IT1255588B - COOLING DEVICE FOR ELECTRIC COMPONENTS - Google Patents
COOLING DEVICE FOR ELECTRIC COMPONENTSInfo
- Publication number
- IT1255588B IT1255588B ITMI922105A ITMI922105A IT1255588B IT 1255588 B IT1255588 B IT 1255588B IT MI922105 A ITMI922105 A IT MI922105A IT MI922105 A ITMI922105 A IT MI922105A IT 1255588 B IT1255588 B IT 1255588B
- Authority
- IT
- Italy
- Prior art keywords
- rows
- corrugation
- insert
- cooling device
- flow direction
- Prior art date
Links
- 238000001816 cooling Methods 0.000 title 1
- 229910001092 metal group alloy Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
- H05K7/20254—Cold plates transferring heat from heat source to coolant
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The cavity (34) is formed between two plate-shaped components (31,32), of which at least one is of light metal alloy. An insert (13) is in the form of a corrugated strip. Pref. the insert corrugations extend transversely to the flow direction, i.e. over part of the flow path in the flow direction. Several rows of such corrugation may be formed one behind the other with a preset offset between the rows. The corrugations may be rectangular or trapezoidal. There need not to be any spacing between the corrugation rows. USE/ADVANTAGE - For electric and electronic components, with simple design and high thermal transfer capacity.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE4131739A DE4131739C2 (en) | 1991-09-24 | 1991-09-24 | Cooling device for electrical components |
Publications (3)
Publication Number | Publication Date |
---|---|
ITMI922105A0 ITMI922105A0 (en) | 1992-09-11 |
ITMI922105A1 ITMI922105A1 (en) | 1994-03-11 |
IT1255588B true IT1255588B (en) | 1995-11-09 |
Family
ID=6441348
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
ITMI922105A IT1255588B (en) | 1991-09-24 | 1992-09-11 | COOLING DEVICE FOR ELECTRIC COMPONENTS |
Country Status (4)
Country | Link |
---|---|
CH (1) | CH685140A5 (en) |
DE (1) | DE4131739C2 (en) |
FR (1) | FR2681757B1 (en) |
IT (1) | IT1255588B (en) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4401607C2 (en) * | 1994-01-20 | 1997-04-10 | Siemens Ag | Cooling unit for power semiconductors |
DE4421025C2 (en) * | 1994-06-16 | 1999-09-09 | Abb Patent Gmbh | Heatsink with at least one cooling channel |
FR2747005B1 (en) * | 1996-03-26 | 1998-06-19 | Thomson Csf | MICROELECTRONIC PACKAGE WITH COOLING SYSTEM |
FR2748800A1 (en) * | 1996-05-15 | 1997-11-21 | Ferraz | Heat exchanger for electronic component and electric apparatus cooling |
US5983997A (en) * | 1996-10-17 | 1999-11-16 | Brazonics, Inc. | Cold plate having uniform pressure drop and uniform flow rate |
DE19704934B4 (en) * | 1997-02-10 | 2004-09-23 | Daimlerchrysler Ag | Cooling rail with two channels |
WO2000038488A1 (en) * | 1998-12-22 | 2000-06-29 | Otis Elevator Company | Liquid cooled elevator machine drive |
DE19911204B4 (en) * | 1999-03-13 | 2008-09-11 | Behr Gmbh & Co. Kg | Arrangement for cooling electronic components |
DE19911205A1 (en) * | 1999-03-13 | 2000-09-14 | Behr Gmbh & Co | Electronic components cooling device for integration with heat exchanger in motor vehicle, uses rubber layer to compensate for unevennesses of fins or plastic box, and avoids soldering of cooling fins |
DE60140837D1 (en) * | 2000-04-19 | 2010-02-04 | Thermal Form & Function Inc | Cooling plate with cooling fins with a vaporizing coolant |
