JP2000077796A - Flexible double-side printed circuit board, connection method thereof, forming method of capacitor, and flexible double-sided printed circuit board provided with capacitor - Google Patents
Flexible double-side printed circuit board, connection method thereof, forming method of capacitor, and flexible double-sided printed circuit board provided with capacitorInfo
- Publication number
- JP2000077796A JP2000077796A JP10248913A JP24891398A JP2000077796A JP 2000077796 A JP2000077796 A JP 2000077796A JP 10248913 A JP10248913 A JP 10248913A JP 24891398 A JP24891398 A JP 24891398A JP 2000077796 A JP2000077796 A JP 2000077796A
- Authority
- JP
- Japan
- Prior art keywords
- circuit board
- printed circuit
- conductive layer
- sided printed
- flexible double
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、フレキシブル両面
プリント回路板および接続方法およびコンデンサ形成方
法およびコンデンサ付きフレキシブル両面プリント回路
板に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a flexible double-sided printed circuit board, a connection method, a capacitor forming method, and a flexible double-sided printed circuit board with a capacitor.
【０００２】[0002]
【従来の技術】フレキシブル両面プリント回路板は、可
撓性を有する絶縁性のベースフィルムの両面上に形成さ
れた導電箔などによる導電層に、電極を含む回路パター
ンが形成され、このフレキシブル両面プリント回路板の
回路パターンに、電子部品類が搭載・半田付け接合され
る。2. Description of the Related Art In a flexible double-sided printed circuit board, a circuit pattern including electrodes is formed on a conductive layer such as a conductive foil formed on both sides of a flexible insulating base film. Electronic components are mounted and soldered on the circuit pattern of the circuit board.
【０００３】近年、電子機器の小型化および軽量化への
要求が高まるにつれて、フレキシブル両面プリント回路
板も細線化、配線間隙の狭小化と、ベースフィルムの薄
板化に加えてさらに、実装密度の向上に伴うスルーホー
ルの小径化や、数層の多層構造とした場合のビア・ホー
ルの小径化が進行している。In recent years, as the demand for smaller and lighter electronic devices has increased, flexible double-sided printed circuit boards have become thinner, wiring gaps have been narrowed, and base films have been made thinner, and the mounting density has been further improved. Accordingly, the diameter of the through hole has been reduced, and the diameter of the via hole in the case of a multilayer structure having several layers has been progressing.
【０００４】前記のような薄型のフレキシブル両面プリ
ント回路板は、柔軟性や折り曲げ耐久性に加えて軽量性
が要求される用途として、たとえばハード・ディスク装
置（ＨＤＤ）のサスペンション部分や、携帯電話機の液
晶パネル回路基板や、ＩＣカード搭載向けとして薄さが
要求されるＣＳＰ（Ｃｈｉｐ Ｓｃａｌｅ Ｐａｃｋａ
ｇｅ）のインタポーザなどにおいて特に有効に使用され
る。[0004] The thin flexible double-sided printed circuit board as described above is used for applications requiring lightness in addition to flexibility and bending durability, such as a suspension portion of a hard disk drive (HDD) and a cellular phone. CSP (Chip Scale Packa) which is required to be thin for mounting on liquid crystal panel circuit boards and IC cards
ge) is particularly effectively used in the interposer.
【０００５】このようなフレキシブル両面プリント回路
板の例として、第１面と第２面にそれぞれ導電層として
形成された銅箔とポリイミド層から成る場合は、ポリイ
ミドの液状未硬化材を第１の銅箔の表面に塗布し、さら
に第２の銅箔を被せて摂氏３００度程度の硬化温度で硬
化させることによって、ポリイミド層を可撓性を備える
ベースフィルムとしている。As an example of such a flexible double-sided printed circuit board, when a copper foil and a polyimide layer formed as conductive layers on the first surface and the second surface, respectively, are used, a liquid uncured polyimide material is used as the first material. The polyimide layer is used as a flexible base film by coating the surface of the copper foil, further covering the second copper foil, and curing at a curing temperature of about 300 degrees Celsius.
【０００６】[0006]
【発明が解決しようとする課題】ところで、フレキシブ
ル両面プリント回路板の第１面と第２面の導電層にそれ
ぞれ形成された回路パターン間を電気的に接続させる場
合の従来の方法として、図１１の断面図に示されるよう
に、ベースフィルム１００にスルーホール１０１を設
け、スルーホール１０１の壁面に無電解メッキ部分１０
２を形成させて第２面上の回路パターン１０６を第１面
上の回路パターン１０７と導通させていた。このように
して、フレキシブル両面プリント回路板の第１面にそれ
ぞれ形成された回路パターン１０５、１０７を用いて電
子回路を構成させるものであった。FIG. 11 shows a conventional method for electrically connecting circuit patterns formed respectively on the first and second conductive layers of a flexible double-sided printed circuit board. As shown in the cross-sectional view of FIG.
2 to form the circuit pattern 106 on the second surface with the circuit pattern 107 on the first surface. In this manner, an electronic circuit is configured using the circuit patterns 105 and 107 formed on the first surface of the flexible double-sided printed circuit board, respectively.
【０００７】しかしながら、前記のようなスルーホール
による接続は、スルーホールの導通加工に係るレジスト
塗布、穴開け加工、メッキ処理、レジスト除去といった
数次の工程が必要となり、全体の工数が増加するという
欠点があった。However, the connection by the through hole as described above requires several steps such as resist coating, drilling, plating, and resist removal for conducting the through hole, which increases the total man-hour. There were drawbacks.
【０００８】さらに、スルーホールの孔径が小型にな
り、またスルーホール深さが浅くなるにつれ、スルーホ
ール壁面の粗さや形状の管理が容易でなくなり、形成さ
れるメッキ層の品質管理およびスルーホール壁面のメッ
キ層と回路パターンとの接続強度の管理が困難になり、
この結果として接続部分の電気的および機械的な信頼性
が低下するという問題があった。Further, as the hole diameter of the through hole becomes smaller and the depth of the through hole becomes smaller, it becomes difficult to control the roughness and shape of the wall surface of the through hole. It becomes difficult to control the connection strength between the plating layer and the circuit pattern,
As a result, there is a problem that the electrical and mechanical reliability of the connection part is reduced.
【０００９】さらに、フレキシブル両面プリント回路板
上にコンデンサを設ける際には、独立した単品の部品と
して構成されているコンデンサを回路パターン間にハン
ダ付けなどにより取り付け接続しており、よってコンデ
ンサが部品として必要になるのみならず、ハンダ付け接
続の工程がさらに必要になるという欠点があった。Further, when a capacitor is provided on a flexible double-sided printed circuit board, a capacitor configured as an independent single component is attached and connected between circuit patterns by soldering or the like. Not only is it necessary, but there is a disadvantage that a soldering connection step is further required.
【００１０】本発明は、前記のような従来技術における
問題点を解決するためなされたもので、少ない工程で容
易に接続作業がなされ、しかも接続部分の信頼性が高い
フレキシブル両面プリント回路板および接続方法およ
び、コンデンサをフレキシブル両面プリント回路板上に
形成させる方法および、コンデンサ付きフレキシブル両
面プリント回路板を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems in the prior art, and a flexible double-sided printed circuit board which can be easily connected in a small number of steps and has a highly reliable connection portion. It is an object of the present invention to provide a method, a method for forming a capacitor on a flexible double-sided printed circuit board, and a flexible double-sided printed circuit board with a capacitor.
【００１１】[0011]
【課題を解決するための手段】前記従来技術の課題を解
決するため、本発明に係るフレキシブル両面プリント回
路板は、可撓性を有する絶縁フィルムを挟んで第１面と
第２面の両面に導電層が形成されたフレキシブル両面プ
リント回路板の前記第１面の導電層に電極パターンが形
成され、前記フレキシブル両面プリント回路板の端部
が、前記第１面を内側に折り込むように少なくとも２
度、折り畳まれ、且つ前記折り畳み部分の前記第２面の
導電層が前記第１面の前記電極パターンに電気的に接続
された構成としたことを特徴とする。In order to solve the above-mentioned problems of the prior art, a flexible double-sided printed circuit board according to the present invention is provided on both the first surface and the second surface with a flexible insulating film interposed therebetween. An electrode pattern is formed on the conductive layer on the first surface of the flexible double-sided printed circuit board on which the conductive layer is formed, and at least two end portions of the flexible double-sided printed circuit board are folded inward on the first surface.
The conductive layer on the second surface of the folded portion is electrically connected to the electrode pattern on the first surface.
【００１２】前記の構成によれば、折畳み部分の第２面
の導電層が第１面の導電層に接続されていることで、ス
ルーホール等の接続手段を適用することなく両導電層が
電気的に接続される。According to the above configuration, since the conductive layer on the second surface of the folded portion is connected to the conductive layer on the first surface, both conductive layers are electrically connected without using connection means such as through holes. Connected.
【００１３】しかも第２面の導電層が第１面の導電層に
接合されることによって、接合面が広く確保され、また
接合面の平坦化が容易であることにより接合部分の電気
的特性の向上のみならず機械的強度の向上がなされる。
これにより、第２面の導電層に形成された回路パターン
と、第１面の導電層に形成された回路パターンとが高い
信頼性で接続される。In addition, since the conductive layer on the second surface is bonded to the conductive layer on the first surface, a wide bonding surface is ensured, and the flattening of the bonding surface facilitates the improvement of the electrical characteristics of the bonding portion. In addition to the improvement, the mechanical strength is improved.
Thereby, the circuit pattern formed on the conductive layer on the second surface and the circuit pattern formed on the conductive layer on the first surface are connected with high reliability.
