FR2453226A1 - Bain et procede d'electrodeposition d'argent et d'alliage or/argent - Google Patents

Bain et procede d'electrodeposition d'argent et d'alliage or/argent

Info

Publication number
FR2453226A1
FR2453226A1 FR8007437A FR8007437A FR2453226A1 FR 2453226 A1 FR2453226 A1 FR 2453226A1 FR 8007437 A FR8007437 A FR 8007437A FR 8007437 A FR8007437 A FR 8007437A FR 2453226 A1 FR2453226 A1 FR 2453226A1
Authority
FR
France
Prior art keywords
silver
bath
electrodeposition
gold
electroplating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
FR8007437A
Other languages
English (en)
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Engelhard Minerals and Chemicals Corp
Original Assignee
Engelhard Minerals and Chemicals Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Engelhard Minerals and Chemicals Corp filed Critical Engelhard Minerals and Chemicals Corp
Publication of FR2453226A1 publication Critical patent/FR2453226A1/fr
Withdrawn legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/46—Electroplating: Baths therefor from solutions of silver
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/56—Electroplating: Baths therefor from solutions of alloys
    • C25D3/64—Electroplating: Baths therefor from solutions of alloys containing more than 50% by weight of silver

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)

Abstract

L'invention concerne un bain alcalin aqueux pour l'électrodéposition d'argent ou d'alliages d'argent. On stabilise un bain alcalin aqueux pour l'électrodéposition d'argent ou d'alliages d'argent sur un support, ce bain étant sensiblement exempt de cyanures libres et contenant un brillanteur imine, la stabilisation étant effectuée par addition d'acide borique et d'un hydroxyde d'ammonium ou de métal alcalin de manière que le pH soit compris entre 8,0 et 9,5 environ. Application notamment à la bijouterie.
FR8007437A 1979-04-04 1980-04-02 Bain et procede d'electrodeposition d'argent et d'alliage or/argent Withdrawn FR2453226A1 (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US2717779A 1979-04-04 1979-04-04

Publications (1)

Publication Number Publication Date
FR2453226A1 true FR2453226A1 (fr) 1980-10-31

Family

ID=21836140

Family Applications (1)

Application Number Title Priority Date Filing Date
FR8007437A Withdrawn FR2453226A1 (fr) 1979-04-04 1980-04-02 Bain et procede d'electrodeposition d'argent et d'alliage or/argent

Country Status (11)

Country Link
JP (1) JPS55134191A (fr)
AR (1) AR225759A1 (fr)
AU (1) AU5717880A (fr)
BR (1) BR8001854A (fr)
DE (1) DE3013191A1 (fr)
DK (1) DK146980A (fr)
FR (1) FR2453226A1 (fr)
GB (1) GB2046794A (fr)
IT (1) IT1127414B (fr)
NL (1) NL8001999A (fr)
SE (1) SE8002598L (fr)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3609309A1 (de) * 1986-03-20 1987-09-24 Duerrwaechter E Dr Doduco Bad zum elektrolytischen abscheiden von silber-palladium-legierungen
JPH051393A (ja) * 1990-07-19 1993-01-08 Electroplating Eng Of Japan Co 銀銅合金メツキ浴及び銀銅合金ロウ材
ES2117995T3 (es) * 1994-02-05 1998-09-01 Heraeus Gmbh W C Baño para deposito galvanico de aleaciones de plata-estaño.
DE4406419C1 (de) * 1994-02-28 1995-04-13 Heraeus Gmbh W C Bad zum galvanischen Abscheiden von Silber-Gold-Legierungen
JP2000212763A (ja) * 1999-01-19 2000-08-02 Shipley Far East Ltd 銀合金メッキ浴及びそれを用いる銀合金被膜の形成方法
JP4919430B2 (ja) * 1999-12-02 2012-04-18 株式会社日本キャリア工業 食肉の細断装置
US20130023166A1 (en) * 2011-07-20 2013-01-24 Tyco Electronics Corporation Silver plated electrical contact
CN102560571B (zh) * 2012-02-22 2015-08-05 江苏大学 无氰镀银稳定电镀液、制备方法及其镀银的方法
CN103741178B (zh) * 2014-01-20 2017-06-16 厦门大学 一种用于硅表面直接电镀光滑致密银薄膜的溶液及电镀方法
US20160145756A1 (en) * 2014-11-21 2016-05-26 Rohm And Haas Electronic Materials Llc Environmentally friendly gold electroplating compositions and methods
JP7353249B2 (ja) * 2020-08-19 2023-09-29 Ｅｅｊａ株式会社 シアン系電解銀合金めっき液

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2262705A1 (fr) * 1974-03-01 1975-09-26 Schering Ag
FR2343062A2 (fr) * 1976-03-01 1977-09-30 Technic Bain d'electrolyse ne contenant pas de cyanure pour le depot electrolytique de l'argent
FR2348286A1 (fr) * 1976-04-13 1977-11-10 Oxy Metal Industries Corp Bains de depot electrolytique d'alliages argent-or, renfermant une polyalkyleneimine et une alkylenepolyamine
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2262705A1 (fr) * 1974-03-01 1975-09-26 Schering Ag
FR2343062A2 (fr) * 1976-03-01 1977-09-30 Technic Bain d'electrolyse ne contenant pas de cyanure pour le depot electrolytique de l'argent
FR2348286A1 (fr) * 1976-04-13 1977-11-10 Oxy Metal Industries Corp Bains de depot electrolytique d'alliages argent-or, renfermant une polyalkyleneimine et une alkylenepolyamine
US4121982A (en) * 1978-02-03 1978-10-24 American Chemical & Refining Company Incorporated Gold alloy plating bath and method

Also Published As

Publication number Publication date
AR225759A1 (es) 1982-04-30
IT1127414B (it) 1986-05-21
DE3013191A1 (de) 1980-10-23
NL8001999A (nl) 1980-10-07
BR8001854A (pt) 1980-11-18
DK146980A (da) 1980-10-05
AU5717880A (en) 1980-10-09
JPS55134191A (en) 1980-10-18
GB2046794A (en) 1980-11-19
SE8002598L (sv) 1980-10-05
IT8048317A0 (it) 1980-04-02

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