GB8918194D0 - Mounting arrangements for electronic components - Google Patents

Mounting arrangements for electronic components

Info

Publication number
GB8918194D0
GB8918194D0 GB8918194A GB8918194A GB8918194D0 GB 8918194 D0 GB8918194 D0 GB 8918194D0 GB 8918194 A GB8918194 A GB 8918194A GB 8918194 A GB8918194 A GB 8918194A GB 8918194 D0 GB8918194 D0 GB 8918194D0
Authority
GB
United Kingdom
Prior art keywords
electronic components
mounting arrangements
arrangements
mounting
electronic
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
GB8918194A
Other versions
GB2221793A (en
GB2221793B (en
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Marconi Electronic Devices Ltd
Original Assignee
Marconi Electronic Devices Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Marconi Electronic Devices Ltd filed Critical Marconi Electronic Devices Ltd
Publication of GB8918194D0 publication Critical patent/GB8918194D0/en
Publication of GB2221793A publication Critical patent/GB2221793A/en
Application granted granted Critical
Publication of GB2221793B publication Critical patent/GB2221793B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L23/4012—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws for stacked arrangements of a plurality of semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/10—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers
    • H01L25/11—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices having separate containers the devices being of a type provided for in group H01L29/00
    • H01L25/112—Mixed assemblies
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Rectifiers (AREA)
GB8918194A 1988-08-10 1989-08-09 Mounting arrangements for electrical components Expired - Fee Related GB2221793B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB8818958A GB8818958D0 (en) 1988-08-10 1988-08-10 Mounting arrangements for electrical components

Publications (3)

Publication Number Publication Date
GB8918194D0 true GB8918194D0 (en) 1989-09-20
GB2221793A GB2221793A (en) 1990-02-14
GB2221793B GB2221793B (en) 1992-07-08

Family

ID=10641885

Family Applications (2)

Application Number Title Priority Date Filing Date
GB8818958A Pending GB8818958D0 (en) 1988-08-10 1988-08-10 Mounting arrangements for electrical components
GB8918194A Expired - Fee Related GB2221793B (en) 1988-08-10 1989-08-09 Mounting arrangements for electrical components

Family Applications Before (1)

Application Number Title Priority Date Filing Date
GB8818958A Pending GB8818958D0 (en) 1988-08-10 1988-08-10 Mounting arrangements for electrical components

Country Status (1)

Country Link
GB (2) GB8818958D0 (en)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2748888B1 (en) * 1996-05-14 1998-06-19 Gec Alsthom Transport Sa DEVICE WITH SEMICONDUCTOR POWER ELEMENTS
US5940273A (en) * 1998-06-08 1999-08-17 Inductotherm Corp. Semiconductor clamping device
JP4092071B2 (en) * 2000-11-30 2008-05-28 三菱電機株式会社 Semiconductor power module
US9312786B2 (en) 2012-12-21 2016-04-12 Abb Technology Ltd Cells control in a multilevel converter

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL33443C (en) * 1931-06-26 1900-01-01
GB496797A (en) * 1937-04-26 1938-12-06 Mallory & Co Inc P R Improvements in and relating to rectifier units
GB640212A (en) * 1947-04-22 1950-07-12 Asea Ab High voltage dry valve plate apparatus

Also Published As

Publication number Publication date
GB2221793A (en) 1990-02-14
GB2221793B (en) 1992-07-08
GB8818958D0 (en) 1988-09-14

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Legal Events

Date Code Title Description
732 Registration of transactions, instruments or events in the register (sect. 32/1977)
PCNP Patent ceased through non-payment of renewal fee

Effective date: 19930809