FR2647624B1 - Attache dissipatrice de chaleur d'un element electronique ou equivalent - Google Patents

Attache dissipatrice de chaleur d'un element electronique ou equivalent

Info

Publication number
FR2647624B1
FR2647624B1 FR9002337A FR9002337A FR2647624B1 FR 2647624 B1 FR2647624 B1 FR 2647624B1 FR 9002337 A FR9002337 A FR 9002337A FR 9002337 A FR9002337 A FR 9002337A FR 2647624 B1 FR2647624 B1 FR 2647624B1
Authority
FR
France
Prior art keywords
electronic
heat dissipating
equivalent element
dissipating attachment
attachment
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
FR9002337A
Other languages
English (en)
French (fr)
Other versions
FR2647624A1 (fr
Inventor
Roth Helmut
Soehner Gerhard
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Robert Bosch GmbH
Original Assignee
Robert Bosch GmbH
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Robert Bosch GmbH filed Critical Robert Bosch GmbH
Publication of FR2647624A1 publication Critical patent/FR2647624A1/fr
Application granted granted Critical
Publication of FR2647624B1 publication Critical patent/FR2647624B1/fr
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20845—Modifications to facilitate cooling, ventilating, or heating for automotive electronic casings
    • H05K7/20854—Heat transfer by conduction from internal heat source to heat radiating structure
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4334—Auxiliary members in encapsulations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/4847—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond
    • H01L2224/48472—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a wedge bond the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
    • H01L2924/191—Disposition
    • H01L2924/19101—Disposition of discrete passive components
    • H01L2924/19107—Disposition of discrete passive components off-chip wires
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09009—Substrate related
    • H05K2201/09118—Moulded substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/0999—Circuit printed on or in housing, e.g. housing as PCB; Circuit printed on the case of a component; PCB affixed to housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10416—Metallic blocks or heatsinks completely inserted in a PCB
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04—Soldering or other types of metallurgic bonding
    • H05K2203/049—Wire bonding

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
FR9002337A 1989-05-24 1990-02-26 Attache dissipatrice de chaleur d'un element electronique ou equivalent Expired - Fee Related FR2647624B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE19893916899 DE3916899C2 (de) 1989-05-24 1989-05-24 Gehäuse zur Aufnahme einer elektronischen Schaltung

Publications (2)

Publication Number Publication Date
FR2647624A1 FR2647624A1 (fr) 1990-11-30
FR2647624B1 true FR2647624B1 (fr) 1994-04-01

Family

ID=6381303

Family Applications (1)

Application Number Title Priority Date Filing Date
FR9002337A Expired - Fee Related FR2647624B1 (fr) 1989-05-24 1990-02-26 Attache dissipatrice de chaleur d'un element electronique ou equivalent

Country Status (2)

Country Link
DE (1) DE3916899C2 (de)
FR (1) FR2647624B1 (de)

