FR2692427B1 - Appareillage électrique incluant un circuit hybride et son procédé de fabrication. - Google Patents
Appareillage électrique incluant un circuit hybride et son procédé de fabrication.Info
- Publication number
- FR2692427B1 FR2692427B1 FR929207324A FR9207324A FR2692427B1 FR 2692427 B1 FR2692427 B1 FR 2692427B1 FR 929207324 A FR929207324 A FR 929207324A FR 9207324 A FR9207324 A FR 9207324A FR 2692427 B1 FR2692427 B1 FR 2692427B1
- Authority
- FR
- France
- Prior art keywords
- manufacturing process
- electrical equipment
- equipment including
- hybrid circuit
- hybrid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
- H01L25/165—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01014—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR929207324A FR2692427B1 (fr) | 1992-06-15 | 1992-06-15 | Appareillage électrique incluant un circuit hybride et son procédé de fabrication. |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR929207324A FR2692427B1 (fr) | 1992-06-15 | 1992-06-15 | Appareillage électrique incluant un circuit hybride et son procédé de fabrication. |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2692427A1 FR2692427A1 (fr) | 1993-12-17 |
FR2692427B1 true FR2692427B1 (fr) | 1994-09-02 |
Family
ID=9430824
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR929207324A Expired - Fee Related FR2692427B1 (fr) | 1992-06-15 | 1992-06-15 | Appareillage électrique incluant un circuit hybride et son procédé de fabrication. |
Country Status (1)
Country | Link |
---|---|
FR (1) | FR2692427B1 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE10323146A1 (de) * | 2003-05-22 | 2004-12-09 | Robert Bosch Gmbh | Gehäuse zu definierten Verfüllung |
DE102005059082A1 (de) * | 2005-12-10 | 2007-06-14 | Danfoss A/S | Verfahren zum Vergießen elektrischer Komponenten und Gehäuseanordnung |
US8184440B2 (en) * | 2009-05-01 | 2012-05-22 | Abl Ip Holding Llc | Electronic apparatus having an encapsulating layer within and outside of a molded frame overlying a connection arrangement on a circuit board |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0193661B1 (fr) * | 1985-03-04 | 1990-07-18 | Sumitomo Electric Industries, Ltd. | Diode et connecteur à diode incorporée |
DE3916899C2 (de) * | 1989-05-24 | 2003-04-03 | Bosch Gmbh Robert | Gehäuse zur Aufnahme einer elektronischen Schaltung |
DE4033999A1 (de) * | 1990-10-25 | 1992-04-30 | Siemens Ag | Schaltungsmodul mit sicherheitsgehaeuse |
DE4038788A1 (de) * | 1990-12-05 | 1992-06-11 | Bsg Schalttechnik | Gehaeuse fuer elektrische schaltungen |
-
1992
- 1992-06-15 FR FR929207324A patent/FR2692427B1/fr not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2692427A1 (fr) | 1993-12-17 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |