FR2888975A1 - Procede de securisation pour la protection de donnees - Google Patents
Procede de securisation pour la protection de donnees Download PDFInfo
- Publication number
- FR2888975A1 FR2888975A1 FR0507766A FR0507766A FR2888975A1 FR 2888975 A1 FR2888975 A1 FR 2888975A1 FR 0507766 A FR0507766 A FR 0507766A FR 0507766 A FR0507766 A FR 0507766A FR 2888975 A1 FR2888975 A1 FR 2888975A1
- Authority
- FR
- France
- Prior art keywords
- integrated circuit
- circuit board
- shield
- matrix
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/073—Special arrangements for circuits, e.g. for protecting identification code in memory
- G06K19/07309—Means for preventing undesired reading or writing from or onto record carriers
- G06K19/07372—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit
- G06K19/07381—Means for preventing undesired reading or writing from or onto record carriers by detecting tampering with the circuit with deactivation or otherwise incapacitation of at least a part of the circuit upon detected tampering
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/70—Protecting specific internal or peripheral components, in which the protection of a component leads to protection of the entire computer
- G06F21/86—Secure or tamper-resistant housings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/573—Protection from inspection, reverse engineering or tampering using passive means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/57—Protection from inspection, reverse engineering or tampering
- H01L23/576—Protection from inspection, reverse engineering or tampering using active circuits
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0275—Security details, e.g. tampering prevention or detection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2221/00—Indexing scheme relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/21—Indexing scheme relating to G06F21/00 and subgroups addressing additional information or applications relating to security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F2221/2143—Clearing memory, e.g. to prevent the data from being stolen
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01057—Lanthanum [La]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1517—Multilayer substrate
- H01L2924/15192—Resurf arrangement of the internal vias
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1532—Connection portion the connection portion being formed on the die mounting surface of the substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/30—Technical effects
- H01L2924/301—Electrical effects
- H01L2924/3025—Electromagnetic shielding
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0268—Marks, test patterns or identification means for electrical inspection or testing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10151—Sensor
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10734—Ball grid array [BGA]; Bump grid array
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Security & Cryptography (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Software Systems (AREA)
- Storage Device Security (AREA)
Abstract
Description
Claims (10)
Priority Applications (7)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0507766A FR2888975B1 (fr) | 2005-07-21 | 2005-07-21 | Procede de securisation pour la protection de donnees |
US11/256,124 US7791898B2 (en) | 2005-07-21 | 2005-10-21 | Security apparatus |
PCT/US2006/024161 WO2007018761A2 (fr) | 2005-07-21 | 2006-06-20 | Procede de securite pour la protection de donnees |
BRPI0613561-7A BRPI0613561A2 (pt) | 2005-07-21 | 2006-06-20 | método de segurança para proteção de dados |
CN2006800325295A CN101258552B (zh) | 2005-07-21 | 2006-06-20 | 用于数据保护的安全方法及装置 |
KR1020087003789A KR20080033418A (ko) | 2005-07-21 | 2006-06-20 | 데이터 보호를 위한 보안 방법 |
TW095126522A TWI388048B (zh) | 2005-07-21 | 2006-07-20 | 積體電路防護裝置及方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR0507766A FR2888975B1 (fr) | 2005-07-21 | 2005-07-21 | Procede de securisation pour la protection de donnees |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2888975A1 true FR2888975A1 (fr) | 2007-01-26 |
FR2888975B1 FR2888975B1 (fr) | 2007-09-07 |
