The terminal crimping mechanism device 20 includes a lateral substantially U-shaped support member 21, a pair of crimping dies 22 and 25, a crimping drive unit 26, and a pressure detection unit 24.
The pair of pressure contact dies 22 and 25 includes a lower pressure contact die 22 and an upper pressure contact die 25, and the terminal 14 can be pressure-contacted therebetween.
The lower crimping die 22 is mounted on the lower base portion 21a of the support member 21 so as to project upward. Further, a support table 22a is attached to the lower base portion 21a adjacent to the lower pressure bonding die 22. The pressure-bonding section 14a of the terminal 14 is placed on the lower pressure-bonding die 22, and the other part of the terminal 14 is placed on the support table 22a, so that the terminal 14 can be supported in a placed state.
Further, a pressure transmission member 23 is disposed in the lower base portion 21a below the lower pressure die 22 in a state of being in contact with the lower pressure die 22. Further, a pressure detecting unit 24 is disposed below the pressure transmitting member 23 in a state of being in contact with the pressure transmitting member 23. The pressure applied to the lower pressure bonding die 22 during the pressure bonding of the terminal is transmitted to the pressure detecting unit 24 via the pressure transmitting member 23. The pressure detecting unit 24 is configured by a sensor that outputs an electric signal corresponding to pressure, such as a strain gauge, a piezoelectric element, or an optical fiber pressure sensor. When the pressure generated at the time of crimping the terminal is transmitted to the pressure detecting section 24 via the pressure transmitting member 23, the pressure detecting section 24 is configured to output a pressure waveform corresponding to the pressure change as an electric signal.
The pressure detecting unit 24 may be assembled to the upper pressure bonding die 25 side, or may be assembled to both sides of the pair of pressure bonding dies 22 and 25. In the latter case, the pressure waveform may be subjected to pressure acceptance determination processing described later, or the average waveform of the detected waveforms may be subjected to pressure acceptance determination processing described later.
The pressure driving section 26 is configured by a toggle mechanism, an air cylinder, a hydraulic cylinder, and the like, and is provided in the upper support portion 21b of the support member 21. The upper pressure-bonding die 25 is supported by a pressure-bonding driving unit 26 so as to be able to move up and down in a drooping posture. The upper press mold 25 is configured to move closer to or away from the lower press mold 22 by the driving of the press driving unit 26. The pressure driving unit 26 may be configured to relatively move the pair of pressure dies 22 and 25 closer to or farther from each other.
Further, the terminal crimping mechanism device 20 incorporates: a terminal supply mechanism 28 for continuously supplying the plurality of terminals 14 to the lower crimping die 22; and a wire processing mechanism 29 for continuously performing a process of cutting the wire 12 by a predetermined length set in advance, peeling off an end thereof, and disposing the cut wire in the pressure-bonding section 14a of the terminal 14. Further, the terminal crimping process for crimping the terminal 14 to the electric wire 12 can be continuously performed. Various configurations including known configurations can be applied to the terminal supply mechanism 28 and the wire processing mechanism 29, and therefore detailed descriptions thereof are omitted.
<2 > apparatus for determining whether terminal pressure welding state is acceptable or not
Fig. 3 is a block diagram showing a hardware configuration of the terminal crimping state acceptance/rejection determination device 30. The terminal pressure bonding state acceptance/rejection determination device 30 is configured to be electrically connected to the pressure detection unit 24 so as to be able to input the pressure waveform detected by the pressure detection unit 24, and to perform pressure bonding acceptance/rejection determination of the terminal based on the pressure waveform.
More specifically, the terminal pressure contact state non-defective determination device 30 is constituted by a general computer such as a CPU32, an internal storage device 34, and an external storage device 35, which are connected to each other via a bus 31. The internal storage device 34 includes a ROM for storing a basic program and the like, a RAM for temporarily holding data, and the like, and the external storage device 35 is configured by a nonvolatile storage device such as a flash memory or a hard disk device. The external storage device 35 stores a determination program 35a for performing pressure acceptance determination processing described later. The CPU32 as a main control unit performs arithmetic processing based on the determination program 35a, and realizes various functions such as a pass/fail determination unit that determines whether or not the terminal 14 is pressure-connected as described later. The determination program 35a is usually stored in the external storage device 35 in advance, but may be provided in a state of being recorded in a recording medium such as a CD-ROM, a DVD-ROM, or a flash memory, or may be provided by being downloaded from an external server via a network, or the like, and may be additionally or interchangeably stored in the external storage device 35.
The external storage device 35 stores a reference waveform 35b, a discrimination range setting parameter 35c for discrimination range setting processing based on the reference waveform 35b, and a discrimination threshold parameter 35d for discrimination processing.
In the device 30 for determining whether the terminal pressure bonding state is acceptable or not, the pressure waveform input circuit unit 36, the signal output circuit unit 37, the input unit 38, and the display unit 39 are also connected to the bus line 31.
The pressure waveform input circuit unit 36 is configured by an AD conversion circuit or the like, and is configured to convert the pressure waveform detected by the pressure detection unit 24 into a digital signal when the pressure waveform is input as an analog signal. The pressure waveform converted into a digital signal by the pressure waveform input circuit unit 36 is sequentially stored in the internal storage device 34 or the external storage device 35, and used for reference waveform setting and determination range setting processing and pressure-contact-quality determination processing, which will be described later.
The signal output circuit section 37 is an output circuit that outputs a control signal and the like to other devices under the control of the CPU 32. Here, as will be described later, an error stop signal or the like for the terminal crimping mechanism device 20 is output via the signal output circuit unit 37 and supplied to the terminal crimping mechanism device 20.
The input unit 38 is configured by various switches, a touch panel, and the like, and is configured to be able to receive various instructions to the present terminal pressure state acceptance/rejection determination device 30, such as a reference waveform processing start instruction and a pressure acceptance/rejection determination processing start instruction.
The display unit 39 is constituted by a liquid crystal display device, a lamp, and the like, and is configured to be capable of displaying various information such as the result of determination of whether or not the terminal is pressure-bonded, and a pressure waveform under the control of the CPU 32.
Fig. 4 is a functional block diagram of the terminal crimping state acceptance/rejection determination device 30. As shown in the figure, the device 30 for determining whether the terminal pressure bonding state is acceptable or not includes a signal preprocessing unit 32a, a pressure bonding waveform acquiring unit 32b, a reference waveform processing unit 32c, and a pressure bonding acceptability determining unit 32d, and the pressure bonding acceptability determining unit 32d includes a 1 st determining processing unit 32d1, a 2 nd determining processing unit 32d2, and a 3 rd determining processing unit 32d 3. As described above, the CPU32 performs predetermined arithmetic processing in accordance with the determination program 35a to realize these functions.
The signal preprocessing unit 32a is configured to perform offset processing for removing a DC component, filter processing for removing a predetermined frequency component, and the like on a pressure waveform input as a digital signal from the pressure detection unit 24 via the pressure waveform input circuit unit 36.
The pressure waveform acquisition unit 32b is configured to sample the pressure waveform of the primary pressure based on the pressure waveform preprocessed as described above. Hereinafter, a pressure waveform portion of the pressure waveform subjected to primary pressure bonding may be referred to as a pressure bonding waveform.
The pressure waveform sampled and acquired by the pressure waveform acquiring unit 32b is supplied to the reference waveform processing unit 32c or the pressure acceptance/rejection determining unit 32 d.
The reference waveform processing unit 32c sets the reference waveform and the discrimination range setting parameter 35c based on the crimp waveform supplied from the crimp waveform acquiring unit 32b, and stores the reference waveform and the discrimination range setting parameter in the external storage device 35.
The pressure-contact-acceptability judging unit 32d is configured to execute the pressure-contact-acceptability judging process in the 1 st judging processor 32d1, the 2 nd judging processor 32d2, and the 3 rd judging processor 32d3, respectively, based on the reference waveform 35b, the judgment range setting parameter 35c, the judgment threshold parameter 35d, and the pressure-contact waveform supplied from the pressure-contact-waveform acquiring unit 32 b. The 1 st discrimination processing unit 32d1 is configured to perform pressure acceptance/rejection discrimination based on a difference between the correlation degree between the pressure waveform and the reference waveform 35b in the initial pressure contact period, the 2 nd discrimination processing unit 32d2 is configured to perform pressure acceptance/rejection discrimination based on a physical quantity corresponding to the pressure change rate in the intermediate pressure contact period, and the 3 rd discrimination processing unit 32d3 is configured to perform pressure acceptance/rejection discrimination based on a correlation coefficient between the pressure waveform and the predetermined waveform 35b in the final pressure contact period.
The pressure contact acceptance/rejection determining unit 32d is configured to perform display control of the display unit 39, error stop control of the terminal pressure contact mechanism device 20, and the like based on the determination results of the 1 st determining processing unit 32d1, the 2 nd determining processing unit 32d2, and the 3 rd determining processing unit 32d 3.
In addition, a part or all of the functions performed by the terminal pressure contact state qualification determination device 30 may be realized by hardware such as a dedicated logic circuit.
<3. processing of the terminal crimping state acceptance/rejection judging device >
The reference waveform setting and the setting process within the determination range and the terminal pressure welding acceptability determination process performed by the terminal pressure welding acceptability determination device 30 will be described.
<3.1. reference waveform processing >
Fig. 5 is a flowchart showing a process of setting the reference waveform and setting the determination range.
First, a user of the apparatus issues a terminal crimping start instruction to the terminal crimping mechanism apparatus 20, and issues a reference waveform processing start instruction to the terminal crimping state qualification determination apparatus 30. Then, the pressure waveform detected by the pressure detection portion 24 is input as pressure waveform information indicating the elapse of time t and the change in pressure P through the pressure waveform input circuit portion 36. The crimping waveform PWS at this time is as shown in fig. 6, and a waveform in which upward convex waveforms exhibiting a large pressure after a small pressure portion are connected is observed. In addition, when the pressure welding is performed a plurality of times, the pressure welding waveform PWS is observed as a waveform continuously connected at intervals. Since the crimp waveform differs depending on the type of the terminal 14, the waveform shape as described above is not necessarily observed.
When the terminal pressure contact state qualification determination device 30 receives the reference waveform processing start instruction, the reference waveform 35b is acquired in step S1.
As for the reference waveform 35b, the obtained crimping waveform PWS of the first crimping may be set as the reference waveform 35b as it is, or an average waveform of the obtained crimping waveforms PWS of the plurality of crimps may be set as the reference waveform 35 b.
The pressure waveform PWS may be acquired for the pressure waveform input from the pressure detection unit 24 as follows, for example. That is, whether or not the pressure P is equal to or higher than the preset sampling trigger pressure value Ps (or is higher than the sampling trigger pressure value Ps) is determined to determine whether or not the pressure-receiving waveform PWS is present. The predetermined sampling trigger pressure value Ps may be determined as a value of several tens% of a pressure peak value of the pressure waveform based on a result of a test performed in the past, for example. For example, the time ta at which the pressure P reaches the predetermined sampling trigger pressure value Ps may be set as the sampling reference time ta, and the period TS defined by the preceding period TSa and the following period TSb may be set as the sampling period TS. As for the preceding period TSa and the following period TSb, a value experimentally or empirically determined based on the sampling reference time ta as a period during which a pressure waveform effective for the pressure acceptance determination is present may be used. Hereinafter, the time at which the sampling period TS starts may be referred to as a sampling start time t 0. Of course, the presence or absence of the pressure waveform and the setting in the sampling period are not limited to the above examples. For example, the sampling may be performed within a certain pressure range, or may be performed for a predetermined period in conjunction with the crimping operation in the terminal crimping mechanism device 20. Of course, sampling according to the change in the pressure waveform can perform sampling without receiving an operation signal from the terminal crimping mechanism device 20, and the structure can be simplified.
After the reference waveform 35b is set as described above, the process proceeds from step S1 to step S2. In step S2, the terminal pressure state qualification determination device 30 calculates a pressure peak Ymax in the reference waveform 35b, calculates the pressure sections Ya, Yb based on the pressure peak Ymax, and stores the calculated pressure sections Ya, Yb as the determination range setting parameter 35c in the external storage device 35.
Fig. 7 is a diagram showing a reference waveform. As shown in the figure, the pressure peak value Ymax is obtained as the maximum value of the pressure in the reference waveform 35 b. Further, the pressure peak value Ymax may be obtained as the maximum value of the pressure in the pressure waveform PWS of a plurality of times. For example, the partitioning pressures Ya and Yb may be calculated as values obtained by multiplying the pressure peak value Ymax by a predetermined ratio preset by the input unit 38 or the like. The divisional pressure Ya, Yb is set to include a pressure range corresponding to the middle period of the crimping waveform PWS in which the pressure change is large, and for example, the divisional pressure Ya is calculated by multiplying the pressure peak Ymax by 0.7, and the divisional pressure Yb is calculated by multiplying the pressure peak Ymax by 0.3. Accordingly, even when a plurality of types of terminal crimping are performed, the appropriate segmented pressures Ya and Yb can be set by multiplying the obtained pressure peak value Ymax by a proportional value without setting the pressure segmented pressures Ya and Yb in accordance with the type. Of course, the partition pressures Ya and Yb may be set by direct input from a user or the like.
