JPH026047A - Vapor solder tank - Google Patents
Vapor solder tankInfo
- Publication number
- JPH026047A JPH026047A JP15622388A JP15622388A JPH026047A JP H026047 A JPH026047 A JP H026047A JP 15622388 A JP15622388 A JP 15622388A JP 15622388 A JP15622388 A JP 15622388A JP H026047 A JPH026047 A JP H026047A
- Authority
- JP
- Japan
- Prior art keywords
- vapor
- cover
- heat medium
- joined
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 19
- 238000001816 cooling Methods 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 22
- 238000010586 diagram Methods 0.000 description 7
- 230000004907 flux Effects 0.000 description 5
- 238000005476 soldering Methods 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔概 要〕
各種プリント板の電子部品実装に広く使用されるバッチ
式のベーパ半田槽に関し、
加熱槽の開口部を閉鎖して熱媒体の消費量低減が図れ、
且つフレオン蒸気による被接合品のフランクス流出を防
止することを目的とし、上部が開口した容器の底部に熱
媒体を加熱するヒータを配設し、熱媒体の蒸気を冷却す
るを一次冷却パイプとフレオン蒸気を冷却する二次冷却
バイブを該容器内側壁に周設して、熱媒体蒸気層とフレ
オン蒸気層を設けた加熱槽と、被接合品を載置する篭に
少なくとも１本ワイヤを２着して、政策を上下方向に移
動するエレベータと、上記容器の前記開口部を閉鎖でき
る大きさで上記エレベータのワイヤを貫通させる孔を穿
設した蓋と、一定の長さに切断したワイヤを上記被接合
品を覆う大きさの箱の底板外側に緊着したカバーとから
なり、上記ワイヤ他端を上記蓋の下面に緊着して、ヒ記
篭を該カバーの下側となるよう上記孔に上記エレベータ
の該ワイヤを貫通させ、上記被接合品を載置した政策を
下降させると該蓋により上記容器の前記開口部を閉鎖す
るとともに、上記フレオン蒸気層を通過する時は該カバ
ーにより該被接合品を覆い、上記熱媒体蒸気層に下降す
ると該被接合品より該カバーが離脱するように構成する
。[Detailed Description of the Invention] [Summary] Regarding batch-type vapor soldering baths widely used for mounting electronic components on various printed circuit boards, the opening of the heating bath can be closed to reduce consumption of heat medium.
In addition, in order to prevent Freon vapor from flowing out of the products to be joined, a heater for heating the heat medium is installed at the bottom of the container with an open top, and a primary cooling pipe and Freon are used to cool the heat medium vapor. A secondary cooling vibrator for cooling the steam is installed around the inner wall of the container, a heating tank is provided with a heat medium vapor layer and a Freon vapor layer, and at least one wire is attached to a basket on which the products to be welded are placed. an elevator that moves the container in the vertical direction; a lid that has a hole through which the wire of the elevator passes through and is large enough to close the opening of the container; and a wire cut to a certain length that is The other end of the wire is tightly attached to the bottom surface of the lid, and the hole is inserted so that the recorder is on the underside of the cover. When the wire of the elevator is passed through the elevator, and the container carrying the article to be welded is lowered, the lid closes the opening of the container, and when passing through the Freon vapor layer, the cover closes the opening of the container. The cover is configured to cover the articles to be welded and to separate from the articles when the cover descends to the heat medium vapor layer.
本発明は、各種プリント板の電子部品実装に広く使用さ
れるバッチ式のベーパ半田槽に関する。The present invention relates to a batch type vapor solder bath widely used for mounting electronic components on various printed boards.
最近、各種電子機器に装着するプリント板は部品実装の
高密度化、および電子部品の多様化に伴い、実装した電
子部品とプリント配線基板の接合部に大きなストレスが
発生する。そのため、小さなストレスで接合部すること
ができるベーパ半田槽の使用が増加しているが、熱媒体
が高価なためにその消費量の低減と、フレオン層による
フラックスの流出が防止できる新しいベーパ半田槽が要
求されている。Recently, printed circuit boards mounted on various electronic devices have become more densely packaged and electronic components have become more diverse, causing large stress to occur at the joints between the mounted electronic components and the printed wiring board. For this reason, the use of vapor solder baths that can form joints with small stress is increasing, but since the heat medium is expensive, a new vapor solder bath that can reduce its consumption and prevent the flux from flowing out due to the Freon layer. is required.
