HK1018983A1 - Semiconductor substrate and strackable semiconductor package and fabrication method thereof. - Google Patents
Semiconductor substrate and strackable semiconductor package and fabrication method thereof.Info
- Publication number
- HK1018983A1 HK1018983A1 HK99104100A HK99104100A HK1018983A1 HK 1018983 A1 HK1018983 A1 HK 1018983A1 HK 99104100 A HK99104100 A HK 99104100A HK 99104100 A HK99104100 A HK 99104100A HK 1018983 A1 HK1018983 A1 HK 1018983A1
- Authority
- HK
- Hong Kong
- Prior art keywords
- strackable
- fabrication method
- semiconductor
- semiconductor substrate
- semiconductor package
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
- H01L23/053—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body
- H01L23/055—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls the container being a hollow construction and having an insulating or insulated base as a mounting for the semiconductor body the leads having a passage through the base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/50—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor for integrated circuit devices, e.g. power bus, number of leads
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/16—Fillings or auxiliary members in containers or encapsulations, e.g. centering rings
- H01L23/18—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device
- H01L23/24—Fillings characterised by the material, its physical or chemical properties, or its arrangement within the complete device solid or gel at the normal operating temperature of the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
- H01L25/105—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L27/00
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2225/00—Details relating to assemblies covered by the group H01L25/00 but not provided for in its subgroups
- H01L2225/03—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00
- H01L2225/10—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers
- H01L2225/1005—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00
- H01L2225/1011—All the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/648 and H10K99/00 the devices having separate containers the devices being of a type provided for in group H01L27/00 the containers being in a stacked arrangement
- H01L2225/1047—Details of electrical connections between containers
- H01L2225/1058—Bump or bump-like electrical connections, e.g. balls, pillars, posts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L24/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/15165—Monolayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/162—Disposition
- H01L2924/1627—Disposition stacked type assemblies, e.g. stacked multi-cavities
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Dispersion Chemistry (AREA)
- Wire Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019970047075A KR100280398B1 (ko) | 1997-09-12 | 1997-09-12 | 적층형 반도체 패키지 모듈의 제조 방법 |
Publications (1)
Publication Number | Publication Date |
---|---|
HK1018983A1 true HK1018983A1 (en) | 2000-01-14 |
Family
ID=19521226
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
HK99104100A HK1018983A1 (en) | 1997-09-12 | 1999-09-21 | Semiconductor substrate and strackable semiconductor package and fabrication method thereof. |
Country Status (6)
Country | Link |
---|---|
US (1) | US6137163A (xx) |
JP (1) | JP2967344B2 (xx) |
KR (1) | KR100280398B1 (xx) |
CN (1) | CN1150617C (xx) |
DE (1) | DE19802347B4 (xx) |
HK (1) | HK1018983A1 (xx) |
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KR100302593B1 (ko) | 1998-10-24 | 2001-09-22 | 김영환 | 반도체패키지및그제조방법 |
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KR20010068781A (ko) * | 2000-01-10 | 2001-07-23 | 윤종용 | 반도체 칩 패키지 |
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AU2001234610A1 (en) * | 2000-01-31 | 2001-08-07 | Joseph L. Chovan | Micro electro-mechanical component and system architecture |
DE10007414B4 (de) | 2000-02-18 | 2006-07-06 | eupec Europäische Gesellschaft für Leistungshalbleiter mbH & Co. KG | Verfahren zur Durchkontaktierung eines Substrats für Leistungshalbleitermodule durch Lot und mit dem Verfahren hergestelltes Substrat |
US6586836B1 (en) | 2000-03-01 | 2003-07-01 | Intel Corporation | Process for forming microelectronic packages and intermediate structures formed therewith |
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JP3999945B2 (ja) * | 2001-05-18 | 2007-10-31 | 株式会社東芝 | 半導体装置の製造方法 |
US6765287B1 (en) | 2001-07-27 | 2004-07-20 | Charles W. C. Lin | Three-dimensional stacked semiconductor package |
US6451626B1 (en) | 2001-07-27 | 2002-09-17 | Charles W.C. Lin | Three-dimensional stacked semiconductor package |
US20030042615A1 (en) | 2001-08-30 | 2003-03-06 | Tongbi Jiang | Stacked microelectronic devices and methods of fabricating same |
KR100435813B1 (ko) * | 2001-12-06 | 2004-06-12 | 삼성전자주식회사 | 금속 바를 이용하는 멀티 칩 패키지와 그 제조 방법 |
US6971160B1 (en) | 2002-01-03 | 2005-12-06 | The United States Of America As Represented By The Secretary Of The Air Force | Hybrid electrical circuit method with mated substrate carrier method |
