GB2147148A - Electronic circuit assembly - Google Patents

Electronic circuit assembly Download PDF

Info

Publication number
GB2147148A
GB2147148A GB08325803A GB8325803A GB2147148A GB 2147148 A GB2147148 A GB 2147148A GB 08325803 A GB08325803 A GB 08325803A GB 8325803 A GB8325803 A GB 8325803A GB 2147148 A GB2147148 A GB 2147148A
Authority
GB
United Kingdom
Prior art keywords
adhesive
carrier
components
electronic components
contacts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
GB08325803A
Other languages
English (en)
Other versions
GB8325803D0 (en
Inventor
John Patrick Burke
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to GB08325803A priority Critical patent/GB2147148A/en
Publication of GB8325803D0 publication Critical patent/GB8325803D0/en
Priority to JP59503532A priority patent/JPS61500047A/ja
Priority to PCT/GB1984/000330 priority patent/WO1985001634A1/en
Priority to EP84903558A priority patent/EP0159331A1/en
Publication of GB2147148A publication Critical patent/GB2147148A/en
Priority to KR1019850700044A priority patent/KR850700100A/ko
Priority to DK229285A priority patent/DK229285D0/da
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
GB08325803A 1983-09-27 1983-09-27 Electronic circuit assembly Withdrawn GB2147148A (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
GB08325803A GB2147148A (en) 1983-09-27 1983-09-27 Electronic circuit assembly
JP59503532A JPS61500047A (ja) 1983-09-27 1984-09-27 電子回路組立方法
PCT/GB1984/000330 WO1985001634A1 (en) 1983-09-27 1984-09-27 Electronic circuit assembly
EP84903558A EP0159331A1 (en) 1983-09-27 1984-09-27 Electronic circuit assembly
KR1019850700044A KR850700100A (ko) 1983-09-27 1985-05-17 전자 회로 조립체
DK229285A DK229285D0 (da) 1983-09-27 1985-05-23 Fremgangsmaade til montering af elektronisk kredsloeb

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB08325803A GB2147148A (en) 1983-09-27 1983-09-27 Electronic circuit assembly

Publications (2)

Publication Number Publication Date
GB8325803D0 GB8325803D0 (en) 1983-10-26
GB2147148A true GB2147148A (en) 1985-05-01

Family

ID=10549343

Family Applications (1)

Application Number Title Priority Date Filing Date
GB08325803A Withdrawn GB2147148A (en) 1983-09-27 1983-09-27 Electronic circuit assembly

Country Status (6)

Country Link
EP (1) EP0159331A1 (ko)
JP (1) JPS61500047A (ko)
KR (1) KR850700100A (ko)
DK (1) DK229285D0 (ko)
GB (1) GB2147148A (ko)
WO (1) WO1985001634A1 (ko)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2200801A (en) * 1986-12-25 1988-08-10 Tdk Corp Attaching electronic circuit element to printed circuit board
GB2221098A (en) * 1988-04-06 1990-01-24 Sagem Electrical component equipped with double pairs of contacts for enabling two different possible mountings on a printed circuit board
US4927697A (en) * 1987-11-28 1990-05-22 British Aerospace Public Limited Company Surface mounting leadless components on conductor pattern supporting substrates
GB2237691A (en) * 1989-10-30 1991-05-08 Mitsubishi Electric Corp Semiconductor device and wiring board module

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3675734D1 (de) * 1985-09-30 1991-01-03 Siemens Ag Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.
DE3806738C1 (ko) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
EP0378233B1 (en) * 1989-01-13 1994-12-28 Matsushita Electric Industrial Co., Ltd. An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same
DE58909888C5 (de) * 1989-05-31 2017-03-02 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement
JPH0828565B2 (ja) * 1990-09-06 1996-03-21 ティーディーケイ株式会社 電子部品のプリント基板への搭載方法

