JP2000190070A - Method and device for soldering - Google Patents
Method and device for solderingInfo
- Publication number
- JP2000190070A JP2000190070A JP37588998A JP37588998A JP2000190070A JP 2000190070 A JP2000190070 A JP 2000190070A JP 37588998 A JP37588998 A JP 37588998A JP 37588998 A JP37588998 A JP 37588998A JP 2000190070 A JP2000190070 A JP 2000190070A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- heating container
- heating
- main body
- high frequency
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、精密電子部品のは
んだ付けに適したはんだ付け方法および装置に関する。The present invention relates to a soldering method and apparatus suitable for soldering precision electronic components.
【０００２】[0002]
【従来の技術】ＬＳＩのような高機能電子部品は、半導
体素子をパッケージに収容し、該パッケージをリッドと
称する蓋部材で蓋をして、これらをはんだではんだ付け
することにより密閉している。従来、パッケージとリッ
ドのはんだ付けは、リッド或いはパッケージの一方に予
めはんだを付着させたり、或いはリッドとパッケージ間
にワッシャー状のはんだを挟んだりして、リッドとパッ
ケージを重ね合わせてから両者を加熱してはんだ付けを
行うものである。該はんだ付け時、フラックスを用いる
と、フラックス残渣が半導体素子やリードに悪影響を及
ぼすことがあるため、フラックスを用いないではんだ付
けすることが行われている。フラックスを用いないはん
だ付けでは、大気中の酸素がはんだ付けを阻害すること
から酸素のない状態、つまり不活性雰囲気ではんだ付け
を行う。2. Description of the Related Art A high-performance electronic component such as an LSI accommodates a semiconductor element in a package, covers the package with a lid member called a lid, and seals the package with solder. . Conventionally, when soldering a package and a lid, the solder is pre-applied to either the lid or the package, or a washer-like solder is sandwiched between the lid and the package, and the lid and the package are stacked and heated. Then, soldering is performed. At the time of the soldering, if a flux is used, the flux residue may have an adverse effect on a semiconductor element or a lead. Therefore, soldering is performed without using a flux. In soldering without using flux, soldering is performed in a state without oxygen, that is, in an inert atmosphere because oxygen in the air hinders soldering.
【０００３】従来、リッドとパッケージのはんだ付けに
は、プリント基板のはんだ付け用のリフロー炉が用いら
れていた。このリフロー炉とは、上下部にヒーターが設
置されトンネル内をチェーンコンベア、或いはメッシュ
コンベア等の走行装置が走行しているものである。リフ
ロー炉を用いたリッドとパッケージのはんだ付けは、は
んだを付着させたリッドの上にパッケージを載置した
り、リッドとパッケージ間にフォームはんだを挟んだり
したものを走行装置でトンネル内に走行させてはんだ付
けを行っていた。Conventionally, a reflow furnace for soldering a printed circuit board has been used for soldering a lid and a package. The reflow furnace is one in which heaters are installed at upper and lower portions and a traveling device such as a chain conveyor or a mesh conveyor travels in a tunnel. When soldering the lid and package using a reflow furnace, place the package on the lid to which the solder is attached, or sandwich the foam solder between the lid and the package, and run it in a tunnel using a traveling device. Soldering.
【０００４】[0004]
【発明が解決しようとする課題】ところで半導体のリッ
ドは、大きさが小さいものでは０．１×３×３（mm）と
非常に小さく、また重量も軽いため、リフロー炉のよう
な大きな加熱装置ではんだ付けを行うと、リフロー炉の
コンベアやメッシュベルトにおける振動や衝撃でリッド
とパッケージの位置ずれを起こしてしまうことがあっ
た。また大きなリフロー炉では、リフロー炉内を不活性
雰囲気にしてはんだ付けする場合、小さなリッドやパッ
ケージに対してリフロー炉が必要以上に大きいため、使
用する不活性ガスの消費量も大量となって経済的にも問
題のあるものであった。本発明は、微小なはんだ付け物
を正確に、しかも不活性ガスを使用する場合は、その消
費量も少なくて済むというはんだ付け方法および装置を
提供することにある。The semiconductor lid is as small as 0.1 × 3 × 3 (mm) in the case of a small size and is light in weight, so that a large heating device such as a reflow furnace is used. When soldering is performed in this manner, the lid and the package may be displaced due to vibration or impact on the conveyor or mesh belt of the reflow furnace. Also, in a large reflow furnace, when soldering in an inert atmosphere inside the reflow furnace, the reflow furnace is larger than necessary for small lids and packages, so the consumption of inert gas used is large and economical. Was problematic. SUMMARY OF THE INVENTION An object of the present invention is to provide a soldering method and a soldering device which can accurately use a small soldering material and consume a small amount of the gas when an inert gas is used.
