JP2000281900A5 - - Google Patents
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- JP2000281900A5 JP2000281900A5 JP1999332630A JP33263099A JP2000281900A5 JP 2000281900 A5 JP2000281900 A5 JP 2000281900A5 JP 1999332630 A JP1999332630 A JP 1999332630A JP 33263099 A JP33263099 A JP 33263099A JP 2000281900 A5 JP2000281900 A5 JP 2000281900A5
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- -1 aliphatic dicarboxylic acids Chemical class 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 3
- WNLRTRBMVRJNCN-UHFFFAOYSA-N Adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- WPYMKLBDIGXBTP-UHFFFAOYSA-N Benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 2
- JFCQEDHGNNZCLN-UHFFFAOYSA-N Glutaric acid Chemical compound OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 2
- 239000004952 Polyamide Substances 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N Sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- TYFQFVWCELRYAO-UHFFFAOYSA-N Suberic acid Chemical compound OC(=O)CCCCCCC(O)=O TYFQFVWCELRYAO-UHFFFAOYSA-N 0.000 description 2
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Chemical compound OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 150000001991 dicarboxylic acids Chemical group 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- OFOBLEOULBTSOW-UHFFFAOYSA-N malonic acid Chemical compound OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 239000011528 polyamide (building material) Substances 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N terephthalic acid group Chemical group C(C1=CC=C(C(=O)O)C=C1)(=O)O KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- GBURUDXSBYGPBL-UHFFFAOYSA-N 2,2,3-trimethylhexanedioic acid Chemical compound OC(=O)C(C)(C)C(C)CCC(O)=O GBURUDXSBYGPBL-UHFFFAOYSA-N 0.000 description 1
- BTUDGPVTCYNYLK-UHFFFAOYSA-N 2,2-dimethylglutaric acid Chemical compound OC(=O)C(C)(C)CCC(O)=O BTUDGPVTCYNYLK-UHFFFAOYSA-N 0.000 description 1
- RXOHFPCZGPKIRD-UHFFFAOYSA-N 2,6-Naphthalenedicarboxylic acid Chemical compound C1=C(C(O)=O)C=CC2=CC(C(=O)O)=CC=C21 RXOHFPCZGPKIRD-UHFFFAOYSA-N 0.000 description 1
- JZUMVFMLJGSMRF-UHFFFAOYSA-N 2-Methyladipic acid Chemical compound OC(=O)C(C)CCCC(O)=O JZUMVFMLJGSMRF-UHFFFAOYSA-N 0.000 description 1
- DNXOCFKTVLHUMU-UHFFFAOYSA-N 2-[4-(carboxymethoxy)phenoxy]acetic acid Chemical compound OC(=O)COC1=CC=C(OCC(O)=O)C=C1 DNXOCFKTVLHUMU-UHFFFAOYSA-N 0.000 description 1
- GAGWMWLBYJPFDD-UHFFFAOYSA-N 2-methyloctane-1,8-diamine Chemical compound NCC(C)CCCCCCN GAGWMWLBYJPFDD-UHFFFAOYSA-N 0.000 description 1
- WVDRSXGPQWNUBN-UHFFFAOYSA-N 4-(4-carboxyphenoxy)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1OC1=CC=C(C(O)=O)C=C1 WVDRSXGPQWNUBN-UHFFFAOYSA-N 0.000 description 1
- NEQFBGHQPUXOFH-UHFFFAOYSA-N 4-(4-carboxyphenyl)benzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1C1=CC=C(C(O)=O)C=C1 NEQFBGHQPUXOFH-UHFFFAOYSA-N 0.000 description 1
- SQJQLYOMPSJVQS-UHFFFAOYSA-N 4-(4-carboxyphenyl)sulfonylbenzoic acid Chemical compound C1=CC(C(=O)O)=CC=C1S(=O)(=O)C1=CC=C(C(O)=O)C=C1 SQJQLYOMPSJVQS-UHFFFAOYSA-N 0.000 description 1
- BDJRBEYXGGNYIS-UHFFFAOYSA-N Azelaic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 1
