GB2221793A - Mounting arrangements for electronic components - Google Patents

Mounting arrangements for electronic components Download PDF

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Publication number
GB2221793A
GB2221793A GB8918194A GB8918194A GB2221793A GB 2221793 A GB2221793 A GB 2221793A GB 8918194 A GB8918194 A GB 8918194A GB 8918194 A GB8918194 A GB 8918194A GB 2221793 A GB2221793 A GB 2221793A
Authority
GB
United Kingdom
Prior art keywords
stack
devices
clamping pressure
adjust
heat sinks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8918194A
Other versions
GB2221793B (en
GB8918194D0 (en
Inventor
Michael Payne
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Electronic Devices Ltd
Original Assignee
Marconi Electronic Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Electronic Devices Ltd filed Critical Marconi Electronic Devices Ltd
Publication of GB8918194D0 publication Critical patent/GB8918194D0/en
Publication of GB2221793A publication Critical patent/GB2221793A/en
Application granted granted Critical
Publication of GB2221793B publication Critical patent/GB2221793B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)

Abstract

In a mounting arrangement for power semiconductor devices in which devices (1) and heat sinks (2) are clamped in two or more linear stacks in a common frame, at least one of the stacks includes means to adjust the clamping pressure in that stack individually. <IMAGE>

Description

Mounting arrangements for electrical components The present invention relates to mounting arrangements for electrical components.
In particular, although not exclusively, the invention is concerned with mounting arrangements for high power semiconductor devices such as transistors, diodes and thyristors. It is often required to mount such devices so as to ensure good electrical and/or thermal contact between devices, or between devices and electrodes or heat sinks where permanent bonding, for example by soldering or welding, is impractical, either because of the nature of the devices or because it may be necessary to replace devices from time to time.
In such mounting arrangements it is important to apply sufficient pressure both between devices and electrodes, since considerable amounts of heat can be generated at poor interfaces, and between devices and heat sinks in order to dissipate the heat generated within the devices in operation. At the same time too high a pressure can mechanically damage some devices, and for many devices the correct clamping pressure is crucial to satisfactory operation.
In presently known mounting arangements a number of devices may be arranged in a linear stack with electrodes, Insulators and/or heat sinks positioned between them as necessary, with the clamping pressure applied by means of tie rods extending between end frame members. In such arrangements the same pressure is necessarily applied to all devices in the stack.
According to one aspect of the present invention in a mounting arrangement in which a plurality of components or devices are clamped to form a unitary structure, said components or devices are arranged in at least two substantially linear stacks between common end frames, and at least one of said linear stacks includes means individually to adjust the clamping pressure applied to said one stack between said end frames.
According to another aspect of the present invention an assembly of high power semiconductor devices comprises at least a first semiconductor device and one or more electrodes, insulators or heat sinks disposed in a first stack between a pair of end frame members and means to secure said end frames together whereby clamping pressure may be applied to said first stack, and at least a second semiconductor device and one or more electrodes, insulators or heat sinks disposed between said end frame members in a second stack including means individually to adjust the clamping pressure applied to said second stack between said end frame embers.
Preferably said first stack also includes means individually to adjust the clamping pressure applied to said first stack.
A mounting arrangement in accordance with the present invention will now be described by way of example with reference to the accompanying drawing, which shows the arrangement schematically in elevation.
Referring to the drawing two high-power semiconductor devices 1, each sandwiched between a respective pair of heat sinks 2, are arranged in a first linear array or stack with electrical insulators 3 between adjacent heat sinks 2 and at either end of the stack. The stack is clamped between a first end frame member 4 and the head of a bolt 5 secured to a second end frame member 6.
The bolt 5 secures a dished washer assembly 7 against the frame member 6, and an indicator washer 8 is secured under a securing nut 9. The end frame members 4 and 6 are held in position by means of tie bolts 10.
A third semiconductor device 11 is sandwiched between a respective pair of heat sinks 2 and is arranged in a second stack with respective insulators 3 between the end frame member 4 and a spacer assembly 12, the spacer assembly 12 comprising a threaded rod 13 on which a dished washer assembly 14 is secured against the frame member 6, by means of a nut 15, and an indicator washer 16 is secured by means of a nut 17. The threaded rod 13 extends within a tubular member 18 which bears against the adjacent insulator 3, and the effective length of the spacer assembly 12 is set by means of a pair of nuts 19.
The dished washer assemblies 7 and 14 are preset to required loads with the respective indicator washers 8 and 16 captive, and when the first stack is clamped the tie bolts 10 are tightened until the preset load on the dished washer assembly 7 is reached, whereupon the indicator washer 8 is released. The nuts 19 of the spacer assembly 12 may then be adjusted until the preset load on the dished washer assembly 14 is reached and the indicator washer 16 released.
As described above the device 11 in the second stack may be replaced without dismantling the whole mounting arrangement.
If both stacks included spacer asemblies 12 then clearly devices in either stack could be replaced without dismantling the whole arrangement. In the latter case the end frames 4 and 6 and the tie bolts 10 may be replaced by a frame of fixed dimensions (not shown) since the necessary loading of the stacks may be achieved by means of the individual spacer assemblies.
It will be appreciated that the preset loads for the two stacks may be of equal or unequal length, so that differences in device thicknesses due to manufacturing tolerances may be accomnodated.