【００１４】本発明に係るフレキシブル両面プリント回
路板の接続方法は、可撓性を有する絶縁フィルムを挟ん
で第１面と第２面の両面に導電層が形成されたフレキシ
ブル両面プリント回路板の前記第１面の導電層と前記第
２面の導電層とを電気的に接続する方法であって、 前
記フレキシブル両面プリント回路板の端部を、前記第１
面を内側に折り込むように少なくとも２度、折り畳み、
且つ前記折り畳み部分の前記第２面の導電層を前記第１
面の導電層に電気的に接続させることを特徴とする。[0014] The method for connecting a flexible double-sided printed circuit board according to the present invention is a method of connecting a flexible double-sided printed circuit board having conductive layers formed on both first and second surfaces with a flexible insulating film interposed therebetween. A method of electrically connecting a conductive layer on a first surface and a conductive layer on a second surface, the method comprising: connecting an end of the flexible double-sided printed circuit board to the first conductive layer.
Fold at least twice to fold the surface inward,
The conductive layer on the second surface of the folded portion is the first conductive layer.
It is characterized in that it is electrically connected to the surface conductive layer.
【００１５】前記の方法によれば、折畳み部分の第２面
の導電層が第１面の導電層に接続されることで、スルー
ホール等の接続手段を適用することなく両導電層の電気
的な接続がなされる。According to the above method, the conductive layer on the second surface of the folded portion is connected to the conductive layer on the first surface, so that the electrical connection between the two conductive layers can be made without using connection means such as through holes. Connections are made.
【００１６】しかも第２面の導電層が第１面の導電層に
接合されることによって、接合面が広く確保され、また
接合面の平坦化が容易であることにより接合部分の電気
的特性の向上のみならず機械的強度の向上がなされる。
これにより、第２面の導電層に形成された回路パターン
と、第１面の導電層に形成された回路パターンとが高い
信頼性で接続される。In addition, since the conductive layer on the second surface is bonded to the conductive layer on the first surface, a wide bonding surface is ensured, and the flatness of the bonding surface is easy, so that the electrical characteristics of the bonding portion are improved. In addition to the improvement, the mechanical strength is improved.
Thereby, the circuit pattern formed on the conductive layer on the second surface and the circuit pattern formed on the conductive layer on the first surface are connected with high reliability.
【００１７】あるいは、本発明に係るコンデンサを備え
たフレキシブル両面プリント回路板は、可撓性を有し、
かつ所定の誘電率を備える絶縁フィルムを挟んで第１面
と第２面の両面に導電層が形成されたフレキシブル両面
プリント回路であって、前記フレキシブル両面プリント
回路板上の前記第１面に、前記導電層と非接続に極板が
形成され、前記フレキシブル両面プリント回路板上の第
１面の前記導電層が誘電体フィルムで覆われ、前記フレ
キシブル両面プリント回路板の端部が前記誘電体フィル
ムとともに、前記第１面を内側にして巻き込まれてコン
デンサが形成され、前記巻き込まれた部分の前記第２面
の導電層と前記第１面に形成された前記極板とが電気的
に接続されたことを特徴とする。Alternatively, the flexible double-sided printed circuit board provided with the capacitor according to the present invention has flexibility,
A flexible double-sided printed circuit in which conductive layers are formed on both surfaces of a first surface and a second surface with an insulating film having a predetermined dielectric constant interposed therebetween, wherein the first surface on the flexible double-sided printed circuit board has An electrode plate is formed so as not to be connected to the conductive layer, the conductive layer on the first surface on the flexible double-sided printed circuit board is covered with a dielectric film, and an end of the flexible double-sided printed circuit board is connected to the dielectric film. At the same time, the capacitor is formed by being wound with the first surface inside, and the conductive layer on the second surface of the wound portion and the electrode plate formed on the first surface are electrically connected. It is characterized by having.
【００１８】前記の構成によれば、巻き込まれた部分の
両導電層間には絶縁フィルムが介在し、さらにこれに加
えて、巻き込まれたことによって隣接する状態となった
両導電層間には巻き込まれた誘電体フィルムが介在する
ことになり、この誘電体フィルムの分極による効果で、
形成されるコンデンサの容量が増加する。しかも、フレ
キシブル両面プリント回路板の端部を巻き込む構成だけ
でフレキシブル両面プリント回路板上にコンデンサが形
成される。According to the above-described structure, the insulating film is interposed between the two conductive layers in the entangled portion. In addition, the insulating film is entangled between the two conductive layers brought into an adjacent state by the entanglement. Dielectric film intervenes, the effect of the polarization of this dielectric film,
The capacity of the formed capacitor increases. Moreover, the capacitor is formed on the flexible double-sided printed circuit board only by winding the end of the flexible double-sided printed circuit board.
【００１９】さらに、コンデンサの一方の電極を構成す
る第２面の導電層が、第１面に形成された極板と電気的
に接続されることで、形成されたコンデンサの両電極の
接続端子がいずれも第１面上に形成され、回路パターン
構成が簡素化される。しかも第２面の導電層が第１面の
極板に接合されることによって、接合面が広く確保さ
れ、また接合面の平坦化が容易であることにより接合部
分の電気的特性の向上のみならず機械的強度の向上がな
される。Further, the conductive layer on the second surface constituting one electrode of the capacitor is electrically connected to the electrode plate formed on the first surface, so that the connection terminals of both electrodes of the formed capacitor are formed. Are formed on the first surface, and the circuit pattern configuration is simplified. Moreover, since the conductive layer on the second surface is bonded to the electrode plate on the first surface, a wide bonding surface is ensured, and the flattening of the bonding surface facilitates the improvement of the electrical characteristics of the bonding portion. In addition, the mechanical strength is improved.
【００２０】また、本発明に係るフレキシブル両面プリ
ント回路板上のコンデンサの形成方法は、可撓性を有
し、かつ所定の誘電率を備える絶縁フィルムを挟んで第
１面と第２面の両面に導電層が形成されたフレキシブル
両面プリント回路板上にコンデンサを形成させる方法で
あって、前記フレキシブル両面プリント回路板上の前記
第１面に、極板を、前記第１面の前記導電層と非接続に
形成し、前記フレキシブル両面プリント回路板上の第１
面の前記導電層を誘電体フィルムで覆い、前記フレキシ
ブル両面プリント回路板の端部を前記誘電体フィルムと
ともに、前記第１面を内側にして巻き込み、前記巻き込
まれた部分の前記第２面の導電層と前記第１面に形成さ
れた前記極板とを電気的に接続することを特徴とする。Further, the method for forming a capacitor on a flexible double-sided printed circuit board according to the present invention is characterized in that both surfaces of the first and second surfaces are sandwiched by an insulating film having flexibility and a predetermined dielectric constant. A method of forming a capacitor on a flexible double-sided printed circuit board having a conductive layer formed thereon, comprising: an electrode plate on the first surface on the flexible double-sided printed circuit board; and a conductive layer on the first surface. Formed on the flexible double-sided printed circuit board,
The conductive layer of the surface is covered with a dielectric film, and the end of the flexible double-sided printed circuit board is wound together with the dielectric film with the first surface inward. A layer is electrically connected to the electrode plate formed on the first surface.
【００２１】前記の方法によれば、巻き込まれた部分の
両導電層間に絶縁フィルムと、さらに誘電体フィルムを
介在させることで、形成されるコンデンサの容量増加が
なされる。しかも、フレキシブル両面プリント回路板の
端部を巻き込むだけでフレキシブル両面プリント回路板
上にコンデンサが形成される。According to the above-described method, the capacity of the formed capacitor is increased by interposing the insulating film and the dielectric film between the two conductive layers in the wound portion. In addition, a capacitor is formed on the flexible double-sided printed circuit board simply by rolling the edge of the flexible double-sided printed circuit board.
【００２２】さらに、コンデンサの一方の電極を構成す
る第２面の導電層が、第１面に形成された極板と電気的
に接続されることで、形成されるコンデンサの両電極の
接続端子がいずれも第１面上に形成され、回路パターン
構成が簡素化される。しかも第２面の導電層が第１面の
極板に接合されることによって、接合面が広く確保さ
れ、また接合面の平坦化が容易であることにより接合部
分の電気的特性の向上のみならず機械的強度の向上がな
される。Furthermore, the conductive layer on the second surface, which constitutes one electrode of the capacitor, is electrically connected to the electrode plate formed on the first surface, so that the connection terminals of both electrodes of the formed capacitor are formed. Are formed on the first surface, and the circuit pattern configuration is simplified. Moreover, since the conductive layer on the second surface is bonded to the electrode plate on the first surface, a wide bonding surface is ensured, and the flattening of the bonding surface facilitates the improvement of the electrical characteristics of the bonding portion. In addition, the mechanical strength is improved.
【００２３】あるいは、本発明に係るフレキシブル両面
プリント回路板は、可撓性を有する絶縁フィルムを挟ん
で第１面と第２面の両面に導電層が形成されたフレキシ
ブル両面プリント回路板の前記第１面の導電層に電極パ
ターンが形成され、前記フレキシブル両面プリント回路
板の端部が細長く延伸され、前記端部が捻られて前記第
１面と前記第２面が反転され、且つ前記端部が前記第２
面を内側にして折り曲げられ、さらに前記折り曲げられ
た端部の前記第２面の導電層が前記第１面の前記電極パ
ターンに電気的に接続された構成としてもよい。Alternatively, the flexible double-sided printed circuit board according to the present invention is a flexible double-sided printed circuit board having a conductive layer formed on both first and second surfaces with a flexible insulating film interposed therebetween. An electrode pattern is formed on one surface of the conductive layer, an end of the flexible double-sided printed circuit board is elongated, and the end is twisted so that the first surface and the second surface are inverted. Is the second
A configuration may be employed in which the conductive layer on the second surface at the bent end is electrically connected to the electrode pattern on the first surface, with the surface being inward.
