CA1058312A - Circuit device packaging technique - Google Patents
Circuit device packaging techniqueInfo
- Publication number
- CA1058312A CA1058312A CA251,202A CA251202A CA1058312A CA 1058312 A CA1058312 A CA 1058312A CA 251202 A CA251202 A CA 251202A CA 1058312 A CA1058312 A CA 1058312A
- Authority
- CA
- Canada
- Prior art keywords
- lead conductors
- cavity
- integrated circuit
- circuit chip
- lead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G04—HOROLOGY
- G04G—ELECTRONIC TIME-PIECES
- G04G17/00—Structural details; Housings
- G04G17/02—Component assemblies
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01039—Yttrium [Y]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01087—Francium [Fr]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/1901—Structure
- H01L2924/1904—Component type
- H01L2924/19041—Component type being a capacitor
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electric Clocks (AREA)
- Light Receiving Elements (AREA)
- Oscillators With Electromechanical Resonators (AREA)
- Electromechanical Clocks (AREA)
Abstract
CIRCUIT DEVICE PACKAGING TECHNIQUE
Abstract of the Disclosure The package of a circuit device such as an integrated semiconductor circuit device is molded into a special shape to fit its function. The package includes leads extending from the circuit device to selected positions for interconnection both inside and outside the volume of the package such as for switch points or attachment of other electrical components to the circuit device. Support members or cavities are simultane-ously molded directly into the package for the mechanical support of the other electrical, magnetic, optical or optoelectronic components. Also, optical elements such as lenses or filters may be molded directly into the package to carry out optical functions.
Abstract of the Disclosure The package of a circuit device such as an integrated semiconductor circuit device is molded into a special shape to fit its function. The package includes leads extending from the circuit device to selected positions for interconnection both inside and outside the volume of the package such as for switch points or attachment of other electrical components to the circuit device. Support members or cavities are simultane-ously molded directly into the package for the mechanical support of the other electrical, magnetic, optical or optoelectronic components. Also, optical elements such as lenses or filters may be molded directly into the package to carry out optical functions.
Description
~ T~-5874/5883/5890/6000 ~OS831Z ~ -,.- . . .
` This invention rclates to packaging techniques for circuit devices and, more particularly, to molded packages for circuit devices providing all of the electrical connection points and mechanical support means for external electrical or optical components.
Conventionally, circuit devices such as integrated circuits are molded into plastic packages of rectangular shapes wlth metal leads ex-tending beyond the plastic body of the package in a regular array to pro-vide external connection points to and from the circuit device. One such packaging technique is that utili~ed in providing a standard dual-in-line plastic package where the leads extend on opposite sides of the package r . ..
and are approximately a tenth of an inch apart.
It is therefore an object of the present invention to provicle a simplified mqthod of manufacturing modules incorporating circuit devices such a6 integrated circuit devices.
It is another object of the invention to provide an encapsulating package for circuit devices which additionally provides mechanical support and electrical connection points for other component devices -;
It is,a further object of the invention to provide a package or ;` ~ circuit dévices which provides optical filtering for an optical device as well as electrical conductor~ for connecting the optical device to another clrcuit device.
Still janother object of the invention is to provide a method of packaging circuit devices such as integrated circuit devices which provides : ' . , - ' ' . ' - mechanlcal support for external components as well as electrical inter-connects fron;l the circuit device to the external components. --These and other objects are accomplished in accordance with the present invention by providing a-single melal lead frame upon which a circuit de~vicj such as a semiconductor integrated circuit chip is mountcd.
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Connectors such as ball bonded wires selectively connect terminal pads on the integrated circuit to selected lead frame conductors.
- The lead frame includes a selectively positioned conductors for co-nnection of external components to the integrated circuit. These components may include, for example, a display, a fixed or variable capacitor, a fixed or variable resistor, an oscillator crystal, batteries, a ~hotosensor or coil or the like. The lead frame is plastic encaps;ulated with the plastic being formed to completely seal the integrated circuit and connectors within the plastic while providing mechanical support protrusions, cavities or channels for the external components. Openings are provided in the plastic both within the cavities or channels and opposite the cavity or `~
-channel openings expo~ing selectively positioned conductors to which the external components may be electrically connected from the opposite side. Selected lead frame conductors may also extend be-yond the periphery of the encapsulated device for connection of the module to other components or into a larger system.
One example of the technique embodied in the present invention -is a watch module packaging arrangement.
Prior art electronic watches have been manufactured by pro-viding movements in the form of electronic moduIes which are en-closed in a càvity within a metal~watch case or other jewelry ~housing. The module is generally of the hybrid type comprised of ;~
a substrate of insulative material on which all of the electronic - ~ .
timekeeping clrcuitry, display drivers, oscillator crystal, variable ~capacitor and display elements have been mounted and electrically nterconnected. -The substrates are generally of two sections, a first section circuit board such as a certamic or printed circuit board having single or multilayer interconnects on which the time-keeping circuit, display drivers and display elements are mounted ~
' ' I :
` This invention rclates to packaging techniques for circuit devices and, more particularly, to molded packages for circuit devices providing all of the electrical connection points and mechanical support means for external electrical or optical components.
Conventionally, circuit devices such as integrated circuits are molded into plastic packages of rectangular shapes wlth metal leads ex-tending beyond the plastic body of the package in a regular array to pro-vide external connection points to and from the circuit device. One such packaging technique is that utili~ed in providing a standard dual-in-line plastic package where the leads extend on opposite sides of the package r . ..
and are approximately a tenth of an inch apart.
It is therefore an object of the present invention to provicle a simplified mqthod of manufacturing modules incorporating circuit devices such a6 integrated circuit devices.
It is another object of the invention to provide an encapsulating package for circuit devices which additionally provides mechanical support and electrical connection points for other component devices -;
It is,a further object of the invention to provide a package or ;` ~ circuit dévices which provides optical filtering for an optical device as well as electrical conductor~ for connecting the optical device to another clrcuit device.