従来広（使用されているベーパ半田槽は、第３図の模式
図に示すように、リフローにより半田結合する部品１
（以下被接合品と略称する）を挿入して加熱できる大き
さに成形して、上端の開口部にフランジ２−１ｂを設け
た容器２−１ の底板２−１８に、前記半田をリフロー
する熱媒体４１例えば弗素系の不活性液体の加熱用ヒー
タ２−２を配設して、そのヒータ２−２の加熱により発
生した熱媒体蒸気を冷却する一次冷却パイプ２−３を、
容器２−１の底板２−１８より一定の高さで側壁内に周
設し、その−次冷却パイプ２−３より一定寸法隔てた上
部に被接合品ｌを洗浄するフレオン蒸気を冷却すに二次
冷却バイブ２−４を同じく側壁内に周設する。それによ
り、熱媒体４の液面と一次冷却バイブ２−３の間に熱媒
体の蒸気層Ａと、−次冷却パイプ２−３と二次冷却パイ
プ２−４の間にフレオンの蒸気層Ｂを設けている。As shown in the schematic diagram in Fig. 3, the vapor solder tank used in the conventional wide (vapor solder tank)
The solder is reflowed onto the bottom plate 2-18 of the container 2-1, which has a flange 2-1b at the opening at the upper end. A primary cooling pipe 2-3 is provided with a heater 2-2 for heating a heat medium 41, for example, a fluorine-based inert liquid, and cools the heat medium vapor generated by heating the heater 2-2.
A pipe is installed around the side wall at a certain height above the bottom plate 2-18 of the container 2-1, and is placed in the upper part at a certain distance from the cooling pipe 2-3 for cooling the Freon vapor used to clean the parts to be joined. A secondary cooling vibe 2-4 is also provided around the side wall. As a result, a vapor layer A of the heat medium is formed between the liquid level of the heat medium 4 and the primary cooling vibe 2-3, and a vapor layer B of Freon is formed between the secondary cooling pipe 2-3 and the secondary cooling pipe 2-4. has been established.
そして、被接合品１を載置する篭３−１をワイヤ３−２
で吊して図示していない駆動手段により矢印方向に上下
するエレベータ３を容器２−１開口部の上部に設けて、
篭３−１に載置した被接合品１を下降して加熱槽２内の
フレオン蒸気層Ｂを通過させることによりその被接合品
１の洗浄を行い、ヒータ２−２で指定温度に加熱された
熱媒体蒸気層Ａに挿入することにより、被接合品１の半
田をリフローして接合するように構成されている。Then, the basket 3-1 on which the product 1 to be welded is placed is connected to the wire 3-2.
An elevator 3 is provided above the opening of the container 2-1, and is suspended by a drive means (not shown) to move up and down in the direction of the arrow.
The workpiece 1 placed on the basket 3-1 is lowered and passed through the Freon vapor layer B in the heating tank 2 to clean the workpiece 1, and is heated to a specified temperature by the heater 2-2. By inserting the heat medium vapor layer A into the heated heat medium vapor layer A, the solder of the parts 1 to be joined is reflowed and joined.
以上説明した従来のベーパ半田槽で問題となるのは、熱
媒体をヒータで加熱して熱媒体蒸気層Ａを形成し、その
上にフレオン蒸気層Ｂを形成して熱媒体の蒸気を流失さ
せないような構造となっているが、加熱槽が大きいとそ
の中央部では一次冷却バイブと二次冷却パイプの冷却効
果が及ばないため、容器の開口部から高価な熱媒体の蒸
気が外部に流失するという問題が生じる。The problem with the conventional vapor soldering bath described above is that the heat medium is heated by a heater to form a heat medium vapor layer A, and a Freon vapor layer B is formed on top of the heat medium vapor layer A to prevent the vapor of the heat medium from flowing away. However, if the heating tank is large, the cooling effect of the primary cooling vibrator and secondary cooling pipe will not reach the center of the tank, so the vapor of the expensive heat medium will flow out from the opening of the container. A problem arises.