Family
ID=36177629
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR0507766A Expired - Fee Related FR2888975B1 (fr) | 2005-07-21 | 2005-07-21 | Procede de securisation pour la protection de donnees |
Country Status (5)
Country | Link |
---|---|
US (1) | US7791898B2 (fr) |
CN (1) | CN101258552B (fr) |
BR (1) | BRPI0613561A2 (fr) |
FR (1) | FR2888975B1 (fr) |
TW (1) | TWI388048B (fr) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008156568A1 (fr) * | 2007-06-12 | 2008-12-24 | Itt Manufacturing Enterprises, Inc. | Grille de protection et de détection de circuit intégré |
WO2010058094A1 (fr) * | 2008-11-21 | 2010-05-27 | Innova Card | Dispositif de protection d'un boitier de circuit intégré électronique contre les intrusions par voie physique ou chimique |
WO2011003636A1 (fr) * | 2009-07-07 | 2011-01-13 | International Business Machines Corporation | Structure de verrouillage multicouche et procédé associé, destiné à la protection de clés et de codes cryptographiques |
Families Citing this family (52)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7898413B2 (en) * | 2007-01-25 | 2011-03-01 | Verifone, Inc. | Anti-tamper protected enclosure |
US7710286B1 (en) | 2007-03-30 | 2010-05-04 | Maxim Integrated Products, Inc. | Intrusion detection using a conductive material |
US7923830B2 (en) * | 2007-04-13 | 2011-04-12 | Maxim Integrated Products, Inc. | Package-on-package secure module having anti-tamper mesh in the substrate of the upper package |
US7868441B2 (en) * | 2007-04-13 | 2011-01-11 | Maxim Integrated Products, Inc. | Package on-package secure module having BGA mesh cap |
US7615416B1 (en) | 2007-08-31 | 2009-11-10 | Maxim Integrated Products, Inc. | Secure package with anti-tamper peripheral guard ring |
US7898090B1 (en) | 2007-09-28 | 2011-03-01 | Ixys Ch Gmbh | General purpose ball grid array security cap |
US7812428B2 (en) * | 2007-12-05 | 2010-10-12 | Atmel Rousset S.A.S. | Secure connector grid array package |
US8552566B1 (en) | 2008-05-30 | 2013-10-08 | Maxim Integrated Products, Inc. | Integrated circuit package having surface-mount blocking elements |
US20100123469A1 (en) * | 2008-11-19 | 2010-05-20 | Edward Craig Hyatt | System and method for protecting circuit boards |
US8030722B1 (en) * | 2009-03-04 | 2011-10-04 | Amkor Technology, Inc. | Reversible top/bottom MEMS package |
US8115283B1 (en) | 2009-07-14 | 2012-02-14 | Amkor Technology, Inc. | Reversible top/bottom MEMS package |
US8089331B2 (en) * | 2009-05-12 | 2012-01-03 | Raytheon Company | Planar magnetic structure |
US8593824B2 (en) * | 2010-10-27 | 2013-11-26 | Verifone, Inc. | Tamper secure circuitry especially for point of sale terminal |
US9641026B2 (en) * | 2011-06-08 | 2017-05-02 | Alstom Technology Ltd. | Enhanced communication infrastructure for hierarchical intelligent power distribution grid |
US8965590B2 (en) | 2011-06-08 | 2015-02-24 | Alstom Grid Inc. | Intelligent electrical distribution grid control system data |
US9281689B2 (en) | 2011-06-08 | 2016-03-08 | General Electric Technology Gmbh | Load phase balancing at multiple tiers of a multi-tier hierarchical intelligent power distribution grid |
US8434158B2 (en) * | 2011-08-29 | 2013-04-30 | Maxim Integrated Products, Inc. | Systems and methods for detecting and thwarting unauthorized access and hostile attacks on secured systems |
US9029962B1 (en) | 2011-10-12 | 2015-05-12 | Amkor Technology, Inc. | Molded cavity substrate MEMS package fabrication method and structure |
KR20140034332A (ko) * | 2012-08-14 | 2014-03-20 | 삼성전자주식회사 | 보안 장치 및 이를 구비하는 집적 회로 |
CN102858082B (zh) * | 2012-09-26 | 2015-06-10 | 深圳市九思泰达技术有限公司 | 核心模块安全区防护结构 |
WO2014055064A1 (fr) * | 2012-10-02 | 2014-04-10 | Hewlett-Packard Development Company, L.P. | Ensemble blindage de sécurité |
CN103617908B (zh) * | 2013-11-15 | 2015-11-04 | 福建鑫诺通讯技术有限公司 | 支付终端的键盘安全保护装置及方法 |
WO2015196450A1 (fr) | 2014-06-27 | 2015-12-30 | Microsoft Technology Licensing, Llc | Système de protection de données en mode hors tension |
US10423766B2 (en) | 2014-06-27 | 2019-09-24 | Microsoft Technology Licensing, Llc | Data protection system based on user input patterns on device |
