JPS6264473A - Fusion joining device for article - Google Patents

Fusion joining device for article

Info

Publication number
JPS6264473A
JPS6264473A JP60203343A JP20334385A JPS6264473A JP S6264473 A JPS6264473 A JP S6264473A JP 60203343 A JP60203343 A JP 60203343A JP 20334385 A JP20334385 A JP 20334385A JP S6264473 A JPS6264473 A JP S6264473A
Authority
JP
Japan
Prior art keywords
tank
cooling
heat
heating
heat transfer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP60203343A
Other languages
Japanese (ja)
Other versions
JPH0416262B2 (en
Inventor
Kenji Kondo
近藤　権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP60203343A priority Critical patent/JPS6264473A/en
Priority to CN86104969.1A priority patent/CN1004680B/en
Priority to EP86307129A priority patent/EP0218391B1/en
Priority to US06/908,025 priority patent/US4679721A/en
Priority to EP89201803A priority patent/EP0349094B1/en
Priority to DE8686307129T priority patent/DE3672439D1/en
Priority to DE89201803T priority patent/DE3689005D1/en
Publication of JPS6264473A publication Critical patent/JPS6264473A/en
Priority to KR2019900006849U priority patent/KR900007617Y1/en
Priority to KR2019900007521U priority patent/KR920005953Y1/en
Publication of JPH0416262B2 publication Critical patent/JPH0416262B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/012—Soldering with the use of hot gas
    • B23K1/015—Vapour-condensation soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To execute efficiently heating and cooling, and also to reduce a loss of a heat energy by forming a treating tank whose lower part and upper part consist of a heating tank and a cooling tank, respectively, through a heat insulating material, and providing a turnable cover which has provided a water feed use hollow part on an opening part of the cooling tank. CONSTITUTION:A treating tank 12 is formed by providing a heating tank 17 and a cooling tank 18 on the lower part and the upper part, respectively, through a heat insulating material 19. A heat transition liquid 13 having a boiling point exceeding a melting point of a paste solder 22 is contained in the heating tank 17. The cooling tank 18 is provided with a cooler 16, and also a cover 26 having a hollow part 27 for feeding a cooling water 28 is provided so as to be turnable on an upper opening part 25. A placing base 23 on which a printed board 20 to which the paste solder 22 has been applied, and chip parts 21 have been placed in charged to the heating tank 17 through a rod 24. Subsequently, the heat transition liquid 13 is heated and boiled by a heater 14, the paste solder 22 is heated and melted by generated vapor 15, and the printed board 20 and the chip parts 21 are joined. The vapor 15 which has further ascended is cooled and solidified by the cooler and the cover 26, dropped down and collected to the heating tank 17 as the heat transition liquid 13.

Description

【発明の詳細な説明】 〔産業上の利用分野コ この発明は、苅１熱された液状の熱転移液の蒸気４・熱
媒体として物品を接合する接合剤の融解を行う物品の融
着接合装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] This invention relates to fusion bonding of articles, in which 1. vapor of a heated liquid heat transfer liquid 4. melts a bonding agent for bonding articles as a heating medium. It is related to the device.

〔従来の技術〕[Conventional technology]

一般に物品を接合させるには、はんだごて等電熱による
加熱固体、液体または気体状の熱媒体物質を用いるか、
熱エネルギーをもった光線等を利用して熱エネルギーを
接合剤に転移させて加熱し接合剤を流動体にして接合剤
の保有した熱により物品の接合部を接合適温に上昇せし
めた後冷却して接合を行っている。Generally, to join articles, a solid, liquid, or gaseous heating medium substance heated by electric heat such as a soldering iron is used, or
Thermal energy is transferred to the bonding agent using a beam of heat, etc. to heat the bonding agent.The bonding agent is turned into a fluid, and the heat retained in the bonding agent is used to raise the bonding area of the article to the appropriate temperature for bonding, and then the product is cooled. The joint is performed using

