HK1096163A1 - Template replication method - Google Patents

Template replication method

Info

Publication number
HK1096163A1
HK1096163A1 HK07103468.0A HK07103468A HK1096163A1 HK 1096163 A1 HK1096163 A1 HK 1096163A1 HK 07103468 A HK07103468 A HK 07103468A HK 1096163 A1 HK1096163 A1 HK 1096163A1
Authority
HK
Hong Kong
Prior art keywords
template
replicas
replication method
template replication
pattern
Prior art date
Application number
HK07103468.0A
Other languages
English (en)
Inventor
Babak Heidari
Erik Bolmsjoe
Marc Beck
Original Assignee
Obducat Ab
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Obducat Ab filed Critical Obducat Ab
Publication of HK1096163A1 publication Critical patent/HK1096163A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y10/00—Nanotechnology for information processing, storage or transmission, e.g. quantum computing or single electron logic
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B82—NANOTECHNOLOGY
    • B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
    • B82Y40/00—Manufacture or treatment of nanostructures
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/0002—Lithographic processes using patterning methods other than those involving the exposure to radiation, e.g. by stamping

Landscapes

  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Nanotechnology (AREA)
  • Physics & Mathematics (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Mathematical Physics (AREA)
  • Theoretical Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Shaping Of Tube Ends By Bending Or Straightening (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Steroid Compounds (AREA)
  • Cosmetics (AREA)
  • Pharmaceuticals Containing Other Organic And Inorganic Compounds (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
  • Polyoxymethylene Polymers And Polymers With Carbon-To-Carbon Bonds (AREA)
  • Control Of Exposure In Printing And Copying (AREA)
  • Liquid Developers In Electrophotography (AREA)
HK07103468.0A 2005-06-10 2007-03-30 Template replication method HK1096163A1 (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
EP05105100A EP1731961B1 (en) 2005-06-10 2005-06-10 Template replication method

Publications (1)

Publication Number Publication Date
HK1096163A1 true HK1096163A1 (en) 2007-05-25

Family

ID=34977068

Family Applications (2)

Application Number Title Priority Date Filing Date
HK07103468.0A HK1096163A1 (en) 2005-06-10 2007-03-30 Template replication method
HK07104676.6A HK1098543A1 (en) 2005-06-10 2007-05-02 Imprint stamp comprising cyclic olefin copolymer

Family Applications After (1)

Application Number Title Priority Date Filing Date
HK07104676.6A HK1098543A1 (en) 2005-06-10 2007-05-02 Imprint stamp comprising cyclic olefin copolymer

Country Status (7)

