FR2665280B1 - Procede de production d'une carte a circuit integre et carte obtenue. - Google Patents

Procede de production d'une carte a circuit integre et carte obtenue.

Info

Publication number
FR2665280B1
FR2665280B1 FR9109363A FR9109363A FR2665280B1 FR 2665280 B1 FR2665280 B1 FR 2665280B1 FR 9109363 A FR9109363 A FR 9109363A FR 9109363 A FR9109363 A FR 9109363A FR 2665280 B1 FR2665280 B1 FR 2665280B1
Authority
FR
France
Prior art keywords
card
producing
integrated circuit
circuit card
obtained card
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9109363A
Other languages
English (en)
Other versions
FR2665280A1 (fr
Inventor
Shojiro Kodai
Katsunori Ochi
Osamu Murakami
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Publication of FR2665280A1 publication Critical patent/FR2665280A1/fr
Application granted granted Critical
Publication of FR2665280B1 publication Critical patent/FR2665280B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/0772—Physical layout of the record carrier
    • G06K19/07724—Physical layout of the record carrier the record carrier being at least partially made by a molding process
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14647—Making flat card-like articles with an incorporated IC or chip module, e.g. IC or chip cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Credit Cards Or The Like (AREA)
FR9109363A 1990-07-25 1991-07-24 Procede de production d'une carte a circuit integre et carte obtenue. Expired - Fee Related FR2665280B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2200706A JP2560895B2 (ja) 1990-07-25 1990-07-25 Ｉｃカードの製造方法およびｉｃカード

Publications (2)

Publication Number Publication Date
FR2665280A1 FR2665280A1 (fr) 1992-01-31
FR2665280B1 true FR2665280B1 (fr) 1996-08-09

Family

ID=16428876

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9109363A Expired - Fee Related FR2665280B1 (fr) 1990-07-25 1991-07-24 Procede de production d'une carte a circuit integre et carte obtenue.

Country Status (3)

Country Link
US (2) US5272374A (fr)
JP (1) JP2560895B2 (fr)
FR (1) FR2665280B1 (fr)