ここで、上記の接合方法の中で第２図は例えば、特公昭
５３−４０９３４号公報に示された従来の物品の融着方
法に使用された装置を示ず側断面図で、１は容器、２は
加熱コイル、３は冷却コイル、４はフッ素系の熱転移液
で、フレオンＥ５の名称でＥ・■デュポン社から販売さ
れている沸化ポリオキシプロピレンである。そして、こ
の熱転移液４ば容器１内に図示の位置まで入れられ、加
熱コイル２によりその沸１府点まで加熱され、かつその
温度に維持されている。沸騰ずろ熱転移液４からの加熱
発生された蒸気４ａはほぼ一点鎖線５で示されるように
冷却コイル３の水平面の位置まで満たされ、冷却コイル
３の位置て蒸気４ａは凝縮され、液体となって容器１の
下部に戻る。６は印刷回路板、７は前記印刷回路板６を
載置保持する保持具、８ば前記印刷回路板６に接合され
る電子部品等のチップ部品であり、９は粉末状のはんだ
にペーストを混合した糊状の接合剤であるペースＩ・は
んだで、あらかじめ印刷回路板６の上面とチ・ツブ部品
８の下面に塗布されている。なお、熱転移液４は、ベー
ス）・はんだ９の融解点以上の沸騰点を有するものが使
用されている。Here, in the above joining method, FIG. 2 is a side sectional view without showing the device used in the conventional article fusion method disclosed in Japanese Patent Publication No. 53-40934, and 1 is a side sectional view of the container. , 2 is a heating coil, 3 is a cooling coil, and 4 is a fluorine-based heat transfer liquid, which is fluorinated polyoxypropylene sold by E.D. DuPont under the name Freon E5. The heat transfer liquid 4 is placed in the container 1 to the position shown in the figure, heated by the heating coil 2 to its boiling point, and maintained at that temperature. The steam 4a generated by heating from the boiling-below heat transfer liquid 4 fills the cooling coil 3 almost up to the horizontal plane as shown by the dashed line 5, and the steam 4a condenses at the position of the cooling coil 3 and becomes a liquid. and return to the bottom of container 1. 6 is a printed circuit board, 7 is a holder for mounting and holding the printed circuit board 6, 8 is a chip component such as an electronic component to be joined to the printed circuit board 6, and 9 is a paste applied to powdered solder. Pase I solder, which is a mixed glue-like bonding agent, is applied in advance to the upper surface of the printed circuit board 6 and the lower surface of the chip component 8. The heat transfer liquid 4 used has a boiling point higher than the melting point of the base solder 9.

このように、熱転移液４が沸騰して蒸気４ａとなり、こ
の蒸気４ａの有する熱エネルギ゛−を熱媒体としてペー
ストはんだ９を融解させ、次いで、保持具７を上方へ引
き上げて゛冷却コイル３および空気中で冷却ｊ７凝固さ
せろことにより印刷回路板６とチップ部品８とを接合さ
せる。In this way, the heat transfer liquid 4 boils and becomes steam 4a, and the thermal energy of this steam 4a is used as a heat medium to melt the paste solder 9.Then, the holder 7 is pulled upward and the cooling coil 3 and The printed circuit board 6 and the chip component 8 are bonded by cooling and solidifying in air.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

ところで、従来の物品の融着方法としては、熱転移液４
を連続して蒸気の状態で使用するため、容器１の開１１
部からの流出を避けることができず、また高価な熱転移
液４の消耗が激しいので、経済的ム損失が大きい問題点
があった。By the way, as a conventional method for fusing articles, heat transfer liquid 4
Opening 11 of container 1 in order to use continuously in vapor state.
Since the heat transfer liquid 4 cannot be avoided and the expensive heat transfer liquid 4 is consumed rapidly, there is a problem that there is a large economic loss.

また熱転移液４の液面から所要高さまでの上方空間部は
接合しようとする印刷回路板６やチップ部品８の大きさ
により蒸気４ａが滞溜する蒸気保温層Ａで、この蒸気保
温層Ａの上方は蒸気４ａが容器１の外の大気と混在して
いる蒸気凝結層Ｂである。In addition, the space above the liquid level of the heat transfer liquid 4 up to a required height is a steam heat-insulating layer A in which steam 4a accumulates depending on the size of the printed circuit board 6 or chip component 8 to be bonded. Above is a vapor condensation layer B where the vapor 4a is mixed with the atmosphere outside the container 1.

−ａ的に、熱転移液４が高価であるため、蒸気凝結層Ｂ
には冷却コイル３により蒸気４ａを凝縮牧化して熱転移
液４として容器１内に貯溜せしめている。-a, since the heat transfer liquid 4 is expensive, the vapor condensation layer B
The steam 4a is condensed by the cooling coil 3 and stored in the container 1 as a heat transfer liquid 4.

このように、容器１の内部の蒸気保温層Ａと蒸気凝結層
Ｂとは熱に対する条件が互いに相反する機能が必要とさ
れている。In this way, the steam heat retaining layer A and the steam condensation layer B inside the container 1 are required to have functions that have contradictory heat conditions.