Still janother object of the invention is to provide a method of packaging circuit devices such as integrated circuit devices which provides : ' . , - ' ' . ' - mechanlcal support for external components as well as electrical inter-connects fron;l the circuit device to the external components. --These and other objects are accomplished in accordance with the present invention by providing a-single melal lead frame upon which a circuit de~vicj such as a semiconductor integrated circuit chip is mountcd.
' ' ' 1 ~ .
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Connectors such as ball bonded wires selectively connect terminal pads on the integrated circuit to selected lead frame conductors.
- The lead frame includes a selectively positioned conductors for co-nnection of external components to the integrated circuit. These components may include, for example, a display, a fixed or variable capacitor, a fixed or variable resistor, an oscillator crystal, batteries, a ~hotosensor or coil or the like. The lead frame is plastic encaps;ulated with the plastic being formed to completely seal the integrated circuit and connectors within the plastic while providing mechanical support protrusions, cavities or channels for the external components. Openings are provided in the plastic both within the cavities or channels and opposite the cavity or `~
-channel openings expo~ing selectively positioned conductors to which the external components may be electrically connected from the opposite side. Selected lead frame conductors may also extend be-yond the periphery of the encapsulated device for connection of the module to other components or into a larger system.
One example of the technique embodied in the present invention -is a watch module packaging arrangement.
Prior art electronic watches have been manufactured by pro-viding movements in the form of electronic moduIes which are en-closed in a càvity within a metal~watch case or other jewelry ~housing. The module is generally of the hybrid type comprised of ;~
a substrate of insulative material on which all of the electronic - ~ .
timekeeping clrcuitry, display drivers, oscillator crystal, variable ~capacitor and display elements have been mounted and electrically nterconnected. -The substrates are generally of two sections, a first section circuit board such as a certamic or printed circuit board having single or multilayer interconnects on which the time-keeping circuit, display drivers and display elements are mounted ~
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and electrically interconnected. The substrates are generally of two sections, a first section circuit board such as a cera- ;
mic or printed circuit board having single or multilayer inter-connects on which the timekeeping circuit display drivers and display elements are mounted and interconnected and a second section with is comprised of molded plastic or other mater~al to provide mechanical support for the oscillator crystal, ,~
variable capacitor, battery conductors and battery. The inte-grated circuit chips providing the timekeeping circuitry and drive functions are mounted on the circuit board and selectively connected to the conductors thereof. The integrated circuit and wires thereto are generally sealed within a drop of epoxy -material for the protection thereof. The latter support sec-tion of the substrate may include conductors which mate with conductors of the circuit board section or the oscillator crystal, variable capacitor and battery contacts may be electri-cally connected directly to conductors on the circuit board.
The complexity of these prior art modules is exemplified by ~-~
U.S. Patent Nos. 3,759,031 which lssued to Robert E. McCullough et al on 18 September 1973; 3,803,827 which issued to Dennis A. Robert on 16 April 1974; 3,838,566 which issued to Arthur , H. O'Connor et al on 1 October 1974; and 3,817,021 which issued to John M. Bergey on 18 June 1974. The integrated circuit it-self is relatively inexpensive compared to the cost of manu-facturing the module substrate and the attachment and inter-connection of the circuit devices to the substate and circuit board to provide the module.
It is therefore another object of the prese~t in-vention to provide an improved electronic watch module.
It is another object of the ir,vention to provide a simplified electronic watch module.
~ - 3 -A further object of the invention is to provide an improved method of fabricating electronic watch modules.
Still another object of the invention is to provide a relatively inexpensive electronic watch module and hence a relatively inexpensi~e electronic watch.
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The watch ~odule is fabricated by mounting a semi-conductor circuit chip such as a bipolar injection logic chip `~
~ incorporating all the electronic circuitry necessary to compute time and to drive a display with decoded timekeeping signals on a mounting paid of a metal lead frame. Connectors such as those provided by gold wire are bonded between selected terminal pads on the integrated circuit chip and selected lead frame conductors. Alternately, the integrated circuit may be mounted in upside down fashion with terminal pads of the circuit thermocompression bonded directly to portions of the lead frame conductors. The lead frame is then plastic encapsulated by injection molding techniques. The upper mold is formed to provide, in the injected plastic, a cavity for the display, openings exposing one surface of the selectively positioned .
conductors for the crystal and capacitor and an opening exposing the conductors in the display cavity to which the display is to be ohmically connected. The lower mold is formed to : : .
provide, in the injected plastic, mechanical support cavities ~ for the crystal, variable capacitor and batteries, and an opening exposing the opposite surface of the conductors to which the display is to be connected. The display is then mounted in the cavity provided therefor on the upper surface of the molded lead frame and selectively electrically connected to the lead frame by means of the opening on the opposite surface.
.~ : .. .
The crystal and capacitor are inserted in the cavities provided therefor and electrically connected to the selectively positioned lead frame conductors from the openings provided .:
in the upper surface. Battery contacts are provided in the : , .. .
cavities formed for the batteries by bending the lead frame ~; 30 conductors extending along the periphery of the molded structure down into the cavities and extensions may be added.
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The module is thus provided ready ~or insertion within the cavity of a watch case.
Another example of the technique embodied in the present invention is for an electronic watch. In this example, the mechanical support cavity for a display is provided with an additional ridge to support filter lens which provides .
filtering for a display such `.
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as an LED type display. In additionl the openings opposite the capacitor and crystal cavities on the front surfact are plugged with design coordinated plastic plt~gs. The plastic encapsulating means includes extensions for attachment of a band and a cover is provided for the back. In this ~nstance, the encapsulated cir-cuit incorporates all of the functions otherwise required by a watch case.
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A further example of an embodiment of the packaging technique of the present invention is for a màgnetic bubble memory packaging ~10 arrangement.
Magnetic bubble memory devices have been of growing interest because of the ability to store more bits of information in less space than now required by conventional methods such as ferrite cores and to produce the stored information in a less complicated manner than is; presently possible. Magnetic bubble memories have been developed in which very large numbers of bit information can be~stored in very small areas. Further, techniques are being de-;~ veloped by whlch bits stored in magnetic bubble chips can be pro-cessed~on the same or other magnetic bubble chips with various ;~ 20 ~ logic~and switching functions being performed with less power being required than with conventional computer circuitry and with greater reliabiIity.