【０００５】[0005]
【課題を解決するための手段】本発明者等は、被はんだ
付け物がはんだ付け中に振動や衝撃を受けないようにす
れば、リッドやパッケージのような小さなものでも正確
にはんだ付けができ、またはんだ付けを小さな容器内で
行えば不活性ガスの消費量も少なくて済むこと等に着目
して本発明を完成させた。SUMMARY OF THE INVENTION The present inventors have succeeded in accurately soldering even a small object such as a lid or a package if the object to be soldered is not subjected to vibration or impact during soldering. The present invention has been completed by focusing on the fact that if the soldering is performed in a small container, the consumption of the inert gas can be reduced.
【０００６】本発明は、本体と蓋部材から構成され、少
なくとも本体又は蓋部材のどちらか一方が金属製である
加熱容器内に被はんだ付け物を収容した後、該加熱容器
を高周波誘導電流により加熱して加熱容器内に収容され
た被はんだ付け物をはんだ付けすることを特徴とするは
んだ付け方法である。According to the present invention, after an object to be soldered is accommodated in a heating vessel having a main body and a lid member, at least one of which is made of metal, the heating vessel is subjected to high-frequency induction current. A soldering method comprising heating and soldering an object to be soldered contained in a heating container.
【０００７】また本発明は、加熱容器は本体と蓋部材か
ら構成されているとともに、少なくとも本体又は蓋部材
のどちらか一方が金属製であり、また該加熱容器の外部
には加熱容器を取り囲むようにして高周波加熱コイルが
設置されていることを特徴とするはんだ付け装置でもあ
る。Further, according to the present invention, the heating container comprises a main body and a lid member, at least one of the main body and the lid member is made of metal, and the heating container is provided outside the heating container so as to surround the heating container. And a high-frequency heating coil is installed in the soldering apparatus.
【０００８】[0008]
【発明の実施の形態】本発明は、加熱容器全体を高周波
加熱コイルで加熱して加熱容器内の内部をはんだ付け温
度に昇温させ、この加熱容器内の温度で加熱するという
間接加熱によるはんだ付けである。従って高周波加熱コ
イルでの高周波誘導電流で被加熱物が電磁誘導を起こす
材料、即ち加熱容器が金属製でなければならない。しか
しながら、加熱容器は全て金属製でもよいが、加熱容器
の本体又は蓋部材の何方か一方が金属製であれば金属の
部分が電磁誘導で加熱されて加熱容器内が昇温する。BEST MODE FOR CARRYING OUT THE INVENTION The present invention relates to soldering by indirect heating in which the entire heating vessel is heated by a high-frequency heating coil, the inside of the heating vessel is heated to a soldering temperature, and the inside of the heating vessel is heated at this temperature. It is attached. Therefore, the material to be heated causes electromagnetic induction by the high-frequency induction current in the high-frequency heating coil, that is, the heating container must be made of metal. However, the heating vessel may be entirely made of metal, but if either the main body or the lid member of the heating vessel is made of metal, the metal portion is heated by electromagnetic induction and the temperature inside the heating vessel rises.
