JPS57149754A - Semiconductor device - Google Patents

Semiconductor device

Info

Publication number
JPS57149754A
JPS57149754A JP3572881A JP3572881A JPS57149754A JP S57149754 A JPS57149754 A JP S57149754A JP 3572881 A JP3572881 A JP 3572881A JP 3572881 A JP3572881 A JP 3572881A JP S57149754 A JPS57149754 A JP S57149754A
Authority
JP
Japan
Prior art keywords
header
mounting
outside
semiconductor element
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP3572881A
Other languages
Japanese (ja)
Inventor
Hidetaka Ikuma
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP3572881A priority Critical patent/JPS57149754A/en
Publication of JPS57149754A publication Critical patent/JPS57149754A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/32—Holders for supporting the complete device in operation, i.e. detachable fixtures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H01L2924/1815—Shape

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE:To prevent the obstruction of the screw head of a bolt for mounting at the outside when mounting by forming a hole section, through which the screw head is received in a vessel in which a semiconductor element is received, to one part of the vessel. CONSTITUTION:The semiconductor element 12 is fixed onto a header 11, and an electrode formed to the element 12 is connected to one end of an external lead 13 mounted to an upper surface at one end of the header 11 by using a lead wire 14. The other end of the external lead 13 is sealed with resin 15 in an airtight manner while being projected to the outside, but the hole 16 penetrating even the header 11 is formed largely at one end section of the resin 15 so that the head of the screw 20 sinks at an upper end at that time. The header 11 is placed onto a radiator plate 19 and a printed substrate 17 to which holes are bored similarly, the bolt 20 for mounting at the outside is inserted into the holes while the screw head is sunk into the hole 16, and tightened, and the header, the semiconductor element, etc. are mounted integrally.
JP3572881A 1981-03-12 1981-03-12 Semiconductor device Pending JPS57149754A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3572881A JPS57149754A (en) 1981-03-12 1981-03-12 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3572881A JPS57149754A (en) 1981-03-12 1981-03-12 Semiconductor device

Publications (1)

Publication Number Publication Date
JPS57149754A true JPS57149754A (en) 1982-09-16

Family

ID=12449900

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3572881A Pending JPS57149754A (en) 1981-03-12 1981-03-12 Semiconductor device

Country Status (1)

Country Link
JP (1) JPS57149754A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001547A (en) * 1983-10-21 1991-03-19 Sgs Microelettronica S.P.A. Method and apparatus for improving thermal coupling between a cooling plate of a semiconductor package housing and a heat sink
WO2014148019A1 (en) * 2013-03-20 2014-09-25 株式会社デンソー Semiconductor device and method for manufacturing same
JPWO2017029696A1 (en) * 2015-08-14 2018-03-29 三菱電機株式会社 Air conditioner outdoor unit

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5001547A (en) * 1983-10-21 1991-03-19 Sgs Microelettronica S.P.A. Method and apparatus for improving thermal coupling between a cooling plate of a semiconductor package housing and a heat sink
WO2014148019A1 (en) * 2013-03-20 2014-09-25 株式会社デンソー Semiconductor device and method for manufacturing same
JP2014183242A (en) * 2013-03-20 2014-09-29 Denso Corp Semiconductor device and method for manufacturing the same
JPWO2017029696A1 (en) * 2015-08-14 2018-03-29 三菱電機株式会社 Air conditioner outdoor unit

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