- 239000005711 Benzoic acid Substances 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N Boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 241000202785 Calyptronoma Species 0.000 description 1
- OREAFAJWWJHCOT-UHFFFAOYSA-N Dimethylmalonic acid Chemical compound OC(=O)C(C)(C)C(O)=O OREAFAJWWJHCOT-UHFFFAOYSA-N 0.000 description 1
- QQVIHTHCMHWDBS-UHFFFAOYSA-N Isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 1
- 229920001730 Moisture cure polyurethane Polymers 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- ZGKNDXOLMOFEJH-UHFFFAOYSA-M Sodium hypophosphite Chemical compound [Na+].[O-]P=O ZGKNDXOLMOFEJH-UHFFFAOYSA-M 0.000 description 1
- QMKYBPDZANOJGF-UHFFFAOYSA-N Trimesic acid Chemical compound OC(=O)C1=CC(C(O)=O)=CC(C(O)=O)=C1 QMKYBPDZANOJGF-UHFFFAOYSA-N 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 235000010233 benzoic acid Nutrition 0.000 description 1
- 230000000903 blocking Effects 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 239000000498 cooling water Substances 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N cyclohexane-1,4-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- LNGJOYPCXLOTKL-UHFFFAOYSA-N cyclopentane-1,3-dicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)C1 LNGJOYPCXLOTKL-UHFFFAOYSA-N 0.000 description 1
- GWZCCUDJHOGOSO-UHFFFAOYSA-N diphenic acid Chemical compound OC(=O)C1=CC=CC=C1C1=CC=CC=C1C(O)=O GWZCCUDJHOGOSO-UHFFFAOYSA-N 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- ABMFBCRYHDZLRD-UHFFFAOYSA-N naphthalene-1,4-dicarboxylic acid Chemical compound C1=CC=C2C(C(=O)O)=CC=C(C(O)=O)C2=C1 ABMFBCRYHDZLRD-UHFFFAOYSA-N 0.000 description 1
- WPUMVKJOWWJPRK-UHFFFAOYSA-N naphthalene-2,7-dicarboxylic acid Chemical compound C1=CC(C(O)=O)=CC2=CC(C(=O)O)=CC=C21 WPUMVKJOWWJPRK-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- SXJVFQLYZSNZBT-UHFFFAOYSA-N nonane-1,9-diamine Chemical compound NCCCCCCCCCN SXJVFQLYZSNZBT-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 229910001379 sodium hypophosphite Inorganic materials 0.000 description 1
- 229940071182 stannate Drugs 0.000 description 1
- 239000001384 succinic acid Substances 0.000 description 1
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
Description
半芳香族ポリアミドを構成することがあるテレフタル酸単位以外の他のジカルボン酸単位としては、マロン酸、ジメチルマロン酸、コハク酸、グルタル酸、アジピン酸、2−メチルアジピン酸、トリメチルアジピン酸、ピメリン酸、2,2−ジメチルグルタル酸、2,2−ジエチルコハク酸、アゼライン酸、セバシン酸、スベリン酸等の脂肪族ジカルボン酸;1,3−シクロペンタンジカルボン酸、1,4−シクロヘキサンジカルボン酸等の脂環式ジカルボン酸;イソフタル酸、2,6−ナフタレンジカルボン酸、2,7−ナフタレンジカルボン酸、1,4−ナフタレンジカルボン酸、1,4−フェニレンジオキシジ酢酸、1,3−フェニレンジオキシジ酢酸、ジフェン酸、4,4’−オキシジ安息香酸、ジフェニルメタン−4,4’−ジカルボン酸、ジフェニルスルホン−4,4’−ジカルボン酸、4,4’−ビフェニルジカルボン酸等の芳香族ジカルボン酸から誘導される単位を挙げることができ、これらのうち1種または2種以上を含ませることができる。これらのなかでも芳香族ジカルボン酸から誘導される単位を含ませるのが好ましい。これらの他のジカルボン酸単位の含有量としては、40モル%以下であるのが好ましく、30モル%以下であるのがより好ましく、10モル%以下であるのがさらに好ましい。さらに、トリメリット酸、トリメシン酸、ピロメリット酸などの多価カルボン酸から誘導される単位を、溶融成形が可能な範囲内で含ませることもできる。 