IT8168596A0 - Elemento di sopporto per un modulo di circuito integrato - Google Patents
Elemento di sopporto per un modulo di circuito integratoInfo
- Publication number
- IT8168596A0 IT8168596A0 IT8168596A IT6859681A IT8168596A0 IT 8168596 A0 IT8168596 A0 IT 8168596A0 IT 8168596 A IT8168596 A IT 8168596A IT 6859681 A IT6859681 A IT 6859681A IT 8168596 A0 IT8168596 A0 IT 8168596A0
- Authority
- IT
- Italy
- Prior art keywords
- integrated circuit
- support element
- circuit module
- module
- support
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
- H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/86—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using tape automated bonding [TAB]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01005—Boron [B]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01006—Carbon [C]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01013—Aluminum [Al]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/0102—Calcium [Ca]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01033—Arsenic [As]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01042—Molybdenum [Mo]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01058—Cerium [Ce]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01074—Tungsten [W]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01075—Rhenium [Re]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01082—Lead [Pb]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10S283/00—Printed matter
- Y10S283/904—Credit card
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49121—Beam lead frame or beam lead device
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/12—All metal or with adjacent metals
- Y10T428/12361—All metal or with adjacent metals having aperture or cut
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Wire Bonding (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE3046193 | 1980-12-08 | ||
DE3123198A DE3123198C2 (de) | 1980-12-08 | 1981-06-11 | Trägerelemente für einen IC-Baustein |
Publications (2)
Publication Number | Publication Date |
---|---|
IT8168596A0 true IT8168596A0 (it) | 1981-12-07 |
IT1145229B IT1145229B (it) | 1986-11-05 |
Family
ID=25789585
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IT68596/81A IT1145229B (it) | 1980-12-08 | 1981-12-07 | Elemento di sopporto per un modulo di circuito integrato |
Country Status (9)
Country | Link |
---|---|
US (1) | US4460825A (it) |
JP (1) | JPH054479A (it) |
CH (1) | CH654143A5 (it) |
DE (1) | DE3123198C2 (it) |
FR (1) | FR2495839B1 (it) |
GB (2) | GB2090466B (it) |
IT (1) | IT1145229B (it) |
NL (1) | NL8105344A (it) |
SE (1) | SE458244B (it) |
Families Citing this family (78)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3019207A1 (de) * | 1980-05-20 | 1981-11-26 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Traegerelement fuer einen ic-chip |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
FR2521350B1 (fr) * | 1982-02-05 | 1986-01-24 | Hitachi Ltd | Boitier porteur de puce semi-conductrice |
DE3235650A1 (de) * | 1982-09-27 | 1984-03-29 | Philips Patentverwaltung Gmbh, 2000 Hamburg | Informationskarte und verfahren zu ihrer herstellung |
DE3248385A1 (de) * | 1982-12-28 | 1984-06-28 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Ausweiskarte mit integriertem schaltkreis |
US4567545A (en) * | 1983-05-18 | 1986-01-28 | Mettler Rollin W Jun | Integrated circuit module and method of making same |