US10372937B2 (en) | 2014-06-27 | 2019-08-06 | Microsoft Technology Licensing, Llc | Data protection based on user input during device boot-up, user login, and device shut-down states |
CN104201028B (zh) * | 2014-09-30 | 2019-05-07 | 太阳神(珠海)电子有限公司 | 一种具有安全保密功能的薄膜按键结构及薄膜键盘 |
TWI592068B (zh) * | 2014-10-31 | 2017-07-11 | Mpi Corp | Multilayer circuit board |
US10007811B2 (en) | 2015-02-25 | 2018-06-26 | Private Machines Inc. | Anti-tamper system |
US9900769B2 (en) | 2015-05-29 | 2018-02-20 | Nagravision S.A. | Methods and systems for establishing an encrypted-audio session |
US10122767B2 (en) | 2015-05-29 | 2018-11-06 | Nagravision S.A. | Systems and methods for conducting secure VOIP multi-party calls |
US9891882B2 (en) | 2015-06-01 | 2018-02-13 | Nagravision S.A. | Methods and systems for conveying encrypted data to a communication device |
US10356059B2 (en) | 2015-06-04 | 2019-07-16 | Nagravision S.A. | Methods and systems for communication-session arrangement on behalf of cryptographic endpoints |
FR3037764B1 (fr) * | 2015-06-16 | 2018-07-27 | Ingenico Group | Composant de protection de signaux sensibles, dispositif et procede correspondant |
CN106409793B (zh) * | 2015-07-29 | 2019-11-26 | 乾坤科技股份有限公司 | 具有电磁屏蔽结构的电子模组及其制造方法 |
TWI621378B (zh) | 2015-07-29 | 2018-04-11 | 乾坤科技股份有限公司 | 具有電磁屏蔽結構的電子模組及其製造方法 |
US10049810B2 (en) | 2015-11-09 | 2018-08-14 | Raytheon Company | High voltage high frequency transformer |
CN106548986B (zh) * | 2016-08-23 | 2019-01-29 | 天津大学 | 用于抗攻击芯片的安全封装结构及封装完整性检测方法 |
US10088642B2 (en) | 2016-11-09 | 2018-10-02 | International Business Machines Corporation | Coaxial wire and optical fiber trace via hybrid structures and methods to manufacture |
RU2734232C1 (ru) * | 2017-01-27 | 2020-10-13 | Аселсан Электроник Санайи Ве Тиджарет Аноним Ширкети | Электронная система защиты зоны, содержащей конфиденциальную информацию |
US9932221B1 (en) | 2017-03-02 | 2018-04-03 | Amkor Technology, Inc. | Semiconductor package with multiple compartments |
US10497650B2 (en) | 2017-04-13 | 2019-12-03 | Amkor Technology, Inc. | Semiconductor device and manufacturing method thereof |
US10672553B2 (en) | 2017-05-10 | 2020-06-02 | Raytheon Company | High voltage high frequency transformer |
WO2019089261A1 (fr) | 2017-11-02 | 2019-05-09 | Raytheon Company | Capteur de garde multi-ghz pour détection d'intrusions physiques ou électromagnétiques dans une région gardée |
US10157527B1 (en) | 2017-11-28 | 2018-12-18 | International Business Machines Corporation | Embossed printed circuit board for intrusion detection |
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US11493565B2 (en) * | 2019-12-03 | 2022-11-08 | International Business Machines Corporation | Leakage characterization and management for electronic circuit enhancement |
US11508667B1 (en) * | 2019-12-17 | 2022-11-22 | Xilinx, Inc. | Embedded shield for protection of memory cells |
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US11882645B2 (en) * | 2021-10-22 | 2024-01-23 | International Business Machines Corporation | Multi chip hardware security module |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998018102A1 (fr) * | 1996-10-22 | 1998-04-30 | Reinhard Posch | Procede et dispositif pour proteger des unites de calcul electroniques, notamment des cartes a puce |
EP0860882A2 (fr) * | 1997-02-24 | 1998-08-26 | General Instrument Corporation | Ecrantage par fil de liaison pour circuit intégré en vue de la protection contre les manipulations non autorisées |
US20050044403A1 (en) * | 2003-07-22 | 2005-02-24 | Samsung Electronics Co., Ltd. | Detection circuit for a smart card |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3347483A1 (de) | 1983-12-29 | 1985-07-11 | GAO Gesellschaft für Automation und Organisation mbH, 8000 München | Vorrichtung zur sicherung geheimer informationen |
US4593384A (en) | 1984-12-21 | 1986-06-03 | Ncr Corporation | Security device for the secure storage of sensitive data |
GB2182467B (en) | 1985-10-30 | 1989-10-18 | Ncr Co | Security device for stored sensitive data |
GB2195478B (en) | 1986-09-24 | 1990-06-13 | Ncr Co | Security device for sensitive data |