Country Link
EP (1) EP1731961B1 (zh)
JP (1) JP5646692B2 (zh)
CN (1) CN1916759B (zh)
AT (1) ATE413631T1 (zh)
DE (1) DE602005010839D1 (zh)
ES (1) ES2315797T3 (zh)
HK (2) HK1096163A1 (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8608972B2 (en) 2006-12-05 2013-12-17 Nano Terra Inc. Method for patterning a surface
TW201418875A (zh) 2006-12-05 2014-05-16 Nano Terra Inc 用於圖案化表面的方法
WO2009032815A1 (en) * 2007-09-06 2009-03-12 3M Innovative Properties Company Tool for making microstructured articles
ES2326109B1 (es) * 2007-12-05 2010-06-25 Consejo Superior De Investigaciones Cientificas Microdispositivo de separacion y extraccion selectiva y no invasiva de particulas en suspensiones polidispersas, procedimiento de fabricacion y sus aplicaciones.
JP5107105B2 (ja) * 2008-03-12 2012-12-26 株式会社リコー インプリント方法
WO2011095217A1 (en) * 2010-02-05 2011-08-11 Obducat Ab Method and process for metallic stamp replication for large area nanopatterns
CN102183875B (zh) * 2011-05-09 2012-10-03 苏州光舵微纳科技有限公司 滚轮式紫外线软压印方法
WO2013161095A1 (ja) * 2012-04-26 2013-10-31 東レ株式会社 凹凸構造を有する結晶基板の製造方法
KR101761010B1 (ko) 2015-09-14 2017-07-25 한국과학기술원 나노전사 프린팅 방법 및 이를 이용하여 제작되는 sers 기판, sers 바이얼 및 sers 패치
US10507604B2 (en) 2014-10-29 2019-12-17 Korea Advanced Institute Of Science And Technology Nanotransfer printing method and surface-enhanced raman scattering substrate, surface-enhanced raman scattering vial and surface-enhanced raman scattering patch manufactured using the same
WO2016068538A1 (ko) * 2014-10-29 2016-05-06 한국과학기술원 나노전사 프린팅 방법 및 이를 이용하여 제작되는 sers 기판， sers 바이얼 및 sers 패치
JP6480803B2 (ja) * 2015-05-11 2019-03-13 俊行 阪本 型押し成型装置及びその方法
JP2019056025A (ja) 2017-09-19 2019-04-11 東芝メモリ株式会社 パターン形成材料及びパターン形成方法
US11448958B2 (en) * 2017-09-21 2022-09-20 Canon Kabushiki Kaisha System and method for controlling the placement of fluid resist droplets
JP2019149488A (ja) 2018-02-27 2019-09-05 東芝メモリ株式会社 テンプレート、テンプレートの製造方法および半導体装置の製造方法
CN111142329A (zh) * 2019-12-16 2020-05-12 合肥元旭创芯半导体科技有限公司 一种非破坏性的半导体材料sem监控方法
CN112979322B (zh) * 2021-02-20 2023-09-08 北京北方华创微电子装备有限公司 陶瓷件及其制作方法
CN113618090B (zh) * 2021-08-11 2022-06-07 吉林大学 一种微纳结构辊筒模具加工与压印成形机床及其控制方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB559072A (en) 1940-08-03 1944-02-02 Budd Edward G Mfg Co A method of making stamping dies
DD251847A1 (de) 1986-07-31 1987-11-25 Zeiss Jena Veb Carl Verfahren und anordnung zum bildvergleich
JPS63149116A (ja) * 1986-12-12 1988-06-21 Dainippon Ink & Chem Inc 注型成形品の製造方法
AU6752496A (en) 1995-07-28 1997-03-05 Ely Michael Rabani Pattern formation, replication, fabrication and devices thereby
JPH09330864A (ja) 1996-06-10 1997-12-22 Ge Yokogawa Medical Syst Ltd 複合圧電物質製造方法及び複合圧電物質製造用マスク
JP2000071257A (ja) * 1998-09-02 2000-03-07 Kuraray Co Ltd 成形品の製造方法
JP3991471B2 (ja) * 1998-10-01 2007-10-17 日本ゼオン株式会社 成形体の製造方法
DE10009246A1 (de) * 2000-02-28 2001-08-30 Mitsubishi Polyester Film Gmbh Weiße, biaxial orientierte und UV-stabilisierte Polyesterfolie mit Cycloolefinocopolymer (COC), Verfahren zu ihrer Herstellung und ihre Verwendung
JP4192414B2 (ja) * 2000-09-14 2008-12-10 凸版印刷株式会社 レンズシートの製造方法
US20030017424A1 (en) 2001-07-18 2003-01-23 Miri Park Method and apparatus for fabricating complex grating structures
US20030071016A1 (en) 2001-10-11 2003-04-17 Wu-Sheng Shih Patterned structure reproduction using nonsticking mold
JP2004039136A (ja) * 2002-07-04 2004-02-05 Pioneer Electronic Corp 光学多層記録媒体成形用透明スタンパおよび光学多層記録媒体の製造方法
US6887792B2 (en) * 2002-09-17 2005-05-03 Hewlett-Packard Development Company, L.P. Embossed mask lithography
CN100427222C (zh) * 2003-11-17 2008-10-22 财团法人工业技术研究院 以压印技术制作微电容式超声波换能器的方法

Also Published As

Publication number Publication date
JP5646692B2 (ja) 2014-12-24
JP2013233807A (ja) 2013-11-21
CN1916759B (zh) 2011-11-09
ES2315797T3 (es) 2009-04-01
EP1731961A1 (en) 2006-12-13
HK1098543A1 (en) 2007-07-20
CN1916759A (zh) 2007-02-21
DE602005010839D1 (de) 2008-12-18
EP1731961B1 (en) 2008-11-05
ATE413631T1 (de) 2008-11-15

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