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1221914A (en) * 1969-06-13 1971-02-10 Standard Telephones Cables Ltd Manufacture of integrated circuits
GB1467245A (en) * 1973-07-10 1977-03-16 Lucas Industries Ltd Method of securing component to a substrate
GB2032190A (en) * 1978-09-21 1980-04-30 Sony Corp Printed circuit boards
GB2037489A (en) * 1978-12-18 1980-07-09 Sony Corp Circuit Components Interconnected by Solder Layers
GB2047973A (en) * 1979-04-26 1980-12-03 Sony Corp Electronic circuit arrangements and method of securing leadless circuit parts on printed circuit boards
GB2125220A (en) * 1982-07-14 1984-02-29 Diehl Gmbh & Co An arrangement for connecting an electrical component to a support

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS53130831A (en) * 1977-04-20 1978-11-15 Schreiber Klaeranlagen Apparatus for cleaning dust receiving grate arranged in water way
JPS54155810A (en) * 1978-05-29 1979-12-08 Tdk Corp Bonding method of electronic parts
JPS5541793A (en) * 1978-09-20 1980-03-24 Matsushita Electric Ind Co Ltd Method of mounting microminiature part
JPS55144828A (en) * 1979-04-24 1980-11-12 Onishi Hitoshi Malt producing method and movable malt chamber
JPS5750497A (en) * 1980-09-11 1982-03-24 Mitsubishi Electric Corp Method of mounting electric part on printed board
DE3042043A1 (de) * 1980-11-07 1982-05-27 Nagel, Hans-Joachim, Dr., 2800 Bremen Einrichtung fuer die haltung von mastgefluegel
JPS5880894A (ja) * 1981-11-10 1983-05-16 パイオニア株式会社 プリント基板の製造方法
JPS5885592A (ja) * 1981-11-18 1983-05-21 パイオニア株式会社 プリント基板の製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1221914A (en) * 1969-06-13 1971-02-10 Standard Telephones Cables Ltd Manufacture of integrated circuits
GB1467245A (en) * 1973-07-10 1977-03-16 Lucas Industries Ltd Method of securing component to a substrate
GB2032190A (en) * 1978-09-21 1980-04-30 Sony Corp Printed circuit boards
GB2037489A (en) * 1978-12-18 1980-07-09 Sony Corp Circuit Components Interconnected by Solder Layers
GB2047973A (en) * 1979-04-26 1980-12-03 Sony Corp Electronic circuit arrangements and method of securing leadless circuit parts on printed circuit boards
GB2125220A (en) * 1982-07-14 1984-02-29 Diehl Gmbh & Co An arrangement for connecting an electrical component to a support

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2200801A (en) * 1986-12-25 1988-08-10 Tdk Corp Attaching electronic circuit element to printed circuit board
GB2200801B (en) * 1986-12-25 1991-01-09 Tdk Corp Electronic circuit element
US4927697A (en) * 1987-11-28 1990-05-22 British Aerospace Public Limited Company Surface mounting leadless components on conductor pattern supporting substrates
GB2221098A (en) * 1988-04-06 1990-01-24 Sagem Electrical component equipped with double pairs of contacts for enabling two different possible mountings on a printed circuit board
GB2221098B (en) * 1988-04-06 1991-09-25 Sagem Electrical component,particularly for an electric motor,equipped with double pairs of contacts,especially for enabling two different possible mountings on a
GB2237691A (en) * 1989-10-30 1991-05-08 Mitsubishi Electric Corp Semiconductor device and wiring board module
GB2237691B (en) * 1989-10-30 1993-08-25 Mitsubishi Electric Corp Electronic device

Also Published As

Publication number Publication date
WO1985001634A1 (en) 1985-04-11
GB8325803D0 (en) 1983-10-26
JPS61500047A (ja) 1986-01-09
EP0159331A1 (en) 1985-10-30
DK229285A (da) 1985-05-23
KR850700100A (ko) 1985-10-21
DK229285D0 (da) 1985-05-23

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Legal Events

Date Code Title Description
WAP Application withdrawn, taken to be withdrawn or refused ** after publication under section 16(1)