HK1060906A1 - Segmented counterelectrode for an electrolytic treatment system. - Google Patents

Segmented counterelectrode for an electrolytic treatment system.

Info

Publication number
HK1060906A1
HK1060906A1 HK04103944A HK04103944A HK1060906A1 HK 1060906 A1 HK1060906 A1 HK 1060906A1 HK 04103944 A HK04103944 A HK 04103944A HK 04103944 A HK04103944 A HK 04103944A HK 1060906 A1 HK1060906 A1 HK 1060906A1
Authority
HK
Hong Kong
Prior art keywords
workpieces
contact
electrolytic treatment
treatment system
electrode segment
Prior art date
Application number
HK04103944A
Other languages
English (en)
Inventor
Egon Hubel
Original Assignee
Atotech Deutschland Gmbh
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Atotech Deutschland Gmbh filed Critical Atotech Deutschland Gmbh
Publication of HK1060906A1 publication Critical patent/HK1060906A1/xx

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/12—Process control or regulation
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D17/00—Constructional parts, or assemblies thereof, of cells for electrolytic coating
    • C25D17/10—Electrodes, e.g. composition, counter electrode
    • C25D17/12—Shape or form
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing the conductive pattern
    • H05K3/241—Reinforcing the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Metallurgy (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Automation & Control Theory (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electrical Discharge Machining, Electrochemical Machining, And Combined Machining (AREA)
  • Water Treatment By Electricity Or Magnetism (AREA)
  • Electrolytic Production Of Metals (AREA)
  • Manufacturing Of Printed Wiring (AREA)
HK04103944A 2001-08-22 2004-06-02 Segmented counterelectrode for an electrolytic treatment system. HK1060906A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE10141056A DE10141056C2 (de) 2001-08-22 2001-08-22 Verfahren und Vorrichtung zum elektrolytischen Behandeln von elektrisch leitfähigen Schichten in Durchlaufanlagen
PCT/EP2002/009343 WO2003018878A2 (en) 2001-08-22 2002-08-21 Segmented counterelectrode for an electrolytic treatment system

Publications (1)

Publication Number Publication Date
HK1060906A1 true HK1060906A1 (en) 2004-08-27

Family

ID=7696199

Family Applications (1)

Application Number Title Priority Date Filing Date
HK04103944A HK1060906A1 (en) 2001-08-22 2004-06-02 Segmented counterelectrode for an electrolytic treatment system.

Country Status (15)

Country Link
US (1) US7473344B2 (xx)
EP (1) EP1419290B1 (xx)
JP (1) JP4257203B2 (xx)
KR (1) KR100866821B1 (xx)
CN (1) CN1289719C (xx)
AT (1) ATE289636T1 (xx)
AU (1) AU2002336089A1 (xx)
BR (1) BR0211270B1 (xx)
CA (1) CA2449807A1 (xx)
DE (2) DE10141056C2 (xx)
HK (1) HK1060906A1 (xx)
MX (1) MXPA04001545A (xx)
MY (1) MY127490A (xx)
TW (1) TW548349B (xx)
WO (1) WO2003018878A2 (xx)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004025827B3 (de) * 2004-05-24 2005-06-30 Höllmüller Maschinenbau GmbH Vorrichtung zum elektrischen Kontaktieren von ebenem Behandlungsgut in Durchlaufanlagen
DE102004029894B3 (de) * 2004-06-17 2005-12-22 Atotech Deutschland Gmbh Vorrichtung und Verfahren zum elektrolytischen Behandeln von elektrisch gegeneinander isolierten, elektrisch leitfähigen Strukturen auf Oberflächen von flachem Behandlungsgut
ATE446393T1 (de) * 2006-06-08 2009-11-15 Bct Coating Technologies Ag Vorrichtung zur galvanischen abscheidung von oberflächen und galvanisierungssystem
US20090047783A1 (en) * 2007-08-13 2009-02-19 Bchir Omar J Method of removing unwanted plated or conductive material from a substrate, and method of enabling metallization of a substrate using same
EP2343402B1 (en) * 2008-09-30 2017-08-02 FUJIFILM Corporation Electrolytic treatment method and electrolytic treatment device
DE102009023763A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum elektrolytischen Behandeln von hochohmigen Schichten
DE102009023768A1 (de) 2009-05-22 2010-11-25 Hübel, Egon, Dipl.-Ing. (FH) Verfahren und Vorrichtung zum Steuern von elektrochemischen Oberflächenprozessen
CA2764887C (en) 2009-06-08 2018-09-11 Modumetal Llc Electrodeposited, nanolaminate coatings and claddings for corrosion protection
EA201500947A1 (ru) 2013-03-15 2016-03-31 Модьюметл, Инк. Устройство и способ электроосаждения нанослоистого покрытия
CA2905548C (en) 2013-03-15 2022-04-26 Modumetal, Inc. Nanolaminate coatings
CN105189828B (zh) 2013-03-15 2018-05-15 莫杜美拓有限公司 具有高硬度的镍铬纳米层压涂层
BR112017005534A2 (pt) 2014-09-18 2017-12-05 Modumetal Inc métodos de preparação de artigos por processos de eletrodeposição e fabricação aditiva
EP3194642A4 (en) 2014-09-18 2018-07-04 Modumetal, Inc. A method and apparatus for continuously applying nanolaminate metal coatings
CN104862768B (zh) * 2015-05-27 2017-09-22 广州杰赛科技股份有限公司 一种电路板的电镀方法及装置
JP6672572B2 (ja) * 2015-12-25 2020-03-25 住友電工プリントサーキット株式会社 プリント配線板用めっき装置及びプリント配線板の製造方法
KR101880599B1 (ko) 2016-06-22 2018-07-23 (주)포인텍 애노드 이동형 수평도금장치
CA3036191A1 (en) 2016-09-08 2018-03-15 Modumetal, Inc. Processes for providing laminated coatings on workpieces, and articles made therefrom
EP3612669A1 (en) 2017-04-21 2020-02-26 Modumetal, Inc. Tubular articles with electrodeposited coatings, and systems and methods for producing the same
WO2019210264A1 (en) 2018-04-27 2019-10-31 Modumetal, Inc. Apparatuses, systems, and methods for producing a plurality of articles with nanolaminated coatings using rotation
US20220325429A1 (en) * 2019-09-12 2022-10-13 Atotech Deutschland GmbH & Co. KG Apparatus for wet processing of a planar workpiece, device for a cell of the apparatus and method of operating the apparatus
US20230062477A1 (en) 2020-02-07 2023-03-02 Atotech Deutschland GmbH & Co. KG Electrode and apparatus for electrolytically treating a workpiece, assembly for forming a cell of the apparatus and method and computer program
CN111826689B (zh) * 2020-07-28 2022-02-11 翔声科技（厦门）有限公司 一种多阶段镀镍工艺
CN114808057B (zh) * 2021-01-29 2024-06-21 泰科电子(上海)有限公司 电镀装置和电镀***
US20240003039A1 (en) * 2022-06-29 2024-01-04 Xiamen Hithium Energy Storage Technology Co.,Ltd.. Film plating machine and electroplating production line
CN117802557A (zh) * 2022-09-23 2024-04-02 奥特斯科技(重庆)有限公司 用于对部件承载件结构进行电镀覆的电镀覆设备和方法

