FR2559956B1 - Boitier en metal et resine pour dispositif a semi-conducteur, susceptible d'etre fixe sur un dissipateur non parfaitement plan, et son procede de fabrication - Google Patents

Boitier en metal et resine pour dispositif a semi-conducteur, susceptible d'etre fixe sur un dissipateur non parfaitement plan, et son procede de fabrication

Info

Publication number
FR2559956B1
FR2559956B1 FR8416055A FR8416055A FR2559956B1 FR 2559956 B1 FR2559956 B1 FR 2559956B1 FR 8416055 A FR8416055 A FR 8416055A FR 8416055 A FR8416055 A FR 8416055A FR 2559956 B1 FR2559956 B1 FR 2559956B1
Authority
FR
France
Prior art keywords
dissipator
manufacturing
metal
semiconductor device
fixed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
FR8416055A
Other languages
English (en)
Other versions
FR2559956A1 (fr
Inventor
Luigi Romano
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
STMicroelectronics SRL
Original Assignee
ATES Componenti Elettronici SpA
SGS ATES Componenti Elettronici SpA
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ATES Componenti Elettronici SpA, SGS ATES Componenti Elettronici SpA filed Critical ATES Componenti Elettronici SpA
Publication of FR2559956A1 publication Critical patent/FR2559956A1/fr
Application granted granted Critical
Publication of FR2559956B1 publication Critical patent/FR2559956B1/fr
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H01L23/49562—Geometry of the lead-frame for devices being provided for in H01L29/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4037—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink
    • H01L2023/405—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws characterised by thermal path or place of attachment of heatsink heatsink to package
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H01L23/4006—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs with bolts or screws
    • H01L2023/4075—Mechanical elements
    • H01L2023/4087—Mounting accessories, interposers, clamping or screwing parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
FR8416055A 1983-10-21 1984-10-19 Boitier en metal et resine pour dispositif a semi-conducteur, susceptible d'etre fixe sur un dissipateur non parfaitement plan, et son procede de fabrication Expired FR2559956B1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT8323385A IT1212780B (it) 1983-10-21 1983-10-21 Contenitore in metallo e resina per dispositivo a semiconduttore adatto al fissaggio su un dissipatore non perfettamente piano e processo per la sua fabbricazione.

Publications (2)

Publication Number Publication Date
FR2559956A1 FR2559956A1 (fr) 1985-08-23
FR2559956B1 true FR2559956B1 (fr) 1987-12-18

Family

ID=11206617

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8416055A Expired FR2559956B1 (fr) 1983-10-21 1984-10-19 Boitier en metal et resine pour dispositif a semi-conducteur, susceptible d'etre fixe sur un dissipateur non parfaitement plan, et son procede de fabrication

Country Status (8)

Country Link
US (1) US5001547A (fr)
JP (1) JPS60121744A (fr)
KR (1) KR910009781B1 (fr)
DE (1) DE3438435C2 (fr)
FR (1) FR2559956B1 (fr)
GB (1) GB2148597B (fr)
IT (1) IT1212780B (fr)
NL (1) NL8403177A (fr)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IT1201836B (it) * 1986-07-17 1989-02-02 Sgs Microelettronica Spa Dispositivo a semiconduttore montato in un contenitore segmentato altamente flessibile e fornite di dissipatore termico
US5175610A (en) * 1990-05-09 1992-12-29 Kabushiki Kaisha Toshiba Resin molded type semiconductor device having a metallic plate support
JP2001035977A (ja) * 1999-07-26 2001-02-09 Nec Corp 半導体装置用容器
US6898072B2 (en) * 2002-01-16 2005-05-24 Rockwell Automation Technologies, Inc. Cooled electrical terminal assembly and device incorporating same
US7142434B2 (en) 2002-01-16 2006-11-28 Rockwell Automation Technologies, Inc. Vehicle drive module having improved EMI shielding
US7187568B2 (en) * 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved terminal structure
US6972957B2 (en) * 2002-01-16 2005-12-06 Rockwell Automation Technologies, Inc. Modular power converter having fluid cooled support
US7061775B2 (en) * 2002-01-16 2006-06-13 Rockwell Automation Technologies, Inc. Power converter having improved EMI shielding
US6965514B2 (en) * 2002-01-16 2005-11-15 Rockwell Automation Technologies, Inc. Fluid cooled vehicle drive module
US7177153B2 (en) 2002-01-16 2007-02-13 Rockwell Automation Technologies, Inc. Vehicle drive module having improved cooling configuration
US7187548B2 (en) 2002-01-16 2007-03-06 Rockwell Automation Technologies, Inc. Power converter having improved fluid cooling
US7032695B2 (en) * 2002-01-16 2006-04-25 Rockwell Automation Technologies, Inc. Vehicle drive module having improved terminal design
JP4457895B2 (ja) * 2005-01-14 2010-04-28 船井電機株式会社 電源装置、並びにそれに適用可能な放熱部材固定構造及び回路基板

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US1016728A (en) * 1911-07-26 1912-02-06 New Haven Electrical Mfg Co Electrical fitting.
FR75277E (fr) * 1959-03-06 1961-06-05 Prec Mecanique Labinal Perfectionnements apportés aux prises de courant
US3522490A (en) * 1965-06-28 1970-08-04 Texas Instruments Inc Semiconductor package with heat conducting mounting extending from package on side opposite conductor extensions
NL6903229A (fr) * 1969-03-01 1970-09-03
FR2233732B1 (fr) * 1973-06-15 1976-04-30 Unelec
IT7823238V0 (it) * 1978-11-08 1978-11-08 Ates Componenti Elettron Contenitore in metallo e resina per dispositivo a semiconduttore.
US4249034A (en) * 1978-11-27 1981-02-03 General Electric Company Semiconductor package having strengthening and sealing upper chamber
US4270138A (en) * 1979-03-02 1981-05-26 General Electric Company Enhanced thermal transfer package for a semiconductor device
JPS57149754A (en) * 1981-03-12 1982-09-16 Nec Corp Semiconductor device
FR2503932A1 (fr) * 1981-04-08 1982-10-15 Thomson Csf Boitiers a cosses plates pour composants semi-conducteurs de moyenne puissance et procede de fabrication
US4451973A (en) * 1981-04-28 1984-06-05 Matsushita Electronics Corporation Method for manufacturing a plastic encapsulated semiconductor device and a lead frame therefor
IT8224533A0 (it) * 1982-12-01 1982-12-01 Ora Sgs Microelettronica Spa S Contenitore in metallo e resina ad elevata affidabilita' per dispositivo a semiconduttore.
JPS59152653A (ja) * 1983-02-21 1984-08-31 Hitachi Ltd レジンパツケ−ジ型半導体装置
GB2147457A (en) * 1983-09-28 1985-05-09 Philips Electronic Associated Encapsulated semiconductor device with composite conductive leads

Also Published As

Publication number Publication date
FR2559956A1 (fr) 1985-08-23
DE3438435A1 (de) 1985-05-02
IT1212780B (it) 1989-11-30
KR850003065A (ko) 1985-05-28
KR910009781B1 (ko) 1991-11-30
GB8426633D0 (en) 1984-11-28
US5001547A (en) 1991-03-19
IT8323385A0 (it) 1983-10-21
GB2148597B (en) 1987-05-28
NL8403177A (nl) 1985-05-17
GB2148597A (en) 1985-05-30
JPS60121744A (ja) 1985-06-29
DE3438435C2 (de) 1994-06-01

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CD Change of name or company name
D6 Patent endorsed licences of rights
ST Notification of lapse