BR8107128A - Modulo de circuito integrado reparavel - Google Patents

Modulo de circuito integrado reparavel

Info

Publication number
BR8107128A
BR8107128A BR8107128A BR8107128A BR8107128A BR 8107128 A BR8107128 A BR 8107128A BR 8107128 A BR8107128 A BR 8107128A BR 8107128 A BR8107128 A BR 8107128A BR 8107128 A BR8107128 A BR 8107128A
Authority
BR
Brazil
Prior art keywords
integrated circuit
circuit module
repaired integrated
repaired
module
Prior art date
Application number
BR8107128A
Other languages
English (en)
Inventor
Daniel Marshall Andrews
Carl Edward Hoge
Original Assignee
Burroughs Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Burroughs Corp filed Critical Burroughs Corp
Publication of BR8107128A publication Critical patent/BR8107128A/pt

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Classifications

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    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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    • H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Die Bonding (AREA)
BR8107128A 1980-11-03 1981-11-03 Modulo de circuito integrado reparavel BR8107128A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US20334080A 1980-11-03 1980-11-03

Publications (1)

Publication Number Publication Date
BR8107128A true BR8107128A (pt) 1982-07-20

Family

ID=22753575

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8107128A BR8107128A (pt) 1980-11-03 1981-11-03 Modulo de circuito integrado reparavel

Country Status (3)

Country Link
EP (1) EP0051165A1 (pt)
JP (1) JPS57104234A (pt)
BR (1) BR8107128A (pt)

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CA1290676C (en) * 1987-03-30 1991-10-15 William Frank Graham Method for bonding integrated circuit chips
US5296074A (en) * 1987-03-30 1994-03-22 E. I. Du Pont De Nemours And Company Method for bonding small electronic components
EP0384704A3 (en) * 1989-02-21 1991-05-08 General Electric Company Die attach material and die attach process
US5225023A (en) * 1989-02-21 1993-07-06 General Electric Company High density interconnect thermoplastic die attach material and solvent die attach processing
US5032896A (en) * 1989-08-31 1991-07-16 Hughes Aircraft Company 3-D integrated circuit assembly employing discrete chips
US5372883A (en) * 1990-03-20 1994-12-13 Staystik, Inc. Die attach adhesive film, application method and devices incorporating the same
JP2927982B2 (ja) * 1991-03-18 1999-07-28 ジャパンゴアテックス株式会社 半導体装置
DE4225154A1 (de) * 1992-07-30 1994-02-03 Meyerhoff Dieter Chip-Modul
JP2707189B2 (ja) * 1992-08-26 1998-01-28 株式会社日立製作所 電子部品の基板からの取外し方法及び装置
KR0129119B1 (ko) * 1992-11-27 1998-04-07 모리시다 요이찌 반도체칩의 제거방법 및 제거장치
US5268048A (en) * 1992-12-10 1993-12-07 Hewlett-Packard Company Reworkable die attachment
DE4413529C2 (de) * 1994-04-15 1996-07-25 Tele Filter Tft Gmbh Verfahren zur Herstellung elektronischer Oberflächenwellenbauelemente sowie ein nach dem Verfahren hergestelltes elektronisches Bauelement
US6852814B2 (en) 1994-09-02 2005-02-08 Henkel Corporation Thermosetting resin compositions containing maleimide and/or vinyl compounds
US7645899B1 (en) 1994-09-02 2010-01-12 Henkel Corporation Vinyl compounds
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EP0051165A1 (en) 1982-05-12
JPS57104234A (en) 1982-06-29

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