HK1061436A1 - Method of manufacturing an optical-electrical wiring board - Google Patents
Method of manufacturing an optical-electrical wiring boardInfo
- Publication number
- HK1061436A1 HK1061436A1 HK04102376A HK04102376A HK1061436A1 HK 1061436 A1 HK1061436 A1 HK 1061436A1 HK 04102376 A HK04102376 A HK 04102376A HK 04102376 A HK04102376 A HK 04102376A HK 1061436 A1 HK1061436 A1 HK 1061436A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- optical
- manufacturing
- wiring board
- electrical wiring
- electrical
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/4214—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical element having redirecting reflective means, e.g. mirrors, prisms for deflecting the radiation from horizontal to down- or upward direction toward a device
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/10—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
- G02B6/12—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
- G02B6/13—Integrated optical circuits characterised by the manufacturing method
- G02B6/138—Integrated optical circuits characterised by the manufacturing method by using polymerisation
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0274—Optical details, e.g. printed circuits comprising integral optical means
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
- G02B6/4232—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements using the surface tension of fluid solder to align the elements, e.g. solder bump techniques
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4274—Electrical aspects
- G02B6/428—Electrical aspects containing printed circuit boards [PCB]
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/43—Arrangements comprising a plurality of opto-electronic elements and associated optical interconnections
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optical Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17964699 | 1999-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1061436A1 true HK1061436A1 (en) | 2004-09-17 |
Family
ID=16069419
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK04102376A HK1061436A1 (en) | 1999-06-25 | 2004-03-31 | Method of manufacturing an optical-electrical wiring board |
Country Status (9)
Country | Link |
---|---|
US (1) | US6804423B2 (xx) |
EP (2) | EP1359441B1 (xx) |
JP (1) | JP4457545B2 (xx) |
KR (1) | KR100720854B1 (xx) |
CA (1) | CA2377951C (xx) |
DE (1) | DE60022558T2 (xx) |
HK (1) | HK1061436A1 (xx) |
TW (1) | TW451084B (xx) |
WO (1) | WO2001001176A1 (xx) |
Families Citing this family (64)
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US6706546B2 (en) * | 1998-10-09 | 2004-03-16 | Fujitsu Limited | Optical reflective structures and method for making |
DE10132794A1 (de) * | 2001-07-06 | 2003-01-30 | Siemens Ag | Kopplung an in Leiterplatten eingebettete Lichtleiter |
JP3768901B2 (ja) * | 2002-02-28 | 2006-04-19 | 松下電器産業株式会社 | 立体光導波路の製造方法 |
JP3883901B2 (ja) * | 2002-04-23 | 2007-02-21 | 三菱電機株式会社 | 光路変換デバイスおよびその製造方法 |
US7418174B2 (en) * | 2002-04-26 | 2008-08-26 | Ibiden Co., Ltd. | Optical transmission structural body, optical waveguide, optical waveguide formation method, and optical wiring connection body |
JP4539031B2 (ja) * | 2002-05-28 | 2010-09-08 | パナソニック電工株式会社 | 光電気混載基板の製造方法 |
AU2003241784A1 (en) * | 2002-05-28 | 2003-12-12 | Matsushita Electric Works, Ltd. | Material for substrate mounting optical circuit-electric circuit mixedly and substrate mounting optical circuit-electric circuit mixedly |
JP3848210B2 (ja) * | 2002-05-29 | 2006-11-22 | キヤノン株式会社 | 電子回路基板 |
KR100483622B1 (ko) | 2002-08-16 | 2005-04-19 | 삼성전기주식회사 | 광도파로 소자를 인쇄회로기판에 부착하는 방법 |
GB0225018D0 (en) * | 2002-10-28 | 2002-12-04 | Terahertz Photonics Ltd | An optical board |
US7263248B2 (en) * | 2003-02-11 | 2007-08-28 | Avago Technologies Fiber Ip (Singapore) Pte. Ltd. | Optical via to pass signals through a printed circuit board |
JP4308684B2 (ja) * | 2003-04-04 | 2009-08-05 | 三井化学株式会社 | 光導波路素子およびその製造方法 |
US7324723B2 (en) * | 2003-10-06 | 2008-01-29 | Mitsui Chemicals, Inc. | Optical waveguide having specular surface formed by laser beam machining |
KR100528972B1 (ko) * | 2003-10-27 | 2005-11-16 | 한국전자통신연구원 | 테이퍼진 광도파로가 내장된 광 인쇄회로기판 시스템 |
KR100575951B1 (ko) * | 2003-11-11 | 2006-05-02 | 삼성전자주식회사 | 광 인쇄회로기판 집적형 광연결 패키징 장치 |
JP3887371B2 (ja) * | 2003-11-27 | 2007-02-28 | インターナショナル・ビジネス・マシーンズ・コーポレーション | 光伝送基板、光伝送基板製造方法、及び光電気集積回路 |
US7251393B2 (en) * | 2004-03-30 | 2007-07-31 | Lockheed Martin Corporation | Optical router |
US7263256B2 (en) * | 2004-04-02 | 2007-08-28 | Samsung Electronics Co., Ltd. | Optical connection block, optical module, and optical axis alignment method using the same |
DE102004028814A1 (de) * | 2004-06-15 | 2006-01-05 | Siemens Ag | Leiterplatte und Verfahren zum Herstellen einer Leiterplatte |
JP2006039391A (ja) * | 2004-07-29 | 2006-02-09 | Sony Corp | 光電子装置およびその製造方法 |
JP2006120956A (ja) * | 2004-10-22 | 2006-05-11 | Ibiden Co Ltd | 多層プリント配線板 |
TWI390264B (zh) * | 2004-11-17 | 2013-03-21 | Hitachi Chemical Co Ltd | A photoelectric hybrid circuit mounting substrate and a transfer device using the same |
US7603005B2 (en) | 2004-12-02 | 2009-10-13 | Mitsui Chemicals, Inc. | Optical circuit board and optical and electric combined board |
JP4468843B2 (ja) * | 2005-03-09 | 2010-05-26 | 日東電工株式会社 | 光導波路の製造方法 |
JP2006330697A (ja) * | 2005-04-25 | 2006-12-07 | Kyocera Corp | 光結合構造並びに光伝送機能内蔵基板およびその製造方法 |
US7856164B2 (en) | 2005-08-31 | 2010-12-21 | Mitsumi Electric Co., Ltd. | Waveguide device |
JP4277840B2 (ja) * | 2005-09-30 | 2009-06-10 | ミツミ電機株式会社 | 光導波路デバイスの製造方法 |
TWI306519B (en) | 2006-10-25 | 2009-02-21 | Ind Tech Res Inst | Optical-electrical circuit board |
JP5328095B2 (ja) * | 2006-10-27 | 2013-10-30 | 京セラ株式会社 | 光伝送基板、光電子混載基板、光モジュールおよび光電気回路システム |
JP5137393B2 (ja) * | 2006-12-19 | 2013-02-06 | 古河電気工業株式会社 | 光結合器 |
JP2008158440A (ja) * | 2006-12-26 | 2008-07-10 | Toshiba Corp | 光電気配線板及び光電気配線装置の製造方法 |
JP5018254B2 (ja) * | 2007-06-06 | 2012-09-05 | 日立電線株式会社 | ミラー付き光導波路及びその製造方法 |
TWI393509B (zh) * | 2007-07-04 | 2013-04-11 | Ind Tech Res Inst | 光電混載電路板及其製造方法 |
