IT1313117B1 - Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di - Google Patents

Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di

Info

Publication number
IT1313117B1
IT1313117B1 IT1999MI001833A ITMI991833A IT1313117B1 IT 1313117 B1 IT1313117 B1 IT 1313117B1 IT 1999MI001833 A IT1999MI001833 A IT 1999MI001833A IT MI991833 A ITMI991833 A IT MI991833A IT 1313117 B1 IT1313117 B1 IT 1313117B1
Authority
IT
Italy
Prior art keywords
dry film
printed circuit
circuit board
vacuum
film resist
Prior art date
Application number
IT1999MI001833A
Other languages
English (en)
Inventor
R Charles Keil
Osvaldo Novello
Roberto Stanich
Original Assignee
Morton Int Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Morton Int Inc filed Critical Morton Int Inc
Publication of ITMI991833A0 publication Critical patent/ITMI991833A0/it
Priority to IT1999MI001833A priority Critical patent/IT1313117B1/it
Priority to DE60015035T priority patent/DE60015035T2/de
Priority to EP00306951A priority patent/EP1078735B1/en
Priority to AT00306951T priority patent/ATE280041T1/de
Priority to US09/648,428 priority patent/US6610459B1/en
Priority to CNB001316966A priority patent/CN1204458C/zh
Priority to KR1020000049687A priority patent/KR20010050220A/ko
Priority to TW089117255A priority patent/TW520623B/zh
Priority to JP2000256213A priority patent/JP2001171005A/ja
Priority to SG200004843A priority patent/SG101430A1/en
Publication of ITMI991833A1 publication Critical patent/ITMI991833A1/it
Application granted granted Critical
Publication of IT1313117B1 publication Critical patent/IT1313117B1/it
Priority to US10/316,316 priority patent/US6971429B2/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/14—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers
    • B32B37/16—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating
    • B32B37/18—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only
    • B32B37/182—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the properties of the layers with all layers existing as coherent layers before laminating involving the assembly of discrete sheets or panels only one or more of the layers being plastic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/0007—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding involving treatment or provisions in order to avoid deformation or air inclusion, e.g. to improve surface quality
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/16—Coating processes; Apparatus therefor
    • G03F7/161—Coating processes; Apparatus therefor using a previously coated surface, e.g. by stamping or by transfer lamination
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2309/00—Parameters for the laminating or treatment process; Apparatus details
    • B32B2309/60—In a particular environment
    • B32B2309/68—Vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/06—Lamination
    • H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/08—Treatments involving gases
    • H05K2203/085—Using vacuum or low pressure
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00—Stock material or miscellaneous articles
    • Y10S428/901—Printed circuit
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/17—Surface bonding means and/or assemblymeans with work feeding or handling means
    • Y10T156/1702—For plural parts or plural areas of single part
    • Y10T156/1744—Means bringing discrete articles into assembled relationship
    • Y10T156/1768—Means simultaneously conveying plural articles from a single source and serially presenting them to an assembly station

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Quality & Reliability (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Manufacturing Of Printed Circuit Boards (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Lining Or Joining Of Plastics Or The Like (AREA)
  • Packages (AREA)
  • Vacuum Packaging (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
IT1999MI001833A 1999-08-25 1999-08-25 Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di IT1313117B1 (it)

Priority Applications (11)

Application Number Priority Date Filing Date Title
IT1999MI001833A IT1313117B1 (it) 1999-08-25 1999-08-25 Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di
DE60015035T DE60015035T2 (de) 1999-08-25 2000-08-14 Vakuumlaminierungsvorrichtung mit Fördereinrichtung und Verfahren zum Aufbringen eines Trockenfilmresists auf eine Leiterplatte
EP00306951A EP1078735B1 (en) 1999-08-25 2000-08-14 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
AT00306951T ATE280041T1 (de) 1999-08-25 2000-08-14 Vakuumlaminierungsvorrichtung mit fördereinrichtung und verfahren zum aufbringen eines trockenfilmresists auf eine leiterplatte
KR1020000049687A KR20010050220A (ko) 1999-08-25 2000-08-25 컨베이어화된 진공 어플리케이터 및 인쇄 회로 기판에건조 필름 레지스트를 도포하는 방법
CNB001316966A CN1204458C (zh) 1999-08-25 2000-08-25 将光刻胶干膜层施加到印刷线路板或基片上的方法及设备
US09/648,428 US6610459B1 (en) 1999-08-25 2000-08-25 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board
TW089117255A TW520623B (en) 1999-08-25 2000-08-25 Method of applying a dry film resist to a printed circuit board and apparatus for the same
JP2000256213A JP2001171005A (ja) 1999-08-25 2000-08-25 真空ラミネート装置
SG200004843A SG101430A1 (en) 1999-08-25 2000-08-25 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit borad
US10/316,316 US6971429B2 (en) 1999-08-25 2002-12-11 Conveyorized vacuum applicator and method of applying a dry film resist to a printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT1999MI001833A IT1313117B1 (it) 1999-08-25 1999-08-25 Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di

