HK1219357A1 - 電子裝置及其製造方法 - Google Patents
電子裝置及其製造方法Info
- Publication number
- HK1219357A1 HK1219357A1 HK16107262.8A HK16107262A HK1219357A1 HK 1219357 A1 HK1219357 A1 HK 1219357A1 HK 16107262 A HK16107262 A HK 16107262A HK 1219357 A1 HK1219357 A1 HK 1219357A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- manufacturing
- electronic apparatus
- method therefor
- therefor
- electronic
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04B—TRANSMISSION
- H04B1/00—Details of transmission systems, not covered by a single one of groups H04B3/00 - H04B13/00; Details of transmission systems not characterised by the medium used for transmission
- H04B1/38—Transceivers, i.e. devices in which transmitter and receiver form a structural unit and in which at least one part is used for functions of transmitting and receiving
- H04B1/3827—Portable transceivers
- H04B1/3888—Arrangements for carrying or protecting transceivers
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W84/00—Network topologies
- H04W84/18—Self-organising networks, e.g. ad-hoc networks or sensor networks
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04W—WIRELESS COMMUNICATION NETWORKS
- H04W88/00—Devices specially adapted for wireless communication networks, e.g. terminals, base stations or access point devices
- H04W88/02—Terminal devices
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
- H05K1/116—Lands, clearance holes or other lay-out details concerning the surrounding of a via
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/04—Assemblies of printed circuits
- H05K2201/042—Stacked spaced PCBs; Planar parts of folded flexible circuits having mounted components in between or spaced from each other
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10189—Non-printed connector
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Signal Processing (AREA)
- Computer Networks & Wireless Communication (AREA)
- General Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Tests Of Electronic Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Combinations Of Printed Boards (AREA)
- Transceivers (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014221584A JP6383252B2 (ja) | 2014-10-30 | 2014-10-30 | 電子装置およびその製造方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1219357A1 true HK1219357A1 (zh) | 2017-03-31 |
Family
ID=55854367
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK16107262.8A HK1219357A1 (zh) | 2014-10-30 | 2016-06-22 | 電子裝置及其製造方法 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160128179A1 (zh) |
JP (1) | JP6383252B2 (zh) |
CN (1) | CN105577214A (zh) |
HK (1) | HK1219357A1 (zh) |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017104239A (ja) * | 2015-12-08 | 2017-06-15 | ルネサスエレクトロニクス株式会社 | 電子装置 |
US9825597B2 (en) | 2015-12-30 | 2017-11-21 | Skyworks Solutions, Inc. | Impedance transformation circuit for amplifier |
US10062670B2 (en) * | 2016-04-18 | 2018-08-28 | Skyworks Solutions, Inc. | Radio frequency system-in-package with stacked clocking crystal |
US10515924B2 (en) | 2017-03-10 | 2019-12-24 | Skyworks Solutions, Inc. | Radio frequency modules |
US11357103B1 (en) | 2020-01-21 | 2022-06-07 | Signetik, LLC | System-in-package cellular assembly |
CN112104202A (zh) * | 2020-02-27 | 2020-12-18 | 台达电子工业股份有限公司 | 电源模块 |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6477593B1 (en) * | 1998-06-11 | 2002-11-05 | Adaptec, Inc. | Stacked I/O bridge circuit assemblies having flexibly configurable connections |
US6431879B2 (en) * | 2000-02-10 | 2002-08-13 | Tyco Electronics Corporation | Printed circuit board connector |
US7102892B2 (en) * | 2000-03-13 | 2006-09-05 | Legacy Electronics, Inc. | Modular integrated circuit chip carrier |
JP4611010B2 (ja) * | 2004-12-10 | 2011-01-12 | 日立ビアメカニクス株式会社 | 多層回路基板の製造方法 |
US7848115B2 (en) * | 2006-10-26 | 2010-12-07 | Ici Networks, Llc | Systems for electrically connecting circuit board based electronic devices |
JP2012008817A (ja) * | 2010-06-25 | 2012-01-12 | Toshiba Corp | 半導体メモリカード |
TWM411098U (en) * | 2011-01-28 | 2011-09-01 | Chunghwa Picture Tubes Ltd | Circuit board assembly |
JP2013008880A (ja) * | 2011-06-24 | 2013-01-10 | Fujitsu Ltd | 積層回路基板の製造方法及び積層回路基板 |
JP6211776B2 (ja) * | 2012-03-27 | 2017-10-11 | ローム株式会社 | 無線通信モジュール、led照明装置、太陽光発電システム、自動作動システム、及び検知装置 |
JP2014187241A (ja) * | 2013-03-25 | 2014-10-02 | Seiko Epson Corp | 回路基板モジュール、印刷装置、回路基板モジュールの検査方法 |
JP2013167646A (ja) * | 2013-05-22 | 2013-08-29 | Olympus Corp | 積層実装構造体 |
-
2014
- 2014-10-30 JP JP2014221584A patent/JP6383252B2/ja active Active
-
2015
- 2015-10-08 US US14/878,107 patent/US20160128179A1/en not_active Abandoned
- 2015-10-30 CN CN201510728354.2A patent/CN105577214A/zh active Pending
-
2016
- 2016-06-22 HK HK16107262.8A patent/HK1219357A1/zh unknown
Also Published As
Publication number | Publication date |
---|---|
CN105577214A (zh) | 2016-05-11 |
JP6383252B2 (ja) | 2018-08-29 |
US20160128179A1 (en) | 2016-05-05 |
JP2016092072A (ja) | 2016-05-23 |
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