FR2356339A1 - Module electronique et son procede de fabrication - Google Patents
Module electronique et son procede de fabricationInfo
- Publication number
- FR2356339A1 FR2356339A1 FR7616344A FR7616344A FR2356339A1 FR 2356339 A1 FR2356339 A1 FR 2356339A1 FR 7616344 A FR7616344 A FR 7616344A FR 7616344 A FR7616344 A FR 7616344A FR 2356339 A1 FR2356339 A1 FR 2356339A1
- Authority
- FR
- France
- Prior art keywords
- electronic module
- manufacturing process
- electronic
- manufacturing
- embedded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Clocks (AREA)
- Light Receiving Elements (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Electromechanical Clocks (AREA)
Abstract
L'invention concerne un module électronique et son procédé de fabrication Une pastille de circuit intégré est montée sur un cadre de connexion, et l'ensemble est enrobé dans de la matière plastique. L'enrobage est effectué dans un moule réalisé de façon telle qu'il forme des cavités destinées à recevoir et à maintenir des composants extérieurs. L'invention s'applique à la réalisation de montres électroniques ainsi que de mémoires à bulles magnétiques.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US58162075A | 1975-05-29 | 1975-05-29 | |
US05/581,605 US4012723A (en) | 1975-05-29 | 1975-05-29 | Magnetic bubble memory packaging arrangement and its method of fabrication |
US05/581,604 US3986334A (en) | 1975-05-29 | 1975-05-29 | Electronic watch and its method of fabrication |
US05/581,603 US3986335A (en) | 1975-05-29 | 1975-05-29 | Electronic watch module and its method of fabrication |
Publications (2)
Publication Number | Publication Date |
---|---|
FR2356339A1 true FR2356339A1 (fr) | 1978-01-20 |
FR2356339B1 FR2356339B1 (fr) | 1983-03-04 |
Family
ID=27504954
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR7616344A Granted FR2356339A1 (fr) | 1975-05-29 | 1976-05-31 | Module electronique et son procede de fabrication |
Country Status (7)
Country | Link |
---|---|
JP (1) | JPS51145370A (fr) |
BR (1) | BR7603423A (fr) |
CA (1) | CA1058312A (fr) |
DE (1) | DE2623715A1 (fr) |
FR (1) | FR2356339A1 (fr) |
GB (1) | GB1555364A (fr) |
IT (1) | IT1062029B (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0105841A1 (fr) * | 1982-10-05 | 1984-04-18 | Ebauches Electroniques S.A. | Bande de travail destinée à la fabrication de supports de composants pour montre |
Families Citing this family (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5227555A (en) * | 1975-08-27 | 1977-03-01 | Seiko Instr & Electronics | Electronic timekeeper |
US4064552A (en) * | 1976-02-03 | 1977-12-20 | Angelucci Thomas L | Multilayer flexible printed circuit tape |
GB2072891B (en) * | 1977-06-20 | 1982-08-25 | Hitachi Ltd | Electronic device and method of fabricating the same |
JPS5424673A (en) * | 1977-07-27 | 1979-02-24 | Seiko Epson Corp | Electronic wristwatch |
CH623452B (fr) * | 1977-12-14 | Fontainemelon Horlogerie | Procede de fabrication d'un module de piece d'horlogerie electronique et module de piece d'horlogerie obtenu par la mise en oeuvre de ce procede. | |
JPS56122972U (fr) * | 1980-02-19 | 1981-09-18 | ||
US5124782A (en) * | 1990-01-26 | 1992-06-23 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit package with molded cell |
GB9615164D0 (en) * | 1996-07-19 | 1996-09-04 | Delta Schoeller Ltd | Electrical circuit |
Family Cites Families (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3611061A (en) * | 1971-07-07 | 1971-10-05 | Motorola Inc | Multiple lead integrated circuit device and frame member for the fabrication thereof |
US3784725A (en) * | 1972-07-24 | 1974-01-08 | Solitron Devices | Electronic hybrid package |
-
1976
- 1976-04-27 CA CA251,202A patent/CA1058312A/fr not_active Expired
- 1976-05-17 GB GB20209/76A patent/GB1555364A/en not_active Expired
- 1976-05-26 IT IT49680/76A patent/IT1062029B/it active
- 1976-05-26 DE DE19762623715 patent/DE2623715A1/de not_active Ceased
- 1976-05-28 BR BR3423/76A patent/BR7603423A/pt unknown
- 1976-05-28 JP JP51062158A patent/JPS51145370A/ja active Pending
- 1976-05-31 FR FR7616344A patent/FR2356339A1/fr active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0105841A1 (fr) * | 1982-10-05 | 1984-04-18 | Ebauches Electroniques S.A. | Bande de travail destinée à la fabrication de supports de composants pour montre |
Also Published As
Publication number | Publication date |
---|---|
FR2356339B1 (fr) | 1983-03-04 |
CA1058312A (fr) | 1979-07-10 |
DE2623715A1 (de) | 1977-01-20 |
BR7603423A (pt) | 1976-12-21 |
JPS51145370A (en) | 1976-12-14 |
IT1062029B (it) | 1983-06-25 |
GB1555364A (en) | 1979-11-07 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
ST | Notification of lapse |