GB1361298A - Photopolymerizable compositions and their use - Google Patents

Photopolymerizable compositions and their use

Info

Publication number
GB1361298A
GB1361298A GB481472A GB481472A GB1361298A GB 1361298 A GB1361298 A GB 1361298A GB 481472 A GB481472 A GB 481472A GB 481472 A GB481472 A GB 481472A GB 1361298 A GB1361298 A GB 1361298A
Authority
GB
United Kingdom
Prior art keywords
vinyl
weight
alkyl
meth
styrene
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB481472A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Dynachem Corp
Original Assignee
Dynachem Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dynachem Corp filed Critical Dynachem Corp
Publication of GB1361298A publication Critical patent/GB1361298A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0073—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces
    • H05K3/0076—Masks not provided for in groups H05K3/02 - H05K3/46, e.g. for photomechanical production of patterned surfaces characterised by the composition of the mask
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
    • G03F7/032—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders
    • G03F7/033—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds with binders the binders being polymers obtained by reactions only involving carbon-to-carbon unsaturated bonds, e.g. vinyl polymers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/12—Using specific substances
    • H05K2203/122—Organic non-polymeric compounds, e.g. oil, wax, thiol
    • H05K2203/124—Heterocyclic organic compounds, e.g. azole, furan
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/061—Etching masks
    • H05K3/064—Photoresists
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/389—Improvement of the adhesion between the insulating substrate and the metal by the use of a coupling agent, e.g. silane

Abstract

1361298 Photopolymerizable compositions DYNACHEM CORP 2 Feb 1972 [4 Feb 1971] 4814/72 Heading C3P [Also in Division G2] Photopolymerizable compositions comprise (A) from 10 to 60 parts by weight of an addition polymerizable material comprising one or more non-gaseous compounds having a boiling point above 100‹ C. at atmospheric pressure and containing at least two terminal ethylenic groups, (B) 0À001 to 10 parts by weight of a photo-initiated free-radical generating polymerization initiator, (C) 0À001 to 5 parts by weight of a thermal addition polymerization inhibitor and (D) 40 to 90 parts by weight of a binding agent which is a polymer of (i) at least one non-acidic vinyl compound of the formula wherein R is H, C 1 to C 6 alkyl or halogen and X is H and Y is OOCR 1 , OR 1 , OCR 1 , COOR 1 , CN, CH = CH 2 , or Cl; or X is methyl and Y is COOR 1 , CN, CH = CH 2 or or X and Y are both Cl, and wherein R 1 is C 1 to C 12 alkyl, phenyl or benzyl, and R 3 and R 4 are the same or different and are H, C 1 to C 12 alkyl or benzyl; and (ii) at least one α,#-unsaturated carboxylic acid having 3 to 15 carbon atoms, the proportions of (i) and (ii) being such that the binding agent is soluble in an aqueous solution containing 0À01 to 10% by weight of a watersoluble base. The compositions may additionally contain dyes, pigments, plasticizers and adhesion promoters. The polymerizable material (A) may be, for example, a poly(meth)acrylate ester of a glycol, polyglycol or other polyhydroxy compound, a poly(meth)acrylamide compound, #-methacrylamidoethyl methacrylate or a divinyl ester of a dicarboxylic or disulphonic acid. The binding agent (D) may be, for example, a copolymer of (i) styrene, alphamethylstyrene, p-methylstyrene, p-t-butylstyrene, a vinyl carboxylate ester, vinyl chloride, vinylidene chloride, methyl(meth)acrylate, (meth)acrylonitrile, methacrylamide, an N- alkylacrylamide, a vinyl alkyl ketone or a vinyl alkyl ether with (ii) acrylic, methacrylic, cinnamic, crotonic, sorbic, itaconic, propiolic acid, maleic or fumaric acid, or a half-ester of itaconic, maleic or fumaric acid. Specified binding agents are styrene/acrylic acid copolymer, styrene/ methacrylic acid copolymer, styrene/monobutyl maleate copolymer and vinyl acetate/crotonic acid copolymer. The initiator (B) may be a quinone compound, such as anthraquinone and derivatives thereof, as well as compounds such as diacetyl, benzil, benzoin and benzoin ethers, pivaloin and silver persulphate. Suitable inhibitors (C) include phenols, copper resinate, naphthylamines, cuprous chloride, phenothiazine, pyridine, nitrobenzenes, p-toluquinone, chloranil and aromatic phosphites. The compositions are useful in the production of printing plates, photoresistors and printed circuits (see Division G2).
GB481472A 1971-02-04 1972-02-02 Photopolymerizable compositions and their use Expired GB1361298A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US11279771A 1971-02-04 1971-02-04

