GB1405670A - Electrolytic soldering arrangement - Google Patents
Electrolytic soldering arrangementInfo
- Publication number
- GB1405670A GB1405670A GB4719972A GB4719972A GB1405670A GB 1405670 A GB1405670 A GB 1405670A GB 4719972 A GB4719972 A GB 4719972A GB 4719972 A GB4719972 A GB 4719972A GB 1405670 A GB1405670 A GB 1405670A
- Authority
- GB
- United Kingdom
- Prior art keywords
- electrolyte
- container
- capillary
- drop
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K28/00—Welding or cutting not covered by any of the preceding groups, e.g. electrolytic welding
- B23K28/006—Welding metals by means of an electrolyte
Abstract
1405670 Electrolyte soldering COMPAGNIE HONEYWELL BULL 12 Oct 1972 [13 Oct 1971] 47199/72 Heading C7B An electrolytic soldering arrangement comprises an electrolyte container through which electrolyte can be circulated and having at least one capillary opening to allow a drop of electrolyte to be formed and maintained at the opening during circulation of the solution. At least one anode is in contact with the electrolyte in the container. The conductors to be soldered are placed in contact with the drop and are connected as cathode. As shown container 1 forms part of an electrolyte circuit comprising pump 3 and reservoir 4. Capillary orifice 10 allows a drop 14 of electrolyte to form at the junction of conductors 9a and 9b. Anode 8 fills the crosssection of the container and is connected to a D.C. source 7 which is also connected to 9a and 9b. In a modification, Fig. 2 (not shown), the circulation inlet and outlet to the container are at different levels, the outlet being adjacent the capillary orifice. The capillary opening may be filled by a porous plug, Fig. 3 (not shown). The container 1 may be replaced by two tubes (11) and (12) the capillary opening being at the junction of the tubes, Fig. 4 (not shown). The area of electrolytic treatment may be restricted by a mash, e.g. of adhesive tape which leaves the soldering zone free.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR7136714A FR2156981A5 (en) | 1971-10-13 | 1971-10-13 |
Publications (1)
Publication Number | Publication Date |
---|---|
GB1405670A true GB1405670A (en) | 1975-09-10 |
Family
ID=9084282
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
GB4719972A Expired GB1405670A (en) | 1971-10-13 | 1972-10-12 | Electrolytic soldering arrangement |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS4846543A (en) |
DE (1) | DE2250366A1 (en) |
FR (1) | FR2156981A5 (en) |
GB (1) | GB1405670A (en) |
IT (1) | IT968765B (en) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001068949A1 (en) * | 2000-03-13 | 2001-09-20 | Technology Development Associate Operations Limited | Electro-plating apparatus and method |
WO2001068951A1 (en) * | 2000-03-13 | 2001-09-20 | Technology Development Associate Operations Limited | Electro-plating apparatus and a method of electro-plating |
CN112975212A (en) * | 2021-03-23 | 2021-06-18 | 贵研铂业股份有限公司 | Tape-bonding brazing filler metal for nickel-based/titanium-based/gold-based brazing filler metal, preparation method and welding process |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6547937B1 (en) * | 2000-01-03 | 2003-04-15 | Semitool, Inc. | Microelectronic workpiece processing tool including a processing reactor having a paddle assembly for agitation of a processing fluid proximate to the workpiece |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS4716582U (en) * | 1971-03-23 | 1972-10-26 |
-
1971
- 1971-10-13 FR FR7136714A patent/FR2156981A5/fr not_active Expired
-
1972
- 1972-10-10 IT IT3028472A patent/IT968765B/en active
- 1972-10-12 GB GB4719972A patent/GB1405670A/en not_active Expired
- 1972-10-13 DE DE19722250366 patent/DE2250366A1/en not_active Ceased
- 1972-10-13 JP JP10195572A patent/JPS4846543A/ja active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2001068949A1 (en) * | 2000-03-13 | 2001-09-20 | Technology Development Associate Operations Limited | Electro-plating apparatus and method |
WO2001068951A1 (en) * | 2000-03-13 | 2001-09-20 | Technology Development Associate Operations Limited | Electro-plating apparatus and a method of electro-plating |
AU775148B2 (en) * | 2000-03-13 | 2004-07-22 | Tdao Limited | Electro-plating apparatus and method |
CN112975212A (en) * | 2021-03-23 | 2021-06-18 | 贵研铂业股份有限公司 | Tape-bonding brazing filler metal for nickel-based/titanium-based/gold-based brazing filler metal, preparation method and welding process |
Also Published As
Publication number | Publication date |
---|---|
DE2250366A1 (en) | 1973-04-19 |
FR2156981A5 (en) | 1973-06-01 |
IT968765B (en) | 1974-03-20 |
JPS4846543A (en) | 1973-07-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PS | Patent sealed | ||
PCNP | Patent ceased through non-payment of renewal fee |