DE3338597A1 (de) * | 1983-10-24 | 1985-05-02 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
US4736520A (en) * | 1983-11-04 | 1988-04-12 | Control Data Corporation | Process for assembling integrated circuit packages |
FR2565408B1 (fr) * | 1984-05-30 | 1987-04-10 | Thomson Csf | Dispositif comportant une pastille de circuit integre surmontee d'une dalle isolante servant de boitier |
FR2579798B1 (fr) * | 1985-04-02 | 1990-09-28 | Ebauchesfabrik Eta Ag | Procede de fabrication de modules electroniques pour cartes a microcircuits et modules obtenus selon ce procede |
FR2590051B1 (fr) * | 1985-11-08 | 1991-05-17 | Eurotechnique Sa | Carte comportant un composant et micromodule a contacts de flanc |
US4870476A (en) * | 1986-02-13 | 1989-09-26 | Vtc Incorporated | Integrated circuit packaging process and structure |
JPS6394645A (ja) * | 1986-10-08 | 1988-04-25 | Mitsubishi Electric Corp | 電子装置 |
DE3639630A1 (de) * | 1986-11-20 | 1988-06-01 | Gao Ges Automation Org | Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben |
FR2620586A1 (fr) * | 1987-09-14 | 1989-03-17 | Em Microelectronic Marin Sa | Procede de fabrication de modules electroniques, notamment pour cartes a microcircuits |
EP0339763A3 (en) * | 1988-04-28 | 1990-04-25 | Citizen Watch Co. Ltd. | Ic card |
FR2634095A1 (fr) * | 1988-07-05 | 1990-01-12 | Bull Cp8 | Circuit imprime souple, notamment pour carte a microcircuits electroniques, et carte incorporant un tel circuit |
WO1990000813A1 (en) * | 1988-07-08 | 1990-01-25 | Oki Electric Industry Co., Ltd. | Semiconductor device |
US5276351A (en) * | 1988-10-17 | 1994-01-04 | Semiconductor Energy Laboratory Co., Ltd. | Electronic device and a manufacturing method for the same |
US5205036A (en) * | 1988-10-17 | 1993-04-27 | Semiconductor Energy Laboratory Co., Ltd. | Method of manufacturing a semiconductor device with selective coating on lead frame |
USRE35578E (en) * | 1988-12-12 | 1997-08-12 | Sgs-Thomson Microelectronics, Inc. | Method to install an electronic component and its electrical connections on a support, and product obtained thereby |
USRE35385E (en) * | 1988-12-12 | 1996-12-03 | Sgs-Thomson Microelectronics, Sa. | Method for fixing an electronic component and its contacts to a support |
EP0379624A1 (de) * | 1989-01-27 | 1990-08-01 | Siemens Aktiengesellschaft | Anordnung eines zur Oberflächenmontage geeigneten Halbleiterbauelementes und ein Verfahren zu dessen Oberflächenmontage auf Trägerplatten |
KR900015279A (ko) * | 1989-03-17 | 1990-10-26 | 도모마쓰 겡고 | 칩 캐리어 |
US5200362A (en) * | 1989-09-06 | 1993-04-06 | Motorola, Inc. | Method of attaching conductive traces to an encapsulated semiconductor die using a removable transfer film |
US20010030370A1 (en) * | 1990-09-24 | 2001-10-18 | Khandros Igor Y. | Microelectronic assembly having encapsulated wire bonding leads |
US5679977A (en) | 1990-09-24 | 1997-10-21 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5148265A (en) | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies with fan-in leads |
US7198969B1 (en) | 1990-09-24 | 2007-04-03 | Tessera, Inc. | Semiconductor chip assemblies, methods of making same and components for same |
US5148266A (en) * | 1990-09-24 | 1992-09-15 | Ist Associates, Inc. | Semiconductor chip assemblies having interposer and flexible lead |
DE4101790C1 (en) * | 1991-01-18 | 1992-07-09 | Technisch-Wissenschaftliche-Gesellschaft Thiede Und Partner Mbh, O-1530 Teltow, De | Chip-support arrangement prodn. - in tape form, in dual-in-line format by film-bond technology |
FR2673017A1 (fr) * | 1991-02-18 | 1992-08-21 | Schlumberger Ind Sa | Procede de fabrication d'un module electronique pour carte a memoire et module electronique ainsi obtenu. |
US5210375A (en) * | 1991-06-28 | 1993-05-11 | Vlsi Technology, Inc. | Electronic device package--carrier assembly ready to be mounted onto a substrate |
DE4142409A1 (de) * | 1991-12-20 | 1993-07-01 | Gao Ges Automation Org | Verfahren zum bedrucken von karten mit sacklochfoermiger aussparung und vorrichtung zur ausfuehrung des verfahrens |
DE4204459A1 (de) * | 1992-02-14 | 1993-08-19 | Siemens Nixdorf Inf Syst | Filmtraegermontierter integrierter baustein |
KR930024126A (ko) * | 1992-05-12 | 1993-12-22 | 아키라 기타하라 | 표면실장소자와 그의 반제품 |
US5255430A (en) * | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
ES2100701T5 (es) * | 1993-03-18 | 2002-03-01 | Nagraid Sa | Procedimiento de fabricacion de una tarjeta que comprende al menos un elemento electronico y tarjeta obtenida por tal procedimiento. |
KR950704758A (ko) * | 1993-10-18 | 1995-11-20 | 가나미야지 준 | IC 모듈과 그것을 사용한 데이터 커리어(Ic module using it on data carrier) |
DE4336501A1 (de) * | 1993-10-26 | 1995-04-27 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten mit elektronischen Modulen |
DE4344297A1 (de) * | 1993-12-23 | 1995-06-29 | Giesecke & Devrient Gmbh | Verfahren zur Herstellung von Ausweiskarten |
US5515992A (en) * | 1994-03-31 | 1996-05-14 | Cna Manufacturing Systems, Inc. | Pocket tape sealing and unsealing method and apparatus and improved pocket tape |
JP2606673B2 (ja) * | 1994-10-21 | 1997-05-07 | 松下電器産業株式会社 | 実装体 |
JP3127195B2 (ja) * | 1994-12-06 | 2001-01-22 | シャープ株式会社 | 発光デバイスおよびその製造方法 |
DE19549726B4 (de) * | 1994-12-06 | 2010-04-22 | Sharp K.K. | Lichtemittierendes Bauelement und Herstellverfahren für dieses |
DE19532755C1 (de) * | 1995-09-05 | 1997-02-20 | Siemens Ag | Chipmodul, insbesondere für den Einbau in Chipkarten, und Verfahren zur Herstellung eines derartigen Chipmoduls |
DE19535775C2 (de) * | 1995-09-26 | 2000-06-21 | Siemens Ag | Verfahren zum elektrischen Verbinden eines Kontaktfeldes eines Halbleiterchips mit zumindest einer Kontaktfläche sowie danach hergestellte Chipkarte |
US5817207A (en) | 1995-10-17 | 1998-10-06 | Leighton; Keith R. | Radio frequency identification card and hot lamination process for the manufacture of radio frequency identification cards |
US5703350A (en) * | 1995-10-31 | 1997-12-30 | Lucent Technologies Inc. | Data carriers having an integrated circuit unit |
DE19614501C2 (de) * | 1996-04-13 | 2000-11-16 | Curamik Electronics Gmbh | Verfahren zum Herstellen eines Keramik-Metall-Substrates sowie Keramik-Metall-Substrat |
DE19620025A1 (de) * | 1996-05-17 | 1997-11-20 | Siemens Ag | Trägerelement für einen Halbleiterchip |
WO1997044823A1 (de) | 1996-05-17 | 1997-11-27 | Siemens Aktiengesellschaft | Trägerelement für einen halbleiterchip |
DE19635732A1 (de) * | 1996-09-03 | 1998-03-05 | Siemens Ag | Trägerelement für einen Halbleiterchip |
JPH09327990A (ja) * | 1996-06-11 | 1997-12-22 | Toshiba Corp | カード型記憶装置 |
KR100447035B1 (ko) * | 1996-11-21 | 2004-09-07 | 가부시키가이샤 히타치세이사쿠쇼 | 반도체 장치의 제조방법 |
KR100240748B1 (ko) * | 1996-12-30 | 2000-01-15 | 윤종용 | 기판을 갖는 반도체 칩 패키지와 그 제조 방법 및 그를 이용한적층 패키지 |
JPH1134553A (ja) * | 1997-07-18 | 1999-02-09 | Rohm Co Ltd | Icモジュール、およびその製造方法、ならびにこれを備えたicカード |
DE19745648A1 (de) * | 1997-10-15 | 1998-11-26 | Siemens Ag | Trägerelement für einen Halbleiterchip zum Einbau in Chipkarten |
EP0942392A3 (en) * | 1998-03-13 | 2000-10-18 | Kabushiki Kaisha Toshiba | Chip card |
WO1999048145A1 (fr) * | 1998-03-19 | 1999-09-23 | Hitachi, Ltd. | Dispositif a semi-conducteur, procede de fabrication et structure de montage associes |
FR2781298B1 (fr) * | 1998-07-20 | 2003-01-31 | St Microelectronics Sa | Procede de fabrication d'une carte a puce electronique et carte a puce electronique |
DE19858343A1 (de) * | 1998-12-17 | 2000-06-21 | Giesecke & Devrient Gmbh | Verfahren und Vorrichtung zum Herstellen von personalisierten Chipkarten |
FR2789505B1 (fr) * | 1999-02-08 | 2001-03-09 | Gemplus Card Int | Procede de fabrication de support de memorisation portable de type carte a puce |
JP2001084347A (ja) * | 1999-09-16 | 2001-03-30 | Toshiba Corp | カード型記憶装置及びその製造方法 |
JP3377001B2 (ja) * | 2000-08-31 | 2003-02-17 | セイコーエプソン株式会社 | 半導体装置及びその製造方法、回路基板並びに電子機器 |
DE10135572A1 (de) * | 2001-07-20 | 2003-02-13 | Infineon Technologies Ag | Löt- und klebbares Gehäuse für Chipmodul und Chipmodul |
JP3931330B2 (ja) * | 2001-09-14 | 2007-06-13 | ソニー株式会社 | 熱プレス用プレートおよびカード製造装置 |
KR20030076274A (ko) * | 2002-03-18 | 2003-09-26 | 도레 엔지니아린구 가부시키가이샤 | 비접촉 아이디 카드류 및 그 제조방법 |
CN100371948C (zh) * | 2002-10-15 | 2008-02-27 | 雅斯拓股份有限公司 | 用支承带制造数据载体的方法以及该方法中使用的支承带 |
US7242079B2 (en) * | 2002-10-15 | 2007-07-10 | Axalto S.A. | Method of manufacturing a data carrier |
KR100973286B1 (ko) * | 2003-06-27 | 2010-07-30 | 삼성테크윈 주식회사 | 스마트 카드 접촉 단자 및 이를 이용한 스마트 카드 |
DE102005044001B3 (de) | 2005-09-14 | 2007-04-12 | W.C. Heraeus Gmbh | Laminiertes Substrat für die Montage von elektronischen Bauteilen |
EP2824704A1 (fr) * | 2013-07-12 | 2015-01-14 | Gemalto SA | Module électronique et son procédé de fabrication |
GB2516234B (en) * | 2013-07-15 | 2016-03-23 | Novalia Ltd | Circuit sheet arrangement |
CN108617089B (zh) * | 2016-12-10 | 2020-12-22 | 宏启胜精密电子(秦皇岛)有限公司 | 内埋元件柔性电路板及其制造方法 |
CN106864819B (zh) * | 2017-04-25 | 2023-03-14 | 成都宏明双新科技股份有限公司 | 一种横梁自动包裹生产线及其方法 |
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DE1909480C2 (de) * | 1968-03-01 | 1984-10-11 | General Electric Co., Schenectady, N.Y. | Trägeranordnung und Verfahren zur elektrischen Kontaktierung von Halbleiterchips |
US3716439A (en) * | 1969-12-15 | 1973-02-13 | Omron Tateisi Electronics Co | Method of manufacturing cards |
US3611269A (en) * | 1970-03-19 | 1971-10-05 | Amp Inc | Electrical circuit assembly |
US3754070A (en) * | 1970-08-03 | 1973-08-21 | Motorola Inc | Flash free molding |
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
JPS50137445A (it) * | 1974-04-18 | 1975-10-31 | ||
US4089733A (en) * | 1975-09-12 | 1978-05-16 | Amp Incorporated | Method of forming complex shaped metal-plastic composite lead frames for IC packaging |
US4216577A (en) * | 1975-12-31 | 1980-08-12 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) | Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card |
FR2337381A1 (fr) * | 1975-12-31 | 1977-07-29 | Honeywell Bull Soc Ind | Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte |
US4222516A (en) * | 1975-12-31 | 1980-09-16 | Compagnie Internationale Pour L'informatique Cii-Honeywell Bull | Standardized information card |
US4064552A (en) * | 1976-02-03 | 1977-12-20 | Angelucci Thomas L | Multilayer flexible printed circuit tape |
US4079511A (en) * | 1976-07-30 | 1978-03-21 | Amp Incorporated | Method for packaging hermetically sealed integrated circuit chips on lead frames |
US4089575A (en) * | 1976-09-27 | 1978-05-16 | Amp Incorporated | Connector for connecting a circuit element to the surface of a substrate |
US4142287A (en) * | 1976-12-27 | 1979-03-06 | Amp Incorporated | Electrical devices such as watches and method of construction thereof |
FR2395609A1 (fr) * | 1977-06-24 | 1979-01-19 | Radiotechnique Compelec | Panneau generateur a cellules solaires noyees dans un stratifie et procede pour l'obtenir |
US4137546A (en) * | 1977-10-14 | 1979-01-30 | Plessey Incorporated | Stamped lead frame for semiconductor packages |
DE2840973A1 (de) * | 1978-09-20 | 1980-03-27 | Siemens Ag | Verfahren zur herstellung pruefbarer halbleiter-miniaturgehaeuse in bandform |
FR2439438A1 (fr) * | 1978-10-19 | 1980-05-16 | Cii Honeywell Bull | Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux |
US4195193A (en) * | 1979-02-23 | 1980-03-25 | Amp Incorporated | Lead frame and chip carrier housing |
JPS6041847B2 (ja) * | 1979-05-18 | 1985-09-19 | 松下電器産業株式会社 | チップ型電子部品の製造法 |
DE3036439C2 (de) * | 1980-09-26 | 1982-10-21 | Siemens AG, 1000 Berlin und 8000 München | Verfahren zur Herstellung eines Rückseitenkontaktes bei filmmontierten integrierten Schaltkreisen |
US4549247A (en) * | 1980-11-21 | 1985-10-22 | Gao Gesellschaft Fur Automation Und Organisation Mbh | Carrier element for IC-modules |
DE3123198C2 (de) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Trägerelemente für einen IC-Baustein |
GB2091036B (en) * | 1981-01-13 | 1985-06-26 | Int Computers Ltd | Integrated circuit carrier assembly |
DE3153768C2 (de) * | 1981-04-14 | 1995-11-09 | Gao Ges Automation Org | Ausweiskarte |
GB2103418B (en) * | 1981-06-18 | 1986-10-08 | Stanley Bracey | Packaging of electronics components |
-
1981
- 1981-06-11 DE DE3123198A patent/DE3123198C2/de not_active Expired - Fee Related
- 1981-11-26 NL NL8105344A patent/NL8105344A/nl active Search and Examination
- 1981-11-27 CH CH7592/81A patent/CH654143A5/de not_active IP Right Cessation
- 1981-12-04 SE SE8107263A patent/SE458244B/sv not_active IP Right Cessation
- 1981-12-07 FR FR8122849A patent/FR2495839B1/fr not_active Expired
- 1981-12-07 US US06/328,241 patent/US4460825A/en not_active Expired - Lifetime
- 1981-12-07 IT IT68596/81A patent/IT1145229B/it active
- 1981-12-08 GB GB8136948A patent/GB2090466B/en not_active Expired
-
1984
- 1984-05-25 GB GB08413463A patent/GB2140207B/en not_active Expired
-
1991
- 1991-05-10 JP JP3105556A patent/JPH054479A/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
GB2140207A (en) | 1984-11-21 |
US4460825A (en) | 1984-07-17 |
DE3123198A1 (de) | 1982-07-08 |
GB2090466B (en) | 1985-09-18 |
IT1145229B (it) | 1986-11-05 |
DE3123198C2 (de) | 1993-10-07 |
FR2495839B1 (fr) | 1986-12-12 |
SE458244B (sv) | 1989-03-06 |
CH654143A5 (de) | 1986-01-31 |
FR2495839A1 (fr) | 1982-06-11 |
GB2090466A (en) | 1982-07-07 |
GB8413463D0 (en) | 1984-07-04 |
GB2140207B (en) | 1985-09-18 |
SE8107263L (sv) | 1982-06-09 |
JPH0558920B2 (it) | 1993-08-27 |
NL8105344A (nl) | 1982-07-01 |
JPH054479A (ja) | 1993-01-14 |
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TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19931231 |