【００２４】前記の構成によれば、捻って反転され、さ
らに折曲げられた部分の第２面の導電層が第１面の導電
層に接続されていることで、スルーホール等の接続手段
を適用することなく両導電層が電気的に接続される。According to the above configuration, since the conductive layer on the second surface of the portion that is twisted and inverted and further bent is connected to the conductive layer on the first surface, connection means such as through holes can be provided. Both conductive layers are electrically connected without application.
【００２５】しかも第２面の導電層が第１面の導電層に
接合されることによって、接合面が広く確保され、また
接合面の平坦化が容易であることにより接合部分の電気
的特性の向上のみならず機械的強度の向上がなされる。
これにより、第２面の導電層に形成された回路パターン
と、第１面の導電層に形成された回路パターンとが高い
信頼性で電気的に接続される。In addition, since the conductive layer on the second surface is bonded to the conductive layer on the first surface, a wide bonding surface is ensured, and since the flattening of the bonding surface is easy, the electrical characteristics of the bonding portion are reduced. In addition to the improvement, the mechanical strength is improved.
Thereby, the circuit pattern formed on the conductive layer on the second surface and the circuit pattern formed on the conductive layer on the first surface are electrically connected with high reliability.
【００２６】あるいは、本発明に係るフレキシブル両面
プリント回路板の接続方法は、可撓性を有する絶縁フィ
ルムを挟んで第１面と第２面の両面に導電層が形成され
たフレキシブル両面プリント回路板の前記第１面の導電
層と前記第２面の導電層とを電気的に接続する方法であ
って、前記フレキシブル両面プリント回路板の、細長く
延伸された端部を捻って前記第１面と前記第２面を反転
させ、ついで前記端部を前記第２面を内側にして折り曲
げ、さらに前記第２面の導電層を前記第１面の導電層に
電気的に接続させるようにしてもよい。Alternatively, the method for connecting a flexible double-sided printed circuit board according to the present invention comprises a flexible double-sided printed circuit board having conductive layers formed on both first and second sides with a flexible insulating film interposed therebetween. A method of electrically connecting the conductive layer on the first surface and the conductive layer on the second surface, wherein the flexible double-sided printed circuit board is formed by twisting an elongated elongated end. The second surface may be inverted, and then the end may be bent with the second surface inside, and the conductive layer on the second surface may be electrically connected to the conductive layer on the first surface. .
【００２７】前記の方法によれば、反転するよう捻り、
さらに折曲げられた部分の第２面の導電層が第１面の導
電層に接続されることで、スルーホール等の接続手段を
適用することなく両導電層の電気的な接続がなされる。According to the above-mentioned method, twisting is performed so as to be inverted,
Furthermore, the conductive layer on the second surface in the bent portion is connected to the conductive layer on the first surface, so that the two conductive layers are electrically connected without using connection means such as through holes.
【００２８】しかも第２面の導電層が第１面の導電層に
接合されることによって、接合面が広く確保され、また
接合面の平坦化が容易であることにより接合部分の電気
的特性の向上のみならず機械的強度の向上がなされる。
これにより、第２面の導電層に形成された回路パターン
と、第１面の導電層に形成された回路パターンとが高い
信頼性で電気的に接続される。Moreover, since the conductive layer on the second surface is bonded to the conductive layer on the first surface, a wide bonding surface is ensured, and since the flattening of the bonding surface is easy, the electrical characteristics of the bonding portion are reduced. In addition to the improvement, the mechanical strength is improved.
Thereby, the circuit pattern formed on the conductive layer on the second surface and the circuit pattern formed on the conductive layer on the first surface are electrically connected with high reliability.
【００２９】[0029]
【発明の実施の形態】以下、この発明の好適な実施形態
を添付図を参照して詳細に説明する。なお、以下に述べ
る実施形態は、この発明の本質的な構成と作用を示すた
めの好適な例の一部であり、したがって技術構成上好ま
しい種々の限定が付されている場合があるが、この発明
の範囲は、以下の説明において特にこの発明を限定する
旨の記載がない限り、これらの形態に限られるものでは
ない。Preferred embodiments of the present invention will be described below in detail with reference to the accompanying drawings. The embodiment described below is a part of a preferred example for showing the essential configuration and operation of the present invention, and therefore, various restrictions which are preferable in the technical configuration may be given. The scope of the invention is not limited to these embodiments unless otherwise specified in the following description.
【００３０】図１は、本発明の第１実施形態に係るフレ
キシブル両面プリント回路板の模式断面図である。また
図２は、図１に示されるフレキシブル両面プリント回路
板の接続方法の工程を示す模式断面図である。さらに図
３は、図２に続く工程を示す模式断面図である。FIG. 1 is a schematic sectional view of a flexible double-sided printed circuit board according to a first embodiment of the present invention. FIG. 2 is a schematic cross-sectional view showing steps of a method for connecting the flexible double-sided printed circuit board shown in FIG. FIG. 3 is a schematic cross-sectional view showing a step following FIG.
【００３１】本発明に係るフレキシブル両面プリント回
路板１は、半導体集積回路チップ（ＩＣ）、コンデン
サ、アンテナを内蔵するスマートファイル用電子装置に
組み込まれるフレキシブル両面プリント回路板であり、
図１に示されるように、基板本体がポリイミド樹脂フィ
ルムなどからなる絶縁性で可撓性を有するベースフィル
ム２によって構成されている。ベースフィルム２の両面
上には銅箔などからなる配線導体が設けられて導電層を
形成しており、この導電層をエッチング処理して回路パ
ターンやアンテナが形成されている。A flexible double-sided printed circuit board 1 according to the present invention is a flexible double-sided printed circuit board incorporated in a smart file electronic device having a semiconductor integrated circuit chip (IC), a capacitor, and an antenna.
As shown in FIG. 1, the substrate main body is constituted by an insulating and flexible base film 2 made of a polyimide resin film or the like. Wiring conductors made of copper foil or the like are provided on both sides of the base film 2 to form a conductive layer. The conductive layer is etched to form a circuit pattern and an antenna.
【００３２】両面をそれぞれ第１面（おもて面）と第２
面（うら面）として、第１面の導電層には銅箔エッチン
グ処理で形成された第１パターン電極６と第２パターン
電極７が、独立して配設されている。一方、第２面の導
電層には銅箔エッチング処理で形成された回路パターン
３が設けられている。Both sides are the first side (front side) and the second side, respectively.
As a surface (back surface), a first pattern electrode 6 and a second pattern electrode 7 formed by a copper foil etching process are independently provided on the conductive layer on the first surface. On the other hand, a circuit pattern 3 formed by a copper foil etching process is provided on the conductive layer on the second surface.
【００３３】フレキシブル両面プリント回路板１の端部
は、第１面を内側に折り込むように少なくとも２度、折
り畳まれて、第１折畳部Ｒ１と第２折畳部Ｒ２が順次形
成されている。この折畳み構造により、第１折畳部Ｒ１
の先端の第２面上の回路パターン３は、第１面と対向す
る。The end portion of the flexible double-sided printed circuit board 1 is folded at least twice so that the first surface is folded inward, and a first folded portion R1 and a second folded portion R2 are sequentially formed. . By this folding structure, the first folding part R1
The circuit pattern 3 on the second surface at the end of the first surface is opposed to the first surface.
【００３４】ここで第２折畳部Ｒ２の形成位置が調節さ
れて、第１折畳部Ｒ１の先端の第２面上の回路パターン
３の一部である接続部３ａが、第１面上の第２パターン
電極７に当接するように構成され、さらに、この接続部
３ａと第２パターン電極７が、金属半田、その他のホッ
トメルト材、導電性樹脂などによる導電材８を用いて接
合されている。At this point, the formation position of the second fold R2 is adjusted, and the connecting portion 3a, which is a part of the circuit pattern 3 on the second surface at the tip of the first fold R1, is placed on the first surface. The connecting portion 3a and the second pattern electrode 7 are further joined by using a conductive material 8 such as a metal solder, another hot melt material, a conductive resin, or the like. ing.
【００３５】前記のように本実施形態によれば、折畳み
部分の第２面の導電層が第１面の導電層と直接、接続さ
れる構成によって、従来技術によるスルーホールやジャ
ンパワイヤ等の接続部分を設けることなく両導電層の電
気的接続がなされるから、簡単な構成かつ低コストで製
造することができる。As described above, according to this embodiment, the connection of the conductive layer on the second surface of the folded portion is directly connected to the conductive layer on the first surface. Since the two conductive layers are electrically connected without providing any portion, it can be manufactured with a simple configuration and at low cost.
【００３６】また本実施形態は、従来技術のスルーホー
ル方式同様に、交叉配線が可能であり、よって高実装密
度で低コストのフレキシブル両面プリント回路板を実現
することができる。In this embodiment, as in the case of the through-hole method of the prior art, cross wiring is possible, so that a flexible double-sided printed circuit board having a high mounting density and a low cost can be realized.
【００３７】しかも第２面の回路パターンを第１面の電
極に直接、接合することによって、接合面を広く確保す
ることができ、また接合面の平坦化が容易であることに
より、接合部分の電気的特性を向上させるばかりか、機
械的強度も向上させることができる。Moreover, by directly bonding the circuit pattern on the second surface to the electrode on the first surface, a wide bonding surface can be secured, and the flattening of the bonding surface facilitates the formation of the bonding portion. Not only the electrical characteristics can be improved, but also the mechanical strength can be improved.
