GB2091036B - Integrated circuit carrier assembly - Google Patents
Integrated circuit carrier assemblyInfo
- Publication number
- GB2091036B GB2091036B GB8200520A GB8200520A GB2091036B GB 2091036 B GB2091036 B GB 2091036B GB 8200520 A GB8200520 A GB 8200520A GB 8200520 A GB8200520 A GB 8200520A GB 2091036 B GB2091036 B GB 2091036B
- Authority
- GB
- United Kingdom
- Prior art keywords
- integrated circuit
- carrier assembly
- circuit carrier
- assembly
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4821—Flat leads, e.g. lead frames with or without insulating supports
- H01L21/4842—Mechanical treatment, e.g. punching, cutting, deforming, cold welding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
- H05K7/1015—Plug-in assemblages of components, e.g. IC sockets having exterior leads
- H05K7/1023—Plug-in assemblages of components, e.g. IC sockets having exterior leads co-operating by abutting, e.g. flat pack
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10424—Frame holders
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/17—Post-manufacturing processes
- H05K2203/176—Removing, replacing or disconnecting component; Easily removable component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/301—Assembling printed circuits with electric components, e.g. with resistor by means of a mounting structure
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8200520A GB2091036B (en) | 1981-01-13 | 1982-01-08 | Integrated circuit carrier assembly |
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
GB8100929 | 1981-01-13 | ||
GB8200520A GB2091036B (en) | 1981-01-13 | 1982-01-08 | Integrated circuit carrier assembly |
Publications (2)
Publication Number | Publication Date |
---|---|
GB2091036A GB2091036A (en) | 1982-07-21 |
GB2091036B true GB2091036B (en) | 1985-06-26 |
Family
ID=26278097
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB8200520A Expired GB2091036B (en) | 1981-01-13 | 1982-01-08 | Integrated circuit carrier assembly |
Country Status (1)
Country | Link |
---|---|
GB (1) | GB2091036B (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3123198C2 (en) * | 1980-12-08 | 1993-10-07 | Gao Ges Automation Org | Carrier elements for an IC chip |
US4417777A (en) * | 1981-10-13 | 1983-11-29 | Molex Incorporated | Integrated circuit carrier assembly |
US4504887A (en) * | 1983-04-01 | 1985-03-12 | Amp Incorporated | Leadless integrated circuit package housing having means for contact replacement |
US4638406A (en) * | 1984-10-04 | 1987-01-20 | Motorola, Inc. | Discrete component mounting assembly |
US4750089A (en) * | 1985-11-22 | 1988-06-07 | Texas Instruments Incorporated | Circuit board with a chip carrier and mounting structure connected to the chip carrier |
US5260601A (en) * | 1988-03-14 | 1993-11-09 | Texas Instruments Incorporated | Edge-mounted, surface-mount package for semiconductor integrated circuit devices |
JPH0677469B2 (en) * | 1988-12-28 | 1994-09-28 | 日本電気株式会社 | Multi-contact connector guide structure |
US6339191B1 (en) | 1994-03-11 | 2002-01-15 | Silicon Bandwidth Inc. | Prefabricated semiconductor chip carrier |
JPH10308268A (en) * | 1997-05-08 | 1998-11-17 | Enplas Corp | Socket for electrical component |
US6141869A (en) | 1998-10-26 | 2000-11-07 | Silicon Bandwidth, Inc. | Apparatus for and method of manufacturing a semiconductor die carrier |
DE102015111432A1 (en) * | 2015-07-15 | 2017-01-19 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Method for processing a mechatronic system for a commercial vehicle and a mechatronic system |
-
1982
- 1982-01-08 GB GB8200520A patent/GB2091036B/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
GB2091036A (en) | 1982-07-21 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
GB2107517B (en) | Integrated circuit carrier assembly | |
GB2101819B (en) | Integrated circuit carrier connector | |
DE3279013D1 (en) | Semiconductor integrated circuit | |
DE3278601D1 (en) | Carrier for integrated circuit | |
HK61886A (en) | Single piece carrier for integrated circuit devices | |
EP0058068A3 (en) | Integrated circuit chip carrier | |
GB8309726D0 (en) | Integrated circuit arrangement | |
GB2091459B (en) | Semiconductor integrated circuit | |
GB2095039B (en) | Circuit assembly | |
DE3272424D1 (en) | Semiconductor integrated circuit | |
GB2091036B (en) | Integrated circuit carrier assembly | |
DE3276405D1 (en) | Flip-flop circuit | |
GB8328605D0 (en) | Integrated circuit | |
GB2100543B (en) | Chatter-prevention circuit | |
GB2095033B (en) | Mounting integrated circuit packages | |
DE3275613D1 (en) | Semiconductor circuit | |
DE3272641D1 (en) | Carrier recovery circuit | |
DE3272570D1 (en) | Carrier recovery circuit | |
DE3264963D1 (en) | Semiconductor integrated circuit | |
DE3270070D1 (en) | Circuit arrangement with an integrated circuit | |
GB8326383D0 (en) | Electronic assembly | |
DE3273549D1 (en) | Restructurable integrated circuit | |
KR910006512B1 (en) | Integrated circuit | |
DE3277434D1 (en) | Reference time-detecting circuit | |
GB8517803D0 (en) | Circuit carrier assembly |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PCNP | Patent ceased through non-payment of renewal fee |
Effective date: 19930108 |