US4860351A (en) | 1986-11-05 | 1989-08-22 | Ibm Corporation | Tamper-resistant packaging for protection of information stored in electronic circuitry |
US4933898A (en) | 1989-01-12 | 1990-06-12 | General Instrument Corporation | Secure integrated circuit chip with conductive shield |
US5389738A (en) | 1992-05-04 | 1995-02-14 | Motorola, Inc. | Tamperproof arrangement for an integrated circuit device |
JP3036276B2 (ja) * | 1993-01-22 | 2000-04-24 | 富士電機株式会社 | 電流検出器の一次線輪の構造 |
US5291062A (en) * | 1993-03-01 | 1994-03-01 | Motorola, Inc. | Area array semiconductor device having a lid with functional contacts |
US5557502A (en) * | 1995-03-02 | 1996-09-17 | Intel Corporation | Structure of a thermally and electrically enhanced plastic ball grid array package |
US5639696A (en) | 1996-01-31 | 1997-06-17 | Lsi Logic Corporation | Microelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid array |
DE59914529D1 (de) | 1998-08-18 | 2007-11-29 | Infineon Technologies Ag | Halbleiterchip mit oberflächenabdeckung |
US6396400B1 (en) | 1999-07-26 | 2002-05-28 | Epstein, Iii Edwin A. | Security system and enclosure to protect data contained therein |
US6646565B1 (en) | 2000-06-01 | 2003-11-11 | Hewlett-Packard Development Company, L.P. | Point of sale (POS) terminal security system |
JP2004063664A (ja) * | 2002-07-26 | 2004-02-26 | Murata Mfg Co Ltd | キャビティ付き多層セラミック基板 |
JP3835381B2 (ja) * | 2002-09-04 | 2006-10-18 | 株式会社村田製作所 | 積層型電子部品 |
US6984785B1 (en) * | 2003-10-27 | 2006-01-10 | Asat Ltd. | Thermally enhanced cavity-down integrated circuit package |
-
2005
- 2005-07-21 FR FR0507766A patent/FR2888975B1/fr not_active Expired - Fee Related
- 2005-10-21 US US11/256,124 patent/US7791898B2/en not_active Expired - Fee Related
-
2006
- 2006-06-20 CN CN2006800325295A patent/CN101258552B/zh not_active Expired - Fee Related
- 2006-06-20 BR BRPI0613561-7A patent/BRPI0613561A2/pt not_active IP Right Cessation
- 2006-07-20 TW TW095126522A patent/TWI388048B/zh not_active IP Right Cessation
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO1998018102A1 (fr) * | 1996-10-22 | 1998-04-30 | Reinhard Posch | Procede et dispositif pour proteger des unites de calcul electroniques, notamment des cartes a puce |
EP0860882A2 (fr) * | 1997-02-24 | 1998-08-26 | General Instrument Corporation | Ecrantage par fil de liaison pour circuit intégré en vue de la protection contre les manipulations non autorisées |
US20050044403A1 (en) * | 2003-07-22 | 2005-02-24 | Samsung Electronics Co., Ltd. | Detection circuit for a smart card |
Cited By (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2008156568A1 (fr) * | 2007-06-12 | 2008-12-24 | Itt Manufacturing Enterprises, Inc. | Grille de protection et de détection de circuit intégré |
US7723998B2 (en) | 2007-06-12 | 2010-05-25 | Itt Manufacturing Enterprises, Inc. | Integrated circuit protection and detection grid |
WO2010058094A1 (fr) * | 2008-11-21 | 2010-05-27 | Innova Card | Dispositif de protection d'un boitier de circuit intégré électronique contre les intrusions par voie physique ou chimique |
FR2938953A1 (fr) * | 2008-11-21 | 2010-05-28 | Innova Card | Dispositif de protection d'un boitier de circuit integre electronique contre les intrusions par voie physique ou chimique. |
US8581251B2 (en) | 2008-11-21 | 2013-11-12 | Maxim Integrated Products, Inc. | Device for protecting an electronic integrated circuit housing against physical or chemical ingression |
WO2011003636A1 (fr) * | 2009-07-07 | 2011-01-13 | International Business Machines Corporation | Structure de verrouillage multicouche et procédé associé, destiné à la protection de clés et de codes cryptographiques |
US8938627B2 (en) | 2009-07-07 | 2015-01-20 | International Business Machines Corporation | Multilayer securing structure and method thereof for the protection of cryptographic keys and code |
Also Published As
Publication number | Publication date |
---|---|
TW200709631A (en) | 2007-03-01 |
BRPI0613561A2 (pt) | 2011-01-18 |
CN101258552B (zh) | 2012-05-30 |
FR2888975B1 (fr) | 2007-09-07 |
CN101258552A (zh) | 2008-09-03 |
US20070018334A1 (en) | 2007-01-25 |
US7791898B2 (en) | 2010-09-07 |
TWI388048B (zh) | 2013-03-01 |
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