Other dicarboxylic acid units other than the terephthalic acid unit which may constitute the semi-aromatic polyamide include malonic acid, dimethylmalonic acid, succinic acid, glutaric acid, adipic acid, 2-methyladipic acid, trimethyladipic acid, pimerin - acid, 2,2-dimethyl glutaric acid, 2, 2-diethyl succinate, azelaic acid, sebacic acid, aliphatic dicarboxylic acids such as suberic acid; 1,3-cyclopentane dicarboxylic acid, 1,4-cyclohexanedicarboxylic acid, etc. Alicyclic dicarboxylic acids: isophthalic acid, 2,6-naphthalenedicarboxylic acid, 2,7-naphthalenedicarboxylic acid, 1,4-naphthalenedicarboxylic acid, 1,4-phenylenedioxydiacetic acid, 1,3-phenylenedicarboxylic acid Oxydiacetic acid, diphenic acid, 4,4'-oxydibenzoic acid, diphenylmethane-4,4'-dica Examples include units derived from aromatic dicarboxylic acids such as boric acid, diphenylsulfone-4,4'-dicarboxylic acid, and 4,4'-biphenyldicarboxylic acid, and include one or more of these units. Can be made. Among these, it is preferable to include a unit derived from an aromatic dicarboxylic acid. The content of these other dicarboxylic acid units is preferably at most 40 mol%, more preferably at most 30 mol%, even more preferably at most 10 mol%. Further, a unit derived from a polycarboxylic acid such as trimellitic acid, trimesic acid, and pyromellitic acid can be included in a range where melt molding is possible.
参考例1
テレフタル酸3256.1g(19.60モル)、1,9−ノナンジアミン2960.9g(17.0モル)、2−メチル−1,8−オクタンジアミン474.9g(3.0モル)、安息香酸97.7g(0.80モル)、次亜リン酸ナトリウム一水和物6.8g(原料に対して0.1重量%)および蒸留水2.2リットルを、内容積20リットルのオートクレーブに入れ、窒素置換した。100℃で30分間攪拌し、2時間かけて内部温度を210℃に昇温した。この時、オートクレーブ内を22kg/cm2まで昇圧した。そのまま1時間反応を続けた後230℃に昇温し、その後2時間、230℃に温度を保ち、水蒸気を徐々に抜いて圧力を22kg/cm2に保ちながら反応させた。次に、30分かけて圧力を10kg/cm2まで下げ、更に1時間反応させて、濃硫酸中30℃で測定した極限粘度[η]が0.21dl/gのプレポリマーを得た。これを、100℃、減圧下で12時間乾燥し、2mm以下の大きさまで粉砕した。これを230℃、0.1mmHgの条件下にて、10時間固相重合し、融点が308℃、濃硫酸中30℃で測定した極限粘度[η]が1.04dl/g、末端封止率が90%である白色のポリアミドを得た。
Reference Example 1
3256.1 g (19.60 mol) of terephthalic acid, 2960.9 g (17.0 mol) of 1,9-nonanediamine, 474.9 g (3.0 mol) of 2-methyl-1,8-octanediamine, benzoic acid 97.7 g (0.80 mol), 6.8 g of sodium hypophosphite monohydrate (0.1% by weight based on the raw material) and 2.2 liters of distilled water are put into an autoclave having a capacity of 20 liters. Was replaced with nitrogen. The mixture was stirred at 100 ° C for 30 minutes, and the internal temperature was raised to 210 ° C over 2 hours. At this time, the pressure inside the autoclave was increased to 22 kg / cm 2 . After continuing the reaction for 1 hour, the temperature was raised to 230 ° C., and thereafter, the temperature was maintained at 230 ° C. for 2 hours, and the reaction was carried out while gradually removing water vapor and maintaining the pressure at 22 kg / cm 2 . Next, the pressure was reduced to 10 kg / cm 2 over 30 minutes, and the reaction was further performed for 1 hour to obtain a prepolymer having an intrinsic viscosity [η] of 0.21 dl / g measured at 30 ° C. in concentrated sulfuric acid. This was dried at 100 ° C. under reduced pressure for 12 hours and pulverized to a size of 2 mm or less. This was subjected to solid-state polymerization at 230 ° C. and 0.1 mmHg for 10 hours, and had a melting point of 308 ° C., an intrinsic viscosity [η] of 1.04 dl / g measured at 30 ° C. in concentrated sulfuric acid, and a terminal blocking rate. Was 90%.