After step S2 ends, the process advances to step S3. In step S3, the terminal pressure state qualification determination device 30 obtains the reference time Xa based on the reference waveform 35b and the partition pressure Ya, and stores the obtained reference time Xa in the external storage device 35 as the determination range setting parameter 35 c. The reference time Xa is a time Xa at which the reference waveform 35b becomes the partition pressure Ya, that is, a time Xa of an X coordinate at which the reference waveform 35b and Y ═ Ya intersect each other when the reference waveform 35b is superimposed on an XY coordinate whose X axis is time and Y axis is pressure.
After step S3 ends, the process advances to step S4. In step S4, the terminal pressure state qualification determination device 30 obtains the reference time Xb based on the reference waveform 35b and the partition pressure Yb, and stores the obtained reference time Xb as the determination range setting parameter 35c in the external storage device 35. The reference time Xb is a time Xb at which the reference waveform 35b becomes the partition pressure Yb, that is, a time Xb of the X coordinate at which the reference waveform 35b and Y become the intersection of Yb when the reference waveform 35b is superimposed on the XY coordinate whose X axis is time and Y axis is pressure.
After the end of step S4, the process proceeds to step S5, and the terminal pressure state non-defective determination device 30 obtains the determination end time Xe based on the pressure peak value Ymax in the reference waveform 35b and a predetermined set value Xc preset by the input unit 38 or the like, and stores the determination end time Xe in the external storage device 35 as the determination range setting parameter 35 c. More specifically, the determination completion time Xe is obtained by adding a predetermined set value Xc to the time at which the pressure peak Ymax appears in the reference waveform 35 b.
Through the above steps, the process of setting the reference waveform 35b and setting the determination range ends. After the end of this process, the reference waveform 35b and the determination range setting parameter 35c including the pressure zones Ya, Yb, the reference times Xa, Xb, and the determination end time Xe are set and stored in the external storage device 35.
The reference waveform 35b and the determination range setting parameter 35c including the pressure sections Ya, Yb, the reference times Xa, Xb, and the determination completion time Xe are preferably used as the determination criterion for the pressure acceptance or non-acceptance of the terminal processing condition determined by the type of the terminal 14, the type of the electric wire 12, and the like. Therefore, it is preferable to reset the other reference waveform 35b and the discrimination range setting parameter 35c when the terminal processing conditions such as the type of the terminal 14 and the type of the electric wire 12 change. Of course, when the type of the terminal 14 and the type of the electric wire 12 are changed to such an extent that the detected pressure waveform is not affected or is not affected much, the same reference waveform 35b and the same determination range setting parameter 35c may be used.
Further, it is not necessary to perform the setting of the reference waveform 35b and the setting of the determination range each time the pressure bonding process of the terminal 14 is performed. For example, when the reference waveform 35b and the determination range setting parameter 35c are already obtained for the specified terminal 14 and the specified electric wire 12 by the already performed processing, the determination as to whether the pressure contact state of the terminal 14 is acceptable or not, which will be described later, may be performed by using these reference waveform 35b and determination range setting parameter 35 c.
<3.2. determination of acceptability of terminal crimping >
The terminal crimping state acceptance/rejection determination device 30 is a device that performs the acceptance/rejection determination of crimping based on the crimping waveform detected in the crimping operation of each terminal 14, and here, the acceptance/rejection determination of crimping is performed based on the difference between the degrees of correlation between the crimping waveform PW and the reference waveform 35b in the initial period of crimping in the crimping waveform PW (1 st acceptance/rejection determination process), the acceptance/rejection determination of crimping is performed based on the correlation coefficient indicating the degree of correlation between the crimping waveform PW and the reference waveform 35b in the final period of crimping in the crimping waveform PW (3 rd acceptance/rejection determination process), and the acceptance/rejection determination of crimping is performed based on the physical quantity corresponding to the pressure change speed in the intermediate period of the period assumed between them (2 nd acceptance/rejection determination process).
The pressure-bonding acceptance determination process will be specifically described with reference to a flowchart shown in fig. 8.
That is, the user or the like gives a continuous terminal crimping start instruction to the terminal crimping mechanism device 20 and gives a pressure bonding acceptance/acceptance determination process start instruction to the terminal crimping state acceptance/acceptance determination device 30. Then, the pressure waveform detected by the pressure detection unit 24 is input through the pressure waveform input circuit unit 36. Upon receiving the pressure acceptance/rejection determination process start instruction, the terminal pressure welding state acceptance/rejection determination device 30 samples the pressure welding waveform PW as shown in step S10. The sampling of the pressure waveform PW may be performed at a reference time ta and a period TS similar to the reference time ta and the period TS sampled when the reference waveform 35b is acquired.
