FR2381388A1 - Empaquetage pour dispositifs a semi-conducteur a grande puissance - Google Patents
Empaquetage pour dispositifs a semi-conducteur a grande puissanceInfo
- Publication number
- FR2381388A1 FR2381388A1 FR7804380A FR7804380A FR2381388A1 FR 2381388 A1 FR2381388 A1 FR 2381388A1 FR 7804380 A FR7804380 A FR 7804380A FR 7804380 A FR7804380 A FR 7804380A FR 2381388 A1 FR2381388 A1 FR 2381388A1
- Authority
- FR
- France
- Prior art keywords
- packaging
- metal base
- power semiconductor
- wafers
- ceramic plates
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/14—Mountings, e.g. non-detachable insulating substrates characterised by the material or its electrical properties
- H01L23/142—Metallic substrates having insulating layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/07—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00
- H01L25/072—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L29/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Wire Bonding (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Die Bonding (AREA)
- Bipolar Transistors (AREA)
Abstract
a. Empaquetage de transistors de puissance. b. Les transistors sont constitués par plusieurs petites plaquettes isolées de la base métallique de l'empaquetage en plaçant individuellement ces plaquettes semi-conductrices sur des plaquettes fines en céramique. L'embase métallique est munie de cavités individuelles afin d'assurer la mise en place des plaquettes en céramique et de réduire en même temps l'épaisseur de la base métallique située sous les plaquettes en céramique. En réduisant les epaisseurs des plaquettes en céramique ainsi que celles de l'embase métallique, la résistance thermique de l'empaquetage est notablement réduite. c. Applications à la réalisation du dispositif semi-conducteur de puissance.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US76963777A | 1977-02-17 | 1977-02-17 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR2381388A1 true FR2381388A1 (fr) | 1978-09-15 |
Family
ID=25086071
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7804380A Withdrawn FR2381388A1 (fr) | 1977-02-17 | 1978-02-16 | Empaquetage pour dispositifs a semi-conducteur a grande puissance |
Country Status (5)
Country | Link |
---|---|
JP (1) | JPS53102674A (fr) |
DE (1) | DE2806099A1 (fr) |
FR (1) | FR2381388A1 (fr) |
GB (1) | GB1599852A (fr) |
NL (1) | NL7801658A (fr) |
Cited By (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2511193A1 (fr) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
EP0139029A1 (fr) * | 1983-10-19 | 1985-05-02 | Olin Corporation | Empaquetage pour semi-conducteur |
EP0144866A2 (fr) * | 1983-11-25 | 1985-06-19 | Kabushiki Kaisha Toshiba | Dispositif semi-conducteur comprenant un substrat |
FR2563379A1 (fr) * | 1984-04-20 | 1985-10-25 | Artus | Ensemble de dispositifs electroniques a semi-conducteurs montes sur radiateur |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier |
US4862323A (en) * | 1984-04-12 | 1989-08-29 | Olin Corporation | Chip carrier |
US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
EP0368133A2 (fr) * | 1988-11-05 | 1990-05-16 | Semikron Elektronik Gmbh | Corps de support pour la disposition électriquement isolée de composants |
EP0372228A1 (fr) * | 1988-11-09 | 1990-06-13 | Semikron Elektronik Gmbh | Elément semi-conducteur comprenant une plaque de support |
US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
US10700023B2 (en) | 2016-05-18 | 2020-06-30 | Macom Technology Solutions Holdings, Inc. | High-power amplifier package |
US11367674B2 (en) | 2016-08-10 | 2022-06-21 | Macom Technology Solutions Holdings, Inc. | High power transistors |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5899838U (ja) * | 1981-12-28 | 1983-07-07 | 富士通株式会社 | 半導体装置 |
US4639760A (en) * | 1986-01-21 | 1987-01-27 | Motorola, Inc. | High power RF transistor assembly |
US5317194A (en) * | 1989-10-17 | 1994-05-31 | Kabushiki Kaisha Toshiba | Resin-sealed semiconductor device having intermediate silicon thermal dissipation means and embedded heat sink |
US5917236A (en) * | 1995-12-08 | 1999-06-29 | Hewlett-Packard Company | Packaging system for field effects transistors |
DE102006011995B3 (de) * | 2006-03-16 | 2007-11-08 | Semikron Elektronik Gmbh & Co. Kg | Leistungshalbleitermodul mit segmentierter Grundplatte |
US8237260B2 (en) | 2008-11-26 | 2012-08-07 | Infineon Technologies Ag | Power semiconductor module with segmented base plate |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3728589A (en) * | 1971-04-16 | 1973-04-17 | Rca Corp | Semiconductor assembly |
FR2220879A1 (fr) * | 1973-03-10 | 1974-10-04 | Tokyo Shibaura Electric Co |
-
1978
- 1978-02-14 NL NL7801658A patent/NL7801658A/xx not_active Application Discontinuation
- 1978-02-14 GB GB587878A patent/GB1599852A/en not_active Expired
- 1978-02-14 DE DE19782806099 patent/DE2806099A1/de not_active Withdrawn
- 1978-02-16 JP JP1597678A patent/JPS53102674A/ja active Granted
- 1978-02-16 FR FR7804380A patent/FR2381388A1/fr not_active Withdrawn
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3728589A (en) * | 1971-04-16 | 1973-04-17 | Rca Corp | Semiconductor assembly |
FR2220879A1 (fr) * | 1973-03-10 | 1974-10-04 | Tokyo Shibaura Electric Co |
Non-Patent Citations (1)
Title |
---|
EXBK/73 * |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2511193A1 (fr) * | 1981-08-07 | 1983-02-11 | Thomson Csf | Support en materiau colamine pour le refroidissement et l'encapsulation d'un substrat de circuit electronique |
US4570337A (en) * | 1982-04-19 | 1986-02-18 | Olin Corporation | Method of assembling a chip carrier |
US5014159A (en) * | 1982-04-19 | 1991-05-07 | Olin Corporation | Semiconductor package |
US4866571A (en) * | 1982-06-21 | 1989-09-12 | Olin Corporation | Semiconductor package |
EP0139029A1 (fr) * | 1983-10-19 | 1985-05-02 | Olin Corporation | Empaquetage pour semi-conducteur |
EP0144866A3 (en) * | 1983-11-25 | 1985-09-04 | Kabushiki Kaisha Toshiba | Semiconductor device comprising a substrate |
EP0144866A2 (fr) * | 1983-11-25 | 1985-06-19 | Kabushiki Kaisha Toshiba | Dispositif semi-conducteur comprenant un substrat |
US4862323A (en) * | 1984-04-12 | 1989-08-29 | Olin Corporation | Chip carrier |
FR2563379A1 (fr) * | 1984-04-20 | 1985-10-25 | Artus | Ensemble de dispositifs electroniques a semi-conducteurs montes sur radiateur |
US4853491A (en) * | 1984-10-03 | 1989-08-01 | Olin Corporation | Chip carrier |
EP0368133A2 (fr) * | 1988-11-05 | 1990-05-16 | Semikron Elektronik Gmbh | Corps de support pour la disposition électriquement isolée de composants |
EP0368133A3 (fr) * | 1988-11-05 | 1990-11-22 | Semikron Elektronik Gmbh | Corps de support pour la disposition électriquement isolée de composants |
EP0372228A1 (fr) * | 1988-11-09 | 1990-06-13 | Semikron Elektronik Gmbh | Elément semi-conducteur comprenant une plaque de support |
US10700023B2 (en) | 2016-05-18 | 2020-06-30 | Macom Technology Solutions Holdings, Inc. | High-power amplifier package |
US11367674B2 (en) | 2016-08-10 | 2022-06-21 | Macom Technology Solutions Holdings, Inc. | High power transistors |
US11862536B2 (en) | 2016-08-10 | 2024-01-02 | Macom Technology Solutions Holdings, Inc. | High power transistors |
Also Published As
Publication number | Publication date |
---|---|
DE2806099A1 (de) | 1978-08-24 |
NL7801658A (nl) | 1978-08-21 |
GB1599852A (en) | 1981-10-07 |
JPS6128219B2 (fr) | 1986-06-28 |
JPS53102674A (en) | 1978-09-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |