HK1066275A1 - Sensor for a contact-free temperature measurement - Google Patents
Sensor for a contact-free temperature measurementInfo
- Publication number
- HK1066275A1 HK1066275A1 HK04109159.4A HK04109159A HK1066275A1 HK 1066275 A1 HK1066275 A1 HK 1066275A1 HK 04109159 A HK04109159 A HK 04109159A HK 1066275 A1 HK1066275 A1 HK 1066275A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- sensor
- contact
- temperature measurement
- free temperature
- free
- Prior art date
Links
- 238000009529 body temperature measurement Methods 0.000 title 1
- 239000002305 electric material Substances 0.000 abstract 1
- 239000012528 membrane Substances 0.000 abstract 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/0225—Shape of the cavity itself or of elements contained in or suspended over the cavity
- G01J5/024—Special manufacturing steps or sacrificial layers or layer structures
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/02—Constructional details
- G01J5/04—Casings
- G01J5/046—Materials; Selection of thermal materials
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/12—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using thermoelectric elements, e.g. thermocouples
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/10—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors
- G01J5/20—Radiation pyrometry, e.g. infrared or optical thermometry using electric radiation detectors using resistors, thermistors or semiconductors sensitive to radiation, e.g. photoconductive devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/30107—Inductance
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
- Radiation Pyrometers (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
- Thermistors And Varistors (AREA)
- Thermally Actuated Switches (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE10144343A DE10144343A1 (de) | 2001-09-10 | 2001-09-10 | Sensor zum berührugslosen Messen einer Temperatur |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1066275A1 true HK1066275A1 (en) | 2005-03-18 |
Family
ID=7698366
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04109159.4A HK1066275A1 (en) | 2001-09-10 | 2004-11-19 | Sensor for a contact-free temperature measurement |
Country Status (9)
Country | Link |
---|---|
US (1) | US20030118076A1 (xx) |
EP (2) | EP1296122B1 (xx) |
JP (1) | JP4377118B2 (xx) |
KR (1) | KR100870039B1 (xx) |
CN (1) | CN100408990C (xx) |
AT (1) | ATE352771T1 (xx) |
DE (2) | DE10144343A1 (xx) |
HK (1) | HK1066275A1 (xx) |
TW (1) | TWI225303B (xx) |
Families Citing this family (28)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2004045330A (ja) * | 2002-07-15 | 2004-02-12 | Ricoh Co Ltd | 非接触温度検知装置 |
TW555965B (en) * | 2002-10-07 | 2003-10-01 | Opto Tech Corp | Temperature measurement device |
DE10318501A1 (de) * | 2003-04-24 | 2005-01-05 | Robert Bosch Gmbh | Chipaufbau in einem Premold-Gehäuse |
DE10320357B4 (de) * | 2003-05-07 | 2010-05-12 | Perkinelmer Optoelectronics Gmbh & Co.Kg | Strahlungssensor, Wafer, Sensorarray und Sensormodul |
DE10321639A1 (de) * | 2003-05-13 | 2004-12-02 | Heimann Sensor Gmbh | Infrarotsensor mit optimierter Flächennutzung |
JP4673647B2 (ja) * | 2005-03-22 | 2011-04-20 | 出光興産株式会社 | 金属の表面温度測定装置 |
DE102008041131B4 (de) * | 2008-08-08 | 2020-07-30 | Robert Bosch Gmbh | Thermopile-Sensor zur Detektion von Infrarot-Strahlung |
DE102008041750A1 (de) * | 2008-09-02 | 2010-03-18 | Robert Bosch Gmbh | Thermisch entkoppeltes mikrostrukturiertes Referenzelement für Sensoren |
JP5644121B2 (ja) * | 2010-01-26 | 2014-12-24 | セイコーエプソン株式会社 | 熱型光検出器、熱型光検出装置、電子機器および熱型光検出器の製造方法 |
EP2558830A4 (en) * | 2010-04-14 | 2015-03-11 | Excelitas Technologies Singapore Pte Ltd | VERTICALLY STACKED HEATING COLUMN |
DE102011103818A1 (de) * | 2011-06-01 | 2012-12-06 | Meas Deutschland Gmbh | Infrarot-Sensoranordnung und deren Verwendung |
