DK229285A - Fremgangsmaade til montering af elektronisk kredsloeb - Google Patents

Fremgangsmaade til montering af elektronisk kredsloeb Download PDF

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Publication number
DK229285A
DK229285A DK229285A DK229285A DK229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A DK 229285 A DK229285 A DK 229285A
Authority
DK
Denmark
Prior art keywords
electronic circuits
assembling electronic
assembling
circuits
electronic
Prior art date
Application number
DK229285A
Other languages
English (en)
Other versions
DK229285D0 (da
Inventor
John Patrick Burke
Original Assignee
Dortrell Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dortrell Ltd filed Critical Dortrell Ltd
Publication of DK229285A publication Critical patent/DK229285A/da
Publication of DK229285D0 publication Critical patent/DK229285D0/da

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
    • H05K3/305—Affixing by adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/046—Surface mounting
    • H05K13/0469—Surface mounting by applying a glue or viscous material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10689—Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10954—Other details of electrical connections
    • H05K2201/10984—Component carrying a connection agent, e.g. solder, adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0113—Female die used for patterning or transferring, e.g. temporary substrate having recessed pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0143—Using a roller; Specific shape thereof; Providing locally adhesive portions thereon
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0278—Flat pressure, e.g. for connecting terminals with anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/05—Patterning and lithography; Masks; Details of resist
    • H05K2203/0502—Patterning and lithography
    • H05K2203/0537—Transfer of pre-fabricated insulating pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Supply And Installment Of Electrical Components (AREA)
DK229285A 1983-09-27 1985-05-23 Fremgangsmaade til montering af elektronisk kredsloeb DK229285D0 (da)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
GB08325803A GB2147148A (en) 1983-09-27 1983-09-27 Electronic circuit assembly
PCT/GB1984/000330 WO1985001634A1 (en) 1983-09-27 1984-09-27 Electronic circuit assembly

Publications (2)

Publication Number Publication Date
DK229285A true DK229285A (da) 1985-05-23
DK229285D0 DK229285D0 (da) 1985-05-23

Family

ID=10549343

Family Applications (1)

Application Number Title Priority Date Filing Date
DK229285A DK229285D0 (da) 1983-09-27 1985-05-23 Fremgangsmaade til montering af elektronisk kredsloeb

Country Status (6)

Country Link
EP (1) EP0159331A1 (da)
JP (1) JPS61500047A (da)
KR (1) KR850700100A (da)
DK (1) DK229285D0 (da)
GB (1) GB2147148A (da)
WO (1) WO1985001634A1 (da)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3675734D1 (de) * 1985-09-30 1991-01-03 Siemens Ag Bauelement fuer die oberflaechenmontage und verfahren zur befestigung eines bauelements fuer die oberflaechenmontage.
GB2200801B (en) * 1986-12-25 1991-01-09 Tdk Corp Electronic circuit element
GB8727926D0 (en) * 1987-11-28 1987-12-31 British Aerospace Surface mounting leadless components on conductor pattern supporting substrates
DE3806738C1 (da) * 1988-03-02 1989-09-07 Espe Stiftung & Co Produktions- Und Vertriebs Kg, 8031 Seefeld, De
FR2629953B1 (fr) * 1988-04-06 1991-07-05 Sagem Composant electrique, notamment moteur electrique, equipe de double paires de contacts, notamment pour autoriser deux implantations differentes sur une plaque a circuits imprimes
EP0378233B1 (en) * 1989-01-13 1994-12-28 Matsushita Electric Industrial Co., Ltd. An adhesive composition for use in the mounting of electronic parts and a method for mounting electronic parts on a printed circuit board by the use of the same
DE58909888C5 (de) * 1989-05-31 2017-03-02 Osram Gesellschaft mit beschränkter Haftung Verfahren zum Herstellen eines oberflächenmontierbaren Opto-Bauelements und oberflächenmontierbares Opto-Bauelement
JPH03145186A (ja) * 1989-10-30 1991-06-20 Mitsubishi Electric Corp 半導体モジュール
JPH0828565B2 (ja) * 1990-09-06 1996-03-21 ティーディーケイ株式会社 電子部品のプリント基板への搭載方法

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1221914A (en) * 1969-06-13 1971-02-10 Standard Telephones Cables Ltd Manufacture of integrated circuits
GB1467245A (en) * 1973-07-10 1977-03-16 Lucas Industries Ltd Method of securing component to a substrate
JPS53130831A (en) * 1977-04-20 1978-11-15 Schreiber Klaeranlagen Apparatus for cleaning dust receiving grate arranged in water way
JPS54155810A (en) * 1978-05-29 1979-12-08 Tdk Corp Bonding method of electronic parts
JPS5541793A (en) * 1978-09-20 1980-03-24 Matsushita Electric Ind Co Ltd Method of mounting microminiature part
JPS5726379Y2 (da) * 1978-09-21 1982-06-08
JPS5582487A (en) * 1978-12-18 1980-06-21 Sony Corp Electronic circuit device
JPS55144828A (en) * 1979-04-24 1980-11-12 Onishi Hitoshi Malt producing method and movable malt chamber
JPS55156482U (da) * 1979-04-26 1980-11-11
JPS5750497A (en) * 1980-09-11 1982-03-24 Mitsubishi Electric Corp Method of mounting electric part on printed board
DE3042043A1 (de) * 1980-11-07 1982-05-27 Nagel, Hans-Joachim, Dr., 2800 Bremen Einrichtung fuer die haltung von mastgefluegel
JPS5880894A (ja) * 1981-11-10 1983-05-16 パイオニア株式会社 プリント基板の製造方法
JPS5885592A (ja) * 1981-11-18 1983-05-21 パイオニア株式会社 プリント基板の製造方法
DE3226222A1 (de) * 1982-07-14 1984-01-26 Diehl GmbH & Co, 8500 Nürnberg Einrichtung zur verbindung einer elektrode mit einem traeger

Also Published As

Publication number Publication date
WO1985001634A1 (en) 1985-04-11
GB8325803D0 (en) 1983-10-26
JPS61500047A (ja) 1986-01-09
EP0159331A1 (en) 1985-10-30
KR850700100A (ko) 1985-10-21
DK229285D0 (da) 1985-05-23
GB2147148A (en) 1985-05-01

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