Fig. 9 is a diagram showing an example of the reference waveform 35b and the pressure waveform PW detected during pressure bonding in XY coordinates in which time is taken on the X axis and pressure is taken on the Y axis. The reference waveform 35b and the crimp waveform PW are superimposed so that the respective sampling start times t0 are aligned at the same time, and for convenience of explanation, the sampling start time t0 is 0. In the following description of the processing, reference is made to fig. 9 as necessary.
After step S10, the terminal crimping state qualification determination device 30 executes the 1 st crimping qualification determination process (steps S11 to S15), the 2 nd crimping qualification determination process (steps S16 to S21), and the 3 rd crimping qualification determination process (steps S22 to S25) in parallel on the sampled crimping waveform PW. Each process need not be executed in parallel by a distributed process, a time division process, or the like, and may be a sequential process. In short, the above three processes may be performed for one terminal crimping.
The respective processes will be described in turn.
The 1 st pressure acceptance/rejection determination process is a process of performing pressure acceptance/rejection determination based on a difference between the pressure waveform PW and the reference waveform 35b in the pressure initial period T1(0 to Xb).
That is, the terminal crimping state non-defective determination device 30 calculates a correlation coefficient (Cor) between the crimp waveform PW and the reference waveform 35b in step S11 in the initial crimping period (0 to Xb) based on the following equation.
[ equation 1]
Ysi: pressure of reference waveform in time i
Yi: pressure of crimp waveform in time i
After the correlation coefficient (Cor) is calculated in step S11, the process proceeds to step S12. In step S12, it is determined whether or not the correlation coefficient (Cor) is smaller than a predetermined correlation coefficient threshold value (S (Cor)). The correlation coefficient threshold (s (cor)) is a value that is set and stored in the external storage device 35 as one of the determination threshold parameters 35d in advance by the input unit 38 or the like. As a result of the determination, if the correlation coefficient (Cor) is not less than the predetermined correlation coefficient threshold value (s (Cor)), that is, if it is determined that the degree of correlation between the pressure waveform PW and the reference waveform 35b is high in the initial pressure welding period (0 to Xb), the pressure welding is considered to be good, and the 1 st pressure welding non-acceptance determination process is ended. On the other hand, if the correlation coefficient (Cor) is smaller than the predetermined correlation coefficient threshold value (S (Cor)), that is, if it is determined that the degree of correlation between the pressure waveform PW and the reference waveform 35b is low in the pressure initial period (0 to Xb), the process proceeds to step S13 as a pressure failure.
In step S11, when the correlation coefficient (Cor) is equal to the predetermined correlation coefficient threshold value (S (Cor)), it is possible to determine whether the pressure bonding is good or poor.
In step S13, the display unit 39 displays the content of the defective display, and the terminal pressure bonding mechanism device 20 is signaled to stop the terminal pressure bonding due to an error. Accordingly, the crimping process of the terminal 14 by the terminal crimping mechanism device 20 is temporarily stopped. Thereafter, the process proceeds to step S14.
In step S14, it is determined whether or not a confirmation reset instruction is input via the input unit 38 or the like, and if it is determined that no input is input, the process of step S14 is repeated, and if it is determined that input is input, the process proceeds to step S15. That is, when the user inputs the confirmation reset instruction after recognizing the defective pressure contact of the terminal 14, eliminating the defective product, confirming the state of the terminal pressure contact mechanism device 20, or the like, the process proceeds from step S14 to step S15.
In step S15, the error display on the display unit 39 is released and the signal of the content stopped by the error is released. Accordingly, the terminal 14 pressure-bonding process by the terminal pressure-bonding mechanism device 20 can be continued, and the 1 st pressure-bonding non-eligibility determination process is ended.
The 2 nd pressure welding acceptability judging process is a process of judging whether pressure welding acceptability is acceptable or not based on the physical quantity corresponding to the pressure change speed. More specifically, the 2 nd pressure-bonding non-qualification determination process is a process of determining a reference physical quantity (Sr) corresponding to a pressure change rate based on the reference waveform 35b in a predetermined pressure range (Yb to Ya), determining a physical quantity (Sd) corresponding to a pressure change rate based on the pressure waveform PW in the pressure range (Yb to Ya), and comparing the reference physical quantity (Sr) and the physical quantity (Sd) to determine the pressure-bonding non-qualification.
