HUP0301858A2 - Ólommentes forrasztóanyagok - Google Patents
Ólommentes forrasztóanyagokInfo
- Publication number
- HUP0301858A2 HUP0301858A2 HU0301858A HUP0301858A HUP0301858A2 HU P0301858 A2 HUP0301858 A2 HU P0301858A2 HU 0301858 A HU0301858 A HU 0301858A HU P0301858 A HUP0301858 A HU P0301858A HU P0301858 A2 HUP0301858 A2 HU P0301858A2
- Authority
- HU
- Hungary
- Prior art keywords
- lead
- free solders
- bismuth
- antimony
- indium
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 abstract 1
- 229910045601 alloy Inorganic materials 0.000 abstract 1
- 239000000956 alloy Substances 0.000 abstract 1
- 229910052787 antimony Inorganic materials 0.000 abstract 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 abstract 1
- 229910052797 bismuth Inorganic materials 0.000 abstract 1
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 abstract 1
- 229910052802 copper Inorganic materials 0.000 abstract 1
- 239000010949 copper Substances 0.000 abstract 1
- 229910052738 indium Inorganic materials 0.000 abstract 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 230000008018 melting Effects 0.000 abstract 1
- 238000002844 melting Methods 0.000 abstract 1
- 229910052709 silver Inorganic materials 0.000 abstract 1
- 239000004332 silver Substances 0.000 abstract 1
- 229910052718 tin Inorganic materials 0.000 abstract 1
- 239000011135 tin Substances 0.000 abstract 1
- 238000009736 wetting Methods 0.000 abstract 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Materials For Medical Uses (AREA)
- Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
- Battery Electrode And Active Subsutance (AREA)
- Organic Insulating Materials (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Ceramic Products (AREA)
- Conductive Materials (AREA)
Abstract
A jelen találmányban leírásra kerül egy nagy szilárdságú, anyagkifáradásnak igen ellenálló, erősen nedvesítő, ólommentes forrasztóötvözet, mely hatékony mennyiségű ónt, rezet, ezüstöt, bizmutot,indiumot és antimont tartalmaz, és melynek olvadási hőmérséklete 175-215 °C értékek között van. Ó
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/GB2000/004365 WO2002040213A1 (en) | 2000-11-16 | 2000-11-16 | Lead-free solders |
Publications (3)
Publication Number | Publication Date |
---|---|
HUP0301858A2 true HUP0301858A2 (hu) | 2003-08-28 |
HUP0301858A3 HUP0301858A3 (en) | 2005-05-30 |
HU228577B1 HU228577B1 (en) | 2013-04-29 |
Family
ID=9886311
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HU0301858A HU228577B1 (en) | 2000-11-16 | 2000-11-16 | Lead-free solders |
Country Status (14)
Country | Link |
---|---|
EP (1) | EP1333957B1 (hu) |
AT (1) | ATE293513T1 (hu) |
AU (1) | AU2001214037A1 (hu) |
CY (1) | CY1105145T1 (hu) |
CZ (1) | CZ297089B6 (hu) |
DE (1) | DE60019651T2 (hu) |
DK (1) | DK1333957T3 (hu) |
ES (1) | ES2241671T3 (hu) |
HU (1) | HU228577B1 (hu) |
NO (1) | NO333677B1 (hu) |
PL (1) | PL195528B1 (hu) |
PT (1) | PT1333957E (hu) |
RU (1) | RU2254971C2 (hu) |
WO (1) | WO2002040213A1 (hu) |
Families Citing this family (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20050199323A1 (en) * | 2004-03-15 | 2005-09-15 | Nielson Daniel B. | Reactive material enhanced munition compositions and projectiles containing same |
USRE45899E1 (en) | 2000-02-23 | 2016-02-23 | Orbital Atk, Inc. | Low temperature, extrudable, high density reactive materials |
US7977420B2 (en) | 2000-02-23 | 2011-07-12 | Alliant Techsystems Inc. | Reactive material compositions, shot shells including reactive materials, and a method of producing same |
SG139507A1 (en) * | 2001-07-09 | 2008-02-29 | Quantum Chem Tech Singapore | Improvements in or relating to solders |
EP1465468B1 (en) * | 2003-03-31 | 2007-11-14 | SANYO ELECTRIC Co., Ltd. | Metal mask and method of printing lead-free solder paste using same |
US7459794B2 (en) | 2003-08-26 | 2008-12-02 | Tokuyama Corporation | Substrate for device bonding, device bonded substrate, and method for producing same |
FR2867469A1 (fr) * | 2004-03-15 | 2005-09-16 | Alliant Techsystems Inc | Compositions reactives contenant un metal, et leur procede de production |
CZ300575B6 (cs) * | 2005-01-04 | 2009-06-17 | Jeník@Jan | Bezolovnatá pájka |