また、フレオンの蒸気中を全面露出した被接合品が通過
して行くために、フレオン蒸気による洗浄と同様な結果
となって被接合品のフラックスが流出し、接合強度の信
頼性を低下させるという問題が生じている。In addition, since the fully exposed parts to be joined pass through the Freon vapor, the result is similar to that of cleaning with Freon steam, and the flux from the parts to be joined flows out, reducing the reliability of the joint strength. A problem has arisen.
本発明は上記のような問題点に鑑み、加熱槽の開口部を
閉鎖して熱媒体の消費量低減が図れ、且つフレオン蒸気
による被接合品のフランクス流出を防止することが行え
る新しいベーパ半田槽の提供を目的とする。In view of the above-mentioned problems, the present invention provides a new vapor soldering tank that can reduce the consumption of heat medium by closing the opening of the heating tank, and can prevent frons from flowing out of the products to be joined due to Freon vapor. The purpose is to provide.
本発明は、第１図の模式図に示すように熱媒体４を加熱
するヒータ２−２を、上端に開口部を設けた容器２−１
の底板２−１８に配設し、−次冷却パイプ２−３と二次
冷却パイプ２−４を容器２〜ｌ内側壁に周設して、熱媒
体蒸気層Ａとフレオン蒸気層Ｂを設けた従来と同一の加
熱槽２と、被接合品ｌを載置する箱状の篭１３−１にワ
イヤ１３−２を緊着して上下方向に移動するエレベータ
１３と、加熱槽２の開口部が閉鎖できる大きさで上記エ
レベータ１３のワイヤ１３−２が貫通する孔１５ａを穿
設した蓋１５と、容器２１開口部と一次冷却パイプ２−
３間の寸法と略等しい長さに切断したスヮイヤ１６−１
を、被接合品ｌを覆うことができる大きさに成形した箱
の底板外側に緊着したカバー１６とからなり、そのカバ
ー１６に緊着したワイヤ１６−１の他端を上記蓋１５の
下面に緊着し、被接合品ｌを載置する篭１３−１がその
カバーＩ６の下側となるよう１Ｉ１５の孔１５ａにエレ
ベータ１３のワイヤ１３−２を貫通させ、被接合品１を
載置した篭１３−１を下降させると上記蓋１５により容
器２−１間口部を閉鎖するとともに、フレオン蒸気層Ｂ
を通過する時はカバー１６で被接合品１を覆い、熱媒体
蒸気層Ａに達すると被接合品１よりカバー１６が離脱す
るように構成される。As shown in the schematic diagram of FIG.
A secondary cooling pipe 2-3 and a secondary cooling pipe 2-4 are installed around the inner wall of the containers 2 to 1 to form a heat medium vapor layer A and a Freon vapor layer B. The heating tank 2 is the same as the conventional one, the elevator 13 moves vertically by tightly attaching the wire 13-2 to a box-shaped basket 13-1 on which the workpieces 1 to be welded are placed, and the opening of the heating tank 2. A lid 15 is provided with a hole 15a that is large enough to be closed by the wire 13-2 of the elevator 13, and the opening of the container 21 and the primary cooling pipe 2-.
Swayer 16-1 cut to a length approximately equal to the dimension between 3.
It consists of a cover 16 that is tightly attached to the outside of the bottom plate of a box that is shaped to a size that can cover the product to be welded l, and the other end of the wire 16-1 that is tightly attached to the cover 16 is attached to the lower surface of the lid 15. The wire 13-2 of the elevator 13 is passed through the hole 15a of 1I15 so that the basket 13-1 on which the product to be welded 1 is placed is on the underside of the cover I6, and the product 1 to be welded is placed thereon. When the basket 13-1 is lowered, the lid 15 closes the opening of the container 2-1, and the Freon vapor layer B
The article 1 to be welded is covered with a cover 16 when passing through, and the cover 16 is separated from the article 1 when it reaches the heat medium vapor layer A.