That is, in step S16, the terminal pressure state non-defective determining device 30 calculates the pressure change rate (Sr ═ Ya-Yb)/(Xb-Xa)) in the pressure range (Yb to Ya) as a physical quantity corresponding to the pressure change rate in the reference waveform 35b (see the slope of the straight line indicated by the one-dot chain line in fig. 9). The pressure range (Yb-Ya) is set as a pressure range (Yb-Ya) between the pressure range (below the partition pressure Yb) of the reference waveform 35b in the initial crimping period (0 to Xb) and the pressure range (above the partition pressure Ya) of the reference waveform 35b in the final crimping period (Xa to Xe). The values Xa, Xb, Ya, Yb described above may be values obtained in advance as the discrimination range setting parameter 35 c. Thereafter, the process proceeds to step S17.
In step S17, the pressure change speed (Sd ═ i (Ya-Yb)/(Xd1-Xd2)) in the same pressure range (Yb to Ya) as described above is calculated as a physical quantity corresponding to the pressure change speed in the crimp waveform PW (see the slope of the straight line indicated by the two-dot chain line in fig. 9). The time Xd1 is a time when the pressure becomes Ya in the crimp waveform PW, and the time Xd2 is a time when the pressure becomes Yb in the crimp waveform PW. Thereafter, the process proceeds to step S18.
In step S18, the pressure change rates Sr and Sd are compared to determine whether or not the pressure is acceptable. That is, the values of the pressure change rates Sr and Sd calculated above are substituted into an equation expressed by a pressure change evaluation Value (VP) | (Sr/Sd) -1| × 100, and the value of the pressure change evaluation Value (VP) is calculated. Then, it is determined whether or not the pressure change evaluation Value (VP) is greater than a predetermined pressure change threshold value (s (VP)). The pressure change threshold (s (vp)) is a value that is set and stored in the external storage device 35 by input through the input unit 38 or the like in advance as one of the discrimination threshold parameters 35 d. If the pressure change evaluation Value (VP) is not greater than the predetermined pressure change threshold value (s (VP) as a result of the determination, that is, if the pressure change rates Sr and Sd are relatively similar, the pressure is determined to be good, and the 2 nd pressure acceptance determination process is terminated. On the other hand, if it is determined that the pressure change evaluation Value (VP) is greater than the predetermined pressure change threshold value (S (VP)), that is, if the pressure change rates Sr and Sd are greatly different, the process proceeds to step S19 as a pressure failure.
In step S18, when the pressure change evaluation Value (VP) and the pressure change threshold value (S (VP)) are the same, it is possible to determine whether the pressure bonding is good or poor.
In step S18, the pressure change rates Sr and Sd may be compared with a predetermined threshold value to determine whether or not pressure is acceptable. As a matter of course, the determination of whether or not the pressure is acceptable based on the ratio of the pressure change speeds Sr and Sd as described above has the following advantages: even when a plurality of types of terminal pressure bonding are performed, whether pressure bonding is acceptable or not can be determined on a uniform basis regardless of the magnitude of the pressure change rates Sr and Sd.
In step S19, the display unit 39 displays the content of the defective display, and the terminal pressure bonding mechanism device 20 is signaled to stop the terminal pressure bonding due to an error. Accordingly, the crimping process of the terminal 14 by the terminal crimping mechanism device 20 is temporarily stopped. Thereafter, the process proceeds to step S20.
In step S20, it is determined whether or not a confirmation reset instruction is input via the input unit 38 or the like, and if it is determined that no input is input, the process of step S20 is repeated, and if it is determined that input is input, the process proceeds to step S21. That is, when the user inputs the confirmation reset instruction after recognizing the defective pressure contact of the terminal 14, eliminating the defective product, confirming the state of the terminal pressure contact mechanism device 20, or the like, the process proceeds from step S20 to step S21.
In step S21, the error display on the display unit 39 is released, and the signal of the content stopped by the error is released. Accordingly, the terminal 14 pressure-bonding process by the terminal pressure-bonding mechanism device 20 can be continued, and the 2 nd pressure-bonding non-eligibility determination process is ended.
The 3 rd pressure welding acceptability judging process is a process of judging the pressure welding acceptability based on the correlation coefficient between the pressure welding waveform PW and the reference waveform 35b in the pressure welding end period T3(Xa to Xe).