【０００９】本発明のはんだ付け装置で微小なリッドと
パッケージをはんだ付けする場合、はんだの溶融時にリ
ッドやパッケージが溶融はんだの表面張力で動かされる
ことがある。そこで加熱容器の蓋部材には、リッドとパ
ッケージを押さえるための押さえ棒を取り付けておくの
がよい。リッドとパッケージを動かさないようにするた
めには、蓋部材の重さがかかる程度で充分であり、蓋部
材の重さが押さえ棒にかかるようにするためには、本体
を蓋部材で蓋をした状態で本体と蓋部材間で蓋部材が未
だ降下する余裕を設けておくようにする。[0009] When a small lid and a package are soldered by the soldering apparatus of the present invention, the lid and the package may be moved by the surface tension of the molten solder when the solder is melted. Therefore, it is preferable to attach a holding rod for holding the lid and the package to the lid member of the heating container. The weight of the lid is enough to keep the lid and package from moving, and the body is covered with the lid to keep the weight of the lid on the pressure bar. In such a state, a margin is provided between the main body and the lid member so that the lid member can still descend.
【００１０】加熱容器と高周波加熱コイルは、どちらも
固定されていてもよいが、加熱容器内への被はんだ付け
物の取り出しや蓋部材の開閉等のときに、高周波加熱コ
イルが邪魔となるのであれば、加熱容器、或いは高周波
加熱コイルのどちらか一方を上下動するようにしてもよ
い。Both the heating vessel and the high-frequency heating coil may be fixed. However, the high-frequency heating coil hinders the removal of the object to be soldered into the heating vessel and the opening and closing of the lid member. If so, either the heating container or the high-frequency heating coil may be moved up and down.
【００１１】[0011]
【実施例】以下、図面に基づいて本発明のはんだ付け装
置について説明する。図１は本発明のはんだ付け装置の
正面断面図、図２は本発明のはんだ付け装置の斜視図、
図３は加熱容器内の部分拡大断面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a perspective view of a soldering apparatus according to the present invention. 1 is a front sectional view of the soldering apparatus of the present invention, FIG. 2 is a perspective view of the soldering apparatus of the present invention,
FIG. 3 is a partially enlarged sectional view of the inside of the heating vessel.
【００１２】本発明のはんだ付け装置は、加熱容器１、
高周波加熱コイルから成り、加熱容器１は本体３、蓋部
材４から構成されている。The soldering apparatus of the present invention comprises a heating vessel 1,
The heating vessel 1 is composed of a main body 3 and a cover member 4.
【００１３】本体３には内側中央に受け台５が設置され
ている。該受け台は、リッド６とパッケージ７を収容で
きる溝７が形成されている。The main body 3 is provided with a cradle 5 at the center in the inside. The pedestal is formed with a groove 7 that can accommodate a lid 6 and a package 7.
【００１４】蓋部材４は、前記本体３と密封できるよう
になっており、内側中央には押さえ棒８が吊設されてい
る。該押さえ棒はリッド６上にパッケージ７を載置して
から本体３を蓋部材４で蓋をしたときに、パッケージ７
を押圧できるようになっている。つまり蓋部材４は、本
体３に蓋をしたときに、本体３の周縁が蓋部材４の周縁
と接していない状態で蓋部材の重量が押さえ棒８にかか
るようになっている。蓋部材４の上面には二箇所に穴
９、１０が穿設されており、一方の穴９からは不活性ガ
ス供給パイプ１１が挿入され、もう一方の穴１０からは
熱感知センサー１２が挿入されている。穴９と不活性ガ
ス供給パイプ１１とは摺動自在であるが隙間がほとんど
ないくらいな挿入状態であり、また穴１０と熱感知セン
サー１２とは、或る程度隙間がとられた状態となってい
る。これは不活性ガス供給パイプから不活性ガスを供給
するときに、加熱容器内にあった空気を熱感知センサー
挿入穴から外部に流出させるためである。The lid member 4 can be hermetically sealed with the main body 3, and a holding rod 8 is suspended from the center of the inside. When the package 7 is placed on the lid 6 and the main body 3 is covered with the cover member 4,
Can be pressed. That is, when the lid 4 is covered with the main body 3, the weight of the lid member is applied to the holding rod 8 in a state where the peripheral edge of the main body 3 is not in contact with the peripheral edge of the lid member 4. Holes 9 and 10 are formed in two places on the upper surface of the lid member 4. An inert gas supply pipe 11 is inserted from one of the holes 9, and a heat sensing sensor 12 is inserted from the other hole 10. Have been. The hole 9 and the inert gas supply pipe 11 are slidable but in an inserted state where there is almost no gap, and the hole 10 and the heat sensing sensor 12 are in a state where a certain gap is formed. ing. This is because when the inert gas is supplied from the inert gas supply pipe, the air in the heating vessel flows out of the heat sensing sensor insertion hole to the outside.