Ｃ作 用〕
本発明では、第２図にに示すようにエレベータ３の篭１
３−１に被接合品１を載置してその篭１３−１を下降す
ると、カバ−１６上面に乗っていたＭ２Ｓは直ぐに容器
２−１のフランジ２−１ｂに当接することにより停止し
て、加熱槽２の開口部を閉鎖するとともに被接合品の上
をカバー１６で覆った状態でフレオン蒸気層Ｂを通過し
、更に下降させると蓋１５に緊着したワイヤ１６−１が
張り詰めてカバー１６の下降が停止して、篭１３−１に
載置した被接合品１よりカバー１６が離脱した状態で熱
媒体蒸気層Ａに降下する。C action] In the present invention, as shown in FIG.
When the product 1 to be welded is placed on the container 3-1 and the basket 13-1 is lowered, the M2S that was on the top surface of the cover 16 immediately comes into contact with the flange 2-1b of the container 2-1 and stops. , when the opening of the heating tank 2 is closed and the parts to be joined are covered with the cover 16, the wire 16-1 is passed through the freon vapor layer B and further lowered, and the wire 16-1 tightly attached to the lid 15 becomes taut. The cover 16 stops descending and descends into the heat medium vapor layer A in a state where the cover 16 is detached from the workpiece 1 placed on the basket 13-1.
その被接合品１を熱媒体４の蒸気により加熱して半田を
リフローしているため、高価な熱媒体の蒸気とフレオン
の蒸気は蓋１５により加熱槽２の外部に流失することが
なくなるとともに、フレオン蒸気によるフラツクスの流
出を防止することが可能となる。Since the solder is reflowed by heating the parts 1 to be joined with the steam of the heat medium 4, the vapor of the expensive heat medium and Freon vapor are prevented from flowing out to the outside of the heating tank 2 due to the cover 15, and It becomes possible to prevent flux from flowing out due to Freon vapor.
以下第１図および第２図について本発明の詳細な説明す
る。The present invention will be described in detail below with reference to FIGS. 1 and 2.
第１図は本実施例によるベーパ半田槽を示す模式図、第
２図は本実施例の動作説明図を示し、図中において、第
３図と同一部材には同一記号が付しであるが、その他の
１３は半田槽に被接合品を上下に移動して接合させるエ
レベータ、 １５は容器の開口部を閉鎖する蓋、 １６
は被接合品の上側を覆うカバーである。Fig. 1 is a schematic diagram showing a vapor solder bath according to this embodiment, and Fig. 2 is an explanatory diagram of the operation of this embodiment. In the figure, the same members as in Fig. 3 are given the same symbols. , and the other 13 is an elevator that moves the products to be joined up and down into the solder tank to join them; 15 is a lid that closes the opening of the container; 16
is a cover that covers the upper side of the product to be joined.
エレベータ１３は、ステンレスの金網よりｆｉ状に成形
して被接合品１を載置する篭１３−１に、例えば４本の
ステンレスよりなるワイヤ１３−２を４隅に緊着して、
図示していない駆動手段により篭１３−１を加熱槽２の
内部で上下に移動するように構成したものである。The elevator 13 is constructed by attaching, for example, four stainless steel wires 13-2 to the four corners of a basket 13-1, which is formed into a fi-shape from a stainless steel wire mesh and on which the workpiece 1 is placed.
The cage 13-1 is configured to be moved up and down inside the heating tank 2 by a driving means (not shown).
Ｍ２Ｓは、加熱槽２の開口部が閉鎖できる大きさに金属
板２例えばステンレス薄板より成形して、上記エレベー
タ１３のそれぞれワイヤ１３−２を貫通させる孔１５ａ
を穿設したものである。M2S is formed from a metal plate 2, for example, a thin stainless steel plate, to a size that allows the opening of the heating tank 2 to be closed, and has holes 15a through which the wires 13-2 of the elevator 13 are passed.
