HUP0301858A2 - Ólommentes forrasztóanyagok - Google Patents

Ólommentes forrasztóanyagok

Info

Publication number
HUP0301858A2
HUP0301858A2 HU0301858A HUP0301858A HUP0301858A2 HU P0301858 A2 HUP0301858 A2 HU P0301858A2 HU 0301858 A HU0301858 A HU 0301858A HU P0301858 A HUP0301858 A HU P0301858A HU P0301858 A2 HUP0301858 A2 HU P0301858A2
Authority
HU
Hungary
Prior art keywords
lead
free solders
bismuth
antimony
indium
Prior art date
Application number
HU0301858A
Other languages
English (en)
Inventor
Zhenfeng Guo
Jennie S. Hwang
Alan Leonard Meddle
Original Assignee
Singapore Asahi Chemical And Solder Industries Pte. Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Singapore Asahi Chemical And Solder Industries Pte. Ltd. filed Critical Singapore Asahi Chemical And Solder Industries Pte. Ltd.
Publication of HUP0301858A2 publication Critical patent/HUP0301858A2/hu
Publication of HUP0301858A3 publication Critical patent/HUP0301858A3/hu
Publication of HU228577B1 publication Critical patent/HU228577B1/hu

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C13/00—Alloys based on tin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
    • B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
    • B23K35/24—Selection of soldering or welding materials proper
    • B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
    • B23K35/262—Sn as the principal constituent

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Materials For Medical Uses (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Battery Electrode And Active Subsutance (AREA)
  • Organic Insulating Materials (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Ceramic Products (AREA)
  • Conductive Materials (AREA)

Abstract

A jelen találmányban leírásra kerül egy nagy szilárdságú, anyagkifáradásnak igen ellenálló, erősen nedvesítő, ólommentes forrasztóötvözet, mely hatékony mennyiségű ónt, rezet, ezüstöt, bizmutot,indiumot és antimont tartalmaz, és melynek olvadási hőmérséklete 175-215 °C értékek között van. Ó
HU0301858A 2000-11-16 2000-11-16 Lead-free solders HU228577B1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/GB2000/004365 WO2002040213A1 (en) 2000-11-16 2000-11-16 Lead-free solders

Publications (3)

Publication Number Publication Date
HUP0301858A2 true HUP0301858A2 (hu) 2003-08-28
HUP0301858A3 HUP0301858A3 (en) 2005-05-30
HU228577B1 HU228577B1 (en) 2013-04-29

Family

ID=9886311

Family Applications (1)

Application Number Title Priority Date Filing Date
HU0301858A HU228577B1 (en) 2000-11-16 2000-11-16 Lead-free solders

Country Status (14)

Country Link
EP (1) EP1333957B1 (hu)
AT (1) ATE293513T1 (hu)
AU (1) AU2001214037A1 (hu)
CY (1) CY1105145T1 (hu)
CZ (1) CZ297089B6 (hu)
DE (1) DE60019651T2 (hu)
DK (1) DK1333957T3 (hu)
ES (1) ES2241671T3 (hu)
HU (1) HU228577B1 (hu)
NO (1) NO333677B1 (hu)
PL (1) PL195528B1 (hu)
PT (1) PT1333957E (hu)
RU (1) RU2254971C2 (hu)
WO (1) WO2002040213A1 (hu)

Families Citing this family (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20050199323A1 (en) * 2004-03-15 2005-09-15 Nielson Daniel B. Reactive material enhanced munition compositions and projectiles containing same
USRE45899E1 (en) 2000-02-23 2016-02-23 Orbital Atk, Inc. Low temperature, extrudable, high density reactive materials
US7977420B2 (en) 2000-02-23 2011-07-12 Alliant Techsystems Inc. Reactive material compositions, shot shells including reactive materials, and a method of producing same
SG139507A1 (en) * 2001-07-09 2008-02-29 Quantum Chem Tech Singapore Improvements in or relating to solders
EP1465468B1 (en) * 2003-03-31 2007-11-14 SANYO ELECTRIC Co., Ltd. Metal mask and method of printing lead-free solder paste using same
US7459794B2 (en) 2003-08-26 2008-12-02 Tokuyama Corporation Substrate for device bonding, device bonded substrate, and method for producing same
FR2867469A1 (fr) * 2004-03-15 2005-09-16 Alliant Techsystems Inc Compositions reactives contenant un metal, et leur procede de production
CZ300575B6 (cs) * 2005-01-04 2009-06-17 Jeník@Jan Bezolovnatá pájka
EP2116807A2 (en) 2005-10-04 2009-11-11 Alliant Techsystems Inc. Reactive Material Enhanced Projectiles And Related Methods
CN101357421B (zh) * 2005-12-16 2010-12-29 浙江亚通焊材有限公司 无铅锡焊料
CN100453244C (zh) * 2005-12-16 2009-01-21 浙江亚通焊材有限公司 无铅锡焊料
WO2009011392A1 (ja) 2007-07-18 2009-01-22 Senju Metal Industry Co., Ltd. 車載電子回路用Ｉｎ入り鉛フリーはんだ
US7821130B2 (en) * 2008-03-31 2010-10-26 Infineon Technologies Ag Module including a rough solder joint
WO2010122764A1 (ja) 2009-04-20 2010-10-28 パナソニック株式会社 はんだ材料および電子部品接合体
EP2739431B1 (en) * 2011-08-02 2020-06-24 Alpha Assembly Solutions Inc. Solder compositions
JP2013252548A (ja) * 2012-06-08 2013-12-19 Nihon Almit Co Ltd 微細部品接合用のソルダペースト
CN103042315B (zh) * 2013-01-22 2015-05-27 马莒生 耐热耐湿低熔点无铅焊料合金
JP2015077601A (ja) * 2013-04-02 2015-04-23 千住金属工業株式会社 鉛フリーはんだ合金
KR20160147996A (ko) 2014-04-30 2016-12-23 가부시키가이샤 니혼슈페리어샤 무연솔더합금
CN105431253A (zh) 2014-06-24 2016-03-23 播磨化成株式会社 焊料合金、焊料组合物、钎焊膏以及电子线路基板
WO2016179358A1 (en) * 2015-05-05 2016-11-10 Indium Corporation High reliability lead-free solder alloys for harsh environment electronics applications
JP6135885B2 (ja) * 2015-05-19 2017-05-31 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
WO2016185674A1 (ja) * 2015-05-19 2016-11-24 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6745453B2 (ja) * 2016-05-18 2020-08-26 パナソニックＩｐマネジメント株式会社 はんだ合金およびそれを用いた実装構造体
JP6230737B1 (ja) * 2017-03-10 2017-11-15 株式会社タムラ製作所 鉛フリーはんだ合金、ソルダペースト及び電子回路基板
JP6397079B1 (ja) * 2017-04-07 2018-09-26 株式会社ケーヒン はんだ材料
CN109894768B (zh) * 2019-03-29 2021-06-18 东莞市千岛金属锡品有限公司 一种低温无铅合金焊料的制备方法

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1997009455A1 (en) * 1995-09-01 1997-03-13 Sarnoff Corporation Soldering composition
KR980006783A (ko) * 1996-05-13 1998-03-30 이. 힐러 윌리엄 저가의 위상 고정 모터 제어 방법 및 구조
JP3736819B2 (ja) * 1997-01-17 2006-01-18 株式会社豊田中央研究所 無鉛はんだ合金
WO1999004048A1 (en) * 1997-07-17 1999-01-28 Litton Systems, Inc. Tin-bismuth based lead-free solders
US5938862A (en) * 1998-04-03 1999-08-17 Delco Electronics Corporation Fatigue-resistant lead-free alloy
JP2000288772A (ja) * 1999-02-02 2000-10-17 Nippon Genma:Kk 無鉛はんだ

Also Published As

Publication number Publication date
NO333677B1 (no) 2013-08-05
NO20032185D0 (no) 2003-05-14
DK1333957T3 (da) 2005-06-20
RU2254971C2 (ru) 2005-06-27
DE60019651D1 (de) 2005-05-25
ATE293513T1 (de) 2005-05-15
HU228577B1 (en) 2013-04-29
ES2241671T3 (es) 2005-11-01
RU2003114304A (ru) 2005-01-20
CY1105145T1 (el) 2009-11-04
AU2001214037A1 (en) 2002-05-27
EP1333957B1 (en) 2005-04-20
PT1333957E (pt) 2005-09-30
PL195528B1 (pl) 2007-09-28
WO2002040213A1 (en) 2002-05-23
HUP0301858A3 (en) 2005-05-30
PL361336A1 (en) 2004-10-04
NO20032185L (no) 2003-05-14
CZ297089B6 (cs) 2006-09-13
EP1333957A1 (en) 2003-08-13
DE60019651T2 (de) 2005-09-22
CZ20031348A3 (cs) 2004-04-14

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