Families Citing this family (73)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2684235B1 (fr) * 1991-11-25 1999-12-10 Gemplus Card Int Carte a circuit integre comprenant des moyens de protection du circuit integre.
JP2774906B2 (ja) * 1992-09-17 1998-07-09 三菱電機株式会社 薄形半導体装置及びその製造方法
JPH06312593A (ja) 1993-04-28 1994-11-08 Toshiba Corp 外部記憶装置、外部記憶装置ユニットおよび外部記憶装置の製造方法
KR950704758A (ko) * 1993-10-18 1995-11-20 가나미야지 준 IC 모듈과 그것을 사용한 데이터 커리어(Ic module using it on data carrier)
FR2716555B1 (fr) * 1994-02-24 1996-05-15 Gemplus Card Int Procédé de fabrication d'une carte sans contact.
US5508231A (en) * 1994-03-07 1996-04-16 National Semiconductor Corporation Apparatus and method for achieving mechanical and thermal isolation of portions of integrated monolithic circuits
JP3383398B2 (ja) * 1994-03-22 2003-03-04 株式会社東芝 半導体パッケージ
JP2829494B2 (ja) * 1994-07-15 1998-11-25 新光ネームプレート株式会社 メモリカード及びその製造方法
DE4435802A1 (de) * 1994-10-06 1996-04-11 Giesecke & Devrient Gmbh Verfahren zur Herstellung von Datenträgern mit eingebetteten Elementen und Vorrichtung zur Durchführung des Verfahrens
JP3388921B2 (ja) * 1994-11-29 2003-03-24 株式会社東芝 集積回路カードの製造方法
JP3660382B2 (ja) * 1995-02-03 2005-06-15 株式会社東芝 情報記憶装置およびそれに用いるコネクタ部
US6471130B2 (en) * 1995-02-03 2002-10-29 Kabushiki Kaisha Toshiba Information storage apparatus and information processing apparatus using the same
USRE38997E1 (en) * 1995-02-03 2006-02-28 Kabushiki Kaisha Toshiba Information storage and information processing system utilizing state-designating member provided on supporting card surface which produces write-permitting or write-inhibiting signal
WO1996034362A1 (fr) * 1995-04-24 1996-10-31 Elco Corporation Carte a circuits integres
TW381236B (en) * 1995-07-07 2000-02-01 Docusystem Inc Integrated circuit chip card and the method and system for the manufacture same
JPH0964240A (ja) 1995-08-25 1997-03-07 Toshiba Corp 半導体装置および半導体装置の製造方法
US5892213A (en) * 1995-09-21 1999-04-06 Yamaichi Electronics Co., Ltd. Memory card
JP2799310B2 (ja) * 1996-04-02 1998-09-17 山一電機株式会社 メモリーカード稼動電子機器におけるｉｃ保護装置
KR100209259B1 (ko) * 1996-04-25 1999-07-15 이해규 Ic 카드 및 그 제조방법
US5956601A (en) * 1996-04-25 1999-09-21 Kabushiki Kaisha Toshiba Method of mounting a plurality of semiconductor devices in corresponding supporters
US6022763A (en) * 1996-05-10 2000-02-08 Kabushiki Kaisha Toshiba Substrate for semiconductor device, semiconductor device using the same, and method for manufacture thereof
TW332334B (en) * 1996-05-31 1998-05-21 Toshiba Co Ltd The semiconductor substrate and its producing method and semiconductor apparatus
JPH09327990A (ja) * 1996-06-11 1997-12-22 Toshiba Corp カード型記憶装置
US6001672A (en) * 1997-02-25 1999-12-14 Micron Technology, Inc. Method for transfer molding encapsulation of a semiconductor die with attached heat sink
JPH10302030A (ja) * 1997-02-28 1998-11-13 Toshiba Corp 接続装置、および情報処理装置
US5955021A (en) * 1997-05-19 1999-09-21 Cardxx, Llc Method of making smart cards
US5961909A (en) * 1997-09-03 1999-10-05 Pmt Corporation Method of manufacture of tissue-conformable electrodes
US6025054A (en) * 1997-09-08 2000-02-15 Cardxx, Inc. Smart cards having glue-positioned electronic components
US6091993A (en) * 1998-02-19 2000-07-18 American Medical Systems, Inc. Methods and apparatus for an electrode balloon
EP0942392A3 (fr) * 1998-03-13 2000-10-18 Kabushiki Kaisha Toshiba Carte à puce
US6241153B1 (en) 1998-03-17 2001-06-05 Cardxx, Inc. Method for making tamper-preventing, contact-type, smart cards
US6256873B1 (en) 1998-03-17 2001-07-10 Cardxx, Inc. Method for making smart cards using isotropic thermoset adhesive materials
FR2778817B1 (fr) * 1998-05-18 2000-06-30 Remy Kirchdoerffer Procede de fabrication d'un appareil ou d'un instrument par surmoulage et appareil ou instrument ainsi obtenu
US6040622A (en) * 1998-06-11 2000-03-21 Sandisk Corporation Semiconductor package using terminals formed on a conductive layer of a circuit board
JP4470242B2 (ja) 1999-04-23 2010-06-02 ソニー株式会社 半導体メモリカード
FR2794059B1 (fr) * 1999-05-31 2001-08-10 Gemplus Card Int Dispositif portable a circuit integre et procede de fabrication
US6634561B1 (en) 1999-06-24 2003-10-21 Sandisk Corporation Memory card electrical contact structure
FR2805639B1 (fr) * 2000-02-29 2002-05-24 Schlumberger Systems & Service Procede de fixation d'un module a un corps de carte
US6433285B2 (en) * 2000-03-30 2002-08-13 Matsushita Electronics Corporation Printed wiring board, IC card module using the same, and method for producing IC card module
WO2002082364A1 (fr) * 2001-04-02 2002-10-17 Hitachi, Ltd. Dispositif semi-conducteur et son procédé de production
US7220615B2 (en) * 2001-06-11 2007-05-22 Micron Technology, Inc. Alternative method used to package multimedia card by transfer molding
US20050019989A1 (en) * 2001-11-23 2005-01-27 Francois Droz Method for making a module comprising at least an electronic component
US7037455B2 (en) * 2001-12-21 2006-05-02 Mattel, Inc. Insert molding method
JP4094394B2 (ja) * 2002-09-30 2008-06-04 株式会社ルネサステクノロジ Ｉｃカードおよびその製造方法
DE10340129B4 (de) * 2003-08-28 2006-07-13 Infineon Technologies Ag Elektronisches Modul mit Steckkontakten und Verfahren zur Herstellung desselben
US7573048B2 (en) * 2004-10-08 2009-08-11 Patel Gordhanbhai N Tamper resistant self indicating instant alert radiation dosimeter
US7225537B2 (en) * 2005-01-27 2007-06-05 Cardxx, Inc. Method for making memory cards and similar devices using isotropic thermoset materials with high quality exterior surfaces
US8012809B2 (en) 2005-03-23 2011-09-06 Cardxx, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US7237724B2 (en) * 2005-04-06 2007-07-03 Robert Singleton Smart card and method for manufacturing a smart card
US7607249B2 (en) * 2005-07-15 2009-10-27 Innovatier Inc. RFID bracelet and method for manufacturing a RFID bracelet
FR2895548B1 (fr) * 2005-12-26 2008-03-21 Oberthur Card Syst Sa Procede de fabrication d'une carte a microcircuit, et carte a microcircuit associee
KR101325422B1 (ko) * 2006-04-10 2013-11-04 이노배티어, 인코프레이티드 전자 카드 및 태그용 전자 인레이 모듈, 전자 카드 및 그러한 전자 인레이 모듈과 전자 카드를 제조하는 방법
WO2007147727A1 (fr) * 2006-06-19 2007-12-27 Nagraid S.A. Procede de fabrication de cartes comprenant chacune un module electronique et produits intermediaires
WO2007147729A1 (fr) * 2006-06-19 2007-12-27 Nagraid S.A. Procede de fabrication de cartes comprenant au moins un module electronique, ensemble intervenant dans ce procede et produit intermediaire
US20070290048A1 (en) * 2006-06-20 2007-12-20 Innovatier, Inc. Embedded electronic device and method for manufacturing an embedded electronic device
US20080160397A1 (en) * 2006-08-25 2008-07-03 Innovatier, Inc Battery powered device having a protective frame
US20080055824A1 (en) * 2006-08-25 2008-03-06 Innovatier, Inc. Battery powered device having a protective frame
US7736568B2 (en) 2006-09-19 2010-06-15 Mattel, Inc. Systems and methods of incorporating preformed items into a molded article
PL2132684T3 (pl) 2007-02-09 2013-03-29 Nagravision Sa Sposób produkcji kart elektronicznych zawierających co najmniej jeden nadrukowany wzór
EP2138019A4 (fr) * 2007-03-23 2011-05-04 Innovatier Inc Carte à étage et procédé de fabrication d'une carte à étage
US20080282540A1 (en) * 2007-05-14 2008-11-20 Innovatier, Inc. Method for making advanced smart cards with integrated electronics using isotropic thermoset adhesive materials with high quality exterior surfaces
US20090096614A1 (en) * 2007-10-15 2009-04-16 Innovatier, Inc. Rfid power bracelet and method for manufacturing a rfid power bracelet
US20090181215A1 (en) * 2008-01-15 2009-07-16 Innovatier, Inc. Plastic card and method for making a plastic card
US8080444B2 (en) * 2010-01-14 2011-12-20 Freescale Semiconductor, Inc. Method for forming a packaged semiconductor device having a ground plane
CN102884871B (zh) 2010-04-05 2017-06-16 因诺瓦蒂尔公司 预先层压芯及用于制造电子卡及标签用的预先层压芯的方法
USD691610S1 (en) 2011-11-07 2013-10-15 Blackberry Limited Device smart card
US8950681B2 (en) 2011-11-07 2015-02-10 Blackberry Limited Universal integrated circuit card apparatus and related methods
USD703208S1 (en) * 2012-04-13 2014-04-22 Blackberry Limited UICC apparatus
US8936199B2 (en) 2012-04-13 2015-01-20 Blackberry Limited UICC apparatus and related methods
USD701864S1 (en) * 2012-04-23 2014-04-01 Blackberry Limited UICC apparatus
WO2017066464A1 (fr) 2015-10-14 2017-04-20 Capital One Services, Llc Poche moulée pendant la fabrication d'une carte de transaction
US11166363B2 (en) * 2019-01-11 2021-11-02 Tactotek Oy Electrical node, method for manufacturing electrical node and multilayer structure comprising electrical node
WO2023034642A1 (fr) 2021-09-06 2023-03-09 Metaland Llc Encapsulation d'une incrustation métallique avec de la résine thermodurcissable et procédé de fabrication d'une carte de transaction métallique

Family Cites Families (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1219570A (en) * 1967-08-04 1971-01-20 Lucas Industries Ltd Diode units
US4216577A (en) * 1975-12-31 1980-08-12 Compagnie Internationale Pour L'informatique Cii-Honeywell Bull (Societe Anonyme) Portable standardized card adapted to provide access to a system for processing electrical signals and a method of manufacturing such a card
JPS55120153A (en) * 1979-03-08 1980-09-16 Toshiba Corp Resin molded semiconductor device
US4483067A (en) * 1981-09-11 1984-11-20 U.S. Philips Corporation Method of manufacturing an identification card and an identification manufactured, for example, by this method
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
DE3248385A1 (de) * 1982-12-28 1984-06-28 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit integriertem schaltkreis
JPS60189587A (ja) * 1984-03-09 1985-09-27 Dainippon Printing Co Ltd Ｉｃカ−ド
JPS60217492A (ja) * 1984-04-12 1985-10-31 Sony Corp カ−ド状小型電子機器
JPS60252992A (ja) * 1984-05-30 1985-12-13 Toshiba Corp Ｉｃカ−ド
JPS61188871U (fr) * 1985-05-16 1986-11-25
JPS6232094A (ja) * 1985-08-05 1987-02-12 カシオ計算機株式会社 Ｉｃカ−ド
JPS62154868U (fr) * 1985-08-09 1987-10-01
US4701999A (en) * 1985-12-17 1987-10-27 Pnc, Inc. Method of making sealed housings containing delicate structures
JPS62220397A (ja) * 1986-03-20 1987-09-28 新光電気工業株式会社 Ｉｃカ−ド
JPH074995B2 (ja) * 1986-05-20 1995-01-25 株式会社東芝 Ｉｃカ−ド及びその製造方法
JPS63144095A (ja) * 1986-12-09 1988-06-16 株式会社東芝 Ｉｃカ−ド
JPS63233893A (ja) * 1987-03-23 1988-09-29 松下電子工業株式会社 Ｉｃカ−ドの製造方法
FR2617666B1 (fr) * 1987-07-02 1989-10-27 Bull Cp8 Carte a microcircuits electroniques et son procede de fabrication
US4916522A (en) * 1988-04-21 1990-04-10 American Telephone And Telegraph Company , At & T Bell Laboratories Integrated circuit package using plastic encapsulant
US4961893A (en) * 1988-04-28 1990-10-09 Schlumberger Industries Method for manufacturing memory cards
FR2632100B1 (fr) * 1988-05-25 1992-02-21 Schlumberger Ind Sa Procede de realisation d'une carte a memoire electronique et cartes a memoire electronique obtenue par la mise en oeuvre dudit procede
FR2636453B1 (fr) * 1988-09-14 1992-01-17 Sgs Thomson Microelectronics Procede d'encapsulation de circuits-integres notamment pour cartes a puces
JP2559834B2 (ja) * 1989-01-12 1996-12-04 三菱電機株式会社 Ｉｃカード
FR2650530B1 (fr) * 1989-08-07 1991-11-29 Schlumberger Ind Sa Procede de realisation de corps de carte avec graphisme
US5214846A (en) * 1991-04-24 1993-06-01 Sony Corporation Packaging of semiconductor chips

