FR2778495B1 - Dispositif semiconducteur a structure mos et procede de fabrication d'un tel dispositif - Google Patents

Dispositif semiconducteur a structure mos et procede de fabrication d'un tel dispositif

Info

Publication number
FR2778495B1
FR2778495B1 FR9814151A FR9814151A FR2778495B1 FR 2778495 B1 FR2778495 B1 FR 2778495B1 FR 9814151 A FR9814151 A FR 9814151A FR 9814151 A FR9814151 A FR 9814151A FR 2778495 B1 FR2778495 B1 FR 2778495B1
Authority
FR
France
Prior art keywords
manufacturing
mos structure
semiconductor device
semiconductor
mos
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9814151A
Other languages
English (en)
Other versions
FR2778495A1 (fr
Inventor
Yuuichi Hirano
Yasuo Yamaguchi
Shigeto Maegawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2778495A1 publication Critical patent/FR2778495A1/fr
Application granted granted Critical
Publication of FR2778495B1 publication Critical patent/FR2778495B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/40Electrodes ; Multistep manufacturing processes therefor
    • H01L29/43Electrodes ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
    • H01L29/49Metal-insulator-semiconductor electrodes, e.g. gates of MOSFET
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/66007Multistep manufacturing processes
    • H01L29/66075Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
    • H01L29/66227Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
    • H01L29/66409Unipolar field-effect transistors
    • H01L29/66477Unipolar field-effect transistors with an insulated gate, i.e. MISFET
    • H01L29/66742Thin film unipolar transistors
    • H01L29/66772Monocristalline silicon transistors on insulating substrates, e.g. quartz substrates
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78606Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device
    • H01L29/78618Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure
    • H01L29/78621Thin film transistors, i.e. transistors with a channel being at least partly a thin film with supplementary region or layer in the thin film or in the insulated bulk substrate supporting it for controlling or increasing the safety of the device characterised by the drain or the source properties, e.g. the doping structure, the composition, the sectional shape or the contact structure with LDD structure or an extension or an offset region or characterised by the doping profile
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L29/00Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
    • H01L29/66Types of semiconductor device ; Multistep manufacturing processes therefor
    • H01L29/68Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
    • H01L29/76Unipolar devices, e.g. field effect transistors
    • H01L29/772Field effect transistors
    • H01L29/78Field effect transistors with field effect produced by an insulated gate
    • H01L29/786Thin film transistors, i.e. transistors with a channel being at least partly a thin film
    • H01L29/78651Silicon transistors
    • H01L29/78654Monocrystalline silicon transistors

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Ceramic Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Chemical & Material Sciences (AREA)
  • Crystallography & Structural Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Thin Film Transistor (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Drying Of Semiconductors (AREA)
FR9814151A 1998-05-06 1998-11-10 Dispositif semiconducteur a structure mos et procede de fabrication d'un tel dispositif Expired - Fee Related FR2778495B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP10123303A JPH11317527A (ja) 1998-05-06 1998-05-06 半導体装置及びその製造方法

Publications (2)

Publication Number Publication Date
FR2778495A1 FR2778495A1 (fr) 1999-11-12
FR2778495B1 true FR2778495B1 (fr) 2001-10-19

Family

ID=14857211

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9814151A Expired - Fee Related FR2778495B1 (fr) 1998-05-06 1998-11-10 Dispositif semiconducteur a structure mos et procede de fabrication d'un tel dispositif

Country Status (6)

Country Link
US (2) US6340829B1 (fr)
JP (1) JPH11317527A (fr)
KR (1) KR100305308B1 (fr)
DE (1) DE19853432A1 (fr)
FR (1) FR2778495B1 (fr)
TW (1) TW390036B (fr)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6875640B1 (en) * 2000-06-08 2005-04-05 Micron Technology, Inc. Stereolithographic methods for forming a protective layer on a semiconductor device substrate and substrates including protective layers so formed
KR100366923B1 (ko) * 2001-02-19 2003-01-06 삼성전자 주식회사 에스오아이 기판 및 이의 제조방법
US6465313B1 (en) * 2001-07-05 2002-10-15 Advanced Micro Devices, Inc. SOI MOSFET with graded source/drain silicide
US20030134486A1 (en) * 2002-01-16 2003-07-17 Zhongze Wang Semiconductor-on-insulator comprising integrated circuitry
JP3539946B2 (ja) 2002-03-28 2004-07-07 沖電気工業株式会社 Soi構造を有する半導体装置の製造方法
JP2004039982A (ja) * 2002-07-05 2004-02-05 Mitsubishi Electric Corp 半導体装置
US6995438B1 (en) * 2003-10-01 2006-02-07 Advanced Micro Devices, Inc. Semiconductor device with fully silicided source/drain and damascence metal gate
US7397073B2 (en) * 2004-11-22 2008-07-08 International Business Machines Corporation Barrier dielectric stack for seam protection
US7244659B2 (en) * 2005-03-10 2007-07-17 Micron Technology, Inc. Integrated circuits and methods of forming a field effect transistor
US7528065B2 (en) * 2006-01-17 2009-05-05 International Business Machines Corporation Structure and method for MOSFET gate electrode landing pad
US7557002B2 (en) * 2006-08-18 2009-07-07 Micron Technology, Inc. Methods of forming transistor devices
US7989322B2 (en) 2007-02-07 2011-08-02 Micron Technology, Inc. Methods of forming transistors