JP2002098454A (en) | 2000-07-21 | 2002-04-05 | Mitsubishi Materials Corp | Liquid-cooled heat sink and its manufacturing method |
DE10051338A1 (en) * | 2000-10-17 | 2002-04-18 | Daimlerchrysler Rail Systems | Liquid-cooling device for high-power semiconductor module, has housing with cooling surface and enclosing a liquid-flowed space |
DE10102619A1 (en) * | 2001-01-20 | 2002-05-08 | Conti Temic Microelectronic | Power module for supplying electric motors has corrugated heat sink attached to underside of thick thermally conductive base |
DE10158387B4 (en) * | 2001-11-28 | 2017-01-19 | Modine Manufacturing Co. | Arrangement for cooling electrical components |
JP2005229033A (en) * | 2004-02-16 | 2005-08-25 | Hitachi Ltd | Liquid-cooled system and electronic apparatus having the same |
DE102005025381A1 (en) * | 2005-05-31 | 2006-12-07 | Behr Industry Gmbh & Co. Kg | Device for cooling electronic components |
DE102005034998B4 (en) * | 2005-07-27 | 2016-06-23 | Behr Industry Gmbh & Co. Kg | Method for producing a device for cooling electronic components and device for cooling electronic components |
WO2010020438A1 (en) * | 2008-08-22 | 2010-02-25 | Siemens Aktiengesellschaft | Cooling device |
DE202008013351U1 (en) | 2008-10-08 | 2010-03-25 | Autokühler GmbH & Co. KG | Heat exchanger network and thus equipped heat exchanger |
DE102009051864B4 (en) * | 2009-11-04 | 2023-07-13 | Dr. Ing. H.C. F. Porsche Aktiengesellschaft | Cooling device for electrical equipment |
DE102012006122A1 (en) | 2012-03-26 | 2013-09-26 | Thesys Gmbh | Heat transfer device i.e. heating and/or cooling plate, for maintaining moderate temperature of battery cells of lithium ion battery of vehicle, has gutter-shaped advance channels and return channels extended over entire length of cavity |
DE102012107684A1 (en) * | 2012-08-21 | 2014-02-27 | Autokühler GmbH & Co KG | Heat sink for at least one component to be cooled and method for producing a heat sink |
ITBO20130198A1 (en) * | 2013-05-03 | 2014-11-04 | Magneti Marelli Spa | LIQUID COOLING SYSTEM FOR AN ELECTRONIC COMPONENT AND RELATED PRODUCTION METHOD |
DE102014202293A1 (en) * | 2014-02-07 | 2015-08-13 | Siemens Aktiengesellschaft | heatsink |
EP3010321B1 (en) | 2014-10-14 | 2021-12-01 | Magneti Marelli S.p.A. | Liquid cooling system for an electronic component |
DE102018205568A1 (en) * | 2018-04-12 | 2019-10-17 | Volkswagen Aktiengesellschaft | Component with improved cooling performance and motor vehicle with at least one component |
DE102018208232A1 (en) * | 2018-05-24 | 2019-11-28 | Volkswagen Aktiengesellschaft | Component with a cooling effect optimized by an insert element and motor vehicle with at least one component |
DE102018209586A1 (en) * | 2018-06-14 | 2019-12-19 | Volkswagen Aktiengesellschaft | Electronic component with improved cooling performance and motor vehicle with at least one electronic component |
DE102019202425A1 (en) * | 2019-02-22 | 2020-10-22 | Volkswagen Aktiengesellschaft | Arrangement for uniform cooling of components and motor vehicle with at least one arrangement |
DE102022211794A1 (en) | 2022-11-08 | 2024-05-08 | Robert Bosch Gesellschaft mit beschränkter Haftung | Heat sink for cooling an electrical and/or electronic assembly |
Family Cites Families (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3261396A (en) * | 1963-11-13 | 1966-07-19 | Staver Co | Heat dissipator for electronic circuitry |
US3327776A (en) * | 1965-10-24 | 1967-06-27 | Trane Co | Heat exchanger |
SE337263B (en) * | 1969-03-24 | 1971-08-02 | Asea Ab | |
SE418223B (en) * | 1972-06-02 | 1981-05-11 | Aga Ab | VERMEVEXLARE |
US3833837A (en) * | 1973-07-20 | 1974-09-03 | B West | Modular cooling enclosure with expandable cooling cells |
US4027206A (en) * | 1975-01-27 | 1977-05-31 | L. H. Research | Electronic cooling chassis |
DE2640000C2 (en) * | 1976-09-04 | 1986-09-18 | Brown, Boveri & Cie Ag, 6800 Mannheim | Cylindrical cooling box with opposing inlet and outlet openings for liquid-cooled power semiconductor components and a method for producing the same |
CS191622B1 (en) * | 1977-05-04 | 1979-07-31 | Michal Pellant | Liquid operable cooler,especially for both-sidedly cooled semiconductor power elements |
DE2902771A1 (en) * | 1978-07-21 | 1980-01-31 | Bbc Brown Boveri & Cie | COOLING DEVICE FOR SEMICONDUCTOR COMPONENTS |
SU860176A1 (en) * | 1979-03-11 | 1981-08-30 | Предприятие П/Я А-7992 | Coolant,mainly for cooling semiconductor devices |
DE3026167A1 (en) * | 1980-07-10 | 1982-02-04 | Siemens AG, 1000 Berlin und 8000 München | Cylindrical shaped thyristor cooling can - has cooling medium circulating channels through heat exchange layers, having narrower central regions |
DE3133485A1 (en) * | 1980-09-15 | 1982-05-06 | Peter 2563 Ipsach Herren | LIQUID-COOLED ELECTRICAL ASSEMBLY |
DE8105233U1 (en) * | 1981-02-25 | 1981-08-13 | Steeb, Dieter Christian, 9050 Steinegg-Appenzell | "HEAT EXCHANGER WITH FLAT TUBES" |
DE8107890U1 (en) * | 1981-03-18 | 1981-08-20 | Klöckner-Humboldt-Deutz AG, 5000 Köln | HEAT EXCHANGER |
CS233062B1 (en) * | 1983-04-20 | 1985-02-14 | Vladimir Motycka | Liquid cooler for power semiconductor elements cooling |
EP0144579B1 (en) * | 1983-11-02 | 1987-10-14 | BBC Brown Boveri AG | Cooling body for the liquid cooling of power semiconductor devices |
DE3408771A1 (en) * | 1984-03-09 | 1985-09-12 | Siemens AG, 1000 Berlin und 8000 München | Cooling socket for an electrical component |
SU1243163A1 (en) * | 1984-11-05 | 1986-07-07 | Одесский ордена Трудового Красного Знамени политехнический институт | Radio-electronic unit module |
DE3504207C2 (en) * | 1985-02-07 | 1987-01-29 | Siemens AG, 1000 Berlin und 8000 München | Heat exchanger for an electronics cabinet |
DE8804742U1 (en) * | 1988-04-11 | 1988-06-09 | Siemens AG, 1000 Berlin und 8000 München | Heat sink with inserted filler piece for cooling an electrical component with a liquid cooling medium |
SU1624566A1 (en) * | 1989-02-14 | 1991-01-30 | Всесоюзный Научно-Исследовательский, Проектно-Конструкторский И Технологический Институт Силовых Полупроводниковых Устройств | Cooler for heavy duty semiconductor devices |
DE9100864U1 (en) * | 1991-01-25 | 1991-04-18 | Siemens AG, 8000 München | Liquid heat sink |
-
1991
- 1991-09-24 DE DE4131739A patent/DE4131739C2/en not_active Revoked
-
1992
- 1992-09-11 IT ITMI922105A patent/IT1255588B/en active IP Right Grant
- 1992-09-17 CH CH2929/92A patent/CH685140A5/en not_active IP Right Cessation
- 1992-09-22 FR FR9211251A patent/FR2681757B1/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2681757A1 (en) | 1993-03-26 |
CH685140A5 (en) | 1995-03-31 |
ITMI922105A0 (en) | 1992-09-11 |
FR2681757B1 (en) | 1994-11-25 |
DE4131739A1 (en) | 1993-04-01 |
DE4131739C2 (en) | 1996-12-19 |
ITMI922105A1 (en) | 1994-03-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
0001 | Granted | ||
TA | Fee payment date (situation as of event date), data collected since 19931001 |
Effective date: 19970926 |