Also Published As

Publication number Publication date
US5498388A (en) 1996-03-12
JP2560895B2 (ja) 1996-12-04
US5272374A (en) 1993-12-21
FR2665280A1 (fr) 1992-01-31
JPH0482799A (ja) 1992-03-16

Similar Documents

Publication Publication Date Title
FR2665280B1 (fr) Procede de production d'une carte a circuit integre et carte obtenue.
FR2660092B1 (fr) Procede de fabrication d'une carte a circuit integre.
FR2659157B2 (fr) Procede de fabrication d'une carte dite carte a puce, et carte obtenue par ce procede.
FR2663784B1 (fr) Procede de realisation d'un etage d'un circuit integre.
FR2687817B1 (fr) Carte a circuit integre mince et procede de fabrication.
FR2687816B1 (fr) Procede de personnalisation d'une carte a puce.
FR2507800B1 (fr) Procede de fabrication d'une carte d'identification comportant un module incorpore a circuit integre
FR2661761B1 (fr) Carte a circuit integre.
FR2691817B1 (fr) Procede et carte electronique pour le developpement d'un circuit integre.
BE889816A (fr) Carte d'identification comportant un module a circuit integre et procede de fabrication
FR2646942B1 (fr) Carte a circuit integre
FR2548857B1 (fr) Procede de fabrication en continu d'une carte imprimee
FR2684471B1 (fr) Procede de fabrication d'une carte a memoire et carte a memoire ainsi obtenue.
AR243696A1 (es) Procedimiento de realizacion de una tarjeta de memoria electronica y tarjeta asi obtenida.
DE69204005D1 (de) Herstellungsverfahren von elektronischen Komponenten.
FR2781298B1 (fr) Procede de fabrication d'une carte a puce electronique et carte a puce electronique
FR2659673B1 (fr) Procede de fabrication de papier monnaie et similaire.
DE3789990D1 (de) Elektronisches Druckverfahren.
FR2691675B1 (fr) Elément support papier imprimé pour la fabrication de cartes plastifiées et le procédé de fabrication de cartes plastifiées.
FR2649114B1 (fr) Polymere conducteur et procede de fabrication d'un tel polymere
FR2665281B1 (fr) Procede de fabrication d'une carte a microcircuit et carte obtenue par ce procede.
NO882101D0 (no) Elektronisk voteringsmaskin.
FR2671417B1 (fr) Procede pour la fabrication d'une carte a memoire et carte a memoire ainsi obtenue .
DE69020023D1 (de) Feinmusterherstellungsverfahren.
IT1241342B (it) Macchina per scrivere elettronica.

Legal Events

Date Code Title Description
ST Notification of lapse