EP2116807A2 (en) | 2005-10-04 | 2009-11-11 | Alliant Techsystems Inc. | Reactive Material Enhanced Projectiles And Related Methods |
CN101357421B (zh) * | 2005-12-16 | 2010-12-29 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
CN100453244C (zh) * | 2005-12-16 | 2009-01-21 | 浙江亚通焊材有限公司 | 无铅锡焊料 |
WO2009011392A1 (ja) | 2007-07-18 | 2009-01-22 | Senju Metal Industry Co., Ltd. | 車載電子回路用In入り鉛フリーはんだ |
US7821130B2 (en) * | 2008-03-31 | 2010-10-26 | Infineon Technologies Ag | Module including a rough solder joint |
WO2010122764A1 (ja) | 2009-04-20 | 2010-10-28 | パナソニック株式会社 | はんだ材料および電子部品接合体 |
EP2739431B1 (en) * | 2011-08-02 | 2020-06-24 | Alpha Assembly Solutions Inc. | Solder compositions |
JP2013252548A (ja) * | 2012-06-08 | 2013-12-19 | Nihon Almit Co Ltd | 微細部品接合用のソルダペースト |
CN103042315B (zh) * | 2013-01-22 | 2015-05-27 | 马莒生 | 耐热耐湿低熔点无铅焊料合金 |
JP2015077601A (ja) * | 2013-04-02 | 2015-04-23 | 千住金属工業株式会社 | 鉛フリーはんだ合金 |
KR20160147996A (ko) | 2014-04-30 | 2016-12-23 | 가부시키가이샤 니혼슈페리어샤 | 무연솔더합금 |
CN105431253A (zh) | 2014-06-24 | 2016-03-23 | 播磨化成株式会社 | 焊料合金、焊料组合物、钎焊膏以及电子线路基板 |
WO2016179358A1 (en) * | 2015-05-05 | 2016-11-10 | Indium Corporation | High reliability lead-free solder alloys for harsh environment electronics applications |
JP6135885B2 (ja) * | 2015-05-19 | 2017-05-31 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
WO2016185674A1 (ja) * | 2015-05-19 | 2016-11-24 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
JP6745453B2 (ja) * | 2016-05-18 | 2020-08-26 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた実装構造体 |
JP6230737B1 (ja) * | 2017-03-10 | 2017-11-15 | 株式会社タムラ製作所 | 鉛フリーはんだ合金、ソルダペースト及び電子回路基板 |
JP6397079B1 (ja) * | 2017-04-07 | 2018-09-26 | 株式会社ケーヒン | はんだ材料 |
CN109894768B (zh) * | 2019-03-29 | 2021-06-18 | 东莞市千岛金属锡品有限公司 | 一种低温无铅合金焊料的制备方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1997009455A1 (en) * | 1995-09-01 | 1997-03-13 | Sarnoff Corporation | Soldering composition |
KR980006783A (ko) * | 1996-05-13 | 1998-03-30 | 이. 힐러 윌리엄 | 저가의 위상 고정 모터 제어 방법 및 구조 |
JP3736819B2 (ja) * | 1997-01-17 | 2006-01-18 | 株式会社豊田中央研究所 | 無鉛はんだ合金 |
WO1999004048A1 (en) * | 1997-07-17 | 1999-01-28 | Litton Systems, Inc. | Tin-bismuth based lead-free solders |
US5938862A (en) * | 1998-04-03 | 1999-08-17 | Delco Electronics Corporation | Fatigue-resistant lead-free alloy |
JP2000288772A (ja) * | 1999-02-02 | 2000-10-17 | Nippon Genma:Kk | 無鉛はんだ |
-
2000
- 2000-11-16 DE DE60019651T patent/DE60019651T2/de not_active Expired - Lifetime
- 2000-11-16 AT AT00976153T patent/ATE293513T1/de active
- 2000-11-16 AU AU2001214037A patent/AU2001214037A1/en not_active Abandoned
- 2000-11-16 CZ CZ20031348A patent/CZ297089B6/cs not_active IP Right Cessation
- 2000-11-16 ES ES00976153T patent/ES2241671T3/es not_active Expired - Lifetime
- 2000-11-16 EP EP00976153A patent/EP1333957B1/en not_active Expired - Lifetime
- 2000-11-16 RU RU2003114304/02A patent/RU2254971C2/ru active
- 2000-11-16 DK DK00976153T patent/DK1333957T3/da active
- 2000-11-16 HU HU0301858A patent/HU228577B1/hu unknown
- 2000-11-16 WO PCT/GB2000/004365 patent/WO2002040213A1/en active IP Right Grant
- 2000-11-16 PL PL00361336A patent/PL195528B1/pl unknown
- 2000-11-16 PT PT00976153T patent/PT1333957E/pt unknown
-
2003
- 2003-05-14 NO NO20032185A patent/NO333677B1/no not_active IP Right Cessation
-
2005
- 2005-04-21 CY CY20051100509T patent/CY1105145T1/el unknown
Also Published As
Publication number | Publication date |
---|---|
NO333677B1 (no) | 2013-08-05 |
NO20032185D0 (no) | 2003-05-14 |
DK1333957T3 (da) | 2005-06-20 |
RU2254971C2 (ru) | 2005-06-27 |
DE60019651D1 (de) | 2005-05-25 |
ATE293513T1 (de) | 2005-05-15 |
HU228577B1 (en) | 2013-04-29 |
ES2241671T3 (es) | 2005-11-01 |
RU2003114304A (ru) | 2005-01-20 |
CY1105145T1 (el) | 2009-11-04 |
AU2001214037A1 (en) | 2002-05-27 |
EP1333957B1 (en) | 2005-04-20 |
PT1333957E (pt) | 2005-09-30 |
PL195528B1 (pl) | 2007-09-28 |
WO2002040213A1 (en) | 2002-05-23 |
HUP0301858A3 (en) | 2005-05-30 |
PL361336A1 (en) | 2004-10-04 |
NO20032185L (no) | 2003-05-14 |
CZ297089B6 (cs) | 2006-09-13 |
EP1333957A1 (en) | 2003-08-13 |
DE60019651T2 (de) | 2005-09-22 |
CZ20031348A3 (cs) | 2004-04-14 |
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