IN2012DN05096A - - Google Patents
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- Publication number
- IN2012DN05096A IN2012DN05096A IN5096DEN2012A IN2012DN05096A IN 2012DN05096 A IN2012DN05096 A IN 2012DN05096A IN 5096DEN2012 A IN5096DEN2012 A IN 5096DEN2012A IN 2012DN05096 A IN2012DN05096 A IN 2012DN05096A
- Authority
- IN
- India
- Prior art keywords
- encapsulated
- circuit
- protective material
- protecting
- electrical
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B60—VEHICLES IN GENERAL
- B60R—VEHICLES, VEHICLE FITTINGS, OR VEHICLE PARTS, NOT OTHERWISE PROVIDED FOR
- B60R16/00—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for
- B60R16/02—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements
- B60R16/023—Electric or fluid circuits specially adapted for vehicles and not otherwise provided for; Arrangement of elements of electric or fluid circuits specially adapted for vehicles and not otherwise provided for electric constitutive elements for transmission of signals between vehicle parts or subsystems
- B60R16/0239—Electronic boxes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/065—Hermetically-sealed casings sealed by encapsulation, e.g. waterproof resin forming an integral casing, injection moulding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
- H05K5/069—Other details of the casing, e.g. wall structure, passage for a connector, a cable, a shaft
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
- H05K2203/1178—Means for venting or for letting gases escape
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
- H05K2203/1305—Moulding and encapsulation
- H05K2203/1316—Moulded encapsulation of mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
- Y10T29/49146—Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Casings For Electric Apparatus (AREA)
- Connection Or Junction Boxes (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE102009047681A DE102009047681A1 (de) | 2009-12-08 | 2009-12-08 | Schaltungsmodul und Verfahren zur Herstellung eines solchen Schaltungsmoduls |
PCT/EP2010/069072 WO2011070015A2 (de) | 2009-12-08 | 2010-12-07 | Schaltungsmodul und verfahren zur herstellung eines solchen schaltungsmoduls |
Publications (1)
Publication Number | Publication Date |
---|---|
IN2012DN05096A true IN2012DN05096A (xx) | 2015-10-09 |
Family
ID=43534330
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
IN5096DEN2012 IN2012DN05096A (xx) | 2009-12-08 | 2010-12-07 |
Country Status (8)
Country | Link |
---|---|
US (1) | US9462696B2 (xx) |
EP (1) | EP2510762B1 (xx) |
JP (1) | JP5638088B2 (xx) |
CN (1) | CN102668732B (xx) |
DE (1) | DE102009047681A1 (xx) |
ES (1) | ES2460625T3 (xx) |
IN (1) | IN2012DN05096A (xx) |
WO (1) | WO2011070015A2 (xx) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102015207310A1 (de) * | 2015-04-22 | 2016-10-27 | Zf Friedrichshafen Ag | Elektronikmodul und Verfahren zum Umkapseln desselben |
JP6598511B2 (ja) * | 2015-05-21 | 2019-10-30 | キヤノン株式会社 | 電源装置及び画像形成装置 |
JP6464984B2 (ja) * | 2015-10-13 | 2019-02-06 | 株式会社デンソー | 電子装置 |
DE102015225099A1 (de) * | 2015-12-14 | 2017-06-14 | Robert Bosch Gmbh | Elektronikmodul, insbesondere für Getriebesteuergerät, und Verfahren zum Fertigen eines solchen |
CN112557710A (zh) * | 2020-12-28 | 2021-03-26 | 武汉光迅科技股份有限公司 | 光器件的测试夹具及其测试装置 |
CN113711483B (zh) * | 2021-02-10 | 2022-10-21 | 英诺赛科(苏州)科技有限公司 | 高效高密度的基于GaN的功率转换器及其制造方法 |
US11916488B2 (en) * | 2021-02-10 | 2024-02-27 | Innoscience (Suzhou) Technology Co., Ltd. | High efficiency and high density GaN-based power converter |
US11916490B2 (en) | 2021-02-10 | 2024-02-27 | Innoscience (Suzhou) Technology Co., Ltd. | Multi-functional PCB for assembling GaN-based power converter |