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DE3369294D1 (en) * 1982-05-28 1987-02-26 De La Rue Syst Banding method and apparatus
DE3645319C3 (de) 1986-07-19 2000-07-27 Atotech Deutschland Gmbh Anordnung und Verfahren zum elektrolytischen Behandeln von plattenförmigen Gegenständen
DE3732476A1 (de) 1987-09-24 1989-04-13 Schering Ag Verfahren zur angleichung der teilstroeme in einem elektrolytischen bad
US5188721A (en) 1989-02-10 1993-02-23 Eltech Systems Corporation Plate anode having bias cut edges
US5156730A (en) 1991-06-25 1992-10-20 International Business Machines Electrode array and use thereof
DE4132418C1 (xx) 1991-09-28 1993-02-11 Hans Hoellmueller Maschinenbau Gmbh & Co, 7033 Herrenberg, De
DE19633797B4 (de) 1996-08-22 2005-08-04 Hans Höllmüller Maschinenbau GmbH Vorrichtung zum Galvanisieren von elektronischen Leiterplatten oder dergleichen
DE19736351C1 (de) * 1997-08-21 1998-10-01 Atotech Deutschland Gmbh Verfahren und Vorrichtung zum präzisen Galvanisieren von Werkstücken
EP0959153A3 (en) 1998-05-20 2000-09-13 Process Automation International Limited An electroplating machine
US6395152B1 (en) * 1998-07-09 2002-05-28 Acm Research, Inc. Methods and apparatus for electropolishing metal interconnections on semiconductor devices
DE10100297A1 (de) 2001-01-04 2002-07-18 Gesimat Gmbh Vorrichtung und Verahren zur elektrochemischen Beschichtung

Also Published As

Publication number Publication date
KR20040028802A (ko) 2004-04-03
CN1289719C (zh) 2006-12-13
JP2005501181A (ja) 2005-01-13
WO2003018878A3 (en) 2004-02-26
MY127490A (en) 2006-12-29
DE10141056A1 (de) 2003-05-08
KR100866821B1 (ko) 2008-11-04
MXPA04001545A (es) 2004-05-14
BR0211270A (pt) 2004-12-21
BR0211270B1 (pt) 2011-10-18
DE60203047T2 (de) 2006-01-12
DE10141056C2 (de) 2003-12-24
EP1419290A2 (en) 2004-05-19
DE60203047D1 (de) 2005-03-31
US7473344B2 (en) 2009-01-06
EP1419290B1 (en) 2005-02-23
ATE289636T1 (de) 2005-03-15
CN1561409A (zh) 2005-01-05
TW548349B (en) 2003-08-21
JP4257203B2 (ja) 2009-04-22
US20040232005A1 (en) 2004-11-25
WO2003018878A2 (en) 2003-03-06
AU2002336089A1 (en) 2003-03-10
CA2449807A1 (en) 2003-03-06

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Legal Events

Date Code Title Description
PC Patent ceased (i.e. patent has lapsed due to the failure to pay the renewal fee)

Effective date: 20150821