WO2009119850A1 (ja) * | 2008-03-27 | 2009-10-01 | 京セラ株式会社 | 複合光伝送基板および光モジュール |
JP5055193B2 (ja) | 2008-04-24 | 2012-10-24 | 日東電工株式会社 | 光電気混載基板の製造方法 |
US7672560B2 (en) * | 2008-05-13 | 2010-03-02 | International Business Machines Corporation | Coupling device for use in optical waveguides |
JP4971248B2 (ja) * | 2008-05-27 | 2012-07-11 | 日東電工株式会社 | 光電気混載モジュールの製造方法 |
JP2010044279A (ja) * | 2008-08-15 | 2010-02-25 | Fuji Xerox Co Ltd | 光導波路及びその製造方法 |
JP5230324B2 (ja) * | 2008-09-29 | 2013-07-10 | 京セラ株式会社 | 光伝送基板および光モジュール、ならびに光伝送基板の製造方法 |
JP5109982B2 (ja) * | 2008-10-09 | 2012-12-26 | 日立電線株式会社 | ミラー付き光伝送体の製造方法 |
JP5439080B2 (ja) * | 2009-07-28 | 2014-03-12 | 株式会社日立製作所 | 光i/oアレイモジュール |
KR101228547B1 (ko) * | 2009-12-08 | 2013-01-31 | 한국과학기술원 | 광도파로층 내장 광 인쇄회로기판 및 그 제조방법 |
JP5570322B2 (ja) * | 2010-06-30 | 2014-08-13 | 京セラ株式会社 | 光伝送基体および受光モジュール |
JP5505140B2 (ja) * | 2010-07-05 | 2014-05-28 | 富士通株式会社 | 光モジュールおよび製造方法 |
EP2613188B1 (en) * | 2010-08-31 | 2019-01-23 | Kyocera Corporation | Optical transmission substrate and optical transmission module |
US9360638B2 (en) * | 2010-08-31 | 2016-06-07 | Kyocera Corporation | Optical transmission body, method for manufacturing the same, and optical transmission module |
US8708576B2 (en) | 2011-01-20 | 2014-04-29 | Harris Corporation | Electro-optical device having an elastomeric body and related methods |
JP2012208306A (ja) * | 2011-03-29 | 2012-10-25 | Nitto Denko Corp | 光電気混載基板およびその製法 |
KR20140114829A (ko) | 2012-01-11 | 2014-09-29 | 히타치가세이가부시끼가이샤 | 광도파로 및 그 제조 방법 |
JP2013054369A (ja) * | 2012-10-23 | 2013-03-21 | Ngk Spark Plug Co Ltd | 光導波路付き配線基板 |
CN102984428A (zh) * | 2012-11-12 | 2013-03-20 | 天津理工大学 | 基于小波变换的湿纸密写方法 |
TWI549577B (zh) * | 2012-11-22 | 2016-09-11 | 鴻海精密工業股份有限公司 | 光纖連接器電路基板及光纖連接器 |
US9664858B2 (en) * | 2012-12-20 | 2017-05-30 | Intel Corporation | Optical photonic circuit coupling |
JP6388608B2 (ja) * | 2013-03-01 | 2018-09-12 | コーニンクレッカ フィリップス エヌ ヴェKoninklijke Philips N.V. | 検出器、検出方法、投影データ生成システム、投影データ生成方法及びコンピュータプログラム |
WO2014193978A1 (en) * | 2013-05-28 | 2014-12-04 | Georgia Tech Research Corporation | Glass-polymer optical interposer |
JP6387729B2 (ja) * | 2014-07-31 | 2018-09-12 | 富士通株式会社 | 光電気混載基板、情報処理装置及び光電気混載基板の製造方法 |
NL2013524B1 (en) * | 2014-09-25 | 2016-09-07 | Anteryon Wafer Optics B V | An optical light guide element and a method for manufacturing. |
US10067291B2 (en) * | 2016-10-13 | 2018-09-04 | Stmicroelectronics Sa | Method of manufacturing a waveguide |
JP6959731B2 (ja) * | 2016-11-30 | 2021-11-05 | 日東電工株式会社 | 光電気混載基板 |
EP3358359B1 (de) * | 2017-02-01 | 2019-08-28 | Siemens Aktiengesellschaft | Leiterplatte mit implantiertem optischen stromsensor |
US11262605B2 (en) * | 2017-08-31 | 2022-03-01 | Lightwave Logic Inc. | Active region-less polymer modulator integrated on a common PIC platform and method |
GB201721814D0 (en) | 2017-12-22 | 2018-02-07 | Optoscribe Ltd | Optical apparatus, optical assembly and methods of manufacture thereof |
