IT1318545B1 - Cella di elettrolisi per il ripristino della concentrazione di ionimetallici in processi di elettrodeposizione. - Google Patents

Cella di elettrolisi per il ripristino della concentrazione di ionimetallici in processi di elettrodeposizione.

Info

Publication number
IT1318545B1
IT1318545B1 IT2000MI001207A ITMI20001207A IT1318545B1 IT 1318545 B1 IT1318545 B1 IT 1318545B1 IT 2000MI001207 A IT2000MI001207 A IT 2000MI001207A IT MI20001207 A ITMI20001207 A IT MI20001207A IT 1318545 B1 IT1318545 B1 IT 1318545B1
Authority
IT
Italy
Prior art keywords
ionimetallic
restoration
concentration
electrolysis cell
electrodeposition processes
Prior art date
Application number
IT2000MI001207A
Other languages
English (en)
Inventor
Ulderico Nevosi
Gian Nicola Martelli
Original Assignee
De Nora Elettrodi Spa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by De Nora Elettrodi Spa filed Critical De Nora Elettrodi Spa
Priority to IT2000MI001207A priority Critical patent/IT1318545B1/it
Publication of ITMI20001207A0 publication Critical patent/ITMI20001207A0/it
Priority to AU2001262326A priority patent/AU2001262326A1/en
Priority to PCT/EP2001/006161 priority patent/WO2001092604A2/en
Publication of ITMI20001207A1 publication Critical patent/ITMI20001207A1/it
Application granted granted Critical
Publication of IT1318545B1 publication Critical patent/IT1318545B1/it

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C25D21/14—Controlled addition of electrolyte components

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Automation & Control Theory (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electrolytic Production Of Non-Metals, Compounds, Apparatuses Therefor (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
IT2000MI001207A 2000-05-31 2000-05-31 Cella di elettrolisi per il ripristino della concentrazione di ionimetallici in processi di elettrodeposizione. IT1318545B1 (it)

Priority Applications (3)

Application Number Priority Date Filing Date Title
IT2000MI001207A IT1318545B1 (it) 2000-05-31 2000-05-31 Cella di elettrolisi per il ripristino della concentrazione di ionimetallici in processi di elettrodeposizione.
AU2001262326A AU2001262326A1 (en) 2000-05-31 2001-05-30 Electrolysis cell for restoring the concentration of metal ions in processes of electroplating
PCT/EP2001/006161 WO2001092604A2 (en) 2000-05-31 2001-05-30 Electrolysis cell for restoring the concentration of metal ions in processes of electroplating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT2000MI001207A IT1318545B1 (it) 2000-05-31 2000-05-31 Cella di elettrolisi per il ripristino della concentrazione di ionimetallici in processi di elettrodeposizione.

Publications (3)

Publication Number Publication Date
ITMI20001207A0 ITMI20001207A0 (it) 2000-05-31
ITMI20001207A1 ITMI20001207A1 (it) 2001-12-01
IT1318545B1 true IT1318545B1 (it) 2003-08-27

Family

ID=11445158

Family Applications (1)

Application Number Title Priority Date Filing Date
IT2000MI001207A IT1318545B1 (it) 2000-05-31 2000-05-31 Cella di elettrolisi per il ripristino della concentrazione di ionimetallici in processi di elettrodeposizione.

Country Status (3)

Country Link
AU (1) AU2001262326A1 (it)
IT (1) IT1318545B1 (it)
WO (1) WO2001092604A2 (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
ITMI20011374A1 (it) * 2001-06-29 2002-12-29 De Nora Elettrodi Spa Cella di elettrolisi per il ripristino della concentrazione di ioni metallici in processi di elettrodeposizione
DE102010044551A1 (de) * 2010-09-07 2012-03-08 Coventya Gmbh Anode sowie deren Verwendung in einem alkalischen Galvanikbad
CN104947173A (zh) * 2015-05-22 2015-09-30 北京中冶设备研究设计总院有限公司 一种提高连续电镀镍镀液pH值的装置与方法
CN104894633A (zh) * 2015-05-22 2015-09-09 北京中冶设备研究设计总院有限公司 一种连续电镀镍溶液供给装置
US9920448B2 (en) 2015-11-18 2018-03-20 Applied Materials, Inc. Inert anode electroplating processor and replenisher with anionic membranes
WO2020042870A1 (zh) * 2018-08-27 2020-03-05 叶涛 不溶性阳极酸性电镀铜的镀液生产和再生工艺及装置
US11339483B1 (en) 2021-04-05 2022-05-24 Alchemr, Inc. Water electrolyzers employing anion exchange membranes
CN113463156B (zh) * 2021-07-23 2022-09-20 中国科学院青海盐湖研究所 一种氢氧化镁膜层及其制备方法与***
WO2024078627A1 (zh) * 2022-10-14 2024-04-18 叶涛 一种结合电解溶铜的不溶性阳极镀铜工艺优化方法及装置

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2479856A1 (fr) * 1980-04-04 1981-10-09 Electricite De France Installation de traitement de surface par depot metallique et procede de regeneration des bains de depot metallique par voie electrolytique
JP2671013B2 (ja) * 1988-06-16 1997-10-29 ディップソール株式会社 アルカリ型のニッケル又はニッケル合金メッキにおけるニッケルイオンの供給方法
JPH0270087A (ja) * 1988-09-01 1990-03-08 Nippon Kinzoku Co Ltd 錫めっき方法および装置
JPH0826480B2 (ja) * 1989-03-28 1996-03-13 日本エレクトロプレイテイング・エンジニヤース株式会社 メッキ装置及びメッキ金属の補給方法
US5082538A (en) * 1991-01-09 1992-01-21 Eltech Systems Corporation Process for replenishing metals in aqueous electrolyte solutions
US5100517A (en) * 1991-04-08 1992-03-31 The Goodyear Tire & Rubber Company Process for applying a copper layer to steel wire
JPH04362199A (ja) * 1991-06-06 1992-12-15 Nec Corp 電気めっき装置
JPH05302199A (ja) * 1992-04-24 1993-11-16 Bridgestone Bekaert Steel Code Kk 不溶性陽極を用いた銅めっき法における銅めっき浴の組成制御方法
JPH06158397A (ja) * 1992-11-18 1994-06-07 Asahi Glass Co Ltd 金属の電気メッキ方法
US6365017B1 (en) * 1998-09-08 2002-04-02 Ebara Corporation Substrate plating device

Also Published As

Publication number Publication date
WO2001092604A2 (en) 2001-12-06
ITMI20001207A1 (it) 2001-12-01
ITMI20001207A0 (it) 2000-05-31
WO2001092604A3 (en) 2002-04-25
AU2001262326A1 (en) 2001-12-11

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