FR2980015B1 - Dispositif electronique a puce et procede de fabrication par bobines - Google Patents
Dispositif electronique a puce et procede de fabrication par bobinesInfo
- Publication number
- FR2980015B1 FR2980015B1 FR1157988A FR1157988A FR2980015B1 FR 2980015 B1 FR2980015 B1 FR 2980015B1 FR 1157988 A FR1157988 A FR 1157988A FR 1157988 A FR1157988 A FR 1157988A FR 2980015 B1 FR2980015 B1 FR 2980015B1
- Authority
- FR
- France
- Prior art keywords
- contact pad
- chip
- electronic device
- support film
- manufacturing coils
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Coils Or Transformers For Communication (AREA)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1157988A FR2980015B1 (fr) | 2011-09-08 | 2011-09-08 | Dispositif electronique a puce et procede de fabrication par bobines |
PCT/EP2012/067632 WO2013034759A1 (fr) | 2011-09-08 | 2012-09-10 | Dispositif électronique à puce et procédé de fabrication par bobines |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1157988A FR2980015B1 (fr) | 2011-09-08 | 2011-09-08 | Dispositif electronique a puce et procede de fabrication par bobines |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2980015A1 FR2980015A1 (fr) | 2013-03-15 |
FR2980015B1 true FR2980015B1 (fr) | 2013-11-22 |
Family
ID=46980909
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR1157988A Expired - Fee Related FR2980015B1 (fr) | 2011-09-08 | 2011-09-08 | Dispositif electronique a puce et procede de fabrication par bobines |
Country Status (2)
Country | Link |
---|---|
FR (1) | FR2980015B1 (fr) |
WO (1) | WO2013034759A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3384434B1 (fr) * | 2015-12-04 | 2019-08-21 | Ng, Eng Seng | Procédé pour incorporation circuit intégré flip chip |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5255430A (en) * | 1992-10-08 | 1993-10-26 | Atmel Corporation | Method of assembling a module for a smart card |
FR2740935B1 (fr) * | 1995-11-03 | 1997-12-05 | Schlumberger Ind Sa | Procede de fabrication d'un ensemble de modules electroniques pour cartes a memoire electronique |
DE10214314A1 (de) * | 2002-03-28 | 2003-10-23 | Nedcard B V | Chipmodul |
EP1376462A1 (fr) * | 2002-06-19 | 2004-01-02 | SCHLUMBERGER Systèmes | Procédé de fabrication d'une bande |
-
2011
- 2011-09-08 FR FR1157988A patent/FR2980015B1/fr not_active Expired - Fee Related
-
2012
- 2012-09-10 WO PCT/EP2012/067632 patent/WO2013034759A1/fr active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2013034759A1 (fr) | 2013-03-14 |
FR2980015A1 (fr) | 2013-03-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PLFP | Fee payment |
Year of fee payment: 5 |
|
ST | Notification of lapse |
Effective date: 20170531 |