US6646336B1 (en) * | 2002-06-28 | 2003-11-11 | Koninkl Philips Electronics Nv | Wearable silicon chip |
KR100608349B1 (ko) * | 2002-09-11 | 2006-08-09 | 주식회사 하이닉스반도체 | 요철 형상의 스택기판을 사용한 bga 스택 패키지 및 그제조방법 |
KR20040026530A (ko) * | 2002-09-25 | 2004-03-31 | 삼성전자주식회사 | 반도체 패키지 및 그를 이용한 적층 패키지 |
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US6984881B2 (en) | 2003-06-16 | 2006-01-10 | Sandisk Corporation | Stackable integrated circuit package and method therefor |
US7309923B2 (en) * | 2003-06-16 | 2007-12-18 | Sandisk Corporation | Integrated circuit package having stacked integrated circuits and method therefor |
US7993983B1 (en) | 2003-11-17 | 2011-08-09 | Bridge Semiconductor Corporation | Method of making a semiconductor chip assembly with chip and encapsulant grinding |
US7227249B1 (en) | 2003-12-24 | 2007-06-05 | Bridge Semiconductor Corporation | Three-dimensional stacked semiconductor package with chips on opposite sides of lead |
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KR100721353B1 (ko) * | 2005-07-08 | 2007-05-25 | 삼성전자주식회사 | 칩 삽입형 매개기판의 구조와 제조 방법, 이를 이용한 이종칩의 웨이퍼 레벨 적층 구조 및 패키지 구조 |
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CN102738120B (zh) * | 2012-07-09 | 2016-01-20 | 日月光半导体制造股份有限公司 | 半导体封装件及其制造方法 |
CN103632988B (zh) * | 2012-08-28 | 2016-10-19 | 宏启胜精密电子(秦皇岛)有限公司 | 层叠封装结构及其制作方法 |
US8860202B2 (en) * | 2012-08-29 | 2014-10-14 | Macronix International Co., Ltd. | Chip stack structure and manufacturing method thereof |
CN103413795B (zh) * | 2013-08-28 | 2016-12-28 | 天津大学 | 半导体器件的封装结构和半导体器件的封装工艺流程 |
CN103904057B (zh) * | 2014-04-02 | 2016-06-01 | 华进半导体封装先导技术研发中心有限公司 | PoP封装结构及制造工艺 |
TWM499394U (zh) * | 2014-12-19 | 2015-04-21 | Bothhand Entpr Inc | 電子裝置之封裝盒 |
TWI700798B (zh) * | 2018-07-12 | 2020-08-01 | 南韓商三星電子股份有限公司 | 半導體封裝 |
CN109326580A (zh) * | 2018-11-20 | 2019-02-12 | 中国科学院苏州纳米技术与纳米仿生研究所南昌研究院 | 一种多芯片封装互联结构及多芯片封装互联方法 |
CN111739871A (zh) * | 2020-05-15 | 2020-10-02 | 甬矽电子(宁波)股份有限公司 | 双面芯片封装结构和双面芯片封装工艺 |
US11388811B1 (en) | 2021-05-21 | 2022-07-12 | Amulaire Thermal Technology, Inc. | Heat-dissipating substrate structure with built-in conductive circuits |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
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JPS61101067A (ja) * | 1984-10-24 | 1986-05-19 | Nec Corp | メモリモジユ−ル |
JPH0430561A (ja) * | 1990-05-28 | 1992-02-03 | Hitachi Ltd | 半導体集積回路装置およびその実装構造 |
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US5043794A (en) * | 1990-09-24 | 1991-08-27 | At&T Bell Laboratories | Integrated circuit package and compact assemblies thereof |
US5241454A (en) * | 1992-01-22 | 1993-08-31 | International Business Machines Corporation | Mutlilayered flexible circuit package |
DE4303734C2 (de) * | 1993-02-03 | 1996-07-18 | Deutsches Elektronen Synchr | Chipträger |
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JPH07226456A (ja) * | 1993-04-23 | 1995-08-22 | Nippon Micron Kk | Icパッケージ及びその製造方法 |
US5455385A (en) * | 1993-06-28 | 1995-10-03 | Harris Corporation | Multilayer LTCC tub architecture for hermetically sealing semiconductor die, external electrical access for which is provided by way of sidewall recesses |
JPH07231049A (ja) * | 1994-02-17 | 1995-08-29 | Fujitsu Ltd | セラミックス多層基板の製造方法及びセラミックス多層基板 |
US5380681A (en) * | 1994-03-21 | 1995-01-10 | United Microelectronics Corporation | Three-dimensional multichip package and methods of fabricating |
US5579207A (en) * | 1994-10-20 | 1996-11-26 | Hughes Electronics | Three-dimensional integrated circuit stacking |
JPH08186192A (ja) * | 1994-12-27 | 1996-07-16 | Matsushita Electric Works Ltd | 多層プリント配線板の製造方法 |
JPH08186196A (ja) * | 1994-12-27 | 1996-07-16 | Casio Comput Co Ltd | 半導体装置の実装構造 |
US5835061A (en) * | 1995-06-06 | 1998-11-10 | Wayport, Inc. | Method and apparatus for geographic-based communications service |
US5861666A (en) * | 1995-08-30 | 1999-01-19 | Tessera, Inc. | Stacked chip assembly |
US5838060A (en) * | 1995-12-12 | 1998-11-17 | Comer; Alan E. | Stacked assemblies of semiconductor packages containing programmable interconnect |
US5798564A (en) * | 1995-12-21 | 1998-08-25 | Texas Instruments Incorporated | Multiple chip module apparatus having dual sided substrate |
-
1997
- 1997-09-12 KR KR1019970047075A patent/KR100280398B1/ko not_active IP Right Cessation
-
1998
- 1998-01-22 DE DE1998102347 patent/DE19802347B4/de not_active Expired - Fee Related
- 1998-03-06 CN CNB981007147A patent/CN1150617C/zh not_active Expired - Fee Related
- 1998-04-16 US US09/060,707 patent/US6137163A/en not_active Expired - Lifetime
- 1998-04-30 JP JP12029198A patent/JP2967344B2/ja not_active Expired - Fee Related
-
1999
- 1999-09-21 HK HK99104100A patent/HK1018983A1/xx not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
JP2967344B2 (ja) | 1999-10-25 |
KR100280398B1 (ko) | 2001-02-01 |
KR19990025444A (ko) | 1999-04-06 |
CN1150617C (zh) | 2004-05-19 |
DE19802347A1 (de) | 1999-04-08 |
US6137163A (en) | 2000-10-24 |
CN1211821A (zh) | 1999-03-24 |
DE19802347B4 (de) | 2005-10-06 |
JPH1197583A (ja) | 1999-04-09 |
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Effective date: 20130306 |