JPS5591844A - Electronic parts package - Google Patents

Electronic parts package

Info

Publication number
JPS5591844A
JPS5591844A JP16481878A JP16481878A JPS5591844A JP S5591844 A JPS5591844 A JP S5591844A JP 16481878 A JP16481878 A JP 16481878A JP 16481878 A JP16481878 A JP 16481878A JP S5591844 A JPS5591844 A JP S5591844A
Authority
JP
Japan
Prior art keywords
brazing
cover
substrate
electronic parts
package
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP16481878A
Other languages
Japanese (ja)
Inventor
Susumu Kida
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP16481878A priority Critical patent/JPS5591844A/en
Publication of JPS5591844A publication Critical patent/JPS5591844A/en
Pending legal-status Critical Current

Links

Landscapes

  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

PURPOSE: To prevent dripping of brazing flash and to improve reliability, by using a cover, which is made by piling of brazing material through an intermediate metallic layer of good wettability and the brazing material, on a metallic substrate whose thermal expansion coefficient is similar to that of a package material.
CONSTITUTION: By placing on a package main 2 an electronic part 5, such as a semiconductor, etc., an opening is closed using a closing cover 1. The cover 1's substrate 1A is to be made of a metal whose thermal expansion coefficient is similar to that of the package main 2's material, such as an Fe-Ni-Co alloy (KOVAR), and brazing materials 1c are piled on the substrate 1A keeping a metallic soldering material and an intermediate metallic layer 1B of good wettability, such as an Ag layer , etc, between them, and thus prepared material is to be used as the cover 1. By closing the opening with the cover 1, heat-treating it and melting the brazing materials 1c, the brazing is completed. By doing so, it is possible to prevent the brazing flash from dripping and to improve reliability of the electronic parts.
COPYRIGHT: (C)1980,JPO&Japio
JP16481878A 1978-12-28 1978-12-28 Electronic parts package Pending JPS5591844A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16481878A JPS5591844A (en) 1978-12-28 1978-12-28 Electronic parts package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16481878A JPS5591844A (en) 1978-12-28 1978-12-28 Electronic parts package

Publications (1)

Publication Number Publication Date
JPS5591844A true JPS5591844A (en) 1980-07-11

Family

ID=15800493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16481878A Pending JPS5591844A (en) 1978-12-28 1978-12-28 Electronic parts package

Country Status (1)

Country Link
JP (1) JPS5591844A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02125345U (en) * 1989-03-27 1990-10-16
JPH0482853U (en) * 1990-11-28 1992-07-20
US6495914B1 (en) * 1997-08-19 2002-12-17 Hitachi, Ltd. Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636135U (en) * 1979-08-27 1981-04-07

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5636135U (en) * 1979-08-27 1981-04-07

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02125345U (en) * 1989-03-27 1990-10-16
JPH0482853U (en) * 1990-11-28 1992-07-20
US6495914B1 (en) * 1997-08-19 2002-12-17 Hitachi, Ltd. Multi-chip module structure having conductive blocks to provide electrical connection between conductors on first and second sides of a conductive base substrate

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