FR2711275B1 - Procédé automatiquement aligné de contact en fabrication de semi-conducteurs et dispositifs produits. - Google Patents

Procédé automatiquement aligné de contact en fabrication de semi-conducteurs et dispositifs produits.

Info

Publication number
FR2711275B1
FR2711275B1 FR9411951A FR9411951A FR2711275B1 FR 2711275 B1 FR2711275 B1 FR 2711275B1 FR 9411951 A FR9411951 A FR 9411951A FR 9411951 A FR9411951 A FR 9411951A FR 2711275 B1 FR2711275 B1 FR 2711275B1
Authority
FR
France
Prior art keywords
semiconductor
device manufacturing
aligned contact
contact process
automatically aligned
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9411951A
Other languages
English (en)
Other versions
FR2711275A1 (fr
Inventor
Krishna K Parat
Glen N Wada
Gregory E Atwood
Daniel N Tang
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Intel Corp
Original Assignee
Intel Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Intel Corp filed Critical Intel Corp
Publication of FR2711275A1 publication Critical patent/FR2711275A1/fr
Application granted granted Critical
Publication of FR2711275B1 publication Critical patent/FR2711275B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/71—Manufacture of specific parts of devices defined in group H01L21/70
    • H01L21/768—Applying interconnections to be used for carrying current between separate components within a device comprising conductors and dielectrics
    • H01L21/76897—Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/482—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body
    • H01L23/485—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of lead-in layers inseparably applied to the semiconductor body consisting of layered constructions comprising conductive layers and insulating layers, e.g. planar contacts
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B41/00—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates
    • H10B41/30—Electrically erasable-and-programmable ROM [EEPROM] devices comprising floating gates characterised by the memory core region
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10B—ELECTRONIC MEMORY DEVICES
    • H10B69/00—Erasable-and-programmable ROM [EPROM] devices not provided for in groups H10B41/00 - H10B63/00, e.g. ultraviolet erasable-and-programmable ROM [UVEPROM] devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Semiconductor Memories (AREA)
  • Non-Volatile Memory (AREA)
  • Insulated Gate Type Field-Effect Transistor (AREA)
  • Electrodes Of Semiconductors (AREA)
FR9411951A 1993-10-15 1994-10-06 Procédé automatiquement aligné de contact en fabrication de semi-conducteurs et dispositifs produits. Expired - Fee Related FR2711275B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US13874193A 1993-10-15 1993-10-15

Publications (2)

Publication Number Publication Date
FR2711275A1 FR2711275A1 (fr) 1995-04-21
FR2711275B1 true FR2711275B1 (fr) 1996-10-31

Family

ID=22483421

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9411951A Expired - Fee Related FR2711275B1 (fr) 1993-10-15 1994-10-06 Procédé automatiquement aligné de contact en fabrication de semi-conducteurs et dispositifs produits.

Country Status (3)

Country Link
US (2) US5731242A (fr)
JP (1) JPH07169866A (fr)
FR (1) FR2711275B1 (fr)

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Also Published As

Publication number Publication date
US6194784B1 (en) 2001-02-27
FR2711275A1 (fr) 1995-04-21
US5731242A (en) 1998-03-24
JPH07169866A (ja) 1995-07-04

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