Some drawbacks to implementing magnetic bubble chips and devices into system designs are the need to package the chips cheaply and reliably. Unlike conventional electronic circuits, magnetic bubble devices require a specific magnetic environment in order to operate properly. Three magnetic fields are required to create this env~ironment. The first or Z field is a constant magnetic field perpendicular to the surface of a magnetic bubble chip and is used to maintain magnetic bubble domains in the chip in the proper physical diameters. The second and third or X and Y
fields are excited in such a manner as to produce a rotating mag-netic field parallel to the plane of the surface of the chip. As 1 this fieId rotates, it interacts with magnetizable elements on the :~ ..
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~1-5874/5883/5890/6000 lOS831Z
surface of the chip, thus creating time-varying magnetic field gradings, which control the movement of the magnetic bubble do-mains in the chip. Thus, any design utilizing magnetic bubble devices necessarily ha~ to provide the proper magnetic environment for each chip. Many arrangements have been suggested in which . a large number of magnetic bubble chips are mounted on a single substrate and-share a common set of magnetic field generating coils. The problem with this arrangement is that it is diffi-.. cult to replace the chips in the event that any of them malfunction.
It is therefore another object of the present invention to provice an improved packaqing technique for magnetic bubble chips.
- It.is another object of the invention to provide a sim-plified m-thod of manufacturing packaged magnetic bubble chips . with individually self-contained magnetic field generators.
.Still antoher object of the invention is to provide a simple ., .
and lnexpensive packaging technique for magnetic chips.
A further object of the invention is to provide packaged ~: magnetic bubble devices which are easily and individually connect-able or disconnectable in a system employing a large number of such 20:. devices In this example, the circuit device, which i5 a magnetic bubble chip, is packaged along with X, Y AND Z magnetic field gen-erat:ing means. The package is comprised of a metal lead frame upon which the magnetic bubble chip such as a memory chip device is mounted. Connectors.are utilized to connect terminal pads on the ~: . bubble memory device to selected lead frame conductors. The lead rame includes selectively positioned terminal conductors which pro-vide exterlor terminals for X and Y magnetic field generating coils.
The.lead frame is plastic encapsulated with the plastic being formed 30 to completely seal the magnetic bubble chip and connectors while ~ .
; providing mechanical support ¢hannels for X and Y magnetic field ~coils. ~Openings are provided in the plastic within the channels . . ; . . .
: . -6-parallel to the plane of the lead frame on opposite sides thereof exposing the selectively positioned conductors through which the coils are electrically connected to the lead frame terminal conductors. Permanent magnets are provided on either end of the structure and magnetic field spreading plates are provided over the bottom and top of the structure parallel to the plane of the lead frame to generate a constant Z magnetic field.
In accordance with one embodiment of the present -~
invention there is provided a circuit module for an electronic watch comprising ~a) display means responsive to electrical -signals for displaying time; (b) an integrated circuit chip .
having circuitry for driving said display means with decoded ; electrical timekeeping signals; (c) a metal lead frame having a plurality of lead conductors ohmically coupling said display means to said integrated circuit c~ip, and (d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means havlng a cavity selectively positioned with respect to said plurality of lead conductors with said ',;
~:20 display means being supported within said cavity. ~ .
In accordance with another embodiment of the present .
~ ; invention there is provided a method of fa~ricating an elec- :
: tronic watch module comprising: (a) mounting a semiconductor. .
integrated circuit chip having circuitry for driving a dispiay means with decoded electrical timekeeping signals on a mounting pad of a metal lead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display ..
means to said integrated circuit chip, a second plurality of .
lead conductors for ohmically coupling an oscillator crystal to ~.. . -...
said integrated circuit chip, a third plurality of lead con-ductors for ohmically coupling a capacitor device to said ~, ~
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.. .. , . .. , . , .. . . . . ~ . . ~ . .
` 105l~31~
integrated circuit chip, and a fourth plurality of lead conduc-tors for ohmically coupling one or more batteries to said in- :
tegrated circuit chip; (~) bonding wire connectors between terminal pads on said integrated circuit chip and selected ones of said lead frame conductors; (c) placing the lead frame between the upper and lower molds having mold cavities; (d) injecting a plastic material into the cavities of said upper and lower molds to completely encapsulate said integrated circuit chip, the upper mold being formed to provide in the injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion : ;
of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical :
support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities and a third opening exposing a portion of the opposite surface of said first plurality of lead conductors; (e) removing the en-capsulated lead frame from said mold; (f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening; (g) in-serting an oscillator crystal in said second caviby and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first opening; and (g) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third :
plurality of lead conductors through said second opening.
Further objects and advantages of the invention and the techniques embodied therein will become apparent from the detailed descriptions of - 7a -~.
. ~ .
~I-5874/5883/5890/6000 ~058312 preferred embodimentsand from the claims and from the accompanying drawings wherein:
FIGURE 1 is a planar view of the upper major surface of a lead frame utilized in a watch module fabricated in accordance with techniques embodied in the present invention;
FIGURE 2 is a planar view showing a semiconductor integrated circuit chip being mounted on a pad of the lead frame of FIGURE l;
FIGURE 3 is a planar view of the plastic encapsulated lead frame of FIGURE 2;
FIGURE 4 is a top planar view of the encapsulated lead frame of FIGURE 3 with the carrier portion removed;
FIGURE 5 is a bottom planar view of the encapsulated lead frame of FIGURE 4 with selected peripheral leads bent down to '!