That is, in step S22, the terminal pressure bonding state non-defective determination device 30 obtains an absolute Value (VA) of a difference between the pressure detection value in the pressure waveform PW and the pressure reference value in the reference waveform 35b at each time in the pressure bonding initial period (Xa to Xe), and determines whether or not the absolute Value (VA) with respect to all times in the pressure bonding initial period (Xa to Xe) is larger than the pressure difference threshold value (S (VA)). The pressure difference threshold (s (va)) is a value that is set and stored in the external storage device 35 by input through the input unit 38 or the like in advance as one of the determination threshold parameters 35 d. If it is determined as a result of the determination that the absolute Value (VA) at all times in the initial crimping period (Xa to Xe) is not larger than the pressure difference threshold value (s (VA)), that is, if it is determined that the difference between the crimping waveform PW and the reference waveform 35b is small in the final crimping period T3(Xa to Xe), the 3 rd crimp non-acceptance determination process is terminated as good crimping. On the other hand, if it is determined that the absolute Value (VA) at any time in the initial pressure bonding period (Xa to Xe) is larger than the pressure difference threshold value (S (VA)), that is, if the difference between the pressure bonding waveform PW and the reference waveform 35b is large in the final pressure bonding period T3(Xa to Xe), the process proceeds to step S23 as a pressure bonding failure.
In step S22, when the absolute Value (VA) is greater than the pressure difference threshold value (S (VA)) at a plurality of time points, it may be determined that the pressure is defective. When the absolute Value (VA) at each time is equal to the pressure difference threshold value (s (VA)), it is possible to determine whether the pressure is good or bad.
In step S23, the display unit 39 displays the content of the defective display, and the terminal crimping mechanism device 20 is signaled to stop the terminal crimping due to an error. Accordingly, the crimping process of the terminal 14 by the terminal crimping mechanism device 20 is temporarily stopped. Thereafter, the process proceeds to step S24.
In step S24, it is determined whether or not a confirmation reset instruction is input via the input unit 38 or the like, and if it is determined that no input is input, the process of step S24 is repeated, and if it is determined that input is input, the process proceeds to step S25. That is, when the user inputs the confirmation reset instruction after recognizing the defective pressure contact of the terminal 14, eliminating the defective product, confirming the state of the terminal pressure contact mechanism device 20, or the like, the process proceeds from step S24 to step S25.
In step S25, the error display on the display unit 39 is released, and the signal of the content stopped by the error is released. Accordingly, the terminal 14 pressure-bonding process by the terminal pressure-bonding mechanism device 20 can be continued, and the 3 rd pressure-bonding non-eligibility determination process is ended.
Then, in each of the 1 st pressure welding acceptability judging process (steps S11 to S15), the 2 nd pressure welding acceptability judging process (steps S16 to S21), and the 3 rd pressure welding acceptability judging process (steps S22 to S25), after judging that the pressure welding is good or the pressure welding is poor, the stop due to the error is released, and after the judging process is finished, the production of the pressure welding terminal 14 can be continued as shown in step S26. Then, the terminal 14 is crimped again, and the 1 st pressure welding acceptability determination process, the 2 nd pressure welding acceptability determination process, and the 3 rd pressure welding acceptability determination process are repeated based on the crimp waveform PW obtained along with the crimping. Accordingly, the terminal 14 continuously pressure-contacted is sequentially judged whether or not the pressure-contact is qualified.
According to the terminal press-bonding state qualification determining device, the terminal press-bonding processing device, the terminal press-bonding state qualification determining method, and the terminal press-bonding state qualification determining program configured as described above, the physical quantity corresponding to the pressure change speed is obtained based on the press-bonding waveform PW, and the press-bonding qualification determination is performed based on the physical quantity, so that the press-bonding qualification determination can be performed as appropriately as possible even if there is a shift in the time axis direction of the reference waveform 35b and the press-bonding waveform PW.
In particular, since the physical quantities corresponding to the pressure change speeds are compared in the same pressure range (Yb to Ya) based on the reference waveform 35b and the pressure waveform PW, it is possible to perform pressure non-acceptance determination regardless of the deviation in the time axis direction of the reference waveform 35b and the pressure waveform PW.
In addition, generally, the pressure change is small in the initial stage and the final stage of the pressure bonding. Therefore, the influence of the deviation in the time axis direction of the reference waveform 35b and the crimp waveform PW is small. Therefore, by performing the pressure welding acceptance determination based on the correlation between the reference waveform 35b and the pressure welding waveform PW in the pressure welding initial period (0 to Xb) and the pressure welding final period (Xa to Xe), it is possible to perform more appropriate pressure welding acceptance determination.
In this case, as the determination process of the pressure acceptance or non-acceptance based on the degree of correlation between the reference waveform 35b and the pressure waveform PW, as described above, determination using various values such as comparison with respect to the pressure difference itself or comparison with respect to the correlation coefficient can be employed.