Publications (1)

Publication Number Publication Date
GB1361298A true GB1361298A (en) 1974-07-24

Family

ID=22345895

Family Applications (1)

Application Number Title Priority Date Filing Date
GB481472A Expired GB1361298A (en) 1971-02-04 1972-02-02 Photopolymerizable compositions and their use

Country Status (23)

Country Link
JP (2) JPS5538961B1 (en)
AU (1) AU461461B2 (en)
BE (1) BE778729A (en)
BG (1) BG26673A3 (en)
CA (1) CA965291A (en)
CH (1) CH592322A5 (en)
DD (1) DD101035A5 (en)
DE (1) DE2205146C2 (en)
DK (2) DK142623B (en)
ES (1) ES399317A1 (en)
FI (1) FI57429C (en)
FR (1) FR2124974A5 (en)
GB (1) GB1361298A (en)
HK (1) HK28382A (en)
IL (1) IL38677A (en)
IT (1) IT949005B (en)
LU (1) LU64712A1 (en)
NL (1) NL176021C (en)
NO (1) NO141804C (en)
PL (1) PL83391B1 (en)
RO (1) RO64896A (en)
SE (1) SE390218B (en)
ZA (1) ZA72345B (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2645113A1 (en) * 1975-10-07 1977-04-14 Murakami Screen Kk PHOTO-SENSITIVE COMPOSITION FOR PRESSURE SCREENS
DE2602410A1 (en) * 1974-10-04 1977-07-28 Dynachem Corp PROCESS FOR PREPARING A PHOTO ETCH BASE AND PHOTOPOLYMERIZABLE DIMENSIONS FOR IT
WO1980001321A1 (en) * 1978-12-25 1980-06-26 N Smirnova Dry film photoresist
US4239849A (en) 1978-06-19 1980-12-16 Dynachem Corporation Polymers for aqueous processed photoresists
GB2198741A (en) * 1984-04-03 1988-06-22 Wolfen Filmfab Veb Photopolymerisable materials
US5053317A (en) * 1988-12-06 1991-10-01 Hoechst Aktiengesellschaft Radiation-polymerizable mixture and copying material produced comprising polyurethane-polyurea polymer
US7741013B2 (en) 2000-06-30 2010-06-22 E.I. Du Pont De Nemours And Company Process for thick film circuit patterning
WO2010094017A1 (en) 2009-02-16 2010-08-19 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1056189A (en) * 1974-04-23 1979-06-12 Ernst Leberzammer Polymeric binders for aqueous processable photopolymer compositions
JPS5944615B2 (en) * 1976-02-16 1984-10-31 富士写真フイルム株式会社 Photosensitive resin composition and metal image forming material using the same
SU941918A1 (en) * 1976-08-10 1982-07-07 Предприятие П/Я Г-4444 Dry film protoresist material
DE3034343A1 (en) * 1979-02-21 1981-04-09 Panelgraphic Corp RADIATION CURABLE CELLULOSIC POLYACRYLIC ABRASION RESISTANT COATING
JPS5619752A (en) * 1979-07-27 1981-02-24 Hitachi Chemical Co Ltd Photosensitive resin composition laminate
DE3560654D1 (en) * 1984-02-18 1987-10-22 Basf Ag Photosensitive recording material
DE3504254A1 (en) 1985-02-08 1986-08-14 Basf Ag, 6700 Ludwigshafen LIGHT SENSITIVE RECORDING ELEMENT
DE3619129A1 (en) * 1986-06-06 1987-12-10 Basf Ag LIGHT SENSITIVE RECORDING ELEMENT
JP2613462B2 (en) * 1988-12-28 1997-05-28 コニカ株式会社 Image forming material and image forming method
JP2515885Y2 (en) * 1990-09-28 1996-10-30 アンリツ株式会社 Display of measuring device
DE19638032A1 (en) * 1996-09-18 1998-03-19 Du Pont Deutschland Photopolymerizable mixture with lower oxygen sensitivity for the production of color proofs