provide battery contacts;
FIGURE 6 is a perspective exploded view of the bottom of the watch module of FIGURE 5 showing the insertion of the crystal, capacitor and batteries in the cavities provided therefor;
FIGURE 7 is a perspecti.ve exploded view of an electronic watch showing the display mounted in the display cavity of the watch module of FIGURES 4-6 and the module inserted within the :
cavity of a watch case;
FIGURE 8 is a planar view of the upper major surface of .;
a lead frame utilized in an electronic watch fabricated in accord-ance with techniques embodied in the present invention;
FIGURE 9 is a planar view showing a semiconductor integrated circuit chip being mounted on a pad of the lead frame of FIGURE 8;
. FIGURE 10 is a planar view of the plastic encapsulated lead frame of FIGURE 9;
FIGURE 11 is a bottom planar view of the encapsulated lead frame of FIGURE 10 after the carrier portion has been removed;
,TI-5874/5883/5890/6000 ,-1~5831Z
FIGURE 12 is a perspective exploded view of the watch of FIGURES 10 and 11 showing the insertion of the crystal, capacitor, control switches and batteries in the cavities provided therefor;
FIGURE 13 is a planar view of the front ~ace of the :
complete watch of FIGURE 12 with the capacitor and crystal connection openings plugged and the display and lens in place;
FIGURE 14 is a top planar view of the upper major surface of a lead frame utilized in a magnetic bubble memory device packaged in accordance with techniques embodied in the present invention;
FIGURE 15 is a top planar view showing a magnetic bubble chip mounted on a pad of the lead frame of FIGURE 14;
FIGURE 16 is a top planar view of the plastic encapsuiated lead frame;
FIGURE 17 is a top planar view of the encapsulated lead frame of FIGURE 16 with the carrier portion removed;
FIGURE 18 is a sectioned view of the plastic : -encapsulated lead frame of FIGURE 16;
FIGURE 19 is a perspective view showing the X
- magnetic field coil in place on the structure of FIGURE 17;
FIGURE 20 is a perspective view showing the Y mag-netic field coil in place on the structure of FIGURE 19; and FIGURE 21 is an exploded perspective view of the structure of FIGURE 20 showing the positioning of a pair of permanent magnets providing the Z magnetic field. -:
Referring then to the drawings, an electronic module provided in accordance with the techniques embodied in the present invention is manufactured by providing a `~ -single metal lead frame 10 as shown in FIGURE 1. The lead frame 10 is, for example, stamped out of a strip 11 `~ ~05~31Z
of .010 inch thick iron-cobalt-nickel alloy such as Kovar (trade mark). A number of the lead frames 10 are conveniently stamped out of a single strip 11 with a portion of the strip 11 utilized as a carrier to facilitate handling in process. Another portion 47 of the strip is also left in place to hold some of the lead frame conductors in place through processing.
A mounting pad 12 is provided by the lead frame 10 upon which a semiconductor integrated circuit chip 13 is mounted.
Connectors such as ball bonded gold wires 19 selectively con- -nect terminal pads 18 on the inte~Jrated circuit chip to selected lead frame conductors 16. The semiconductor chip 13 w~ich is preferably of the bipolar injection logic type incorporates all of the ~lectronic circuitry necessary to compute time and ;~
to drive a display such as an LED display with decoded multi-plexed timekeeping signals. One such integrated circuit is described in U.S. Patent Nos. 3,965,666; 4,013,901; 3,964,251 and 3,986,199 which issued to Clark R. Williams, on ~6 June 1976;
22 March 1977; 22 June 1976; and 12 October 1976, respectively.
Alternately, the integrated circuit may be mounted in an upside down fashion with the terminal pads 18 of the circuit 13 thermo-compression bonded directly to the lead frame conductors 16 with the conductors 16 somewhat extended. Lead frame 10 also includes selectively positioned conductors 17 for connection of the display to the circuit, selectively positioned conductors 14 for connection of a variable capacitor in the circuit, and selectively positioned conductors 15 for connection of an oscillator crystal in the circuit. Selected lead frame con-ductors which extend to the periphery of the lead frame are provided for connection of tim~ setting and/or display demand ~witches to the battery and circuit and for connection of one or more batteries to the circuit.
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.~ ' ' , ' : ' .I-5874/5883/58~0/6000 1058312 Next, as illustrated in FIGURE 3, the lead frame is plastic encapsulated with the plastic 21 being formed to completely en-capsulate integrated circuit chip 13 and conductor wires 19 within the plastic. The plastic encapsulation is preferably by transfer injection molding techniques utilizing, for example, epoxy novolak, a well known material utilized in the injection molding of integrated circuit packages. For example, the transfer injection molding takes place with the molds maintained at about 180C under about 50-125 ton pressure with the novolak injected at about 200 psi. The carrier portion of strip 11 and the portion 47 of metal which supports conductors 17 until the injection molding process is complete are then removed resulting in the structure of FIGURE -~
4.
Referring to FIGURE 4, the upper mold is formed to provide, in the injected plastic, cavity 24 for support of the display with an opening exposing the conductors 17 in the display cavity to which the display is to be ohmically connected, opening 14 exposing selectively positioned conductors 22 and opening 23 exposing selectively positioned conductors 15.
Referring to FIGURE 5, the lower mold is formed to provide in the injected plastic a mechanical support cavity 25 for the variable capacitor, mechanical support cavity 26 for the oscillator crystal and mechanical support cavities 28 for the batteries. The lower mold also provides an opening 44 in the injected plastic exposing the opposite surface of the conductors 17 to which the display is to be connected. The cavities 25 and 26 extend to the lead frame exposing the conductors 14 and 15 to which the capacitor and crystal are to be ohmically connected while the battery cavities 28 are shallower and do not extend to the lead frame. The peripheral conductors 20 are bent down ;.
from the position shown in FIGURE 4 to the position shown in FIGURE 5. Battery contacts 29 are mounted in electrical connection with selected conductors 30 of the ., .. . . ~ . . . . . .
105~31Z
peripheral conductors 20 or contacts 29 may be portions of -conductors 30 which are bent over into cavities 28. ~ -As illustrated in FIGURE 6, an oscillator crystal 33 and a micro-miniature variable capacitor 34 are inserted into the cavities 26 and 25 respectively, and ohmically connected to the selectively positioned lead frame conductors 15 and 14 from the openings 23 and 22 provided in the upper surface of the structure by, for example, soldering techniques.