【００３８】本発明に係るフレキシブル両面プリント回
路板の接続方法は、フレキシブル両面プリント回路板を
使用して電子回路を形成する際に、基板であるベースフ
ィルムの第１面と第２面の間にスルーホール加工を施す
ことなく、またジャンパ線を用いることなく、一方の面
上の電極や回路パターンを他方の面上の電極や回路パタ
ーンに直接接合させる方法である。以下、本接続方法を
工程順に、図面を参照しながら説明する。The method for connecting a flexible double-sided printed circuit board according to the present invention is characterized in that, when an electronic circuit is formed using the flexible double-sided printed circuit board, the connection between the first and second surfaces of the base film as the substrate is made. This is a method in which an electrode or a circuit pattern on one surface is directly joined to an electrode or a circuit pattern on the other surface without performing through-hole processing and without using a jumper wire. Hereinafter, the connection method will be described in the order of steps with reference to the drawings.
【００３９】第１の工程として、図２に示されるよう
に、可撓性を有する絶縁フィルム２を挟んで第１面Ｓｆ
１と第２面Ｓｆ２の両面に導電層が形成されたフレキシ
ブル両面プリント回路板ＷＢの、第１面Ｓｆ１および第
２面Ｓｆ２の銅箔をそれぞれエッチング処理することに
より、第１面Ｓｆ１上に第１パターン電極６と第２パタ
ーン電極７を形成させ、また第２面Ｓｆ２上に回路パタ
ーン３を形成させる。As a first step, as shown in FIG. 2, a first surface Sf is sandwiched between flexible insulating films 2.
The copper foils of the first surface Sf1 and the second surface Sf2 of the flexible double-sided printed circuit board WB in which the conductive layers are formed on both surfaces of the first surface Sf2 and the second surface Sf2 are respectively etched to form the first surface Sf1 on the first surface Sf1. One pattern electrode 6 and second pattern electrode 7 are formed, and circuit pattern 3 is formed on second surface Sf2.
【００４０】ついで図３に示されるように、このフレキ
シブル両面プリント回路板ＷＢの一端Ｅｊを、第１面Ｓ
ｆ１を内側に折り込むようにして図中Ｕ１方向に折り畳
み、第１折畳部Ｒ１を形成させる。これにより、第１折
畳部Ｒ１では上下が反転する。Next, as shown in FIG. 3, one end Ej of the flexible double-sided printed circuit board WB is
F1 is folded in the U1 direction in such a manner as to be folded inward to form a first folded portion R1. Thus, the first folding part R1 is turned upside down.
【００４１】ついで図１に示されるように、このフレキ
シブル両面プリント回路板ＷＢをさらに１回、第１面Ｓ
ｆ１を内側に折り込むようにして図中Ｕ２方向に折り畳
む。このとき、接続に必要な長さ分を考慮して、第１折
畳部Ｒ１が第２パターン電極７の位置になるよう相当位
置で折り曲げる。これにより、第２折畳部Ｒ２が形成さ
れ、また第１折畳部Ｒ１の先端部では上下がさらに反転
して、第２面Ｓｆ２側に配設された回路パターン３が第
１面Ｓｆ１側に配設されている第２パターン電極７に対
向して接触可能となっている。Then, as shown in FIG. 1, the flexible double-sided printed circuit board WB is further
F1 is folded in the U2 direction in the figure so as to be folded inward. At this time, in consideration of the length required for connection, the first folded portion R1 is folded at a position corresponding to the position of the second pattern electrode 7. As a result, the second folded portion R2 is formed, and the top and bottom of the first folded portion R1 is further inverted, so that the circuit pattern 3 disposed on the second surface Sf2 side is shifted to the first surface Sf1 side. And can contact the second pattern electrode 7 disposed in the same manner.
【００４２】ついで、第１折畳部Ｒ１の先端部の第２面
Ｓｆ２側に配設された回路パターン３が、第１面Ｓｆ１
側に配設されている第２パターン電極７に対向する部分
を接合部３ａとし、導電材８によって接合部３ａと第２
パターン電極７とを接合させる。導電材８は、金属半田
や、その他のホットメルト材、導電性樹脂などが適す
る。以上の作業によって、回路板の両面を導通させるこ
とができる。Next, the circuit pattern 3 disposed on the side of the second surface Sf2 at the end of the first folded portion R1 is changed to the first surface Sf1.
The portion facing the second pattern electrode 7 disposed on the side is defined as a joining portion 3a, and the joining portion 3a and the second
The pattern electrode 7 is bonded. As the conductive material 8, metal solder, other hot melt materials, conductive resins, and the like are suitable. By the above operation, both sides of the circuit board can be made conductive.
【００４３】この方法により、従来方法であるフレキシ
ブル両面プリント回路板の両面を導通させるスルーホー
ルやジャンパ線等を設けることなく、第２面Ｓｆ２の導
電層に形成された回路パターン３と、第１面Ｓｆ１の導
電層に形成された第２パターン電極７とを、簡素化され
た工程で接続させることができる。したがって従来技術
によるスルーホール・メッキ加工よりも工数削減がで
き、低コストとなる。さらに本方法はスルーホール方式
同様に交叉配線が可能であるから、高い実装密度が得ら
れる。According to this method, the circuit pattern 3 formed on the conductive layer of the second surface Sf2 and the first pattern can be formed without providing through holes or jumper wires for conducting both sides of the flexible double-sided printed circuit board, which is the conventional method. The second pattern electrode 7 formed on the conductive layer on the surface Sf1 can be connected in a simplified process. Therefore, the number of processes can be reduced and the cost can be reduced as compared with the through-hole plating process according to the prior art. Further, this method enables cross wiring similarly to the through-hole method, so that a high mounting density can be obtained.
【００４４】しかも従来のスルーホールによる接続に比
して、第２面Ｓｆ２の接合部３ａと第１面Ｓｆ１の第２
パターン電極７との接合面を広く確保することができ、
また接合面の平坦化が容易であることにより、接合部分
の電気的特性を向上できるのみならず、機械的強度も向
上させることができる。Moreover, compared to the conventional connection using a through hole, the joint 3a of the second surface Sf2 and the second portion of the first surface Sf1
A wide bonding surface with the pattern electrode 7 can be secured,
Further, since the bonding surface can be easily flattened, not only the electrical characteristics of the bonding portion can be improved, but also the mechanical strength can be improved.
【００４５】図４は、本発明の第２実施形態に係るコン
デンサを備えたフレキシブル両面プリント回路板の模式
断面図である。また図５は、図４に示されるコンデンサ
を備えたフレキシブル両面プリント回路板の容量形成の
説明図である。FIG. 4 is a schematic sectional view of a flexible double-sided printed circuit board having a capacitor according to a second embodiment of the present invention. FIG. 5 is an explanatory diagram of the formation of capacitance of a flexible double-sided printed circuit board provided with the capacitor shown in FIG.
【００４６】同図に示されるように、コンデンサを備え
たフレキシブル両面プリント回路板１１は、可撓性を有
し、かつ所定の誘電率ε１を備えるベースフィルム１２
を挟んで第１面に導電層１４が、第２面に導電層１３
が、いずれも大面積でそれぞれ形成され、導電層１４に
は接続ランドまたは接続端子１６が設けられている。As shown in the figure, a flexible double-sided printed circuit board 11 having a capacitor has a flexibility and a base film 12 having a predetermined dielectric constant ε1.
The conductive layer 14 on the first surface and the conductive layer 13 on the second surface
However, each of them is formed in a large area, and the conductive layer 14 is provided with connection lands or connection terminals 16.
【００４７】さらに第１面に、導電層１４と非接続に極
板１７が形成されている。また極板１７には図示されな
い接続ランドまたは接続端子が接続されている。あるい
は極板１７を、接続ランドまたは接続端子として兼用す
る構成とする。Further, an electrode plate 17 is formed on the first surface so as not to be connected to the conductive layer 14. A connection land or connection terminal (not shown) is connected to the electrode plate 17. Alternatively, the electrode plate 17 is configured to also serve as a connection land or a connection terminal.
【００４８】さらに第１面の導電層１４が誘電率ε２の
絶縁性の誘電体フィルム２０で覆われ、フレキシブル両
面プリント回路板１１の端部が誘電体フィルム２０とと
もに、第１面を内側にして４度折り畳むように巻き込ま
れてコンデンサが形成されている。符号Ｒ１１〜Ｒ１４
は折畳部を示している。Further, the conductive layer 14 on the first surface is covered with an insulating dielectric film 20 having a dielectric constant of ε2, and the end of the flexible double-sided printed circuit board 11 together with the dielectric film 20 with the first surface inside. The capacitor is formed so as to be folded four times. Symbols R11 to R14
Indicates a folding part.
【００４９】さらに、前記の巻き込まれた部分の第２面
の導電層１３の、第１面に形成された極板１７に対向す
る部分を接合部１３’として、この接合部１３’と極板
１７とが、導電材１８により電気的に接続されている。
導電材１８には、金属半田や、その他のホットメルト
材、導電性樹脂などが適用される。Further, the portion of the conductive layer 13 on the second surface of the above-mentioned rolled-in portion, which faces the electrode plate 17 formed on the first surface, is defined as a bonding portion 13 '. 17 are electrically connected by a conductive material 18.
As the conductive material 18, metal solder, other hot melt material, conductive resin, or the like is applied.
