JPS53108832A - Manufacture of tin or solder-plated wire - Google Patents

Manufacture of tin or solder-plated wire

Info

Publication number
JPS53108832A
JPS53108832A JP2404977A JP2404977A JPS53108832A JP S53108832 A JPS53108832 A JP S53108832A JP 2404977 A JP2404977 A JP 2404977A JP 2404977 A JP2404977 A JP 2404977A JP S53108832 A JPS53108832 A JP S53108832A
Authority
JP
Japan
Prior art keywords
solder
tin
manufacture
wire
plated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2404977A
Other languages
Japanese (ja)
Other versions
JPS5921946B2 (en
Inventor
Masaru Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Priority to JP52024049A priority Critical patent/JPS5921946B2/en
Publication of JPS53108832A publication Critical patent/JPS53108832A/en
Publication of JPS5921946B2 publication Critical patent/JPS5921946B2/en
Expired legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C26/00—Coating not provided for in groups C23C2/00 - C23C24/00
    • C23C26/02—Coating not provided for in groups C23C2/00 - C23C24/00 applying molten material to the substrate
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26—After-treatment
    • C23C2/261—After-treatment in a gas atmosphere, e.g. inert or reducing atmosphere
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C2/00—Hot-dipping or immersion processes for applying the coating material in the molten state without affecting the shape; Apparatus therefor
    • C23C2/26—After-treatment
    • C23C2/28—Thermal after-treatment, e.g. treatment in oil bath
    • C23C2/285—Thermal after-treatment, e.g. treatment in oil bath for remelting the coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Oil, Petroleum & Natural Gas (AREA)
  • Thermal Sciences (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Coating With Molten Metal (AREA)

Abstract

PURPOSE:To obtain a plated wire of high reliability without causing unevenness by supplying an electric current to a wire, in a vertically running state, previously plated with solder or tin so as to heat the wire and melt the plated solder or tin layer.
JP52024049A 1977-03-05 1977-03-05 Manufacturing method of tin or solder-plated wire Expired JPS5921946B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP52024049A JPS5921946B2 (en) 1977-03-05 1977-03-05 Manufacturing method of tin or solder-plated wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP52024049A JPS5921946B2 (en) 1977-03-05 1977-03-05 Manufacturing method of tin or solder-plated wire

Publications (2)

Publication Number Publication Date
JPS53108832A true JPS53108832A (en) 1978-09-22
JPS5921946B2 JPS5921946B2 (en) 1984-05-23

Family

ID=12127605

Family Applications (1)

Application Number Title Priority Date Filing Date
JP52024049A Expired JPS5921946B2 (en) 1977-03-05 1977-03-05 Manufacturing method of tin or solder-plated wire

Country Status (1)

Country Link
JP (1) JPS5921946B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS621848A (en) * 1985-06-27 1987-01-07 Shinko Kosen Kogyo Kk Method for coating metallic wire with solder by hot dipping
JPS62107093A (en) * 1985-11-05 1987-05-18 Mitsubishi Electric Corp Treatment of tin-lead alloy film on copper alloy bar

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS621848A (en) * 1985-06-27 1987-01-07 Shinko Kosen Kogyo Kk Method for coating metallic wire with solder by hot dipping
JPH0116306B2 (en) * 1985-06-27 1989-03-23 Shinko Wire Co Ltd
JPS62107093A (en) * 1985-11-05 1987-05-18 Mitsubishi Electric Corp Treatment of tin-lead alloy film on copper alloy bar

Also Published As

Publication number Publication date
JPS5921946B2 (en) 1984-05-23

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