GB880414A - Improvements in or relating to the deposition of copper - Google Patents

Improvements in or relating to the deposition of copper

Info

Publication number
GB880414A
GB880414A GB37442/58A GB3744258A GB880414A GB 880414 A GB880414 A GB 880414A GB 37442/58 A GB37442/58 A GB 37442/58A GB 3744258 A GB3744258 A GB 3744258A GB 880414 A GB880414 A GB 880414A
Authority
GB
United Kingdom
Prior art keywords
copper
mixture
stream
nov
container
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB37442/58A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Pilkington Group Ltd
Original Assignee
Pilkington Brothers Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Pilkington Brothers Ltd filed Critical Pilkington Brothers Ltd
Priority to GB37442/58A priority Critical patent/GB880414A/en
Priority to US854185A priority patent/US3084063A/en
Priority to BE584890A priority patent/BE584890A/en
Priority to DEP23919A priority patent/DE1258233B/en
Publication of GB880414A publication Critical patent/GB880414A/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
    • C23C18/54—Contact plating, i.e. electroless electrochemical plating

Abstract

880,414. Coating with metals. PILKING- TON BROS. Ltd., BARNES, P. C., and KAY, S. E. Nov. 13, 1959 [Nov. 20, 1958], No. 37442/58. Class 82 (2) A process of depositing copper on to a surface comprises producing a confined turbulent stream of a solution a cupric salt forming under pressure, injecting a homogeneous liquid suspension of a powder of a metal, higher than copper in the electrochemical series, at a predetermined rate into the stream to produce a homogeneous turbulent stream of the mixture, and spraying the mixture towards the surface before an appreciable amont of metallic copper has been produced. The cupric salt may be copper sulphate acidified with sulphuric acid and may contain a viscous aqueous dispersion of a hydrophillic colloid, e.g. carboxymethyl cellulose, polyvinyl alcohol or a soluble starch, gum or gelatine. As shown the copper sulphate may be held in a container 10 having an outlet 11 connected to a mixing tube 12 at 13 and the metal suspension, e.g. iron or zinc, may be maintained in a container 14 having an outlet 15 which joins the mixing tube 12 at 15 preferably concentrically therewith. The resultant mixture may be spayed from nozzle 18 which may be mounted to have a transverse movement with respect to a conveyer 21 on which the articles 20, e.g. silvered mirrors, are carried. Specification 859,688 is referred to.
GB37442/58A 1958-11-20 1958-11-20 Improvements in or relating to the deposition of copper Expired GB880414A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
GB37442/58A GB880414A (en) 1958-11-20 1958-11-20 Improvements in or relating to the deposition of copper
US854185A US3084063A (en) 1958-11-20 1959-11-19 Process and apparatus for deposition of copper
BE584890A BE584890A (en) 1958-11-20 1959-11-20 Improvements to copper deposition.
DEP23919A DE1258233B (en) 1958-11-20 1959-11-20 Method and device for copper contact plating

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB37442/58A GB880414A (en) 1958-11-20 1958-11-20 Improvements in or relating to the deposition of copper

Publications (1)

Publication Number Publication Date
GB880414A true GB880414A (en) 1961-10-18

Family

ID=10396501

Family Applications (1)

Application Number Title Priority Date Filing Date
GB37442/58A Expired GB880414A (en) 1958-11-20 1958-11-20 Improvements in or relating to the deposition of copper

Country Status (4)

Country Link
US (1) US3084063A (en)
BE (1) BE584890A (en)
DE (1) DE1258233B (en)
GB (1) GB880414A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6065424A (en) * 1995-12-19 2000-05-23 Cornell Research Foundation, Inc. Electroless deposition of metal films with spray processor

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3400012A (en) * 1964-06-10 1968-09-03 Minnesota Mining & Mfg Process of plating metal objects
US3329512A (en) * 1966-04-04 1967-07-04 Shipley Co Chemical deposition of copper and solutions therefor
US3956528A (en) * 1974-11-15 1976-05-11 Minnesota Mining And Manufacturing Company Selective plating by galvanic action
FI783935A (en) * 1978-12-20 1980-06-21 Outokumpu Oy REFERENCE FITTING WITH METAL AV ETT MATERIAL SOM ICKE LEDER ELEKTRICITET
US4974541A (en) * 1988-10-28 1990-12-04 Brother Kogyo Kabushiki Kaisha Image forming apparatus utilizing wet type development
US9439293B2 (en) * 2007-11-21 2016-09-06 Xerox Corporation Galvanic process for making printed conductive metal markings for chipless RFID applications
FR2960167B1 (en) 2010-05-21 2013-02-08 Centre Nat Rech Scient METHOD FOR OBTAINING THIN LAYERS
TWI533496B (en) * 2013-07-23 2016-05-11 Chang Chun Petrochemical Co Electrolytic copper foil

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE541610A (en) *
US1825131A (en) * 1925-09-01 1931-09-29 Nat Cold Steam Company Power unit and method of creating energy
US1981405A (en) * 1931-03-23 1934-11-20 Paterson Parchment Paper Compa Process for manufacturing waterproof textiles, papers, cardboards, and pasteboards and finished containers made from those
US2295928A (en) * 1938-04-29 1942-09-15 Taylor Smith & Taylor Company Method and apparatus for glazing ceramic ware
US2318339A (en) * 1940-03-25 1943-05-04 Pneumastic Co Inc Mixing and surfacing method
US2513081A (en) * 1946-09-05 1950-06-27 Sherwin Williams Co Multichromatic spraying apparatus
US2664363A (en) * 1953-03-16 1953-12-29 Meth Max Method of depositing copper
US2748023A (en) * 1954-11-16 1956-05-29 Meth Max Method and apparatus for depositing copper
US2768944A (en) * 1955-12-15 1956-10-30 Meth Max Copper coating by galvanic action
US2915414A (en) * 1957-06-05 1959-12-01 Henry H Hilemn Copper coating process
US2963383A (en) * 1959-05-14 1960-12-06 Kay Chemicals Inc Spray silvering procedures

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6065424A (en) * 1995-12-19 2000-05-23 Cornell Research Foundation, Inc. Electroless deposition of metal films with spray processor

Also Published As

Publication number Publication date
US3084063A (en) 1963-04-02
BE584890A (en) 1960-05-20
DE1258233B (en) 1968-01-04

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