【００１５】加熱容器１の周囲には、該加熱容器を取り
囲むようにして高周波加熱コイル２が設置されている。
高周波加熱コイル２は図示しない高周波発生装置に電気
的に接続されており、前記熱感知センサー１２で加熱容
器内の温度を測定して所定の温度に制御できるようにな
っている。A high-frequency heating coil 2 is provided around the heating vessel 1 so as to surround the heating vessel.
The high-frequency heating coil 2 is electrically connected to a high-frequency generator (not shown), so that the temperature inside the heating vessel can be controlled to a predetermined temperature by measuring the temperature in the heating vessel with the heat sensing sensor 12.
【００１６】加熱容器１の本体２の下部は上下動装置１
３に固定されており、加熱容器１は矢印Ａのように上下
動可能となっている。The lower part of the main body 2 of the heating vessel 1 is
3, the heating vessel 1 can be moved up and down as indicated by an arrow A.
【００１７】次に上記構成から成る本発明のはんだ付け
装置におけるリッドとパッケージをはんだ付けする方法
について説明する。Next, a method of soldering the lid and the package in the soldering apparatus of the present invention having the above-described configuration will be described.
【００１８】先ず、上下装置１３で加熱容器１を下方に
上げておき、蓋部材４を本体３から外す。そして図３に
示すように本体３の受け台５に予めはんだが付着させら
れたリッド６をはんだ付け面が上となるようにして置
き、さらにその上にパッケージ７を載置する。First, the heating container 1 is raised downward by the lifting device 13, and the lid member 4 is removed from the main body 3. Then, as shown in FIG. 3, a lid 6 to which solder has been attached in advance is placed on a receiving table 5 of the main body 3 so that a soldering surface faces up, and a package 7 is further placed thereon.
【００１９】その後、本体３を蓋部材４で蓋をし、蓋部
材４に取り付けられた押さえ棒８でパッケージ７を押圧
する。そして不活性ガス供給パイプ１１を穴９に、熱感
知センサー１２を穴１０に挿入し、上下動装置１３を稼
働させて加熱容器１を高周波加熱コイル２に囲まれる位
置まで上昇させる。Thereafter, the main body 3 is covered with the cover member 4 and the package 7 is pressed with the pressing rod 8 attached to the cover member 4. Then, the inert gas supply pipe 11 is inserted into the hole 9 and the heat detection sensor 12 is inserted into the hole 10, and the vertical movement device 13 is operated to raise the heating vessel 1 to a position surrounded by the high-frequency heating coil 2.
【００２０】加熱容器１が所定の位置まで上昇したなら
ば、不活性ガス供給パイプ１１から不活性ガスを加熱容
器１内に供給（矢印Ｂ）する。このとき加熱容器内部の
空気は熱感知センサー１２と穴１０の隙間から流出して
いき、加熱容器内部が完全な不活性雰囲気となる。加熱
容器内部が不活性雰囲気になった後、図示しない高周波
加熱装置を稼働させ高周波加熱コイル２に高周波誘導電
流を流す。すると加熱容器１の金属部である本体３と蓋
部材４が電磁誘導を起こして熱を発生し、加熱容器１内
部も間接加熱される。この温度がはんだの溶融温度以上
になるとリッドに付着したはんだが溶融する。このとき
パッケージ７は蓋部材４の押さえ棒８で押圧されている
ため、溶融はんだの表面張力で動かされることがない。
加熱容器内の温度は熱感知センサー１２で測定し、高周
波発生装置にフィードバックされ、ここで高周波電流が
制御される。When the heating vessel 1 has risen to a predetermined position, an inert gas is supplied from the inert gas supply pipe 11 into the heating vessel 1 (arrow B). At this time, the air inside the heating vessel flows out from the gap between the heat sensing sensor 12 and the hole 10, and the inside of the heating vessel becomes a completely inert atmosphere. After the inside of the heating vessel becomes an inert atmosphere, a high-frequency heating device (not shown) is operated to supply a high-frequency induction current to the high-frequency heating coil 2. Then, the main body 3 and the cover member 4 which are metal parts of the heating vessel 1 generate electromagnetic induction to generate heat, and the inside of the heating vessel 1 is also indirectly heated. When this temperature exceeds the melting temperature of the solder, the solder attached to the lid is melted. At this time, since the package 7 is pressed by the pressing rod 8 of the lid member 4, it is not moved by the surface tension of the molten solder.
