FR2819080B1 - Procede d'assemblage d'un composant tel qu'un circuit integre sur un substrat - Google Patents

Procede d'assemblage d'un composant tel qu'un circuit integre sur un substrat

Info

Publication number
FR2819080B1
FR2819080B1 FR0017231A FR0017231A FR2819080B1 FR 2819080 B1 FR2819080 B1 FR 2819080B1 FR 0017231 A FR0017231 A FR 0017231A FR 0017231 A FR0017231 A FR 0017231A FR 2819080 B1 FR2819080 B1 FR 2819080B1
Authority
FR
France
Prior art keywords
assembling
substrate
component
integrated circuit
integrated
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR0017231A
Other languages
English (en)
Other versions
FR2819080A1 (fr
Inventor
Myriam Oudart
Francois Bernard
Marie Jose Molino
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Thales SA
Original Assignee
Thomson CSF SA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Thomson CSF SA filed Critical Thomson CSF SA
Priority to FR0017231A priority Critical patent/FR2819080B1/fr
Publication of FR2819080A1 publication Critical patent/FR2819080A1/fr
Application granted granted Critical
Publication of FR2819080B1 publication Critical patent/FR2819080B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
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    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
    • H01L23/538—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates
    • H01L23/5389—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames the interconnection structure between a plurality of semiconductor chips being formed on, or in, insulating substrates the chips being integrally enclosed by the interconnect and support structures
    • H—ELECTRICITY
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    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
    • H01L24/23—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process
    • H01L24/24—Structure, shape, material or disposition of the high density interconnect connectors after the connecting process of an individual high density interconnect connector
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    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
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    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/75—Apparatus for connecting with bump connectors or layer connectors
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    • H01L24/82—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
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    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
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    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
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    • H01L2224/82001—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] involving a temporary auxiliary member not forming part of the bonding apparatus
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    • H01L2224/82009—Pre-treatment of the connector or the bonding area
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    • H01L2224/922—Connecting different surfaces of the semiconductor or solid-state body with connectors of different types
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1515—Shape
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    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
FR0017231A 2000-12-28 2000-12-28 Procede d'assemblage d'un composant tel qu'un circuit integre sur un substrat Expired - Fee Related FR2819080B1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
FR0017231A FR2819080B1 (fr) 2000-12-28 2000-12-28 Procede d'assemblage d'un composant tel qu'un circuit integre sur un substrat

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR0017231A FR2819080B1 (fr) 2000-12-28 2000-12-28 Procede d'assemblage d'un composant tel qu'un circuit integre sur un substrat

Publications (2)

Publication Number Publication Date
FR2819080A1 FR2819080A1 (fr) 2002-07-05
FR2819080B1 true FR2819080B1 (fr) 2004-02-06

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
FR0017231A Expired - Fee Related FR2819080B1 (fr) 2000-12-28 2000-12-28 Procede d'assemblage d'un composant tel qu'un circuit integre sur un substrat

Country Status (1)

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FR (1) FR2819080B1 (fr)

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2138205B (en) * 1983-04-13 1986-11-05 Philips Electronic Associated Methods of manufacturing a microwave circuit
GB2153144A (en) * 1984-01-13 1985-08-14 Standard Telephones Cables Ltd Circuit packaging
JPH05152387A (ja) * 1991-11-28 1993-06-18 Fujitsu Ltd 圧着用ボンデイングヘツドの調整方法
US5745984A (en) * 1995-07-10 1998-05-05 Martin Marietta Corporation Method for making an electronic module
KR100386061B1 (ko) * 1995-10-24 2003-08-21 오끼 덴끼 고오교 가부시끼가이샤 크랙을방지하기위한개량된구조를가지는반도체장치및리이드프레임
KR100431031B1 (ko) * 1996-10-10 2004-07-27 삼성전자주식회사 반도체칩의장착방법
JPH10308431A (ja) * 1997-05-07 1998-11-17 Nec Corp 半導体素子搭載装置
JP3303832B2 (ja) * 1999-04-01 2002-07-22 日本電気株式会社 フリップチップボンダー

Also Published As

Publication number Publication date
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