Publications (3)

Publication Number Publication Date
ITMI991833A0 ITMI991833A0 (it) 1999-08-25
ITMI991833A1 ITMI991833A1 (it) 2001-02-25
IT1313117B1 true IT1313117B1 (it) 2002-06-17

Family

ID=11383558

Family Applications (1)

Application Number Title Priority Date Filing Date
IT1999MI001833A IT1313117B1 (it) 1999-08-25 1999-08-25 Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di

Country Status (10)

Country Link
US (2) US6610459B1 (it)
EP (1) EP1078735B1 (it)
JP (1) JP2001171005A (it)
KR (1) KR20010050220A (it)
CN (1) CN1204458C (it)
AT (1) ATE280041T1 (it)
DE (1) DE60015035T2 (it)
IT (1) IT1313117B1 (it)
SG (1) SG101430A1 (it)
TW (1) TW520623B (it)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1313117B1 (it) * 1999-08-25 2002-06-17 Morton Int Inc Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di
TW200604060A (en) 2004-06-11 2006-02-01 Assembleon Nv Component placement apparatus, component feeding apparatus and method
JP2006088511A (ja) * 2004-09-24 2006-04-06 Eco & Engineering Co Ltd ラミネート装置
CN101826496B (zh) * 2005-05-23 2015-03-18 揖斐电株式会社 印刷线路板及其制造方法
KR20070009760A (ko) * 2005-07-14 2007-01-19 삼성전자주식회사 액정표시장치의 제조장치와 액정표시장치의 제조방법
US7657994B2 (en) * 2005-10-19 2010-02-09 Delphi Technologies, Inc. Method for installing a switch pad
DE102008006390A1 (de) * 2008-01-28 2009-07-30 Tesa Ag Verfahren zur Verklebung von flexiblen Leiterplatten mit Polymermaterialien zur partiellen oder vollständigen Versteifung
US8151619B2 (en) * 2008-02-04 2012-04-10 Standard Lifters, Inc. Guided keeper assembly and method for metal forming dies
US20100195083A1 (en) * 2009-02-03 2010-08-05 Wkk Distribution, Ltd. Automatic substrate transport system
KR20120016193A (ko) 2009-05-20 2012-02-23 케이엘에이-텐코 코포레이션 태양 전지의 이송 시스템
DE102009035633A1 (de) * 2009-07-31 2011-02-03 Robert Bürkle GmbH Presse und Verfahren zum Ein- und Ausfördern von Werkstücken in die und aus der Presse
CN102196678A (zh) * 2010-03-05 2011-09-21 龙宇电子(深圳)有限公司 一种印刷电路板高铜厚厚芯板压合工艺
CN101840006A (zh) * 2010-05-27 2010-09-22 张家港和升数控机床制造有限公司 物料检测装置
JP5334135B2 (ja) 2010-08-20 2013-11-06 ニチゴー・モートン株式会社 積層装置
EP2626322A1 (en) 2012-02-10 2013-08-14 Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO A foil processing device
KR101382601B1 (ko) * 2012-07-02 2014-04-17 삼성디스플레이 주식회사 유기 발광 표시 장치의 제조 장치 및 그 방법
JP6065598B2 (ja) * 2013-01-17 2017-01-25 大日本印刷株式会社 フィルム貼り付け装置及びフィルム貼り付け方法
CN103974551B (zh) * 2014-03-31 2017-02-15 山东日发纺织机械有限公司 电路基板传送装置
JP6691757B2 (ja) * 2015-09-30 2020-05-13 理想科学工業株式会社 インクジェット印刷装置
CN105904722A (zh) * 2016-05-25 2016-08-31 安徽利华塑业科技有限公司 一种塑胶产品压合组装生产线
US10962889B2 (en) * 2018-11-27 2021-03-30 Applied Materials, Inc. Method and apparatus for high throughput photomask curing
CN109500873B (zh) * 2018-12-26 2024-02-20 广东沃德精密科技股份有限公司 膜片的切割定型机
JP7298864B2 (ja) * 2018-12-27 2023-06-27 株式会社 ベアック ラミネート基板製造装置、ラミネート基板製造ライン及びラミネート基板の製造方法
CN111276790A (zh) * 2020-03-31 2020-06-12 西安理工大学 一种提升丝网印刷rfid读写器天线性能的方法
CN113571442B (zh) * 2020-04-29 2023-09-29 长鑫存储技术有限公司 晶圆处理装置及晶圆传送方法
CN112977942B (zh) * 2021-04-30 2021-07-20 四川英创力电子科技股份有限公司 一种印制电路板边沿自动贴膜装置