WO2013006701A1 (en) | 2011-07-05 | 2013-01-10 | Excelitas Technologies Led Solutions, Inc | Graphene-based thermopile |
WO2013125734A1 (en) * | 2012-02-24 | 2013-08-29 | Nec Corporation | Bolometer and manufacturing method thereof |
WO2013167874A1 (en) * | 2012-05-08 | 2013-11-14 | Cambridge Cmos Sensors Limited | Ir emitter and ndir sensor |
CN102798474B (zh) * | 2012-08-23 | 2014-02-19 | 江苏物联网研究发展中心 | 一种高性能mems热电堆红外探测器结构及其制备方法 |
GB2521474A (en) * | 2013-12-22 | 2015-06-24 | Melexis Technologies Nv | Infrared thermal sensor with beams having different widths |
ES2487590B1 (es) * | 2014-05-22 | 2015-06-02 | Universidad Politécnica De Valencia | Micro-generador termoeléctrico basado en contactos eléctricos pasantes |
CN104176699A (zh) * | 2014-07-18 | 2014-12-03 | 苏州能斯达电子科技有限公司 | 一种具有绝热沟槽的mems硅基微热板及其加工方法 |
JP6701553B2 (ja) * | 2016-01-06 | 2020-05-27 | ローム株式会社 | 孔を有する基板およびその製造方法ならびに赤外線センサおよびその製造方法 |
CN109313079A (zh) | 2016-06-21 | 2019-02-05 | 海曼传感器有限责任公司 | 用于测量温度和检测气体的热电堆红外单个传感器 |
TWI613429B (zh) * | 2016-08-16 | 2018-02-01 | 菱光科技股份有限公司 | 紅外線感測器高真空封裝結構及其方法 |
WO2018122148A1 (de) | 2016-12-30 | 2018-07-05 | Heimann Sensor Gmbh | Smd-fähiger thermopile infrarot sensor |
IT201700070601A1 (it) * | 2017-06-23 | 2018-12-23 | Laser Point S R L | Rilevatore veloce di radiazione elettromagnetica. |
IT201700070606A1 (it) * | 2017-06-23 | 2018-12-23 | Laser Point S R L | Rilevatore di radiazione elettromagnetica. |
CN110862063A (zh) * | 2018-08-28 | 2020-03-06 | 无锡华润上华科技有限公司 | 温度传感器制备方法及温度传感器 |
DE102020209534A1 (de) | 2020-07-29 | 2022-02-03 | Robert Bosch Gesellschaft mit beschränkter Haftung | Temperatursensor für ein chirurgisches Instrument und Verfahren zu seiner Herstellung |
JP2022165185A (ja) * | 2021-04-19 | 2022-10-31 | 国立大学法人 東京大学 | センサ素子及びセンサ装置 |
WO2023013148A1 (ja) * | 2021-08-03 | 2023-02-09 | 住友電気工業株式会社 | 光センサ |
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JP4147784B2 (ja) * | 2001-10-09 | 2008-09-10 | 富士通株式会社 | 角速度センサ |
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US20070045756A1 (en) * | 2002-09-04 | 2007-03-01 | Ying-Lan Chang | Nanoelectronic sensor with integral suspended micro-heater |
-
2001
- 2001-09-10 DE DE10144343A patent/DE10144343A1/de not_active Ceased
-
2002
- 2002-08-28 TW TW091119608A patent/TWI225303B/zh not_active IP Right Cessation
- 2002-09-02 DE DE50209329T patent/DE50209329D1/de not_active Expired - Lifetime
- 2002-09-02 EP EP02019184A patent/EP1296122B1/de not_active Revoked
- 2002-09-02 AT AT02019184T patent/ATE352771T1/de not_active IP Right Cessation
- 2002-09-02 EP EP07001421.2A patent/EP1801554B1/de not_active Expired - Fee Related
- 2002-09-10 CN CNB021316007A patent/CN100408990C/zh not_active Expired - Fee Related
- 2002-09-10 KR KR1020020054747A patent/KR100870039B1/ko not_active IP Right Cessation
- 2002-09-10 US US10/238,546 patent/US20030118076A1/en not_active Abandoned
- 2002-09-10 JP JP2002264813A patent/JP4377118B2/ja not_active Expired - Fee Related
-
2004
- 2004-11-19 HK HK04109159.4A patent/HK1066275A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP4377118B2 (ja) | 2009-12-02 |
KR20030022734A (ko) | 2003-03-17 |
DE50209329D1 (de) | 2007-03-15 |
EP1296122B1 (de) | 2007-01-24 |
EP1801554A2 (de) | 2007-06-27 |
CN100408990C (zh) | 2008-08-06 |
KR100870039B1 (ko) | 2008-11-21 |
CN1514215A (zh) | 2004-07-21 |
JP2003177064A (ja) | 2003-06-27 |
US20030118076A1 (en) | 2003-06-26 |
EP1296122A2 (de) | 2003-03-26 |
EP1296122A3 (de) | 2003-06-11 |
EP1801554B1 (de) | 2014-07-23 |
ATE352771T1 (de) | 2007-02-15 |
DE10144343A1 (de) | 2003-03-27 |
EP1801554A3 (de) | 2007-08-01 |
TWI225303B (en) | 2004-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PC | Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee) |
Effective date: 20160910 |