すなわち、蒸気保温層Ａは接合剤であるペーストはんだ
９の融解温度に短時間で達するようにする必要があり、
蒸気凝結層Ｂでは蒸気４ａを凝縮液化せしめる必要があ
る。In other words, it is necessary that the vapor heat insulation layer A reaches the melting temperature of the paste solder 9, which is the bonding agent, in a short time.
In the vapor condensation layer B, it is necessary to condense and liquefy the vapor 4a.

このため、蒸気保温層Ａでは高温に、蒸気凝結層Ｂでは
低温にする必要があるが、従来の装置では容器１内で蒸
気保温層Ａと蒸気凝結層Ｂとの間で熱の移動が行われる
ため熱エネルギーの損失が大きいという問題点があった
。For this reason, it is necessary to maintain a high temperature in the steam heat retention layer A and a low temperature in the steam condensation layer B, but in conventional equipment, heat transfer occurs between the steam heat retention layer A and the steam condensation layer B within the container 1. There was a problem in that there was a large loss of thermal energy because of the

この発明は、上記問題点を解決するためになされたもの
で、熱エネルギーの損失を可及的に減少せしめた物品の
融着接合装置を提供することを目的とする。The present invention was made in order to solve the above-mentioned problems, and an object thereof is to provide a fusion bonding apparatus for articles in which the loss of thermal energy is reduced as much as possible.

〔問題点を解決するための手段〕[Means for solving problems]

この発明にかかる物〃の融着接合装置は、処理槽を上下
に二分割して下方の加熱槽と上方の冷却槽とし、これら
の間に断熱材を介在せし、め、さらに前記冷却槽の開口
部に通水用の中空部を形成した回動可能の蓋を設けたも
のである。The fusion bonding apparatus according to the present invention divides a processing tank into upper and lower halves to form a lower heating tank and an upper cooling tank, interposes a heat insulating material between these, and furthermore, the cooling tank is A rotatable lid with a hollow part for water passage is provided at the opening.

〔作用〕[Effect]

この発明において（、ｔ１断熱材が分割された加熱槽の
熱エネルギーの冷却槽への移動を阻止する。In this invention, the t1 insulation material prevents the transfer of thermal energy from the divided heating tank to the cooling tank.

また、蓋が熱転移液の蒸気の排出を阻止し、かつ蓋に通
水して冷却することにより蒸気の凝縮をさらに促進する
。Further, the lid prevents the vapor of the heat transfer liquid from being discharged, and further promotes condensation of the vapor by passing water through the lid for cooling.

〔実施例〕〔Example〕

第１図はこの発明の一実施例を示す側断面図で、１１は
物品の融着接合装置の全体を示し、１２は前記融着接合
装置１１の処理槽、１３は前記処理槽１２に収容されて
いる熱転移液で、この熱転移液１３は、例えばフッ素系
不活性液体であるフロリナ−１−（住友スリーエム株式
会社の商標名）を使用している。１４は前記熱転移液１
３を加熱するヒータ、１５は前記ヒ＝り１４によって熱
転移液１３が加熱されて生成した蒸気、１６はｒ１’Ｕ
記蒸気１５を凝縮する冷却器、１７は前記処理槽１２を
二分割することにより形成された下方の加熱槽で、熱転
移液１３を収容し、かつヒータ１４により加熱されて生
成した蒸気１５が充満している。FIG. 1 is a side sectional view showing an embodiment of the present invention, in which numeral 11 shows the entire fusion bonding device for articles, 12 a processing tank of the fusion bonding device 11, and 13 housed in the processing tank 12. This heat transfer liquid 13 uses, for example, Florina-1 (trademark name of Sumitomo 3M Limited), which is a fluorine-based inert liquid. 14 is the heat transfer liquid 1
15 is the steam generated by heating the heat transfer liquid 13 by the heater 14; 16 is r1'U;
A cooler 17 for condensing the steam 15 is a lower heating tank formed by dividing the processing tank 12 into two, which accommodates the heat transfer liquid 13 and allows the steam 15 generated by being heated by the heater 14 to It's full.