US20220256700A1 (en) * | 2021-02-10 | 2022-08-11 | Innoscience (Suzhou) Technology Co., Ltd. | MULTI-FUNCTIONAL PCB FOR ASSEMBLING GaN-BASED POWER CONVERTER |
US11916005B2 (en) * | 2021-02-10 | 2024-02-27 | Innoscience (Suzhou) Technology Co., Ltd. | Multi-functional PCB for assembling GaN-based power converter and method for manufacturing the same |
US11916489B2 (en) * | 2021-02-10 | 2024-02-27 | Innoscience (Suzhou) Technology Co., Ltd. | High efficiency and high density GaN-based power converter |
Family Cites Families (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS62121514A (ja) | 1985-11-22 | 1987-06-02 | Mitsubishi Electric Corp | 数値制御装置の診断方式 |
JPS62121514U (xx) * | 1986-01-24 | 1987-08-01 | ||
US4814943A (en) * | 1986-06-04 | 1989-03-21 | Oki Electric Industry Co., Ltd. | Printed circuit devices using thermoplastic resin cover plate |
US5001548A (en) * | 1989-03-13 | 1991-03-19 | Coriolis Corporation | Multi-chip module cooling |
DE4129238A1 (de) * | 1991-09-03 | 1993-03-04 | Bosch Gmbh Robert | Elektrisches geraet, insbesondere schalt- und steuergeraet fuer kraftfahrzeuge |
US5473512A (en) * | 1993-12-16 | 1995-12-05 | At&T Corp. | Electronic device package having electronic device boonded, at a localized region thereof, to circuit board |
DE19626083C2 (de) * | 1996-06-28 | 2000-03-23 | Siemens Ag | Sensor-Bauelement |
FI963872A (fi) * | 1996-09-27 | 1998-03-28 | Jari Ruuttu | Suojaväline sähkölaitteen suojaamiseksi ympäristöolosuhteilta |
JP2001102714A (ja) | 1999-09-30 | 2001-04-13 | Yazaki Corp | 樹脂封止プリント配線基板 |
JP2001293752A (ja) | 2000-04-10 | 2001-10-23 | Denso Corp | 樹脂のインサート成形方法 |
US6366462B1 (en) * | 2000-07-18 | 2002-04-02 | International Business Machines Corporation | Electronic module with integral refrigerant evaporator assembly and control system therefore |
NL1016549C2 (nl) * | 2000-10-06 | 2002-04-10 | Stork Screens Bv | Werkwijze voor het vervaardigen van een tegen stoorstraling beschermde kaart met een gedrukte schakeling. |
US6900383B2 (en) * | 2001-03-19 | 2005-05-31 | Hewlett-Packard Development Company, L.P. | Board-level EMI shield that adheres to and conforms with printed circuit board component and board surfaces |
DE10252755A1 (de) | 2002-11-13 | 2004-05-27 | Robert Bosch Gmbh | Thermischer und mechanischer Schutz von diskreten Bauelementen in einem Schaltungsmodul |
JP5007562B2 (ja) | 2006-12-27 | 2012-08-22 | セイコーエプソン株式会社 | 時計用文字板の製造方法、時計用文字板および時計 |
CN201233037Y (zh) * | 2008-04-11 | 2009-05-06 | 浙江苏泊尔家电制造有限公司 | 一种防尘防虫防水防火的电磁炉 |
-
2009
- 2009-12-08 DE DE102009047681A patent/DE102009047681A1/de not_active Withdrawn
-
2010
- 2010-12-07 EP EP10790405.4A patent/EP2510762B1/de active Active
- 2010-12-07 US US13/514,549 patent/US9462696B2/en active Active
- 2010-12-07 IN IN5096DEN2012 patent/IN2012DN05096A/en unknown
- 2010-12-07 ES ES10790405.4T patent/ES2460625T3/es active Active
- 2010-12-07 CN CN201080055484.XA patent/CN102668732B/zh active Active
- 2010-12-07 JP JP2012542516A patent/JP5638088B2/ja active Active
- 2010-12-07 WO PCT/EP2010/069072 patent/WO2011070015A2/de active Application Filing
Also Published As
Publication number | Publication date |
---|---|
DE102009047681A1 (de) | 2011-06-09 |
CN102668732A (zh) | 2012-09-12 |
EP2510762B1 (de) | 2014-02-26 |
WO2011070015A2 (de) | 2011-06-16 |
JP2013513247A (ja) | 2013-04-18 |
ES2460625T3 (es) | 2014-05-14 |
WO2011070015A3 (de) | 2011-10-13 |
US9462696B2 (en) | 2016-10-04 |
US20130208433A1 (en) | 2013-08-15 |
JP5638088B2 (ja) | 2014-12-10 |
EP2510762A2 (de) | 2012-10-17 |
CN102668732B (zh) | 2015-06-17 |
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