Family Cites Families (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4127436A (en) * 1975-04-17 1978-11-28 E. I. Du Pont De Nemours And Company Vacuum laminating process
US4038542A (en) * 1975-07-21 1977-07-26 Bausch & Lomb Incorporated Luminaire for controlling locally unidirectional light
US4281922A (en) * 1978-11-14 1981-08-04 Fuji Photo Film Co., Ltd. Plate feeding apparatus for printing apparatus
US4659419A (en) * 1983-05-11 1987-04-21 Hakuto Co., Ltd. Laminator for sticking film sheet on panel surface
US4836649A (en) * 1985-07-12 1989-06-06 Hughes Aircraft Company Optical layout for a three light valve full-color projector employing a dual relay lens system and a single projection lens
US4647966A (en) * 1985-11-22 1987-03-03 The United States Of America As Represented By The Secretary Of The Navy Stereoscopic three dimensional large screen liquid crystal display
US4889790A (en) 1988-02-26 1989-12-26 Morton Thiokol, Inc. Method of forming a conformable mask on a printed circuit board
US4992354A (en) 1988-02-26 1991-02-12 Morton International, Inc. Dry film photoresist for forming a conformable mask and method of application to a printed circuit board or the like
US5164284A (en) 1988-02-26 1992-11-17 Morton International, Inc. Method of application of a conforming mask to a printed circuit board
US5042921A (en) * 1988-10-25 1991-08-27 Casio Computer Co., Ltd. Liquid crystal display apparatus
US4927733A (en) * 1988-12-23 1990-05-22 E. I. Du Pont De Nemours And Company Conformation of vacuum - laminated solder mask coated printed circuit boards by fluid pressurizing
US4946524A (en) 1989-03-02 1990-08-07 Morton International, Inc. Applicator and method for applying dry film solder mask on a board
EP0392226A1 (en) * 1989-03-23 1990-10-17 Mitsubishi Gas Chemical Company, Inc. Vacuum, continuous batch process for producing laminates and apparatus for such process
DE69030537T2 (de) * 1989-07-20 1997-12-04 Sanyo Electric Co Flüssigkristallprojektor
JPH03179449A (ja) * 1989-12-08 1991-08-05 Hakutou Kk フイルムを基板にラミネートする方法およびラミネータ
KR930003307B1 (ko) * 1989-12-14 1993-04-24 주식회사 금성사 입체용 프로젝터
US5073830A (en) * 1990-01-09 1991-12-17 Greyhawk Systems, Inc. High-efficiency polarized light source
ATE162921T1 (de) * 1990-05-08 1998-02-15 Canon Kk Polarisationsumsetzungsapparat
JP2983253B2 (ja) * 1990-06-04 1999-11-29 伯東株式会社 真空ラミネータ
DE4018177A1 (de) * 1990-06-07 1991-12-12 Anger Electronic Gmbh Verfahren zum laminieren von platten und vorrichtung zur durchfuerhrung des verfahrens
US5115305A (en) * 1990-07-05 1992-05-19 Baur Thomas G Electrically addressable liquid crystal projection system with high efficiency and light output
DE4026802A1 (de) * 1990-08-24 1992-02-27 Anger Electronic Gmbh Vorrichtung zum kaschieren einer leiterplatte
US5387953A (en) * 1990-12-27 1995-02-07 Canon Kabushiki Kaisha Polarization illumination device and projector having the same
IT1250461B (it) * 1991-08-09 1995-04-07 Morton Int Inc Procedimento ed apparecchio per applicare in modo continuo in particolare maschere di saldatura su pannelli di circuiti stampati.
US5487218A (en) * 1994-11-21 1996-01-30 International Business Machines Corporation Method for making printed circuit boards with selectivity filled plated through holes
GB9507140D0 (en) * 1995-04-06 1995-05-31 Icg Ltd Platesetter
US5863447A (en) * 1997-04-08 1999-01-26 International Business Machines Corporation Method for providing a selective reference layer isolation technique for the production of printed circuit boards
JPH10315257A (ja) * 1997-05-22 1998-12-02 Meiki Co Ltd 真空積層装置および真空積層方法
IT1313118B1 (it) * 1999-08-25 2002-06-17 Morton Int Inc Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello
IT1313117B1 (it) * 1999-08-25 2002-06-17 Morton Int Inc Apparecchiatura di applicazione a vuoto dotata di mezzi trasportatorie procedimento per applicare un resist a film secco ad un pannello di

Also Published As

Publication number Publication date
US6610459B1 (en) 2003-08-26
CN1204458C (zh) 2005-06-01
CN1301994A (zh) 2001-07-04
ITMI991833A0 (it) 1999-08-25
ITMI991833A1 (it) 2001-02-25
US20030121604A1 (en) 2003-07-03
JP2001171005A (ja) 2001-06-26
EP1078735A2 (en) 2001-02-28
KR20010050220A (ko) 2001-06-15
EP1078735A3 (en) 2002-07-17
ATE280041T1 (de) 2004-11-15
DE60015035D1 (de) 2004-11-25
SG101430A1 (en) 2004-01-30
DE60015035T2 (de) 2006-03-16
EP1078735B1 (en) 2004-10-20
TW520623B (en) 2003-02-11
US6971429B2 (en) 2005-12-06

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