１８は前記処理槽１２の下方で冷却器１６が装着されて
いる冷却槽、１９は前記加熱槽１７の境界面１７ｎと冷
却槽１８の境界面１８１１の間の介在させた断熱材で、
加熱槽１７自体の保有する熱が冷却槽１８へ伝達するの
を阻止している。２０は第１の物品としてのプリント基
板、２１ば前記プリント基板２０に接合される第２の物
品としてのチップ部品、２２は前記プリント基板２０ど
チップ部品２１とを接合する接合剤としてのベーストは
人だ、２３は前記プリント基板２ｏの載置台、２４は前
記載置台２３に接合され、かつ上下に移動させるロッド
（ＩＩＩＫ動機構は省略しである）、２５は前記処理槽
１８の開口部、２６は前記開口部２５を閉ｉ５＠する回
動可能の蓋、２７は前記蓋２６に形成された中空部、２
８は前記中空部２７内に通水される冷却水である。18 is a cooling tank in which the cooler 16 is installed below the processing tank 12; 19 is a heat insulating material interposed between the boundary surface 17n of the heating tank 17 and the boundary surface 1811 of the cooling tank 18;
The heat held by the heating tank 17 itself is prevented from being transmitted to the cooling tank 18. 20 is a printed circuit board as a first article; 21 is a chip component as a second article bonded to the printed circuit board 20; and 22 is a base as a bonding agent for bonding the printed circuit board 20 and the chip component 21. 23 is a mounting table for the printed circuit board 2o, 24 is a rod that is connected to the mounting table 23 and moves it up and down (IIIK moving mechanism is omitted), 25 is an opening of the processing tank 18, 26 is a rotatable lid that closes the opening 25; 27 is a hollow portion formed in the lid 26;
8 is cooling water that is passed into the hollow portion 27.

なお、熱転移液１３ばペーストばんだ２２の融、解点以
上の沸点を有するものを１吏用する。The heat transfer liquid 13 used has a boiling point higher than the melting point of the paste binder 22.

以上のようにプリント基板２０とチップ部品２１はペー
ス１−はんだ２２が塗布されて接合位置に仮固定されて
いる。As described above, the printed circuit board 20 and the chip component 21 are coated with paste 1-solder 22 and temporarily fixed at the bonding position.

次いで、ヒータ１４により熱転移液１３が加熱されて沸
騰し、蒸気１５を発生する。そして、蒸気１５の熱エネ
ルギーにより、ペーストばんだ２２が短時間で加熱され
融解する。次いで、載置台２３が上方へ移動して開口部
２５から取り出されると冷却し凝固ずろ。Next, the heat transfer liquid 13 is heated and boiled by the heater 14 to generate steam 15. Then, the paste band 22 is heated and melted in a short time by the thermal energy of the steam 15. Next, when the mounting table 23 is moved upward and taken out from the opening 25, it is cooled and solidified.

次に、蒸気１５は冷却器１６および蓋２６により冷却さ
れて凝縮して滴下し、熱転移液１３となって貯溜される
。Next, the steam 15 is cooled by the cooler 16 and the lid 26, condenses and drips, and becomes the heat transfer liquid 13 and is stored.

〔発明の効果〕〔Effect of the invention〕

以上説明したようにこの発明は、処理槽を上下に二分割
して加熱槽と冷却槽とし、これらの間に断熱材を介在せ
しめ、さらに前記冷却槽の開口部に通水用の中空部を形
成した回動可能の蓋を設けたので、処理槽の熱の移動が
少なく加熱と冷却が効率よく行われ、蒸気の保有する熱
エネルギーの損失が少ない。また冷却槽内の蒸気は蓋に
より密閉され、さらに、冷却水により冷却されて凝縮が
促進されるため高価な熱転移液の消耗が少なく、経済的
である等の利点を有する。As explained above, the present invention divides a processing tank into upper and lower halves to form a heating tank and a cooling tank, interposes a heat insulating material between them, and further provides a hollow part for water passage at the opening of the cooling tank. Since the rotatable lid is provided, there is less heat transfer in the treatment tank, heating and cooling are performed efficiently, and there is less loss of thermal energy held by steam. In addition, the steam in the cooling tank is sealed by a lid, and is further cooled by cooling water to promote condensation, which has the advantage of reducing consumption of expensive heat transfer liquid and being economical.

【図面の簡単な説明】[Brief explanation of drawings]

第１図はこの発明の一実施例を示す側断面図、第２図は
従来の装置の一例を示す側断面図である。 図中、１１は融着接合装置、１２ば処理槽、１３は熱転
移液、１４はヒータ、１５は蒸気、１６は冷却器、１７
は加熱槽、１８は冷却槽、１７ａ。 １８ａは境界面、１９は断熱材、２ｏはプリント基板、
２１ばチップ部品、２２ばベーストはんだ、２３＋、を
載置ｆ３　、２４　ハａ　ッＦ　、　２５　Ｌｔ　Ｉｌ
ｎ　０部、２６は蓋、２７は中空部、２８は冷却水であ
る。FIG. 1 is a side sectional view showing an embodiment of the present invention, and FIG. 2 is a side sectional view showing an example of a conventional device. In the figure, 11 is a fusion bonding device, 12 is a processing tank, 13 is a heat transfer liquid, 14 is a heater, 15 is steam, 16 is a cooler, 17
18 is a heating tank, 18 is a cooling tank, and 17a. 18a is a boundary surface, 19 is a heat insulating material, 2o is a printed circuit board,
21 Place the chip parts, 22 the base solder, 23+, f3, 24 Ha F, 25 Lt Il
n0 part, 26 is a lid, 27 is a hollow part, and 28 is cooling water.