It has a hole in it.
カバー１６は、上記エレベータ１３の篭１３−１に載置
する被接合品１を覆うことができる大きさの箱状に金属
薄板より成形して、容器２−１の開口部から一次冷却パ
イプ２−３の寸法と略等しい長さに切断した１例えば４
本のステンレスワイヤ１６−１を前記箱の底板外面に緊
着したものである。The cover 16 is formed from a thin metal plate into a box shape large enough to cover the workpieces 1 placed in the basket 13-1 of the elevator 13, and is connected to the primary cooling pipe 2 from the opening of the container 2-1. -1 cut to a length approximately equal to the dimension of 3, e.g. 4
A stainless steel wire 16-1 is tightly attached to the outer surface of the bottom plate of the box.
上記部材を使用したベーパ半田槽は、カバー１６に緊着
した４本のワイヤ１６−１の他端を蓋１５に緊着し、被
接合品１を載置する篭１３−１がそのカバー１６側とな
るように、エレベータ１３のワイヤ１３−２を蓋１５に
穿設した孔１５ａを貫通させて図示していない駆動手段
と結合し、従来と同一の加熱槽２内でエレベータ１３の
篭１３−１が矢印方向の上下に移動するように構成して
いる。In the vapor soldering tank using the above-mentioned members, the other ends of the four wires 16-1 tightly attached to the cover 16 are tightly attached to the lid 15, and the basket 13-1 on which the product 1 to be welded is placed is attached to the cover 16. The wire 13-2 of the elevator 13 is passed through a hole 15a made in the lid 15 so that the wire 13-2 of the elevator 13 is connected to a driving means (not shown), and the cage 13 of the elevator 13 is heated in the same heating tank 2 as the conventional one. -1 is configured to move up and down in the direction of the arrow.
次に上記ベーパ半田槽の作動を第２図に基づいて説明す
る。稼働待機時には、ｆａ）図に示すようにエレベータ
１３を上昇して被接合品を載置する篭１３ｌを容器２−
１の開口部より上部で停止すると、篭１３−１の被接合
品載置面にカバー１６の開口側が当接するとともに、カ
バー１６の上面に１１５が当接して容器２−１のフラン
ジ２−１ｂとの間に隙間が生じた状態で待機させ、稼働
開始時に蓋１５とカバー１６を持ち上げて篭１３−１に
図示していない被接合品を！！置し、その被接合品の上
をカバー１６で覆ってその上に蓋１５が当接する。Next, the operation of the vapor solder bath will be explained based on FIG. 2. When on standby, fa) As shown in the figure, the elevator 13 is raised and the basket 13l on which the products to be welded are placed is moved to the container 2-
When the cover 16 stops above the opening of the container 13-1, the opening side of the cover 16 comes into contact with the workpiece placement surface of the basket 13-1, and the top surface of the cover 16 comes into contact with the cover 115, causing the flange 2-1b of the container 2-1 to come into contact with the opening side of the cover 16. The product to be welded (not shown) is placed in the basket 13-1 by lifting the lid 15 and cover 16 at the start of operation. ! A cover 16 is placed over the article to be welded, and a lid 15 is brought into contact with the cover 16.
そして、（ｂ）図に示すようにエレベータ３を矢印方向
へ下降させると、直ぐにカバ−１６上面に乗っていたＭ
２Ｓは容器２−１のフランジ２−１ｂで停止して開口部
を閉鎖して被接合品の上をカバー１６で覆った状態でフ
レオン蒸気層Ｂを通過する。更に矢印方向へ下降させる
と、（Ｃ）図に示すように蓋１５とカバー１６に緊着し
たワイヤ１６−１が張り詰めてカバー１６の下降が停止
し、それにより篭１３−１に載置した被接合品１の全面
が露出した状態で熱媒体蒸気層Ａに降下して、そのヒー
タ２−２により加熱された熱媒体４の蒸気で被接合品１
の半田をリフローして結合する。When the elevator 3 is lowered in the direction of the arrow as shown in FIG.