Families Citing this family (25)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2812014B2 (ja) * 1991-10-21 1998-10-15 株式会社日立製作所 半導体装置
FR2692427B1 (fr) * 1992-06-15 1994-09-02 Merlin Gerin Appareillage électrique incluant un circuit hybride et son procédé de fabrication.
DE4224720A1 (de) * 1992-07-27 1994-02-03 Duerrwaechter E Dr Doduco Gehäuse für eine elektronische Schaltung mit einem Leistungshalbleiter
DE19734128C5 (de) * 1997-08-07 2004-09-23 Conti Temic Microelectronic Gmbh Kunststoffgehäuse mit einem Metalleinlegeteil in einem Montageflansch
US6147869A (en) * 1997-11-24 2000-11-14 International Rectifier Corp. Adaptable planar module
DE19855389C2 (de) † 1998-12-01 2002-10-31 Siemens Ag Elektronische Vorrichtung
DE19959985A1 (de) * 1999-12-13 2001-07-05 Tyco Electronics Logistics Ag Elektronischer Trennschalter
US6703703B2 (en) 2000-01-12 2004-03-09 International Rectifier Corporation Low cost power semiconductor module without substrate
DE10014457B4 (de) * 2000-03-23 2005-02-03 Grauvogel, Ulrich, Dipl.-Ing. Kühlkörper mit einem Gehäuse für eine wärmeabgebende elektronische Schaltung
DE10038092A1 (de) 2000-08-04 2002-02-14 Bosch Gmbh Robert Verfahren zur elektrischen Verbindung eines Halbleiterbauelements mit einer elektrischen Baugruppe
DE10056474B4 (de) * 2000-11-15 2004-10-28 Epcos Ag Gehäuse, Gehäuseanordnung, Elektrolyt-Kondensator mit dem Gehäuse und Anordnung des Elektrolyt-Kondensators
DE10065857B4 (de) * 2000-12-22 2005-04-14 Siemens Ag Wärmeübertragungsanordnung für ein Kuststoffgehäuse elektronischer Baugruppen
DE10131601A1 (de) * 2001-06-29 2003-01-16 Swoboda Gmbh Geb Verfahren zur Herstellung von Gehäuseteilen
DE20112595U1 (de) 2001-07-31 2002-01-17 Trw Automotive Electron & Comp Gehäuse zur Aufnahme einer Leiterplatte mit elektronischen Bauteilen
DE10247828B4 (de) * 2002-10-14 2005-03-03 Siemens Ag Wärmeableitendes und -abstrahlendes Kuststoffgehäuse mit Kühl-/Tragrippen und umpritztem Kühlkörper und Verfahren zu dessen Fertigung
DE10349775B4 (de) * 2003-10-24 2006-05-11 Sitronic Gmbh & Co. Kg Schaltungsträger für Leuchtdioden
DE102011088970A1 (de) * 2011-12-19 2013-06-20 Robert Bosch Gmbh Steuergerät und Verfahren zum Herstellen eines Steuergeräts für ein Kraftfahrzeug
DE102012207675A1 (de) 2012-05-09 2013-11-14 Robert Bosch Gmbh Anordnung zur Wärmeableitung für ein Kunststoffgehäuse mit darin angeordneten elektronischen Bauelementen
WO2015193026A1 (de) * 2014-06-16 2015-12-23 Robert Bosch Gmbh Steuergerät mit wärmeleitfähiger gehäusewand
DE102015206480A1 (de) 2015-04-10 2016-10-13 Robert Bosch Gmbh Steuergerät
DE102015112186A1 (de) 2015-07-27 2017-02-02 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Kniefänger mit Wärmeleitvorrichtung
DE102016226143A1 (de) 2016-12-23 2018-06-28 Robert Bosch Gmbh Verbundbauteil und Verwendung eines Verbundbauteils
DE102017211048A1 (de) * 2017-06-29 2019-01-03 Robert Bosch Gmbh Gehäuse und Verfahren zur Herstellung eines Gehäuses
DE102020211078A1 (de) * 2020-09-02 2022-03-03 Robert Bosch Gesellschaft mit beschränkter Haftung Steuervorrichtung, insbesondere Lenkungssteuervorrichtung
DE102020127026A1 (de) 2020-10-14 2022-04-14 Bayerische Motoren Werke Aktiengesellschaft Halter für ein Steuergerät eines Fahrzeugs und Fahrzeug

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1302487B (de) * 1966-08-03
GB2085434B (en) * 1977-10-11 1982-12-08 Glaxo Group Ltd Furan derivatives
DE2919058A1 (de) * 1979-05-10 1980-11-20 Siemens Ag Elektronisches geraet mit mindestens einer leiterplatte
US4775917A (en) * 1985-12-03 1988-10-04 Wells Manufacturing Company Thermal compensated circuit board interconnect apparatus and method of forming the same
DE3604074A1 (de) * 1986-02-08 1987-08-13 Bosch Gmbh Robert Zuendschaltgeraet
GB2189350B (en) * 1986-04-16 1989-11-29 Marconi Electronic Devices Electrical circuits
FR2620296B1 (fr) * 1987-09-03 1990-01-19 Bendix Electronics Sa Boitier pour circuit electronique
DE8715073U1 (de) * 1987-11-12 1988-02-25 Siemens AG, 1000 Berlin und 8000 München Elektronische Baueinheit zur Steuerung von Funktionen eines Kraftfahrzeugs
FR2629665B1 (fr) * 1988-03-30 1991-01-11 Bendix Electronics Sa Boitier pour circuit electronique

Also Published As

Publication number Publication date
FR2647624A1 (fr) 1990-11-30
DE3916899C2 (de) 2003-04-03
DE3916899A1 (de) 1990-11-29

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Legal Events

Date Code Title Description
ST Notification of lapse

Effective date: 20091030