【００５０】前記のようにして形成されたコンデンサ
は、極板１７または極板１７に接続されている図示され
ない接続ランドまたは接続端子と、接続端子１６とによ
って、回路パターンや他の構成部品と接続可能になって
いる。The capacitor formed as described above is connected to a circuit pattern or other components by the connection plate 16 and the connection plate 16 or connection lands or connection terminals (not shown) connected to the plate 17. It is possible.
【００５１】このように、本実施形態の構成によれば、
両接続端子すなわち極板１７または極板１７に接続され
ている図示されない接続ランドまたは接続端子と、接続
端子１６とが、いずれもフレキシブル両面プリント回路
板１１の第１面上に形成される。As described above, according to the configuration of the present embodiment,
Both connection terminals, that is, the electrode plate 17 or the connection land or connection terminal (not shown) connected to the electrode plate 17 and the connection terminal 16 are all formed on the first surface of the flexible double-sided printed circuit board 11.
【００５２】本実施形態の構成によれば、両導電層１３
と１４間には誘電率ε１のベースフィルム１２が介在
し、さらにこれに加えて、巻き込まれたことによって隣
接する状態となった両導電層１３と１４間には、誘電率
ε２の、巻き込まれた誘電体フィルム２０が介在するこ
とになる。この結果、誘電体フィルム２０の分極による
効果で、形成されるコンデンサの容量を増加させること
ができる。According to the structure of this embodiment, both conductive layers 13
The base film 12 having a dielectric constant of ε1 is interposed between the conductive layers 13 and 14, and furthermore, the conductive film 13 and the dielectric layer having a dielectric constant of ε2 between The dielectric film 20 is interposed. As a result, the capacitance of the formed capacitor can be increased by the effect of the polarization of the dielectric film 20.
【００５３】図５は、上記の原理を説明するもので、巻
き込み部の一部分を等価的に示す。第１面の導電層１４
は、誘電率ε１で厚みｄ１のベースフィルムを介して第
２面の導電層１３と対向し、この部分により容量Ｃ１が
形成される。ここで、 Ｃ１＝Ａ１・ε１／ｄ１ （Ａ１は対向導電層の面積） である。この容量Ｃ１は、フレキシブル両面プリント回
路板１１が巻き込み加工されない平面形状で形成される
容量と同じである。FIG. 5 explains the above principle, and equivalently shows a part of the winding portion. First surface conductive layer 14
Faces the conductive layer 13 on the second surface via a base film having a dielectric constant of ε1 and a thickness of d1, and this portion forms a capacitor C1. Here, C1 = A1 · ε1 / d1 (A1 is the area of the opposing conductive layer). The capacitance C1 is the same as the capacitance formed in a planar shape in which the flexible double-sided printed circuit board 11 is not wrapped.
【００５４】上記に加えて第１面の導電層１４は更に、
巻き込まれることによって隣接する状態となった第２面
の導電層１３と、挟み込まれた誘電体フィルム２０を介
して対向し、この部分により容量Ｃ２が形成される。こ
こで誘電体フィルム２０の誘電率をε２、厚みをｄ２と
すると、 Ｃ２＝Ａ２・ε２／ｄ２ （Ａ２は隣接導電層の面積） である。この容量Ｃ２は、フレキシブル両面プリント回
路板１１が誘電体フィルム２０を挟んで巻き込み加工さ
れたことにより新たに形成されたものである。In addition to the above, the conductive layer 14 on the first surface further includes
The conductive layer 13 on the second surface, which is brought into an adjacent state by being wound, is opposed to the conductive layer 13 via the sandwiched dielectric film 20, and a capacitor C2 is formed by this portion. Here, assuming that the dielectric constant of the dielectric film 20 is ε2 and the thickness is d2, C2 = A2 · ε2 / d2 (A2 is the area of the adjacent conductive layer). The capacitor C2 is newly formed by winding the flexible double-sided printed circuit board 11 with the dielectric film 20 interposed therebetween.
【００５５】前記のように、本実施形態によれば、総合
キャパシタンスをＣとして、 Ｃ＝Ａ１・ε１／ｄ１＋Ａ２・ε２／ｄ２ のように増加した容量のコンデンサを形成させることが
できる。As described above, according to the present embodiment, it is possible to form a capacitor having an increased capacitance such as C = A1 ・ 1 / d1 + A2 / ε2 / d2, where C is the total capacitance.
【００５６】このように本実施形態では、ベースフィル
ム１２のみならず、巻き込みに際して挟み込んだ誘電体
フィルム２０をも誘電体とし、対向および隣接した導電
層１３、１４を電極として、これらベースフィルムおよ
び誘電体フィルムの分極特性によってコンデンサを構成
させることになる。As described above, in the present embodiment, not only the base film 12 but also the dielectric film 20 sandwiched at the time of winding is used as a dielectric, and the opposing and adjacent conductive layers 13 and 14 are used as electrodes. A capacitor is constituted by the polarization characteristics of the body film.
【００５７】したがってフレキシブル両面プリント回路
板の端部を、誘電体フィルムを挟んで巻き込むだけで、
容量が大のコンデンサを板上に形成したフレキシブル両
面プリント回路板を提供することが可能になる。Therefore, just by winding the end of the flexible double-sided printed circuit board with the dielectric film interposed therebetween,
It is possible to provide a flexible double-sided printed circuit board having a large-capacity capacitor formed on the board.
【００５８】さらに、コンデンサの一方の電極を構成す
る第２面の導電層が、第１面に形成された極板と電気的
に接続されていることで、形成されたコンデンサの両電
極の接続端子をいずれも第１面上に形成でき、よって回
路パターン構成を簡素化できる。しかも第２面の導電層
が第１面の極板に接合されることによって、接合面が広
く確保され、また接合面の平坦化が容易であることによ
り接合部分の電気的特性の向上のみならず機械的強度の
向上がなされた、コンデンサ付きのフレキシブル両面プ
リント回路板を提供することができる。Further, since the conductive layer on the second surface constituting one electrode of the capacitor is electrically connected to the electrode plate formed on the first surface, the connection between the two electrodes of the formed capacitor is achieved. All the terminals can be formed on the first surface, so that the circuit pattern configuration can be simplified. Moreover, since the conductive layer on the second surface is bonded to the electrode plate on the first surface, a wide bonding surface is ensured, and the flattening of the bonding surface facilitates the improvement of the electrical characteristics of the bonding portion. The present invention can provide a flexible double-sided printed circuit board with a capacitor having improved mechanical strength.
【００５９】さらに、折畳み、巻き込んだ部分の厚みを
薄く構成できるので、厚みの薄いフレキシブル両面プリ
ント回路板とすることができる。Furthermore, the thickness of the folded or rolled-up portion can be reduced, so that a flexible double-sided printed circuit board having a small thickness can be obtained.
【００６０】なお、本実施形態の構成と異なり、誘電体
フィルム２０を挟まずに巻き込んだ場合は、巻き込みに
よって第１面の導電層１４と第２面の導電層１３が直
接、接触するから、導電層１４と導電層１３が導通状態
となって短絡され、よってコンデンサが形成されない。Unlike the structure of this embodiment, when the dielectric film 20 is wound without sandwiching it, the winding causes the conductive layer 14 on the first surface and the conductive layer 13 on the second surface to come into direct contact. Conductive layer 14 and conductive layer 13 are brought into conduction and short-circuited, so that no capacitor is formed.
【００６１】また、本発明に係るフレキシブル両面プリ
ント回路板上のコンデンサの形成方法は、可撓性を有
し、所定の誘電率を備える絶縁フィルムを挟んで第１面
と第２面の両面に導電層が形成されたフレキシブル両面
プリント回路板上にコンデンサを形成させるものであ
る。Further, the method of forming a capacitor on a flexible double-sided printed circuit board according to the present invention comprises the steps of: forming a capacitor on both surfaces of a first surface and a second surface with an insulating film having flexibility and a predetermined dielectric constant interposed therebetween; A capacitor is formed on a flexible double-sided printed circuit board on which a conductive layer is formed.
【００６２】その工程は、前記から明らかなように、フ
レキシブル両面プリント回路板上の第１面に、極板を、
第１面の導電層と非接続に形成させる工程と、フレキシ
ブル両面プリント回路板上の第１面の導電層を誘電体フ
ィルムで覆う工程と、フレキシブル両面プリント回路板
の端部を誘電体フィルムとともに、第１面を内側にして
巻き込む工程と、巻き込まれた部分の第２面の導電層と
第１面に形成された極板とを接続する工程から構成され
る。As is apparent from the above description, the process comprises the steps of: attaching an electrode plate to the first surface of the flexible double-sided printed circuit board;
Forming the first side conductive layer on the flexible double-sided printed circuit board with the dielectric film, and covering the end of the flexible double-sided printed circuit board with the dielectric film. And a step of connecting the conductive layer on the second surface and the electrode plate formed on the first surface in a portion where the first surface is turned inside.
【００６３】図６は、本発明の第３実施形態に係るフレ
キシブル両面プリント回路板の接続方法の工程を示す平
面図である。また図７は、図６の側面図である。さらに
図８は、図６に続く工程を示す平面図であり、また図９
は図８の側面図である。そして図１０は、図８に続く工
程を示す平面図である。FIG. 6 is a plan view showing steps of a method for connecting a flexible double-sided printed circuit board according to a third embodiment of the present invention. FIG. 7 is a side view of FIG. FIG. 8 is a plan view showing a step following FIG. 6, and FIG.
FIG. 9 is a side view of FIG. FIG. 10 is a plan view showing a step following FIG.
【００６４】図６および図７に示されるように、本接続
方法が適用されるフレキシブル両面プリント回路板３０
は、可撓性を有する絶縁フィルム３２を挟んで第１面上
に電極３７が形成され、第２面上に導電層３３が形成さ
れており、さらにフレキシブル両面プリント回路板３０
の端部が細長く延伸されて延伸部３０Ａを形成してい
る。As shown in FIGS. 6 and 7, a flexible double-sided printed circuit board 30 to which the present connection method is applied.
Has an electrode 37 formed on a first surface across a flexible insulating film 32, a conductive layer 33 formed on a second surface, and a flexible double-sided printed circuit board 30.
Are elongated to form an elongated portion 30A.
【００６５】この延伸部３０Ａの端部を、図８および図
９に示されるように、矢印Ｔｗ方向に１８０度捻って捻
り部３５を形成させ、これによって第１面と第２面を反
転させる。捻り部３５から端部側では、第２面の導電層
３３が上側になる。As shown in FIGS. 8 and 9, the end of the extending portion 30A is twisted 180 degrees in the direction of the arrow Tw to form a twisted portion 35, whereby the first surface and the second surface are inverted. . On the end side from the twisted portion 35, the conductive layer 33 on the second surface is on the upper side.
【００６６】ついで、図１０に示されるように、延伸部
３０Ａの端部を第２面を内側にして矢印Ｕ方向に折り曲
げると、端部側の第２面の導電層３３が下側になるが、
ここで折り曲げ位置を調整することにより、この導電層
３３の一部分である接合部３３ａが第１面上の電極３７
に当接するようにする。Next, as shown in FIG. 10, when the end of the extending portion 30A is bent in the direction of the arrow U with the second surface inside, the conductive layer 33 on the second surface on the end becomes lower. But,
Here, by adjusting the bending position, the bonding portion 33a, which is a part of the conductive layer 33, is connected to the electrode 37 on the first surface.
To make contact with
【００６７】つぎに、当接している接合部３３ａと電極
３７とを、導電材３８を用いて接合させる。上記のよう
に本発明は、フレキシブル両面プリント回路板３０に延
伸部３０Ａを設け、この延伸部３０Ａをメビウス環状に
捻り、さらに畳むように折り曲げて上下を反転させ、導
電層３３の一部分である接合部３３ａを第１面上の電極
３７へ接合させるものである。Next, the contacting portion 33a and the electrode 37 that are in contact with each other are joined using a conductive material 38. As described above, the present invention provides the flexible double-sided printed circuit board 30 with the extending portion 30A, twisting the extending portion 30A into a Mobius annular shape, and further folding the folded portion 30A upside down to turn it upside down. 33a is joined to the electrode 37 on the first surface.
【００６８】この方法により、従来方法であるフレキシ
ブル両面プリント回路板の両面を導通させるスルーホー
ルやジャンパ線等を設けることなく、第２面上の導電層
３３と、第１面上に形成された電極３７とを、簡素化さ
れた工程で接続させることができる。したがって従来技
術によるスルーホール・メッキ加工よりも工数削減がで
き、低コストとなる。さらに本方法はスルーホール方式
同様に交叉配線が可能であるから、高い実装密度が得ら
れる。According to this method, the conductive layer 33 on the second surface and the conductive layer 33 on the first surface are formed without providing a through hole or a jumper wire for conducting both surfaces of the flexible double-sided printed circuit board, which is a conventional method. The electrode 37 can be connected in a simplified process. Therefore, the number of processes can be reduced and the cost can be reduced as compared with the through-hole plating process according to the prior art. Further, this method enables cross wiring similarly to the through-hole method, so that a high mounting density can be obtained.
【００６９】しかも従来のスルーホールによる接続に比
して、第２面上の導電層３３の接合部３ａと第１面上の
電極３７との接合面を広く確保することができ、また接
合面の平坦化が容易であることにより、接合部分の電気
的特性を向上できるのみならず、機械的強度も向上させ
ることができる。Further, as compared with the conventional connection using a through hole, a wider bonding surface between the bonding portion 3a of the conductive layer 33 on the second surface and the electrode 37 on the first surface can be ensured. Is easy to planarize, so that not only the electrical characteristics of the joint can be improved, but also the mechanical strength can be improved.
【００７０】[0070]
【発明の効果】以上詳述したように、本発明の請求項１
に係るフレキシブル両面プリント回路板は、端部が第１
面を内側に折り込むように少なくとも２度、折り畳ま
れ、折り畳み部分の第２面の導電層が第１面に形成され
た電極パターンに電気的に接続された構成とするもので
あるから、折畳み部分の第２面の導電層と第１面の導電
層との電気的接続を、スルーホールやジャンパワイヤ等
を用いることなく簡単かつ低コストで実現するフレキシ
ブル両面プリント回路板を提供できる。しかも第２面の
導電層と第１面の導電層の接合面が広くなり、さらに接
合面の平坦化が容易であることにより、接合部分の電気
的特性のみならず機械的強度を向上させたフレキシブル
両面プリント回路板を実現できる。As described in detail above, claim 1 of the present invention
The flexible double-sided printed circuit board according to
The folded portion is folded at least twice so that the surface is folded inward, and the conductive layer on the second surface of the folded portion is electrically connected to the electrode pattern formed on the first surface. It is possible to provide a flexible double-sided printed circuit board which realizes the electrical connection between the conductive layer on the second surface and the conductive layer on the first surface simply and at low cost without using through holes or jumper wires. In addition, the bonding surface between the conductive layer on the second surface and the conductive layer on the first surface is widened, and the flattening of the bonding surface is easy, so that not only the electrical characteristics of the bonding portion but also the mechanical strength are improved. A flexible double-sided printed circuit board can be realized.
【００７１】この結果、第２面の導電層に形成された回
路パターンと、第１面の導電層に形成された回路パター
ンとが簡単かつ低コストで接続されたフレキシブル両面
プリント回路板を提供することができる。As a result, there is provided a flexible double-sided printed circuit board in which the circuit pattern formed on the conductive layer on the second surface and the circuit pattern formed on the conductive layer on the first surface are connected simply and at low cost. be able to.
【００７２】本発明の請求項２に係るフレキシブル両面
プリント回路板の接続方法は、フレキシブル両面プリン
ト回路板の端部を、第１面を内側に折り込むように少な
くとも２度折り畳み、折り畳み部分の第２面の導電層を
第１面の導電層に電気的に接続させるものであるから、
この方法により、フレキシブル両面プリント回路板の両
面を導通させるスルーホールやジャンパ線等を設けるこ
となく、簡素化した工程で接続ができ、工数を削減でき
て低コストとなる。In the method for connecting a flexible double-sided printed circuit board according to a second aspect of the present invention, the end of the flexible double-sided printed circuit board is folded at least twice so that the first surface is folded inward, and the second portion of the folded portion is folded. Since the conductive layer on the surface is electrically connected to the conductive layer on the first surface,
According to this method, the connection can be performed in a simplified process without providing a through-hole or a jumper wire for conducting both sides of the flexible double-sided printed circuit board, the number of steps can be reduced, and the cost can be reduced.
【００７３】しかも第２面の導電層と第１面の導電層の
接合面を広くでき、さらに接合面を容易に平坦化できる
ことにより、接合部分の電気的特性のみならず機械的強
度を向上させることが可能になる。これにより、第２面
の導電層に形成された回路パターンと、第１面の導電層
に形成された回路パターンとを簡単かつ低コストで接続
することができる。Further, the bonding surface between the conductive layer on the second surface and the conductive layer on the first surface can be widened and the bonding surface can be easily flattened, so that not only the electrical characteristics of the bonded portion but also the mechanical strength can be improved. It becomes possible. Thereby, the circuit pattern formed on the conductive layer on the second surface and the circuit pattern formed on the conductive layer on the first surface can be easily and inexpensively connected.
【００７４】本発明の請求項３に係るコンデンサを備え
たフレキシブル両面プリント回路板は、所定の誘電率の
可撓性絶縁フィルムを挟んで第１面と第２面の両面に導
電層が形成され、誘電体フィルムで覆われた第１面の導
電層を内側にして端部から巻き込まれたコンデンサが形
成され、巻き込まれた部分の第２面の導電層と、第１面
に導電層と非接続に形成された極板とが電気的に接続さ
れた構成とするものであるから、巻き込まれた部分の両
導電層間に絶縁フィルムと、さらに誘電体フィルムが介
在することで、形成されるコンデンサの容量を増加させ
ることができる。In a flexible double-sided printed circuit board having a capacitor according to a third aspect of the present invention, conductive layers are formed on both first and second surfaces with a flexible insulating film having a predetermined dielectric constant interposed therebetween. A capacitor is formed in which the conductive layer on the first surface covered with the dielectric film is wound inside from the end, and the conductive layer on the second surface of the wound portion and the conductive layer on the first surface are not in contact with each other. Since the electrodes formed in the connection are electrically connected to each other, a capacitor formed by interposing an insulating film and a dielectric film between both conductive layers of the entangled portion. Capacity can be increased.
【００７５】しかも、フレキシブル両面プリント回路板
の端部を巻き込む構成だけで、コンデンサを板上に形成
したフレキシブル両面プリント回路板を提供することが
可能になる。Further, it is possible to provide a flexible double-sided printed circuit board in which a capacitor is formed on the board only by winding the end of the flexible double-sided printed circuit board.
