FR2356339A1 - Module electronique et son procede de fabrication - Google Patents
Module electronique et son procede de fabricationInfo
- Publication number
- FR2356339A1 FR2356339A1 FR7616344A FR7616344A FR2356339A1 FR 2356339 A1 FR2356339 A1 FR 2356339A1 FR 7616344 A FR7616344 A FR 7616344A FR 7616344 A FR7616344 A FR 7616344A FR 2356339 A1 FR2356339 A1 FR 2356339A1
- Authority
- FR
- France
- Prior art keywords
- electronic module
- manufacturing process
- electronic
- manufacturing
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Clocks (AREA)
- Light Receiving Elements (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Electromechanical Clocks (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58162075A | 1975-05-29 | 1975-05-29 | |
US05/581,605 US4012723A (en) | 1975-05-29 | 1975-05-29 | Magnetic bubble memory packaging arrangement and its method of fabrication |
US05/581,604 US3986334A (en) | 1975-05-29 | 1975-05-29 | Electronic watch and its method of fabrication |
US05/581,603 US3986335A (en) | 1975-05-29 | 1975-05-29 | Electronic watch module and its method of fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2356339A1 true FR2356339A1 (fr) | 1978-01-20 |
FR2356339B1 FR2356339B1 (de) | 1983-03-04 |
Family
ID=27504954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7616344A Granted FR2356339A1 (fr) | 1975-05-29 | 1976-05-31 | Module electronique et son procede de fabrication |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS51145370A (de) |
BR (1) | BR7603423A (de) |
CA (1) | CA1058312A (de) |
DE (1) | DE2623715A1 (de) |
FR (1) | FR2356339A1 (de) |
GB (1) | GB1555364A (de) |
IT (1) | IT1062029B (de) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0105841A1 (de) * | 1982-10-05 | 1984-04-18 | Ebauches Electroniques S.A. | Werkstreifen zur Herstellung von Komponententrägern für Uhren |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5227555A (en) * | 1975-08-27 | 1977-03-01 | Seiko Instr & Electronics | Electronic timekeeper |
US4064552A (en) * | 1976-02-03 | 1977-12-20 | Angelucci Thomas L | Multilayer flexible printed circuit tape |
GB2072891B (en) * | 1977-06-20 | 1982-08-25 | Hitachi Ltd | Electronic device and method of fabricating the same |
JPS5424673A (en) * | 1977-07-27 | 1979-02-24 | Seiko Epson Corp | Electronic wristwatch |
CH623452B (fr) * | 1977-12-14 | Fontainemelon Horlogerie | Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede. | |
JPS56122972U (de) * | 1980-02-19 | 1981-09-18 | ||
US5124782A (en) * | 1990-01-26 | 1992-06-23 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit package with molded cell |
GB9615164D0 (en) * | 1996-07-19 | 1996-09-04 | Delta Schoeller Ltd | Electrical circuit |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3611061A (en) * | 1971-07-07 | 1971-10-05 | Motorola Inc | Multiple lead integrated circuit device and frame member for the fabrication thereof |
US3784725A (en) * | 1972-07-24 | 1974-01-08 | Solitron Devices | Electronic hybrid package |
-
1976
- 1976-04-27 CA CA251,202A patent/CA1058312A/en not_active Expired
- 1976-05-17 GB GB20209/76A patent/GB1555364A/en not_active Expired
- 1976-05-26 IT IT49680/76A patent/IT1062029B/it active
- 1976-05-26 DE DE19762623715 patent/DE2623715A1/de not_active Ceased
- 1976-05-28 BR BR3423/76A patent/BR7603423A/pt unknown
- 1976-05-28 JP JP51062158A patent/JPS51145370A/ja active Pending
- 1976-05-31 FR FR7616344A patent/FR2356339A1/fr active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0105841A1 (de) * | 1982-10-05 | 1984-04-18 | Ebauches Electroniques S.A. | Werkstreifen zur Herstellung von Komponententrägern für Uhren |
Also Published As
Publication number | Publication date |
---|---|
FR2356339B1 (de) | 1983-03-04 |
CA1058312A (en) | 1979-07-10 |
DE2623715A1 (de) | 1977-01-20 |
BR7603423A (pt) | 1976-12-21 |
JPS51145370A (en) | 1976-12-14 |
IT1062029B (it) | 1983-06-25 |
GB1555364A (en) | 1979-11-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
FR2356339A1 (fr) | Module electronique et son procede de fabrication | |
BR7310316D0 (pt) | Aparelho exibidor semicondutor eletroluminescente e processo de fabricacao desse aparelho | |
NO178089C (no) | Fremgangsmåte for fremstilling av et elektronisk hukommelseskort | |
FR2439438A1 (fr) | Ruban porteur de dispositifs de traitement de signaux electriques, son procede de fabrication et application de ce ruban a un element de traitement de signaux | |
SG70600A1 (en) | Semiconductor element-mounting board manufacturing method for the board semiconductor device and manufacturing method for the device | |
FR2639763B1 (fr) | Procede de realisation d'un module electronique et module electronique tel qu'obtenu par ce procede | |
FR2760998B1 (fr) | Procede d'inclusion d'une etiquette electronique dans un objet realise en plastique, au moment de la fabrication de l'objet | |
FR2662304B1 (fr) | Procede de fabrication d'une structure integree guide-detecteur de lumiere en materiau semi-conducteur. | |
ES2063803T3 (es) | Metodo de fabricacion de ornamentos. | |
FR2549291B2 (fr) | Procede d'encapsulation de composants electroniques par extrusion de matiere plastique et applications a la fabrication de voyants lumineux et a l'encapsulation de circuits electroniques | |
KR890004594A (ko) | 유연 보드 합체식 전자 부품 주형 수지 케이싱 | |
FR2412225A1 (fr) | Module electronique pour pieces d'horlogerie et son procede de fabrication | |
PT94132A (pt) | Processo para a fabricacao de peliculas de material plastico com bolhas de ar encapsuladas e aparelho para a sua producao | |
FR2407504A1 (fr) | Ensemble d'un oscillateur a cristal et d'un circuit integre | |
KR910008823A (ko) | 필름캐리어 제조용의 필름재 및 필름캐리어의 제조방법 | |
JPS63200550A (ja) | リ−ドフレ−ム | |
KR987000585A (ko) | 표면실장모듈과 그 제조방법(surface-mounted module and a method of producing the same) | |
JPS5578273A (en) | Manufacture for decoration plate for watch | |
FR2348516A1 (fr) | Montre-bracelet electrique analogique et procede pour mouler en matiere plastique une partie de la boite | |
FR2608963B1 (fr) | Moule pour la realisation de pieces de grandes dimensions ainsi que son procede de fabrication et la piece obtenue | |
KR910005414A (ko) | 수지모울드 리이드프레임 및 전자부품과 그 성형금형 | |
JPS5717187A (en) | Manufacture of semiconductor device for detecting light | |
BE798576A (fr) | Procede de fabrication d'une piece moulee a base d'une matiere plastique thermodurcissable renforcee | |
FR2485985A1 (fr) | Moule pour le coulage de montures de lunettes et son procede de fabrication | |
JPS57154863A (en) | Manufacture of resin sealing type electronic parts |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |