IT1394647B1 - Sistema di visione migliorato per l'allineamento di uno schema di stampa serigrafica - Google Patents
Sistema di visione migliorato per l'allineamento di uno schema di stampa serigraficaInfo
- Publication number
- IT1394647B1 IT1394647B1 ITUD2009A000119A ITUD20090119A IT1394647B1 IT 1394647 B1 IT1394647 B1 IT 1394647B1 IT UD2009A000119 A ITUD2009A000119 A IT UD2009A000119A IT UD20090119 A ITUD20090119 A IT UD20090119A IT 1394647 B1 IT1394647 B1 IT 1394647B1
- Authority
- IT
- Italy
- Prior art keywords
- alignment
- screen printing
- vision system
- improved vision
- printing scheme
- Prior art date
Links
- 238000007650 screen-printing Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/9501—Semiconductor wafers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
- H01L21/681—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment using optical controlling means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by at least one potential-jump barrier or surface barrier the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic System
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
- B41M1/00—Inking and printing with a printer's forme
- B41M1/12—Stencil printing; Silk-screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/248—Mechanical details, e.g. fixation holes, reinforcement or guiding means; Perforation lines; Ink holding means; Visually or otherwise detectable marking means; Stencil units
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Priority Applications (10)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000119A IT1394647B1 (it) | 2009-06-22 | 2009-06-22 | Sistema di visione migliorato per l'allineamento di uno schema di stampa serigrafica |
PCT/US2009/059453 WO2010068331A1 (en) | 2008-12-10 | 2009-10-02 | Enhanced vision system for screen printing pattern alignment |
US13/133,919 US8673679B2 (en) | 2008-12-10 | 2009-10-02 | Enhanced vision system for screen printing pattern alignment |
JP2011540726A JP5615837B2 (ja) | 2008-12-10 | 2009-10-02 | スクリーン印刷パターンの位置合せのための強化された視覚システム |
KR1020137019376A KR101445625B1 (ko) | 2008-12-10 | 2009-10-02 | 스크린 프린팅 패턴 정렬을 위한 향상된 비젼 시스템 |
EP09832274.6A EP2359410A4 (en) | 2008-12-10 | 2009-10-02 | IMPROVED VISIBILITY SYSTEM FOR ALIGNMENT OF SCREEN PRINT PATTERNS |
CN2009801499419A CN102318078B (zh) | 2008-12-10 | 2009-10-02 | 用于网版印刷图案对准的增强型检视*** |
KR1020117016082A KR20110105382A (ko) | 2008-12-10 | 2009-10-02 | 스크린 프린팅 패턴 정렬을 위한 향상된 비젼 시스템 |
TW099120279A TWI451585B (zh) | 2009-06-22 | 2010-06-22 | 用於網板印刷圖案對準之強化視覺系統 |
US13/282,219 US20120100666A1 (en) | 2008-12-10 | 2011-10-26 | Photoluminescence image for alignment of selective-emitter diffusions |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
ITUD2009A000119A IT1394647B1 (it) | 2009-06-22 | 2009-06-22 | Sistema di visione migliorato per l'allineamento di uno schema di stampa serigrafica |
Publications (2)
Publication Number | Publication Date |
---|---|
ITUD20090119A1 ITUD20090119A1 (it) | 2010-12-23 |
IT1394647B1 true IT1394647B1 (it) | 2012-07-05 |
Family
ID=42110952
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITUD2009A000119A IT1394647B1 (it) | 2008-12-10 | 2009-06-22 | Sistema di visione migliorato per l'allineamento di uno schema di stampa serigrafica |
Country Status (2)
Country | Link |
---|---|
IT (1) | IT1394647B1 (it) |
TW (1) | TWI451585B (it) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI476874B (zh) * | 2011-07-29 | 2015-03-11 | Hon Hai Prec Ind Co Ltd | 具有導電線路的玻璃板及其製造方法 |
TWI424584B (zh) * | 2011-11-30 | 2014-01-21 | Au Optronics Corp | 製作太陽能電池之方法 |
CN108674010A (zh) * | 2018-06-28 | 2018-10-19 | 无锡奥特维科技股份有限公司 | 丝网印刷设备、叠片机及丝网印刷方法 |
CN113905561B (zh) * | 2021-10-11 | 2023-02-24 | Oppo广东移动通信有限公司 | 具有纹理图案的壳体及其加工方法、电子设备 |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5709905A (en) * | 1997-01-28 | 1998-01-20 | Motorola, Inc. | Apparatus and method for automatic monitoring and control of stencil printing |
JPH10284359A (ja) * | 1997-04-11 | 1998-10-23 | Mitsubishi Electric Corp | ウエハの認識装置及びウエハの認識方法 |
JP4541560B2 (ja) * | 1999-02-08 | 2010-09-08 | キヤノン株式会社 | 電子デバイス、電子源及び画像形成装置の製造方法 |
DE10146879A1 (de) * | 2001-09-26 | 2003-04-17 | Thermosensorik Gmbh | Verfahren zum Nachweis und zur Lokalisierung von Rissen in Silizium-Solarzellen und Silizium-Scheiben |
JP3838911B2 (ja) * | 2001-12-25 | 2006-10-25 | 京セラ株式会社 | 太陽電池素子の製造方法 |
KR100700176B1 (ko) * | 2002-12-18 | 2007-03-27 | 엘지.필립스 엘시디 주식회사 | 액정 표시패널의 디스펜서 및 이를 이용한 노즐과 기판의갭 제어방법 |
US7171897B2 (en) * | 2003-06-05 | 2007-02-06 | Georgia Tech Research Corporation | System and methods for data-driven control of manufacturing processes |
JP2005011886A (ja) * | 2003-06-17 | 2005-01-13 | Sharp Corp | 太陽電池および太陽電池の製造方法 |
DE102005061785B4 (de) * | 2005-12-23 | 2008-04-03 | Basler Ag | Verfahren und Vorrichtung zum Erkennen von Rissen in Silizium-Wafern |
TWI401810B (zh) * | 2006-10-04 | 2013-07-11 | Gigastorage Corp | 太陽能電池 |
TW200818526A (en) * | 2006-10-04 | 2008-04-16 | Gigastorage Corp | Method for forming a solar cell |
JP2008139251A (ja) * | 2006-12-05 | 2008-06-19 | Toshiba Corp | イオン注入パターン検出方法 |
DE102007006525B4 (de) * | 2007-02-06 | 2009-05-14 | Basler Ag | Verfahren und Vorrichtung zur Detektierung von Defekten |
KR20080100057A (ko) * | 2007-05-11 | 2008-11-14 | 주성엔지니어링(주) | 결정질 실리콘 태양전지의 제조방법과 그 제조장치 및시스템 |
DE102007057011B4 (de) * | 2007-11-23 | 2011-04-28 | Pi Photovoltaik-Institut Berlin Ag | Erfassungsvorrichtung und Verfahren zum Erfassen einer Beschädigung einer Solarzelle mittels Photolumineszenz |
US8215473B2 (en) * | 2008-05-21 | 2012-07-10 | Applied Materials, Inc. | Next generation screen printing system |
US8309446B2 (en) * | 2008-07-16 | 2012-11-13 | Applied Materials, Inc. | Hybrid heterojunction solar cell fabrication using a doping layer mask |
-
2009
- 2009-06-22 IT ITUD2009A000119A patent/IT1394647B1/it active
-
2010
- 2010-06-22 TW TW099120279A patent/TWI451585B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
TW201121086A (en) | 2011-06-16 |
ITUD20090119A1 (it) | 2010-12-23 |
TWI451585B (zh) | 2014-09-01 |
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