Claims (4)

1. A mounting arrangement in which a plurality of components or devices are clamped to form a unitary structure, wherein said components or devices are arranged in at least two substantially linear stacks between common end frames, and at least one of said linear stacks includes means individually to adjust the clamping presure applied to said one stack between said end frames.
2. An assembly of high power semiconductor devices comprising at least a first semiconductor device and one or more electrodes, insulators or heat sinks disposed in a first stack between a pair of end frame members and means to secure said end frames together whereby clamping pressure may be applied to said first stack, and at least a second semiconductor device and one or more electrodes, insulators or heat sinks disposed between said end frame members in a second stack including means individually to adjust the clamping pressure applied to said second stack between said end frame members.
3. An assembly in accordance with Claim 2 wherein said first stack also includes means individually to adjust the clamping pressure applied to said first stack.
4. A mounting arrangement substantially as hereinbefore described with reference to the accompanying drawing.
GB8918194A 1988-08-10 1989-08-09 Mounting arrangements for electrical components Expired - Fee Related GB2221793B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8818958A GB8818958D0 (en) 1988-08-10 1988-08-10 Mounting arrangements for electrical components

Publications (3)

Publication Number Publication Date
GB8918194D0 GB8918194D0 (en) 1989-09-20
GB2221793A true GB2221793A (en) 1990-02-14
GB2221793B GB2221793B (en) 1992-07-08

Family

ID=10641885

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8818958A Pending GB8818958D0 (en) 1988-08-10 1988-08-10 Mounting arrangements for electrical components
GB8918194A Expired - Fee Related GB2221793B (en) 1988-08-10 1989-08-09 Mounting arrangements for electrical components

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8818958A Pending GB8818958D0 (en) 1988-08-10 1988-08-10 Mounting arrangements for electrical components

Country Status (1)

Country Link
GB (2) GB8818958D0 (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0807975A1 (en) * 1996-05-14 1997-11-19 Gec Alsthom Transport Sa Power semiconductor device
EP0967648A2 (en) * 1998-06-08 1999-12-29 Inductotherm Corp. Semiconductor clamping device
US6809410B2 (en) * 2000-11-30 2004-10-26 Mitsubishi Denki Kabushiki Kaisha Power semiconductor module
US9312786B2 (en) 2012-12-21 2016-04-12 Abb Technology Ltd Cells control in a multilevel converter

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB381555A (en) * 1931-06-26 1932-09-26 Union Switch & Signal Co Improvements relating to detector devices for radio receiving apparatus
GB496797A (en) * 1937-04-26 1938-12-06 Mallory & Co Inc P R Improvements in and relating to rectifier units
GB640212A (en) * 1947-04-22 1950-07-12 Asea Ab High voltage dry valve plate apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB381555A (en) * 1931-06-26 1932-09-26 Union Switch & Signal Co Improvements relating to detector devices for radio receiving apparatus
GB496797A (en) * 1937-04-26 1938-12-06 Mallory & Co Inc P R Improvements in and relating to rectifier units
GB640212A (en) * 1947-04-22 1950-07-12 Asea Ab High voltage dry valve plate apparatus

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0807975A1 (en) * 1996-05-14 1997-11-19 Gec Alsthom Transport Sa Power semiconductor device
FR2748888A1 (en) * 1996-05-14 1997-11-21 Gec Alsthom Transport Sa POWER SEMICONDUCTOR ELEMENT DEVICE
US5883431A (en) * 1996-05-14 1999-03-16 Gec Alsthom Transport Sa Device with power semiconductor components
EP0967648A2 (en) * 1998-06-08 1999-12-29 Inductotherm Corp. Semiconductor clamping device
EP0967648A3 (en) * 1998-06-08 2002-12-18 Inductotherm Corp. Semiconductor clamping device
US6809410B2 (en) * 2000-11-30 2004-10-26 Mitsubishi Denki Kabushiki Kaisha Power semiconductor module
US9312786B2 (en) 2012-12-21 2016-04-12 Abb Technology Ltd Cells control in a multilevel converter

Also Published As

Publication number Publication date
GB2221793B (en) 1992-07-08
GB8818958D0 (en) 1988-09-14
GB8918194D0 (en) 1989-09-20

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930809