In general, the pressure changes greatly between the initial pressure bonding period (0 to Xb) and the final pressure bonding period (Xa to Xe). Therefore, as described above, the pressure range for comparing the pressure change rates is preferably set to the pressure range (Yb to Ya) between the initial pressure bonding period (0 to Xb) and the final pressure bonding period (Xa to Xe) in the reference waveform 35 b.
{ modification example }
The above embodiments are illustrative, and the present invention is not limited to the above embodiments, but can be variously modified.
For example, in the above embodiment, the 1 st pressure welding acceptability judging process, the 2 nd pressure welding acceptability judging process, and the 3 rd pressure welding acceptability judging process are performed, but at least one of the 1 st pressure welding acceptability judging process and the 3 rd pressure welding acceptability judging process may be omitted.
In the above-described embodiment, the values Sr and Sd obtained by dividing the pressure change amount by the time change amount are used as the physical quantities corresponding to the pressure change speed in each of the reference waveform 35b and the crimp waveform PW. For example, the time itself required for the pressure to change within a certain range may be used as a physical quantity corresponding to the pressure change speed. In addition, a physical quantity corresponding to a pressure change speed in a predetermined time range may be obtained in each of the reference waveform 35b and the pressure welding waveform PW. In short, any physical quantity may be used as long as it varies according to the pressure change rate.
The configurations described in the embodiments and the modifications can be combined as appropriate unless contradicted by each other.
Claims (4)
1. A device for determining whether a terminal pressure state is qualified or not, which determines whether the terminal pressure state is qualified or not, includes:
a pressure waveform input unit that inputs a pressure waveform detected by crimping a terminal; and
a quality determination unit for determining a physical quantity corresponding to a pressure change speed based on the pressure waveform, and performing pressure welding quality determination based on the physical quantity,
the pressure-bonding-non-qualification determining unit performs pressure-bonding-non-qualification determination by comparing a reference physical quantity obtained based on a predetermined reference waveform as a value that varies according to a pressure change rate in a predetermined pressure range in a pressure-bonding intermediate period with a physical quantity obtained based on the pressure waveform as a value that varies according to a pressure change rate in the predetermined pressure range in the pressure-bonding intermediate period.
2. The terminal crimping state acceptance/non-acceptance determination device according to claim 1, wherein,
the pressure-bonding acceptance/rejection determination unit performs pressure-bonding acceptance/rejection determination based on a degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined pressure-bonding initial period, and performs pressure-bonding acceptance/rejection determination based on a degree of correlation between the pressure waveform and a predetermined reference waveform in a predetermined pressure-bonding final period.
3. A device for determining whether a terminal pressure state is qualified or not, which determines whether the terminal pressure state is qualified or not, includes:
a pressure waveform input unit that inputs a pressure waveform detected by crimping a terminal; and
a quality determination unit for determining a physical quantity corresponding to a pressure change speed based on the pressure waveform, and performing pressure welding quality determination based on the physical quantity,
the pressure waveform is detected by a pressure waveform detecting unit which detects a pressure waveform of the pressure waveform and a predetermined reference waveform, a pressure waveform is detected from the pressure waveform and a predetermined reference waveform, further, the pressure welding acceptance determination is performed by comparing a reference physical quantity obtained as an inclination value corresponding to a pressure change rate in a predetermined pressure range between the pressure range of the reference waveform in the predetermined initial pressure welding period and the pressure range of the reference waveform in the predetermined final pressure welding period with the physical quantity obtained as an inclination value corresponding to a pressure change rate in the predetermined pressure range based on the pressure waveform.
4. A terminal crimping device is provided with:
a pair of crimping dies for crimping the terminals;
a crimping drive section that relatively moves the pair of crimping dies toward or away from each other;
a pressure detection unit provided in the pair of crimping dies and detecting a pressure waveform accompanying crimping of the terminal; and
the device for determining whether or not a terminal is in a crimped state according to any one of claims 1 to 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910248305.7A CN111751034A (en) | 2019-03-29 | 2019-03-29 | Device for determining whether terminal crimping state is qualified or not, and terminal crimping processing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910248305.7A CN111751034A (en) | 2019-03-29 | 2019-03-29 | Device for determining whether terminal crimping state is qualified or not, and terminal crimping processing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111751034A true CN111751034A (en) | 2020-10-09 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910248305.7A Pending CN111751034A (en) | 2019-03-29 | 2019-03-29 | Device for determining whether terminal crimping state is qualified or not, and terminal crimping processing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111751034A (en) |
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2019
- 2019-03-29 CN CN201910248305.7A patent/CN111751034A/en active Pending
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Application publication date: 20201009 |