The temperature in the heating vessel is measured by the heat sensor 12 and fed back to the high frequency generator, where the high frequency current is controlled.
【００２１】そしてはんだが完全に溶融したならば、高
周波発生装置の稼働を止める。すると加熱容器１は外部
の冷気で冷やされ、加熱容器内もはんだの溶融温度以下
に下がって、はんだが凝固し、はんだ付けが終了する。
その後、不活性ガス供給パイプ１１と熱感知センサー１
２をそれぞれの挿入穴から引き抜き、加熱容器１を上下
動装置１３で下降させる。加熱容器１が所定位置までさ
がったならば蓋部材４を本体３から外して、加熱容器内
ではんだ付けされたリッドとパッケージを取り出す。When the solder is completely melted, the operation of the high frequency generator is stopped. Then, the heating container 1 is cooled by the external cold air, the temperature inside the heating container also drops below the melting temperature of the solder, the solder solidifies, and the soldering ends.
Then, the inert gas supply pipe 11 and the heat sensor 1
2 is pulled out from each of the insertion holes, and the heating container 1 is lowered by the vertical movement device 13. When the heating container 1 has dropped to a predetermined position, the lid member 4 is removed from the main body 3 and the lid and the package soldered in the heating container are taken out.
【００２２】本発明装置で、周囲に高温はんだがメッキ
された０．１×３×３（mm）のリッドの上に、はんだ付
け部にニッケルメッキが施されたパッケージを載置し、
加熱容器内の酸素濃度を１０ｐｐｍにしてはんだ付けを
行ったところ、リッドとパッケージは位置ずれすること
なく、またはんだ付け部にはボイドの発生がないはんだ
付け部が得られた。In the apparatus of the present invention, a package having a nickel-plated soldered portion is placed on a 0.1 × 3 × 3 (mm) lid having a high-temperature solder plated around the package.
When the soldering was performed with the oxygen concentration in the heating vessel set at 10 ppm, a soldered portion was obtained without displacement of the lid and the package or without generation of voids in the soldered portion.
【００２３】[0023]
【発明の効果】以上説明したように本発明によれば、微
小な被はんだ付け物でも位置ずれすることなく正確には
んだ付けができ、また該はんだ付けを不活性雰囲気で行
う場合、不活性ガスの使用量をきわめて少なくできると
いう信頼性、経済性に優れたはんだ付けが行えるもので
ある。As described above, according to the present invention, even a minute soldering object can be accurately soldered without displacement, and when the soldering is performed in an inert atmosphere, an inert gas is used. The soldering can be performed with excellent reliability and economical efficiency because the amount of used can be extremely reduced.
【図１】本発明のはんだ付け装置の正面断面図FIG. 1 is a front sectional view of a soldering apparatus of the present invention.
【図２】本発明のはんだ付け装置の斜視図FIG. 2 is a perspective view of the soldering apparatus of the present invention.
【図３】加熱容器内の部分拡大断面図FIG. 3 is a partially enlarged cross-sectional view of a heating vessel.