Claims (1)

【特許請求の範囲】[Claims] 　処理槽内に接合剤の融解点以上の沸点を有する熱転移
液を収容し、この熱転移液を加熱して生成した蒸気によ
り前記接合剤を溶融して第１の物品と第２の物品の接合
を行い、前記熱転移液の上部の蒸気を冷却して凝縮還流
する物品の融着接合装置において、前記処理槽を上下に
二分割して下方の加熱槽と上方の冷却槽とし、これらの
間に断熱材を介在せしめ、さらに、前記冷却槽の上部の
開口部に通水用の中空部を形成した開閉可能な蓋を設け
るとともに、前記第１の物品と第２の物品を載置して上
下に移動制御される載置台を設けたことを特徴とする物
品の融着接合装置。A heat transfer liquid having a boiling point higher than the melting point of the binder is stored in a processing tank, and the binder is melted by the steam generated by heating the heat transfer liquid to form a first article and a second article. In a fusion bonding apparatus for articles in which the vapor at the upper part of the heat transfer liquid is cooled and condensed and refluxed, the processing tank is divided into upper and lower halves to form a lower heating tank and an upper cooling tank. A heat insulating material is interposed between the cooling tank, and an openable and closable lid having a hollow part for water passage is provided in the upper opening of the cooling tank, and the first article and the second article are placed thereon. What is claimed is: 1. A fusion splicing device for articles, comprising a mounting table that is controlled to move up and down.
JP60203343A 1985-09-17 1985-09-17 Fusion joining device for article Granted JPS6264473A (en)

Priority Applications (9)

Application Number Priority Date Filing Date Title
JP60203343A JPS6264473A (en) 1985-09-17 1985-09-17 Fusion joining device for article
CN86104969.1A CN1004680B (en) 1985-09-17 1986-07-30 Article heat cohesive device
DE8686307129T DE3672439D1 (en) 1985-09-17 1986-09-16 APPARATUS FOR MELT JOINING OBJECTS.
US06/908,025 US4679721A (en) 1985-09-17 1986-09-16 Apparatus for fuse-bonding articles
EP89201803A EP0349094B1 (en) 1985-09-17 1986-09-16 Apparatus for soldering printed circuit boards
EP86307129A EP0218391B1 (en) 1985-09-17 1986-09-16 Apparatus for fuse-bonding articles
DE89201803T DE3689005D1 (en) 1985-09-17 1986-09-16 Device for soldering printed circuits.
KR2019900006849U KR900007617Y1 (en) 1985-09-17 1990-05-21 Apparatus for fuse bonding articles
KR2019900007521U KR920005953Y1 (en) 1985-09-17 1990-05-30 Soldering apparatus

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP60203343A JPS6264473A (en) 1985-09-17 1985-09-17 Fusion joining device for article

Publications (2)

Publication Number Publication Date
JPS6264473A true JPS6264473A (en) 1987-03-23
JPH0416262B2 JPH0416262B2 (en) 1992-03-23

Family

ID=16472450

Family Applications (1)

Application Number Title Priority Date Filing Date
JP60203343A Granted JPS6264473A (en) 1985-09-17 1985-09-17 Fusion joining device for article

Country Status (2)

Country Link
JP (1) JPS6264473A (en)
KR (1) KR900007617Y1 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220770A (en) * 1989-02-22 1990-09-03 Nec Corp Batch operated vapor phase soldering device
JP2013190112A (en) * 2012-03-12 2013-09-26 Mitsubishi Electric Corp Heat treatment device

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02220770A (en) * 1989-02-22 1990-09-03 Nec Corp Batch operated vapor phase soldering device
JP2013190112A (en) * 2012-03-12 2013-09-26 Mitsubishi Electric Corp Heat treatment device

Also Published As

Publication number Publication date
KR900007617Y1 (en) 1990-08-23
JPH0416262B2 (en) 1992-03-23

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