実施例1
参考例1のポリアミド100重量部に対して、臭素化ポリスチレン(マナック社製「プラセフティ1200Z」)45重量部、錫酸亜鉛(日本軽金属社製「FLAMTARD−S」)7重量部、ガラス繊維(日東紡績製「CS 3J−256」)75重量部を加え、ドライブレンドした。これを東洋精機製作所製の二軸押出機「ラボプラストミル2D25W」を使用して、シリンダー温度320℃、40rpmの回転速度で溶融状態で押し出し、冷却水槽でストランドを冷却した後、ペレット化することによりポリアミド組成物を製造した。これを120℃で12時間真空乾燥した後、日精樹脂工業製射出成形機「NS15」を用いて、シリンダー温度を320℃、金型温度を150℃に設定して射出成形し、得られた成形品の物性を前記の方法で評価した。評価結果を下記の表2に示す。
Example 1
45 parts by weight of brominated polystyrene ("Plasafe 1200Z" manufactured by Manac), 7 parts by weight of zinc stannate ("FLAMTARD-S " manufactured by Nippon Light Metal Co., Ltd.), 100 parts by weight of polyamide of Reference Example 1, glass fiber ( 75 parts by weight of Nitto Boseki's "CS 3J-256 " ) were added and dry blended. Using a twin screw extruder “Laboplast Mill 2D25W” manufactured by Toyo Seiki Seisaku-sho, extrude it in a molten state at a cylinder temperature of 320 ° C. and a rotation speed of 40 rpm, cool the strand in a cooling water tank, and pelletize it. Produced a polyamide composition. This was vacuum-dried at 120 ° C. for 12 hours, and then subjected to injection molding using an injection molding machine “NS15” manufactured by Nissei Plastics Industry Co., Ltd. at a cylinder temperature of 320 ° C. and a mold temperature of 150 ° C. The physical properties of the product were evaluated by the methods described above. The evaluation results are shown in Table 2 below.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33263099A JP4480823B2 (en) | 1999-01-29 | 1999-11-24 | Polyamide composition |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2141399 | 1999-01-29 | ||
JP11-21413 | 1999-01-29 | ||
JP33263099A JP4480823B2 (en) | 1999-01-29 | 1999-11-24 | Polyamide composition |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2000281900A JP2000281900A (en) | 2000-10-10 |
JP2000281900A5 true JP2000281900A5 (en) | 2006-09-21 |
JP4480823B2 JP4480823B2 (en) | 2010-06-16 |
Family
ID=26358470
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33263099A Expired - Lifetime JP4480823B2 (en) | 1999-01-29 | 1999-11-24 | Polyamide composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4480823B2 (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2007154110A (en) * | 2005-12-07 | 2007-06-21 | Asahi Kasei Chemicals Corp | Resin composition exhibiting excellent heat resistance |
-
1999
- 1999-11-24 JP JP33263099A patent/JP4480823B2/en not_active Expired - Lifetime
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