As illustrated in FIGURE 7, the display 35 is then mounted in cavity 24 on the upper surface of the molded lead frame and selectively electrically connected to lead frame contacts 17 from the opening 44 in the bottom surface of the structure. The dis-play 15 is comprised, for example, of a plurality of segmented light emitting diode chips 36 mounted on a ceramic substrate 37.
The segments 36 are connected to conductors on the ceramic with common segment conductors and common digit conductors 38 terminating on the underside of substrate 37. The conductors 38 mate up with respective conductors 17 of the lead frame and are ohmically bonded by thermocompression bonding or soldering techniques through opening 44.
The module may then be mounted within a cavity 45 of a watch case 40. The watch case includes, for example, a filtering lens 41 for a light emitting diode display. Single pole, single throw pushbutton switches 42 and 43 are inserted in the watch case 40 to make contact with selected ones of the lead frame conductors 20 extending out of the encapsulating material along the periphery of the module, to provide the time setting and/or display demand function control signals to the circuit.
The completed module is, for example, about 1 inch or .less in diameter and may be fitted in a large variety of cases.
Although an LED type display is illustrated, it is contemplated that other displays such as liquid crystal or electro-chromic display devices may be utilized in place rI-S874/5883/589o/6ooo 105~312 of the LED display.
In another example, an electronic watch is fabricated utilizing the techniques embodied in the preSellt invention by providing a single metal lead frame 10 as shown in FIGURE 8.
This lead frame 10 is, for example, stamped out of a strip 11 of .010 inch thick iron-cobalt-nickel alloy such as Kovar. A number of the lead frames 10 are conveniently stamped out of a single strip 11 with a portion of the strip 11 utilized as a carrier to facilitate handling in process. Another portion 47 of the strip is also left in place to hold some of the lead frame conductors in place through processing.
A mounting pad 12 is provided by the lead frame 10 upon which a semiconductor integrated circuit chip 13 is mounted, as ~-shown in FIGURE 9. Connectors such as ball bonded gold wires 19 selectively connect terminal pads 18 on the integrated circuit chip to selected lead frame conductors 16. The semiconductor chip 13 is preferably of the bipolar injection logic type incor-porating all of the electronic circuitry necessary to compute time and to drive a display similar to that described with respect to the watch module of FIGURES 1-7. Alternately, the integrated circuit may be mounted in an upside down fashion with the terminal pads 18 of the circuit 13 thermocompression bonded directly to the lead frame conductors 16 with the conductors 16 somewhat extended. Lead frame 10 also includes selectively positioned conductors 17 for connection of the display to the circuit, selectively positioned conductors 14 for connection of a variable capacitor in the circuit, and selectively positioned conductors ~ ~ -15 for connection of an oscillator crystal in the circuit. -Selectively positioned conductors 20 are provided for connection of time setting and/or display demand switches to the battery and circuit with selectively positioned conductors 30 being provided . . .,: . ~ :
~05831Z
~or connection of one or more batteries to the circuit.
- Next, as illustrated in FIGURE 10, the lead frame is plastic encapsulated with the plastic 21 being formed to com-pletely encapsulate integrated circuit chip 13 and conductor wires 19 within the plastic. The plastic encapsulation is preferably by transfer injection molding techniques utilizing, for example, the epoxy novolak material described above. The plastic may be transparent or translucent and may be colorless or of any desired color as it is here desirable for the resulting product to be visually aesthetically pleasing. The carrier portion of strip 11 and the portion 47 of metal which supports conductors 17 until the injection molding process is complete are then removed resulting in the structure of FIGURE 11 As shown in FIGURE 10, the upper mold is formed to provide, in the injected plastic, cavity 24 for support of the display with the cavity extending to provide an opening exposing the conductors 17 to which the display is to be ohmically connected and a ridge 24A for support of a lens or filter. The upper mold is also formed to provide in the injected plastic selectively shaped openings 22 and 23 exposing selectively positioned conductors 14, 15, 20 and 30.
Referring to FIGURE 11, the lower mold is formed to provide in the injected plastic a mechanical support cavity 25 for the variable capacitor, mechanical support cavity 26 for the oscillator crystal and mechanical support cavities 28 for the batteries. The lower mold also provides an opening 44 in the injected plastic exposing the opposite surface of the conductors 17 to which the display is to be connected. The cavities 25 and 26 extend to the lead frame exposing the conductors 14 and 15 to which the capacitor and crystal are to be ohmically connected while the battery cavities 28 are shallower and do not extend to the lead frame. Battery contact extensions 29 may be bonded in electrical connection with the selected r~ TI-5874/5883/5890/6000 `` 105831Z
lead frame conductors 30 or the lead frame conductors 30 may be made of sufficient length to extend into the cavities 28 to directly connect a pole '~-of the battery.
As illustrated in FIGURE 12, an oscillator crystal 33 and a micro-miniaturc variable capacitor 34 are inserted into the cavities 26 and Z5 respectively, and ohmically connected to the selectively positioned lead ~h .S
frame conductors 15 and 14 from the openings 23 and 22 provided in the upper surface of the structure by, for example, soldering techniques.
The display 35 is then mounted in cavity 24 on the upper surface of-the molded structure and selectively electrically connected to the lead frame contacts 17 from the corresponding opening 44 in the bottom surface of the structure, as shown in FIGURE 11. The display 15 is comprised, for example, o a plurality of segmented light emitting diode chips 36 mounted on a ceramic substrate 37. The segmente 36 are connected to ' conductors on the ceramic with common segment conductors and common digit conductors 38 terminating on the underside of substrate 37. The conductors 38 mate up with respective conductors 17 of the lead frame and are ohmically bonded by thermocompression bonding or soldering techniques.
Single pole, single throw pushbutton switches 42 and 43 are in-serted in the watch case 40 to make ohmic connection with selected of the lead frame cohductors 20 to provide the time setting and/or display demand function control signals to the circuit. The openings 22 and 23 .
are then plugged with design coordinated plastic plugs 22a and 23a, respectively. The plugs 22a and 23a may be fastened to the watch face ~ . . ~.
by means of any appropriate adhesive. The watch case also includes, for examplej a filtering lens 41 adherently mounted in the ridge 24a for : .
filtering the light emitted by the diode display 35. A top view of the .