Family Cites Families (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63318779A (ja) 1987-06-22 1988-12-27 Sanyo Electric Co Ltd 半導体装置の製造方法
JPS6420663A (en) 1987-07-15 1989-01-24 Nec Corp Manufacture of semiconductor device
JPH01291467A (ja) * 1988-05-19 1989-11-24 Toshiba Corp 薄膜トランジスタ
US5258645A (en) * 1990-03-09 1993-11-02 Fujitsu Limited Semiconductor device having MOS transistor and a sidewall with a double insulator layer structure
US5151376A (en) * 1990-05-31 1992-09-29 Sgs-Thomson Microelectronics, Inc. Method of making polycrystalline silicon resistors for integrated circuits
US5323047A (en) * 1992-01-31 1994-06-21 Sgs-Thomson Microelectronics, Inc. Structure formed by a method of patterning a submicron semiconductor layer
US5424570A (en) * 1992-01-31 1995-06-13 Sgs-Thomson Microelectronics, Inc. Contact structure for improving photoresist adhesion on a dielectric layer
US5576556A (en) 1993-08-20 1996-11-19 Semiconductor Energy Laboratory Co., Ltd. Thin film semiconductor device with gate metal oxide and sidewall spacer
JPH06338601A (ja) * 1993-05-31 1994-12-06 Toshiba Corp 半導体装置及びその製造方法
US5719065A (en) 1993-10-01 1998-02-17 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing semiconductor device with removable spacers
US5428240A (en) * 1994-07-07 1995-06-27 United Microelectronics Corp. Source/drain structural configuration for MOSFET integrated circuit devices
TW333680B (en) * 1996-12-17 1998-06-11 Mos Electronics Taiwan Inc The processes for improving polysilicon & gate oxide quality inside programmable cell
JPH1168103A (ja) * 1997-08-22 1999-03-09 Mitsubishi Electric Corp 半導体装置の製造方法
US6174756B1 (en) 1997-09-30 2001-01-16 Siemens Aktiengesellschaft Spacers to block deep junction implants and silicide formation in integrated circuits
US5880006A (en) * 1998-05-22 1999-03-09 Vlsi Technology, Inc. Method for fabrication of a semiconductor device

Also Published As

Publication number Publication date
JPH11317527A (ja) 1999-11-16
KR100305308B1 (ko) 2001-09-29
KR19990087000A (ko) 1999-12-15
FR2778495A1 (fr) 1999-11-12
TW390036B (en) 2000-05-11
US6699758B2 (en) 2004-03-02
US20020020876A1 (en) 2002-02-21
DE19853432A1 (de) 1999-11-18
US6340829B1 (en) 2002-01-22

Similar Documents

Publication Publication Date Title
FR2788629B1 (fr) Transistor mis et procede de fabrication d'un tel transistor sur un substrat semiconducteur
FR2799305B1 (fr) Procede de fabrication d'un dispositif semi-conducteur a grille enveloppante et dispositif obtenu
FR2738079B1 (fr) Dispositif a semiconducteurs, a tranchee, et procede de fabrication
FR2792458B1 (fr) Dispositif a semi-conducteur et son procede de fabrication
FR2741196B1 (fr) Module de conversion thermoelectrique et procede de fabrication d'un tel module
FR2768836B1 (fr) Dispositif d'identification et procede de fabrication du dispositif associe
FR2682811B1 (fr) Dispositif a semiconducteurs de type empile et procede de fabrication.
FR2798223B1 (fr) Dispositif a semiconducteur et procede de fabrication de celui-ci
FR2776833B1 (fr) Condensateur ferroelectrique et procede de fabrication d'un dispositif semi-conducteur le comprenant
FR2767603B1 (fr) Procede de fabrication d'un dispositif a semiconducteur sur un substrat semiconducteur
FR2791470B1 (fr) Circuit integre monolithique incorporant un composant inductif et procede de fabrication d'un tel circuit integre
FR2793021B1 (fr) Capteur de temperature et procede de fabrication d'un tel capteur
FR2691836B1 (fr) Procede de fabrication d'un dispositif a semi-conducteurs comportant au moins une puce et dispositif correspondant.
FR2724489B1 (fr) Dispositif a semiconducteur et son procede de fabrication
FR2752334B1 (fr) Dispositif a semiconducteurs muni d'un cadre de montage et son procede de fabrication
FR2750799B1 (fr) Dispositif a semiconducteurs empechant le deverrouillage et procede de fabrication de ce dispositif
FR2778495B1 (fr) Dispositif semiconducteur a structure mos et procede de fabrication d'un tel dispositif
FR2759495B1 (fr) Dispositif semiconducteur en polymere comportant au moins une fonction redresseuse et procede de fabrication d'un tel dispositif
FR2797712B1 (fr) Dispositif emetteur d'electrons et procede de fabrication d'un tel dispositif
FR2800911B1 (fr) Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
FR2800909B1 (fr) Boitier semi-conducteur optique et procede de fabrication d'un tel boitier
FR2770030B1 (fr) Dispositif a semiconducteur comprenant un transistor mos et procede de fabrication
FR2665982B1 (fr) Dispositif de memoire a semi-conducteur a haut degre d'integration et procede de fabrication d'un tel dispositif.
FR2694657B1 (fr) Dispositif a semiconducteurs et procede de fabrication.
FR2776124B1 (fr) Dispositif semiconducteur a diode et procede de fabrication

Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20110801