【符号の説明】 １ 加熱容器 ２ 高周波加熱コイル ３ 本体 ４ 蓋部材 ８ 押さえ棒 １１ 不活性ガス供給パイプ １２ 熱感知センサー １３ 上下動装置[Description of Signs] 1 Heating vessel 2 High frequency heating coil 3 Main body 4 Lid member 8 Holding rod 11 Inert gas supply pipe 12 Heat sensing sensor 13 Vertical movement device
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ テーマコート゛(参考） Ｂ２３Ｋ 101:40 ──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. 7 Identification code FI Theme coat ゛ (Reference) B23K 101: 40
Claims (6)
本体又は蓋部材のどちらか一方が金属製である加熱容器
内に被はんだ付け物を収容した後、該加熱容器を高周波
誘導電流により加熱して加熱容器内に収容された被はん
だ付け物をはんだ付けすることを特徴とするはんだ付け
方法。An object to be soldered is housed in a heating vessel comprising a main body and a lid member, wherein at least one of the main body and the lid member is made of metal, and the heating vessel is heated by a high-frequency induction current. A soldering object contained in the heating container by means of soldering.
ていることを特徴とする請求項１記載のはんだ付け方
法。2. The soldering method according to claim 1, wherein the inside of the heating vessel is in an inert atmosphere.
いるとともに、少なくとも本体又は蓋部材のどちらか一
方が金属製であり、また該加熱容器の外部には加熱容器
を取り囲むようにして高周波加熱コイルが設置されてい
ることを特徴とするはんだ付け装置。3. The heating container comprises a main body and a lid member, at least one of the main body and the lid member is made of metal, and a high-frequency wave is provided outside the heating container so as to surround the heating container. A soldering device comprising a heating coil.
の供給管が挿入されていることを特徴とする請求項３記
載のはんだ付け装置。4. The soldering apparatus according to claim 3, wherein an inert gas supply pipe is inserted into the main body or the cover member.
する押さえ棒が取り付けられていることを特徴とする請
求項３記載のはんだ付け装置。5. The soldering apparatus according to claim 3, wherein a pressing rod for pressing an object to be soldered is attached to the lid member.
は、上下動可能となっていることを特徴とする請求項３
記載のはんだ付け装置。6. The heating vessel or the high-frequency heating coil is capable of moving up and down.
The soldering device as described.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37588998A JP2000190070A (en) | 1998-12-21 | 1998-12-21 | Method and device for soldering |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP37588998A JP2000190070A (en) | 1998-12-21 | 1998-12-21 | Method and device for soldering |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JP2000190070A true JP2000190070A (en) | 2000-07-11 |
Family
ID=18506222
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP37588998A Pending JP2000190070A (en) | 1998-12-21 | 1998-12-21 | Method and device for soldering |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2000190070A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086933A (en) * | 2001-09-07 | 2003-03-20 | Matsushita Electric Ind Co Ltd | Device and method for reflow |
| JP2005503659A (en) * | 2001-09-17 | 2005-02-03 | スタフォード，ジョン | Micro Magnetic Latch Relay Package and Packaging Method |
| JP2007142343A (en) * | 2005-11-22 | 2007-06-07 | Toyota Industries Corp | Soldering equipment and soldering method |
| JP2009049240A (en) * | 2007-08-21 | 2009-03-05 | Origin Electric Co Ltd | Device for manufacturing electronic part package, and method of manufacturing the same |
| CN102211235A (en) * | 2011-04-18 | 2011-10-12 | 哈尔滨工业大学 | Soldering method and device of heterogeneous stainless steel oil injection nozzle nut of engine |
-
1998
- 1998-12-21 JP JP37588998A patent/JP2000190070A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003086933A (en) * | 2001-09-07 | 2003-03-20 | Matsushita Electric Ind Co Ltd | Device and method for reflow |
| JP4499963B2 (en) * | 2001-09-07 | 2010-07-14 | パナソニック株式会社 | Reflow device |
| JP2005503659A (en) * | 2001-09-17 | 2005-02-03 | スタフォード，ジョン | Micro Magnetic Latch Relay Package and Packaging Method |
| JP2007142343A (en) * | 2005-11-22 | 2007-06-07 | Toyota Industries Corp | Soldering equipment and soldering method |
| JP2009049240A (en) * | 2007-08-21 | 2009-03-05 | Origin Electric Co Ltd | Device for manufacturing electronic part package, and method of manufacturing the same |
| CN102211235A (en) * | 2011-04-18 | 2011-10-12 | 哈尔滨工业大学 | Soldering method and device of heterogeneous stainless steel oil injection nozzle nut of engine |
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