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA614181A (en) * 1961-02-07 J. Mcgraw William Photopolymerizable compositions, elements and processes
US2893868A (en) * 1955-08-22 1959-07-07 Du Pont Polymerizable compositions
NL218803A (en) * 1956-07-09
GB835849A (en) * 1957-04-26 1960-05-25 Du Pont Photopolymerisable compositions and uses thereof
US3458311A (en) * 1966-06-27 1969-07-29 Du Pont Photopolymerizable elements with solvent removable protective layers
US3469982A (en) * 1968-09-11 1969-09-30 Jack Richard Celeste Process for making photoresists

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2602410A1 (en) * 1974-10-04 1977-07-28 Dynachem Corp PROCESS FOR PREPARING A PHOTO ETCH BASE AND PHOTOPOLYMERIZABLE DIMENSIONS FOR IT
DE2645113A1 (en) * 1975-10-07 1977-04-14 Murakami Screen Kk PHOTO-SENSITIVE COMPOSITION FOR PRESSURE SCREENS
US4239849A (en) 1978-06-19 1980-12-16 Dynachem Corporation Polymers for aqueous processed photoresists
WO1980001321A1 (en) * 1978-12-25 1980-06-26 N Smirnova Dry film photoresist
GB2198741A (en) * 1984-04-03 1988-06-22 Wolfen Filmfab Veb Photopolymerisable materials
US5053317A (en) * 1988-12-06 1991-10-01 Hoechst Aktiengesellschaft Radiation-polymerizable mixture and copying material produced comprising polyurethane-polyurea polymer
US7741013B2 (en) 2000-06-30 2010-06-22 E.I. Du Pont De Nemours And Company Process for thick film circuit patterning
WO2010094017A1 (en) 2009-02-16 2010-08-19 E. I. Du Pont De Nemours And Company Process for thick film circuit patterning

Also Published As

Publication number Publication date
CA965291A (en) 1975-04-01
LU64712A1 (en) 1973-09-04
DE2205146A1 (en) 1972-11-23
ZA72345B (en) 1973-03-28
RO64896A (en) 1980-01-15
AU461461B2 (en) 1975-05-12
NL7201460A (en) 1972-08-08
FR2124974A5 (en) 1972-09-22
IT949005B (en) 1973-06-11
HK28382A (en) 1982-07-02
SE390218B (en) 1976-12-06
AU3839272A (en) 1973-08-02
BG26673A3 (en) 1979-05-15
NL176021C (en) 1987-07-16
FI57429B (en) 1980-04-30
DE2205146C2 (en) 1990-03-08
DK142623B (en) 1980-12-01
IL38677A (en) 1974-12-31
DD101035A5 (en) 1973-10-12
JPS5538961B1 (en) 1980-10-07
IL38677A0 (en) 1972-03-28
DK144184B (en) 1982-01-04
FI57429C (en) 1980-08-11
ES399317A1 (en) 1974-12-16
JPH0136924B2 (en) 1989-08-03
NL176021B (en) 1984-09-03
CH592322A5 (en) 1977-10-31
JPS58144824A (en) 1983-08-29
BE778729A (en) 1972-07-31
DK144184C (en) 1982-06-14
NO141804C (en) 1980-05-14
NO141804B (en) 1980-02-04
PL83391B1 (en) 1975-12-31
DK142623C (en) 1981-08-03

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Legal Events

Date Code Title Description
414F Notice of opposition given (sect. 14/1949)
414A Case decided by the comptroller ** specification amended (sect. 14/1949)
SP Amendment (slips) printed
PS Patent sealed [section 19, patents act 1949]
PE20 Patent expired after termination of 20 years