~I-S874/5883/5890/600~
completcd watch is shown in FIGUR~ 13, In still a further example, a magnetic bubble chip is package(l in accordancc: ~ith techniques of the present invention by providin~ a single metal lead rame 10 as shown in FIGURE 14, The lead Irame 10 is, for example, stamped out of a strip of ,010 inch thick copper or other ~netal having nonmagnetic properties, A number of the lead frames ~,~f~
10 are conveniently stamped out of a single strip with a portion 11 of the strip utilized as a carrier to facilitate handling in process. Other portions 47 of the strip are also left in place to support some of the lead rame con-_;
ductors through processing. -~
A mounting pad lZ is provided by the lead frame 10 upon which a magnetic bubble chip such as a magnetic bubble memory chip 13A is mounted by means of an adhesive such as epoxy, The pad 12 may be bent around a line 12A to a lower elevation than the remainder of the lead frame. Connectors such as wires 19 selectively connect the terminal pads 18 on the magnetic bubble chip to selected lead frame conductors 16 as shown in FIGURE 15. The wires are bonded by either thermocompres-sion or ultrasonic bonding techniques, Lead frame 10 also includes selec-tively positioned conductors 17A-C which provide external terminals to magnetic field producing coils also mounted on the package as will honce-forth be described.
-- ~;
NexS, as illustrated in FIGURE 16, the lead frame is plastic en- ;-capsulated with the plastic being formed to completely seal the magnetic bubble chip 13, conductors 16 and connectors 19 while providing in the same step a pair of mechanical support channels for X and Y magnetic field coils, The plastic encapsulation is again preferably accomplished by tran~fer injection molding techniques utilizing, for example, epoxy ~-5874/5883/57go/6000 ~0583~Z
novolak. The carrier strip 11 and tlle portions 47 which support Lhe CO;I-ductors 16 and 17A-C until the injection molding process is complcte are j~:
then removed resulting in the structure of FIGURE 17.
As shown in FIGURES 16 and 17, the mold is formed to provide in the injected plastic the X and Y channels which extend perpendicularly to oach other around the package and openinf~s 14A-C exposing the selcc-tivcly poYitioned conductors 17A-C, respectively, of the lead frame. The oponings 14A-C arc provided in both upper and lower major suraces of the package so that the conductor ends of the coils may be inserted rom 10 one major surface and ohmically connected to the conductors 17A-C by , soldering techniques, for example, from the opposite major surface.
FIGURE 18 shows the encapsulated magnetic bubble chip 13A
in cross-section. It should be noted, as discussed above, the lead frame pad 12 upon which the magnetic bubble chip 13A is mounted is preferably positioned in a plane displaced from the plane of the remainder of the lcad frame conductors so that the upper major surface o the ma~netic bubble chip 13A is in approxin~ately the same plane as the surface oL
conductors 16, This facilitates the connection of wires between the con-ductors 16 and the input/output terminal pads 18 of the chip 13A.
Referring now to FIGURE 19, the X coil 25A is next wound about the encapsulated magnetic bubble chip within the X channel provided therefor. The ends of the coil are ohrnically connected to the selectively positioned terminal conductors 17A and C by means of the openings 14A
and C, respectively. Next, as shown in I'IGURE 20, thc Y magnetic ield producin~ coil 26A i9 wrapped about the encapsulated magnetic bubble chip over the coil 25A within the Y channel provided therfor. The ends of the coil 26A are ohmically connected to the selectively positioned terminal conductors 17A and B by means of the openings 14A and B, respectively.
. .
~ TI-5874/5883/5790/6000 .
~0583~Z
The Z magnetic field is provided by permanent bar magnets 28A and B which are positioned at opposite ends of the assembly as shown in FIGURE 21. Magnetic spreading plates Z9A and B are then positioned over the top and bottom major surfaces of the structure parallel to the plane of the magnetic bubble chip to provide a uniform constant z magnetic field from magnets 25A and B. The permanent magnets 28A and B and the magnetic spreading plates 29A
and B may be adhesively bonded to the molded encapsulating material and/or to each other. The X and Y magnetic coils may be connected to external electrical excitation signals by means of terminals 15A-C shown in FIGURE 17. The input and output signals to the magnetic bubble chip are provided on external terminals 16A.
Various embodiments of the invention have now been described in detail. Since it is obvious that many additional changes and modifications can be made to the above described details without departing from the nature and spirit of the invention, it is understood that the invention is not to be limited to said details except as set forth in the appended claims.
.
.
`` - lOS831Z
and electrically interconnected. The substrates are generally of two sections, a first section circuit board such as a cera- ;
mic or printed circuit board having single or multilayer inter-connects on which the timekeeping circuit display drivers and display elements are mounted and interconnected and a second section with is comprised of molded plastic or other mater~al to provide mechanical support for the oscillator crystal, ,~
variable capacitor, battery conductors and battery. The inte-grated circuit chips providing the timekeeping circuitry and drive functions are mounted on the circuit board and selectively connected to the conductors thereof. The integrated circuit and wires thereto are generally sealed within a drop of epoxy -material for the protection thereof. The latter support sec-tion of the substrate may include conductors which mate with conductors of the circuit board section or the oscillator crystal, variable capacitor and battery contacts may be electri-cally connected directly to conductors on the circuit board.
The complexity of these prior art modules is exemplified by ~-~
U.S. Patent Nos. 3,759,031 which lssued to Robert E. McCullough et al on 18 September 1973; 3,803,827 which issued to Dennis A. Robert on 16 April 1974; 3,838,566 which issued to Arthur , H. O'Connor et al on 1 October 1974; and 3,817,021 which issued to John M. Bergey on 18 June 1974. The integrated circuit it-self is relatively inexpensive compared to the cost of manu-facturing the module substrate and the attachment and inter-connection of the circuit devices to the substate and circuit board to provide the module.
It is therefore another object of the prese~t in-vention to provide an improved electronic watch module.
It is another object of the ir,vention to provide a simplified electronic watch module.