【００７６】さらに、コンデンサの一方の電極を構成す
る第２面の導電層が、第１面に形成された極板と電気的
に接続されていることで、形成されたコンデンサの両電
極の接続端子をいずれも第１面上に形成でき、よって回
路パターン構成を簡素化できる。しかも第２面の導電層
が第１面の極板に接合されることによって、接合面が広
く確保され、また接合面の平坦化が容易であることによ
り接合部分の電気的特性の向上のみならず機械的強度の
向上がなされたフレキシブル両面プリント回路板を提供
することができる。Further, since the conductive layer on the second surface constituting one electrode of the capacitor is electrically connected to the electrode plate formed on the first surface, the connection between the two electrodes of the formed capacitor is achieved. All the terminals can be formed on the first surface, so that the circuit pattern configuration can be simplified. Moreover, since the conductive layer on the second surface is bonded to the electrode plate on the first surface, a wide bonding surface is ensured, and the flattening of the bonding surface facilitates the improvement of the electrical characteristics of the bonding portion. A flexible double-sided printed circuit board with improved mechanical strength can be provided.
【００７７】本発明の請求項４に係るフレキシブル両面
プリント回路板上のコンデンサの形成方法は、所定の誘
電率の可撓性絶縁フィルムを挟んで第１面と第２面の両
面に導電層が形成されたフレキシブル両面プリント回路
板上の第１面の導電層を誘電体フィルムで覆い、端部を
第１面を内側にして誘電体フィルムとともに巻き込み、
巻き込まれた部分の第２面の導電層と、第１面に導電層
と非接続に形成された極板とを電気的に接続するもので
あるから、巻き込まれた部分の両導電層間に絶縁フィル
ムと、さらに誘電体フィルムを介在させることにより、
形成されるコンデンサの容量を増加させることができ
る。According to a fourth aspect of the present invention, there is provided a method of forming a capacitor on a flexible double-sided printed circuit board, wherein a conductive layer is formed on both the first and second surfaces with a flexible insulating film having a predetermined dielectric constant interposed therebetween. The conductive layer on the first surface on the formed flexible double-sided printed circuit board is covered with a dielectric film, and the end is wound with the dielectric film with the first surface inside.
Since the conductive layer on the second surface of the entangled portion is electrically connected to the electrode plate formed on the first surface and not connected to the conductive layer, an insulation is provided between both conductive layers of the entangled portion. By interposing a film and a dielectric film,
The capacity of the formed capacitor can be increased.
【００７８】しかも、フレキシブル両面プリント回路板
の端部を巻き込む構成だけで、コンデンサを板上に形成
させることが可能になる。Moreover, the capacitor can be formed on the flexible double-sided printed circuit board only by winding the end portion of the circuit board.
【００７９】さらに、コンデンサの一方の電極を構成す
る第２面の導電層を、第１面に形成された極板と電気的
に接続することによって、形成されたコンデンサの両電
極の接続端子をいずれも第１面上に形成することがで
き、よって回路パターン構成を簡素化できる。しかも第
２面の導電層を第１面の極板に接合させることによっ
て、接合面を広く確保でき、また接合面の平坦化が容易
であることにより接合部分の電気的特性の向上のみなら
ず機械的強度の向上を実現することができる。Further, by electrically connecting the conductive layer on the second surface constituting one electrode of the capacitor to the electrode plate formed on the first surface, the connection terminals of both electrodes of the formed capacitor are connected. Either can be formed on the first surface, so that the circuit pattern configuration can be simplified. Moreover, by bonding the conductive layer on the second surface to the electrode plate on the first surface, a wide bonding surface can be ensured, and the flattening of the bonding surface facilitates not only the improvement of the electrical characteristics of the bonding portion, but also An improvement in mechanical strength can be realized.
【００８０】本発明の請求項５に係るフレキシブル両面
プリント回路板は、細長く延伸された端部が捻られて第
１面と第２面が反転され、さらにこの端部が第２面を内
側にして折り曲げられ、さらに折り曲げられた端部の第
２面の導電層が第１面の導電層に形成された電極パター
ンに電気的に接続された構成とするものであるから、折
り曲げられた部分の第２面の導電層と第１面の導電層と
の電気的接続を、スルーホールやジャンパワイヤ等を用
いることなく簡単かつ低コストで実現するフレキシブル
両面プリント回路板を提供できる。しかも第２面の導電
層と第１面の導電層の接合面が広くなり、さらに接合面
の平坦化が容易であることにより、接合部分の電気的特
性のみならず機械的強度を向上させたフレキシブル両面
プリント回路板を実現できる。In the flexible double-sided printed circuit board according to the fifth aspect of the present invention, the elongated end is twisted so that the first surface and the second surface are inverted, and this end is turned with the second surface inside. And the conductive layer on the second surface at the bent end is electrically connected to the electrode pattern formed on the conductive layer on the first surface. A flexible double-sided printed circuit board can be provided that realizes electrical connection between the conductive layer on the second surface and the conductive layer on the first surface simply and at low cost without using through holes or jumper wires. In addition, the bonding surface between the conductive layer on the second surface and the conductive layer on the first surface is widened, and the flattening of the bonding surface is easy, so that not only the electrical characteristics of the bonding portion but also the mechanical strength are improved. A flexible double-sided printed circuit board can be realized.
【００８１】この結果、第２面の導電層に形成された回
路パターンと、第１面の導電層に形成された回路パター
ンとが簡単かつ低コストで接続されたフレキシブル両面
プリント回路板を提供することができる。As a result, a flexible double-sided printed circuit board is provided in which the circuit pattern formed on the conductive layer on the second surface and the circuit pattern formed on the conductive layer on the first surface are simply and inexpensively connected. be able to.
【００８２】本発明の請求項６に係るフレキシブル両面
プリント回路板の接続方法は、細長く延伸された端部を
捻って第１面と第２面を反転させ、さらにこの端部を第
２面を内側にして折り曲げ、さらに折り曲げた端部の第
２面の導電層を第１面の導電層に形成された電極パター
ンに電気的に接続するものであるから、この方法によ
り、フレキシブル両面プリント回路板の両面を導通させ
るスルーホールやジャンパ線等を設けることなく、簡素
化した工程で接続ができ、工数を削減できて低コストと
なる。In the method for connecting a flexible double-sided printed circuit board according to the sixth aspect of the present invention, the first surface and the second surface are inverted by twisting the elongated end, and the second surface is connected to the second surface. The flexible double-sided printed circuit board is formed by this method because the conductive layer on the second surface at the bent end is electrically connected to the electrode pattern formed on the conductive layer on the first surface. The connection can be performed in a simplified process without providing a through-hole or a jumper wire for conducting both sides of the device, and the number of steps can be reduced and the cost can be reduced.
【００８３】しかも第２面の導電層と第１面の導電層の
接合面を広くでき、さらに接合面を容易に平坦化できる
ことにより、接合部分の電気的特性のみならず機械的強
度を向上させることが可能になる。これにより、第２面
の導電層に形成された回路パターンと、第１面の導電層
に形成された回路パターンとを簡単かつ低コストで接続
することができる。In addition, the bonding surface between the conductive layer on the second surface and the conductive layer on the first surface can be widened and the bonding surface can be easily flattened, so that not only the electrical characteristics of the bonded portion but also the mechanical strength can be improved. It becomes possible. Thereby, the circuit pattern formed on the conductive layer on the second surface and the circuit pattern formed on the conductive layer on the first surface can be easily and inexpensively connected.
【図１】本発明の第１実施形態に係るフレキシブル両面
プリント回路板の模式断面図である。FIG. 1 is a schematic sectional view of a flexible double-sided printed circuit board according to a first embodiment of the present invention.
【図２】図１に示されるフレキシブル両面プリント回路
板の接続方法の工程を示す模式断面図である。FIG. 2 is a schematic sectional view showing steps of a method for connecting the flexible double-sided printed circuit board shown in FIG.
【図３】図２に続く工程を示す模式断面図である。FIG. 3 is a schematic sectional view showing a step following FIG. 2;
【図４】本発明の第２実施形態に係るコンデンサを備え
たフレキシブル両面プリント回路板の模式断面図であ
る。FIG. 4 is a schematic sectional view of a flexible double-sided printed circuit board provided with a capacitor according to a second embodiment of the present invention.
【図５】図４に示されるコンデンサを備えたフレキシブ
ル両面プリント回路板の容量形成の説明図である。FIG. 5 is an explanatory diagram of capacity formation of a flexible double-sided printed circuit board provided with the capacitor shown in FIG. 4;
【図６】本発明の第３実施形態に係るフレキシブル両面
プリント回路板の接続方法の工程を示す平面図である。FIG. 6 is a plan view showing steps of a method for connecting a flexible double-sided printed circuit board according to a third embodiment of the present invention.
【図７】図６の側面図である。FIG. 7 is a side view of FIG. 6;
【図８】図６に続く工程を示す平面図である。FIG. 8 is a plan view showing a step following the step shown in FIG.
【図９】図８の側面図である。FIG. 9 is a side view of FIG.
【図１０】図８に続く工程を示す平面図である。FIG. 10 is a plan view showing a step following the step shown in FIG.
【図１１】従来のフレキシブル両面プリント回路板の断
面図である。FIG. 11 is a sectional view of a conventional flexible double-sided printed circuit board.
１……フレキシブル両面プリント回路板、２……ベース
フィルム、３……回路パターン、３ａ……接続部、６…
…第１パターン電極、７……第２パターン電極、８……
導電材、Ｒ１……第１折畳部、Ｒ２……第２折畳部1 ... flexible double-sided printed circuit board, 2 ... base film, 3 ... circuit pattern, 3a ... connection part, 6 ...
... 1st pattern electrode, 7 ... 2nd pattern electrode, 8 ...