2S stops at the flange 2-1b of the container 2-1, closes the opening, and passes through the Freon vapor layer B with the cover 16 covering the parts to be welded. When it is further lowered in the direction of the arrow, as shown in FIG. With the entire surface of the welded product 1 exposed, the product 1 descends to the heat medium vapor layer A, and the vapor of the heat medium 4 heated by the heater 2-2 is used to heat the product 1.
Reflow solder to join.
その結果、エレベータ３の篭１３−１に被接合品１を載
置して下降すると、篭１３−１の上部に乗っていた蓋１
５が直ちに容器２−１のフランジ２−１ｂと当接して停
止し、それにより加熱槽２の開口部が閉鎖されてフレオ
ンの蒸気、および熱媒体の蒸気が外部へ流失するのを防
ぐことができる。また、フレオン蒸気層Ｂは被接合品１
の上をカバー１６で覆った状態で通過するので、フレオ
ン蒸気による被接合品ｌの洗浄が少なくなってフラック
スの流出を減少させることができる。As a result, when the product 1 to be welded is placed on the basket 13-1 of the elevator 3 and lowered, the lid 1 that was on the top of the basket 13-1
5 immediately comes into contact with the flange 2-1b of the container 2-1 and stops, thereby closing the opening of the heating tank 2 and preventing Freon vapor and heat medium vapor from flowing out to the outside. can. In addition, the Freon vapor layer B is
Since the workpieces 1 are passed over with the cover 16 covered, cleaning of the parts 1 to be joined by Freon vapor is reduced, and leakage of flux can be reduced.
以上の説明から明らかなように本発明によれば極めて簡
単な構成で、高価な熱媒体を収納した容器の開口部を閉
鎖してその消費量の低減が図れるとともに、フレオン蒸
気によるフラックスの流出が防止できる等の利点があり
、著しい経済的及び、信頼性向上の効果が期待できるベ
ーパ半田槽を提供することができる。As is clear from the above description, according to the present invention, with an extremely simple configuration, it is possible to close the opening of a container containing an expensive heat medium to reduce its consumption, and to prevent flux from flowing out due to Freon vapor. It is possible to provide a vapor solder bath which has advantages such as being able to prevent such problems, and which can be expected to have significant economical and reliability improvement effects.
第１図は本発明の一実施例によるベーパ半田槽を示す模
式図、
第２図は本実施例の作動説明図、
第３図は従来のベーパ半田槽を示す模式図である。
図において、
１は被接合品、
２は加熱槽、 ２−１は容器、
２−１ａは底板、 ２−１ｂはフランジ、２−
２はヒータ、 ２−３は一次冷却パイプ、２−４は
二次冷却パイプ、
４は熱媒体、
１３はエレベータ、 １３−１は篭、１３−２．１６
−１ はワイヤ、
Ｉ５は蓋、 １５ａは孔、１６はカバー
Ａは熱媒体蒸気層、 Ｂはフレオン蒸気層、を示す。
第１図
ヒー７２−２
やＬｍミめべ°−ハ０学１Ｌ枦ｔらオ【すＪ冴ｌぐ図第
３図FIG. 1 is a schematic diagram showing a vapor solder tank according to an embodiment of the present invention, FIG. 2 is an explanatory diagram of the operation of this embodiment, and FIG. 3 is a schematic diagram showing a conventional vapor solder tank. In the figure, 1 is the product to be joined, 2 is the heating tank, 2-1 is the container, 2-1a is the bottom plate, 2-1b is the flange, 2-
2 is a heater, 2-3 is a primary cooling pipe, 2-4 is a secondary cooling pipe, 4 is a heat medium, 13 is an elevator, 13-1 is a cage, 13-2.16
-1 is a wire, I5 is a lid, 15a is a hole, 16 is a cover A is a heat medium vapor layer, and B is a Freon vapor layer. Fig. 1 H 72-2 Ya Lm Mimebe° - Ha 0 Gaku1L 枦tRao [Su J Sae lg Fig. 3
Claims (1)
加熱するヒータ（２−２）を配設し、熱媒体（４）の蒸
気を冷却するを一次冷却パイプ（２−３）と、フレオン
蒸気を冷却する二次冷却パイプ（２−４）を該容器（２
−１）内側壁に周設して、熱媒体蒸気層（Ａ）とフレオ
ン蒸気層（Ｂ）を設けた加熱槽（２）と、被接合品（１
）を載置する篭（１３−１）に少なくとも１本ワイヤ（
１３−２）を繋着して、該篭（１３−１）を上下方向に
移動するエレベータ（１３）と、 上記容器（２−１）の前記開口部を閉鎖できる大きさで