~ - 3 -A further object of the invention is to provide an improved method of fabricating electronic watch modules.
Still another object of the invention is to provide a relatively inexpensive electronic watch module and hence a relatively inexpensi~e electronic watch.
`
:
- 3a -'~
~3 ' ' 10S8312 :
The watch ~odule is fabricated by mounting a semi-conductor circuit chip such as a bipolar injection logic chip `~
~ incorporating all the electronic circuitry necessary to compute time and to drive a display with decoded timekeeping signals on a mounting paid of a metal lead frame. Connectors such as those provided by gold wire are bonded between selected terminal pads on the integrated circuit chip and selected lead frame conductors. Alternately, the integrated circuit may be mounted in upside down fashion with terminal pads of the circuit thermocompression bonded directly to portions of the lead frame conductors. The lead frame is then plastic encapsulated by injection molding techniques. The upper mold is formed to provide, in the injected plastic, a cavity for the display, openings exposing one surface of the selectively positioned .
conductors for the crystal and capacitor and an opening exposing the conductors in the display cavity to which the display is to be ohmically connected. The lower mold is formed to : : .
provide, in the injected plastic, mechanical support cavities ~ for the crystal, variable capacitor and batteries, and an opening exposing the opposite surface of the conductors to which the display is to be connected. The display is then mounted in the cavity provided therefor on the upper surface of the molded lead frame and selectively electrically connected to the lead frame by means of the opening on the opposite surface.
.~ : .. .
The crystal and capacitor are inserted in the cavities provided therefor and electrically connected to the selectively positioned lead frame conductors from the openings provided .:
in the upper surface. Battery contacts are provided in the : , .. .
cavities formed for the batteries by bending the lead frame ~; 30 conductors extending along the periphery of the molded structure down into the cavities and extensions may be added.
,, .
`':
: `~ 105831Z
The module is thus provided ready ~or insertion within the cavity of a watch case.
Another example of the technique embodied in the present invention is for an electronic watch. In this example, the mechanical support cavity for a display is provided with an additional ridge to support filter lens which provides .
filtering for a display such `.
, .
- 4a -' . ,:
.' -~-,TI-5874/5883/5890/6000 -` 105831Z
.. . .
as an LED type display. In additionl the openings opposite the capacitor and crystal cavities on the front surfact are plugged with design coordinated plastic plt~gs. The plastic encapsulating means includes extensions for attachment of a band and a cover is provided for the back. In this ~nstance, the encapsulated cir-cuit incorporates all of the functions otherwise required by a watch case.
.
A further example of an embodiment of the packaging technique of the present invention is for a màgnetic bubble memory packaging ~10 arrangement.
Magnetic bubble memory devices have been of growing interest because of the ability to store more bits of information in less space than now required by conventional methods such as ferrite cores and to produce the stored information in a less complicated manner than is; presently possible. Magnetic bubble memories have been developed in which very large numbers of bit information can be~stored in very small areas. Further, techniques are being de-;~ veloped by whlch bits stored in magnetic bubble chips can be pro-cessed~on the same or other magnetic bubble chips with various ;~ 20 ~ logic~and switching functions being performed with less power being required than with conventional computer circuitry and with greater reliabiIity.
Some drawbacks to implementing magnetic bubble chips and devices into system designs are the need to package the chips cheaply and reliably. Unlike conventional electronic circuits, magnetic bubble devices require a specific magnetic environment in order to operate properly. Three magnetic fields are required to create this env~ironment. The first or Z field is a constant magnetic field perpendicular to the surface of a magnetic bubble chip and is used to maintain magnetic bubble domains in the chip in the proper physical diameters. The second and third or X and Y
fields are excited in such a manner as to produce a rotating mag-netic field parallel to the plane of the surface of the chip. As 1 this fieId rotates, it interacts with magnetizable elements on the :~ ..
.
~1-5874/5883/5890/6000 lOS831Z
surface of the chip, thus creating time-varying magnetic field gradings, which control the movement of the magnetic bubble do-mains in the chip. Thus, any design utilizing magnetic bubble devices necessarily ha~ to provide the proper magnetic environment for each chip. Many arrangements have been suggested in which . a large number of magnetic bubble chips are mounted on a single substrate and-share a common set of magnetic field generating coils. The problem with this arrangement is that it is diffi-.. cult to replace the chips in the event that any of them malfunction.
It is therefore another object of the present invention to provice an improved packaqing technique for magnetic bubble chips.
- It.is another object of the invention to provide a sim-plified m-thod of manufacturing packaged magnetic bubble chips . with individually self-contained magnetic field generators.
.Still antoher object of the invention is to provide a simple ., .
and lnexpensive packaging technique for magnetic chips.
A further object of the invention is to provide packaged ~: magnetic bubble devices which are easily and individually connect-able or disconnectable in a system employing a large number of such 20:. devices In this example, the circuit device, which i5 a magnetic bubble chip, is packaged along with X, Y AND Z magnetic field gen-erat:ing means. The package is comprised of a metal lead frame upon which the magnetic bubble chip such as a memory chip device is mounted. Connectors.are utilized to connect terminal pads on the ~: . bubble memory device to selected lead frame conductors. The lead rame includes selectively positioned terminal conductors which pro-vide exterlor terminals for X and Y magnetic field generating coils.
The.lead frame is plastic encapsulated with the plastic being formed 30 to completely seal the magnetic bubble chip and connectors while ~ .
; providing mechanical support ¢hannels for X and Y magnetic field ~coils. ~Openings are provided in the plastic within the channels . . ; . . .
: . -6-parallel to the plane of the lead frame on opposite sides thereof exposing the selectively positioned conductors through which the coils are electrically connected to the lead frame terminal conductors. Permanent magnets are provided on either end of the structure and magnetic field spreading plates are provided over the bottom and top of the structure parallel to the plane of the lead frame to generate a constant Z magnetic field.