Conductive material, R1 first fold, R2 second fold
Claims (6)
１面と第２面の両面に導電層が形成されたフレキシブル
両面プリント回路板の前記第１面の導電層に電極パター
ンが形成され、 前記フレキシブル両面プリント回路板の端部が、前記第
１面を内側に折り込むように少なくとも２度、折り畳ま
れ、 且つ前記折り畳み部分の前記第２面の導電層が前記第１
面の前記電極パターンに電気的に接続された構成とした
ことを特徴とするフレキシブル両面プリント回路板。An electrode pattern is formed on the conductive layer on the first surface of a flexible double-sided printed circuit board having a conductive layer formed on both surfaces of a first surface and a second surface with a flexible insulating film interposed therebetween. An end of the flexible double-sided printed circuit board is folded at least twice so that the first surface is folded inward, and the conductive layer on the second surface of the folded portion is the first surface.
A flexible double-sided printed circuit board, wherein the flexible double-sided printed circuit board is electrically connected to the electrode pattern on the surface.
１面と第２面の両面に導電層が形成されたフレキシブル
両面プリント回路板の前記第１面の導電層と前記第２面
の導電層とを電気的に接続する方法であって、 前記フレキシブル両面プリント回路板の端部を、前記第
１面を内側に折り込むように少なくとも２度、折り畳
み、 且つ前記折り畳み部分の前記第２面の導電層を前記第１
面の導電層に電気的に接続させることを特徴とするフレ
キシブル両面プリント回路板の接続方法。2. A flexible double-sided printed circuit board in which conductive layers are formed on both surfaces of a first surface and a second surface with a flexible insulating film interposed therebetween. A method for electrically connecting a conductive layer to an end of the flexible double-sided printed circuit board at least twice so as to fold the first surface inward, and the second surface of the folded portion. Of the first conductive layer
A method for connecting a flexible double-sided printed circuit board, wherein the method is electrically connected to a surface conductive layer.
る絶縁フィルムを挟んで第１面と第２面の両面に導電層
が形成されたフレキシブル両面プリント回路であって、 前記フレキシブル両面プリント回路板上の前記第１面
に、前記導電層と非接続に極板が形成され、 前記フレキシブル両面プリント回路板上の第１面の前記
導電層が誘電体フィルムで覆われ、 前記フレキシブル両面プリント回路板の端部が前記誘電
体フィルムとともに、前記第１面を内側にして巻き込ま
れてコンデンサが形成され、 前記巻き込まれた部分の前記第２面の導電層と前記第１
面に形成された前記極板とが電気的に接続されたことを
特徴とするコンデンサを備えたフレキシブル両面プリン
ト回路板。3. A flexible double-sided printed circuit comprising a conductive layer formed on both first and second surfaces with an insulating film having flexibility and a predetermined dielectric constant interposed therebetween. An electrode plate is formed on the first surface on the double-sided printed circuit board so as not to be connected to the conductive layer. The conductive layer on the first surface on the flexible double-sided printed circuit board is covered with a dielectric film. An end of the double-sided printed circuit board is wound together with the dielectric film with the first surface inward to form a capacitor. The conductive layer on the second surface of the wound portion and the first capacitor are formed.
A flexible double-sided printed circuit board comprising a capacitor, wherein the electrode plate formed on a surface is electrically connected to the electrode plate.
る絶縁フィルムを挟んで第１面と第２面の両面に導電層
が形成されたフレキシブル両面プリント回路板上にコン
デンサを形成させる方法であって、 前記フレキシブル両面プリント回路板上の前記第１面
に、極板を、前記第１面の前記導電層と非接続に形成
し、 前記フレキシブル両面プリント回路板上の第１面の前記
導電層を誘電体フィルムで覆い、 前記フレキシブル両面プリント回路板の端部を前記誘電
体フィルムとともに、前記第１面を内側にして巻き込
み、 前記巻き込まれた部分の前記第２面の導電層と前記第１
面に形成された前記極板とを電気的に接続することを特
徴とするフレキシブル両面プリント回路板のコンデンサ
の形成方法。4. A capacitor is formed on a flexible double-sided printed circuit board having conductive layers formed on both first and second surfaces with an insulating film having flexibility and a predetermined dielectric constant interposed therebetween. An electrode plate is formed on the first surface on the flexible double-sided printed circuit board in a manner not connected to the conductive layer on the first surface, and a first surface on the flexible double-sided printed circuit board is provided. Covering the conductive layer with a dielectric film, winding the end of the flexible double-sided printed circuit board together with the dielectric film with the first surface inside, and the conductive layer on the second surface of the wound portion And the first
A method for forming a capacitor of a flexible double-sided printed circuit board, comprising electrically connecting the electrode plate formed on a surface.
１面と第２面の両面に導電層が形成されたフレキシブル
両面プリント回路板の前記第１面の導電層に電極パター
ンが形成され、 前記フレキシブル両面プリント回路板の端部が細長く延
伸され、 前記端部が捻られて前記第１面と前記第２面が反転さ
れ、 且つ前記端部が前記第２面を内側にして折り曲げられ、 さらに前記折り曲げられた端部の前記第２面の導電層が
前記第１面の前記電極パターンに電気的に接続された構
成としたことを特徴とするフレキシブル両面プリント回
路板。5. An electrode pattern is formed on the conductive layer on the first surface of a flexible double-sided printed circuit board in which conductive layers are formed on both surfaces of a first surface and a second surface with a flexible insulating film interposed therebetween. The end of the flexible double-sided printed circuit board is elongated, the end is twisted, the first surface and the second surface are inverted, and the end is bent with the second surface inside. A flexible double-sided printed circuit board, wherein a conductive layer on the second surface at the bent end is electrically connected to the electrode pattern on the first surface.
１面と第２面の両面に導電層が形成されたフレキシブル
両面プリント回路板の前記第１面の導電層と前記第２面
の導電層とを電気的に接続する方法であって、 前記フレキシブル両面プリント回路板の、細長く延伸さ
れた端部を捻って前記第１面と前記第２面を反転させ、 ついで前記端部を前記第２面を内側にして折り曲げ、 さらに前記第２面の導電層を前記第１面の導電層に電気
的に接続させることを特徴とするフレキシブル両面プリ
ント回路板の接続方法。6. A flexible double-sided printed circuit board in which a conductive layer is formed on both surfaces of a first surface and a second surface with a flexible insulating film interposed therebetween. A method for electrically connecting a conductive layer, wherein the first and second surfaces of the flexible double-sided printed circuit board are inverted by twisting an elongated end of the flexible double-sided printed circuit board. A method for connecting a flexible double-sided printed circuit board, comprising bending the second surface inside, and electrically connecting the conductive layer on the second surface to the conductive layer on the first surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24891398A JP4078723B2 (en) | 1998-09-03 | 1998-09-03 | A flexible double-sided printed circuit board having a capacitor and a method for forming the capacitor. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP24891398A JP4078723B2 (en) | 1998-09-03 | 1998-09-03 | A flexible double-sided printed circuit board having a capacitor and a method for forming the capacitor. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2000077796A true JP2000077796A (en) | 2000-03-14 |
| JP4078723B2 JP4078723B2 (en) | 2008-04-23 |
Family
ID=17185294
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP24891398A Expired - Fee Related JP4078723B2 (en) | 1998-09-03 | 1998-09-03 | A flexible double-sided printed circuit board having a capacitor and a method for forming the capacitor. |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4078723B2 (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006033346A3 (en) * | 2004-09-21 | 2006-05-11 | Ibiden Co Ltd | Flexible printed wiring board |
| WO2014203633A1 (en) * | 2013-06-17 | 2014-12-24 | 株式会社村田製作所 | Flexible cable and electronic apparatus |
| US20150192961A1 (en) * | 2013-04-28 | 2015-07-09 | Boe Technology Group Co., Ltd. | Flexible substrate, display device and method for bonding electronic devices on flexible substrate |
-
1998
- 1998-09-03 JP JP24891398A patent/JP4078723B2/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2006033346A3 (en) * | 2004-09-21 | 2006-05-11 | Ibiden Co Ltd | Flexible printed wiring board |
| US7312401B2 (en) | 2004-09-21 | 2007-12-25 | Ibiden Co., Ltd. | Flexible printed wiring board |
| JPWO2006033346A1 (en) * | 2004-09-21 | 2008-05-15 | イビデン株式会社 | Flexible printed wiring board |
| US7786389B2 (en) | 2004-09-21 | 2010-08-31 | Ibiden Co., Ltd. | Flexible printed wiring board |
| JP5006649B2 (en) * | 2004-09-21 | 2012-08-22 | イビデン株式会社 | Flexible printed wiring board |
| US20150192961A1 (en) * | 2013-04-28 | 2015-07-09 | Boe Technology Group Co., Ltd. | Flexible substrate, display device and method for bonding electronic devices on flexible substrate |
| US9651996B2 (en) * | 2013-04-28 | 2017-05-16 | Boe Technology Group Co., Ltd. | Flexible substrate, display device and method for bonding electronic devices on flexible substrate |
| WO2014203633A1 (en) * | 2013-06-17 | 2014-12-24 | 株式会社村田製作所 | Flexible cable and electronic apparatus |
| JPWO2014203633A1 (en) * | 2013-06-17 | 2017-02-23 | 株式会社村田製作所 | Capacitors and electronic devices |
| US9847171B2 (en) | 2013-06-17 | 2017-12-19 | Murata Manufacturing Co., Ltd. | Flexible cable and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP4078723B2 (en) | 2008-04-23 |
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