上記エレベータ（１３）のワイヤ（１３−２）を貫通さ
せる孔（１５ａ）を穿設した蓋（１５）と、一定の長さ
に切断したワイヤ（１６−１）を上記被接合品（１）を
覆う大きさの箱の底板外側に繋着したカバー（１６）と
からなり、 上記ワイヤ（１６−１）他端を上記蓋（１５）の下面に
繋着して、上記篭（１３−１）を該カバー（１６）の下
側となるよう上記孔（１５ａ）に上記エレベータ（１３
）の該ワイヤ（１３−２）を貫通させ、上記被接合品（
１）を載置した該篭（１３−１）を下降させると該蓋（
１５）により上記容器（２−１）の前記開口部を閉鎖す
るとともに、上記フレオン蒸気層（Ｂ）を通過する時は
該カバー（１６）により該被接合品（１）を覆い、上記
熱媒体蒸気層（Ａ）に下降すると該被接合品（１）より
該カバー（１６）が離脱するうように構成されてなるこ
とを特徴とするベーパ半田槽。[Claims] A heater (2-2) for heating a heat medium (4) is provided at the bottom of a container (2-1) with an open top, and a heater (2-2) for heating a heat medium (4) is provided as a primary heater for cooling the vapor of the heat medium (4). A cooling pipe (2-3) and a secondary cooling pipe (2-4) for cooling Freon vapor are connected to the container (2-3).
-1) A heating tank (2) provided with a heat medium vapor layer (A) and a Freon vapor layer (B) surrounding the inner wall, and a product to be joined (1).
) at least one wire (
an elevator (13) to which the basket (13-2) is connected and moves the basket (13-1) in the vertical direction; and an elevator (13) having a size that can close the opening of the container (2-1). ) A lid (15) with a hole (15a) through which the wire (13-2) passes through, and a wire (16-1) cut to a certain length with a size that covers the article to be joined (1). a cover (16) connected to the outside of the bottom plate of the box; the other end of the wire (16-1) is connected to the bottom surface of the lid (15), and the basket (13-1) is connected to the cover. The elevator (13) is inserted into the hole (15a) so as to be below the elevator (16).
) is passed through the wire (13-2), and the above-mentioned product to be joined (
When the basket (13-1) on which 1) is placed is lowered, the lid (13-1) is lowered.
15), the opening of the container (2-1) is closed, and when passing through the Freon vapor layer (B), the article to be joined (1) is covered with the cover (16), and the heating medium A vapor solder bath characterized in that the cover (16) is configured to separate from the article (1) to be joined when descending to the vapor layer (A).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63156223A JP2581172B2 (en) | 1988-06-23 | 1988-06-23 | Vapor solder bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63156223A JP2581172B2 (en) | 1988-06-23 | 1988-06-23 | Vapor solder bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH026047A true JPH026047A (en) | 1990-01-10 |
| JP2581172B2 JP2581172B2 (en) | 1997-02-12 |
Family
ID=15623049
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63156223A Expired - Lifetime JP2581172B2 (en) | 1988-06-23 | 1988-06-23 | Vapor solder bath |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2581172B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH049271A (en) * | 1990-04-27 | 1992-01-14 | Seiko Instr Inc | Vapor soldering device |
-
1988
- 1988-06-23 JP JP63156223A patent/JP2581172B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH049271A (en) * | 1990-04-27 | 1992-01-14 | Seiko Instr Inc | Vapor soldering device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2581172B2 (en) | 1997-02-12 |
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