HK1247441A1 - 不具有裸片附接墊的引線載體結構和由此形成的封裝 - Google Patents
不具有裸片附接墊的引線載體結構和由此形成的封裝Info
- Publication number
- HK1247441A1 HK1247441A1 HK18106943.5A HK18106943A HK1247441A1 HK 1247441 A1 HK1247441 A1 HK 1247441A1 HK 18106943 A HK18106943 A HK 18106943A HK 1247441 A1 HK1247441 A1 HK 1247441A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- die attach
- carrier structure
- formed therefrom
- attach pads
- packages formed
- Prior art date
Links
Classifications
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- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00012—Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/146—Mixed devices
- H01L2924/1461—MEMS
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18165—Exposing the passive side of the semiconductor or solid-state body of a wire bonded chip
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/183—Connection portion, e.g. seal
- H01L2924/18301—Connection portion, e.g. seal being an anchoring portion, i.e. mechanical interlocking between the encapsulation resin and another package part
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/38—Effects and problems related to the device integration
- H01L2924/386—Wire effects
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Wire Bonding (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201562156488P | 2015-05-04 | 2015-05-04 | |
US201562156983P | 2015-05-05 | 2015-05-05 | |
PCT/US2016/030775 WO2016179278A1 (en) | 2015-05-04 | 2016-05-04 | Lead carrier structure and packages formed therefrom without die attach pads |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1247441A1 true HK1247441A1 (zh) | 2018-09-21 |
Family
ID=57218010
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK18106943.5A HK1247441A1 (zh) | 2015-05-04 | 2018-05-28 | 不具有裸片附接墊的引線載體結構和由此形成的封裝 |
Country Status (8)
Country | Link |
---|---|
US (1) | US20180047588A1 (zh) |
JP (1) | JP2018514947A (zh) |
KR (1) | KR20180002812A (zh) |
CN (1) | CN107912069A (zh) |
HK (1) | HK1247441A1 (zh) |
PH (1) | PH12017501998A1 (zh) |
TW (1) | TW201709456A (zh) |
WO (1) | WO2016179278A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102016112289B4 (de) * | 2016-07-05 | 2020-07-30 | Danfoss Silicon Power Gmbh | Leiterrahmen und Verfahren zur Herstellung desselben |
US10577130B1 (en) * | 2016-12-07 | 2020-03-03 | Space Systems/Loral, Llc | Flexible radio frequency converters for digital payloads |
US9978613B1 (en) * | 2017-03-07 | 2018-05-22 | Texas Instruments Incorporated | Method for making lead frames for integrated circuit packages |
TWI718947B (zh) * | 2020-05-13 | 2021-02-11 | 強茂股份有限公司 | 半導體封裝元件及其製造方法 |
US11562947B2 (en) | 2020-07-06 | 2023-01-24 | Panjit International Inc. | Semiconductor package having a conductive pad with an anchor flange |
CN112908862A (zh) * | 2021-01-22 | 2021-06-04 | 山东盛品电子技术有限公司 | 一种无上片胶固定的芯片背面裸露封装方法及芯片 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3668101B2 (ja) * | 2000-07-05 | 2005-07-06 | 三洋電機株式会社 | 半導体装置 |
KR100987376B1 (ko) * | 2003-08-27 | 2010-10-12 | 삼성에스디아이 주식회사 | 리튬전지용 결합제와 전극 및 이를 채용한 리튬전지 |
US7205178B2 (en) * | 2004-03-24 | 2007-04-17 | Freescale Semiconductor, Inc. | Land grid array packaged device and method of forming same |
US9324672B2 (en) * | 2009-08-21 | 2016-04-26 | Stats Chippac, Ltd. | Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package |
US7883991B1 (en) * | 2010-02-18 | 2011-02-08 | Taiwan Semiconductor Manufacturing Company, Ltd. | Temporary carrier bonding and detaching processes |
US8643165B2 (en) * | 2011-02-23 | 2014-02-04 | Texas Instruments Incorporated | Semiconductor device having agglomerate terminals |
WO2013022477A2 (en) * | 2011-08-11 | 2013-02-14 | Eoplex Limited | Lead carrier with multi-material print formed package components |
EP2657963B1 (en) * | 2012-04-24 | 2017-09-06 | Shin-Etsu Chemical Co., Ltd. | Wafer-trilayer adhesive layer-support composite, wafer support with trilayer adhesive layer for use in wafer processing, trilayer adhesive layer for use in wafer processing, method of manufacturing said composite and method of manufacturing a thin wafer using said composite |
WO2014037815A2 (en) * | 2012-09-07 | 2014-03-13 | Eoplex Limited | Lead carrier with print-formed terminal pads |
US9269623B2 (en) * | 2012-10-25 | 2016-02-23 | Rohm And Haas Electronic Materials Llc | Ephemeral bonding |
JP6033734B2 (ja) * | 2013-04-30 | 2016-11-30 | 日東電工株式会社 | フィルム状接着剤、ダイシングテープ一体型フィルム状接着剤、及び、半導体装置の製造方法 |
-
2016
- 2016-05-04 JP JP2017554508A patent/JP2018514947A/ja active Pending
- 2016-05-04 US US15/542,401 patent/US20180047588A1/en not_active Abandoned
- 2016-05-04 KR KR1020177035028A patent/KR20180002812A/ko unknown
- 2016-05-04 CN CN201680025500.8A patent/CN107912069A/zh active Pending
- 2016-05-04 TW TW105113795A patent/TW201709456A/zh unknown
- 2016-05-04 WO PCT/US2016/030775 patent/WO2016179278A1/en active Application Filing
-
2017
- 2017-11-02 PH PH12017501998A patent/PH12017501998A1/en unknown
-
2018
- 2018-05-28 HK HK18106943.5A patent/HK1247441A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
PH12017501998A1 (en) | 2018-03-26 |
JP2018514947A (ja) | 2018-06-07 |
TW201709456A (zh) | 2017-03-01 |
CN107912069A (zh) | 2018-04-13 |
US20180047588A1 (en) | 2018-02-15 |
KR20180002812A (ko) | 2018-01-08 |
WO2016179278A1 (en) | 2016-11-10 |
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