FR3125339A1 (fr) | 2021-07-16 | 2023-01-20 | Valère FONTAINE-PICOUREIX | Champ d'information de photons permettant de multiples interconnexions dynamiques de modules Opto-électroniques programmables. |
US11867956B2 (en) * | 2021-08-19 | 2024-01-09 | Advanced Semiconductor Engineering, Inc. | Optoelectronic device |
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JPH0724596B2 (ja) * | 1984-12-27 | 1995-03-22 | サントリー株式会社 | インタ−フェロンの精製方法 |
US5125054A (en) * | 1991-07-25 | 1992-06-23 | Motorola, Inc. | Laminated polymer optical waveguide interface and method of making same |
JPH05264833A (ja) * | 1991-12-24 | 1993-10-15 | Hitachi Maxell Ltd | 光表面実装用基板およびその製造方法 |
US5170448A (en) * | 1992-01-06 | 1992-12-08 | Motorola, Inc. | Optical waveguide apparatus and method for partially collecting light |
US5394490A (en) * | 1992-08-11 | 1995-02-28 | Hitachi, Ltd. | Semiconductor device having an optical waveguide interposed in the space between electrode members |
DE4416563C1 (de) * | 1994-05-11 | 1995-07-20 | Ant Nachrichtentech | Anordnung zur Ankopplung von optoelektronischen Komponenten und Lichtwellenleitern aneinander |
JPH09281352A (ja) * | 1996-04-10 | 1997-10-31 | Fuji Xerox Co Ltd | 光電気伝送路の形成方法及び光電気配線基板 |
JP3705873B2 (ja) * | 1996-10-17 | 2005-10-12 | 株式会社アドバンテスト | 光・電気混在配線板 |
JPH11183749A (ja) * | 1997-12-22 | 1999-07-09 | Hitachi Chem Co Ltd | 光回路基板とその製造法 |
JP3715425B2 (ja) * | 1998-03-06 | 2005-11-09 | ブラザー工業株式会社 | 光導波路付基板の製造方法 |
DE19826648B4 (de) * | 1998-06-16 | 2005-07-28 | Siemens Ag | Schaltungsträger mit einer optischen Schicht und optoelektronisches Bauelement |
JP4374648B2 (ja) * | 1999-04-13 | 2009-12-02 | 凸版印刷株式会社 | 光・電気配線基板及び製造方法並びに実装基板 |
-
2000
- 2000-06-23 TW TW089112441A patent/TW451084B/zh not_active IP Right Cessation
- 2000-06-26 EP EP03017283A patent/EP1359441B1/en not_active Expired - Lifetime
- 2000-06-26 DE DE60022558T patent/DE60022558T2/de not_active Expired - Lifetime
- 2000-06-26 KR KR1020017016557A patent/KR100720854B1/ko not_active IP Right Cessation
- 2000-06-26 JP JP2001507127A patent/JP4457545B2/ja not_active Expired - Fee Related
- 2000-06-26 WO PCT/JP2000/004174 patent/WO2001001176A1/ja not_active Application Discontinuation
- 2000-06-26 EP EP00940832A patent/EP1215514A4/en not_active Withdrawn
- 2000-06-26 CA CA002377951A patent/CA2377951C/en not_active Expired - Fee Related
-
2001
- 2001-12-20 US US10/022,388 patent/US6804423B2/en not_active Expired - Fee Related
-
2004
- 2004-03-31 HK HK04102376A patent/HK1061436A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
DE60022558D1 (de) | 2005-10-13 |
EP1215514A4 (en) | 2003-08-27 |
JP4457545B2 (ja) | 2010-04-28 |
KR20020038594A (ko) | 2002-05-23 |
EP1215514A1 (en) | 2002-06-19 |
EP1359441B1 (en) | 2005-09-07 |
CA2377951C (en) | 2007-03-20 |
US20020051599A1 (en) | 2002-05-02 |
EP1359441A1 (en) | 2003-11-05 |
US6804423B2 (en) | 2004-10-12 |
CA2377951A1 (en) | 2001-01-04 |
DE60022558T2 (de) | 2006-06-08 |
KR100720854B1 (ko) | 2007-05-23 |
WO2001001176A1 (fr) | 2001-01-04 |
TW451084B (en) | 2001-08-21 |
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Effective date: 20090626 |