In accordance with one embodiment of the present -~
invention there is provided a circuit module for an electronic watch comprising ~a) display means responsive to electrical -signals for displaying time; (b) an integrated circuit chip .
having circuitry for driving said display means with decoded ; electrical timekeeping signals; (c) a metal lead frame having a plurality of lead conductors ohmically coupling said display means to said integrated circuit c~ip, and (d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means havlng a cavity selectively positioned with respect to said plurality of lead conductors with said ',;
~:20 display means being supported within said cavity. ~ .
In accordance with another embodiment of the present .
~ ; invention there is provided a method of fa~ricating an elec- :
: tronic watch module comprising: (a) mounting a semiconductor. .
integrated circuit chip having circuitry for driving a dispiay means with decoded electrical timekeeping signals on a mounting pad of a metal lead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display ..
means to said integrated circuit chip, a second plurality of .
lead conductors for ohmically coupling an oscillator crystal to ~.. . -...
said integrated circuit chip, a third plurality of lead con-ductors for ohmically coupling a capacitor device to said ~, ~
. - 7 -~` .
.. .. , . .. , . , .. . . . . ~ . . ~ . .
` 105l~31~
integrated circuit chip, and a fourth plurality of lead conduc-tors for ohmically coupling one or more batteries to said in- :
tegrated circuit chip; (~) bonding wire connectors between terminal pads on said integrated circuit chip and selected ones of said lead frame conductors; (c) placing the lead frame between the upper and lower molds having mold cavities; (d) injecting a plastic material into the cavities of said upper and lower molds to completely encapsulate said integrated circuit chip, the upper mold being formed to provide in the injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion : ;
of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical :
support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities and a third opening exposing a portion of the opposite surface of said first plurality of lead conductors; (e) removing the en-capsulated lead frame from said mold; (f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening; (g) in-serting an oscillator crystal in said second caviby and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first opening; and (g) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third :
plurality of lead conductors through said second opening.
Further objects and advantages of the invention and the techniques embodied therein will become apparent from the detailed descriptions of - 7a -~.
. ~ .
~I-5874/5883/5890/6000 ~058312 preferred embodimentsand from the claims and from the accompanying drawings wherein:
FIGURE 1 is a planar view of the upper major surface of a lead frame utilized in a watch module fabricated in accordance with techniques embodied in the present invention;
FIGURE 2 is a planar view showing a semiconductor integrated circuit chip being mounted on a pad of the lead frame of FIGURE l;
FIGURE 3 is a planar view of the plastic encapsulated lead frame of FIGURE 2;
FIGURE 4 is a top planar view of the encapsulated lead frame of FIGURE 3 with the carrier portion removed;
FIGURE 5 is a bottom planar view of the encapsulated lead frame of FIGURE 4 with selected peripheral leads bent down to '!
provide battery contacts;
FIGURE 6 is a perspective exploded view of the bottom of the watch module of FIGURE 5 showing the insertion of the crystal, capacitor and batteries in the cavities provided therefor;
FIGURE 7 is a perspecti.ve exploded view of an electronic watch showing the display mounted in the display cavity of the watch module of FIGURES 4-6 and the module inserted within the :
cavity of a watch case;
FIGURE 8 is a planar view of the upper major surface of .;
a lead frame utilized in an electronic watch fabricated in accord-ance with techniques embodied in the present invention;
FIGURE 9 is a planar view showing a semiconductor integrated circuit chip being mounted on a pad of the lead frame of FIGURE 8;
. FIGURE 10 is a planar view of the plastic encapsulated lead frame of FIGURE 9;
FIGURE 11 is a bottom planar view of the encapsulated lead frame of FIGURE 10 after the carrier portion has been removed;
,TI-5874/5883/5890/6000 ,-1~5831Z
FIGURE 12 is a perspective exploded view of the watch of FIGURES 10 and 11 showing the insertion of the crystal, capacitor, control switches and batteries in the cavities provided therefor;
FIGURE 13 is a planar view of the front ~ace of the :
complete watch of FIGURE 12 with the capacitor and crystal connection openings plugged and the display and lens in place;
FIGURE 14 is a top planar view of the upper major surface of a lead frame utilized in a magnetic bubble memory device packaged in accordance with techniques embodied in the present invention;
FIGURE 15 is a top planar view showing a magnetic bubble chip mounted on a pad of the lead frame of FIGURE 14;
FIGURE 16 is a top planar view of the plastic encapsuiated lead frame;
FIGURE 17 is a top planar view of the encapsulated lead frame of FIGURE 16 with the carrier portion removed;
FIGURE 18 is a sectioned view of the plastic : -encapsulated lead frame of FIGURE 16;
FIGURE 19 is a perspective view showing the X
- magnetic field coil in place on the structure of FIGURE 17;
FIGURE 20 is a perspective view showing the Y mag-netic field coil in place on the structure of FIGURE 19; and FIGURE 21 is an exploded perspective view of the structure of FIGURE 20 showing the positioning of a pair of permanent magnets providing the Z magnetic field. -:
Referring then to the drawings, an electronic module provided in accordance with the techniques embodied in the present invention is manufactured by providing a `~ -single metal lead frame 10 as shown in FIGURE 1. The lead frame 10 is, for example, stamped out of a strip 11 `~ ~05~31Z
of .010 inch thick iron-cobalt-nickel alloy such as Kovar (trade mark). A number of the lead frames 10 are conveniently stamped out of a single strip 11 with a portion of the strip 11 utilized as a carrier to facilitate handling in process. Another portion 47 of the strip is also left in place to hold some of the lead frame conductors in place through processing.
A mounting pad 12 is provided by the lead frame 10 upon which a semiconductor integrated circuit chip 13 is mounted.
Connectors such as ball bonded gold wires 19 selectively con- -nect terminal pads 18 on the inte~Jrated circuit chip to selected lead frame conductors 16. The semiconductor chip 13 w~ich is preferably of the bipolar injection logic type incorporates all of the ~lectronic circuitry necessary to compute time and ;~
to drive a display such as an LED display with decoded multi-plexed timekeeping signals. One such integrated circuit is described in U.S. Patent Nos. 3,965,666; 4,013,901; 3,964,251 and 3,986,199 which issued to Clark R. Williams, on ~6 June 1976;
22 March 1977; 22 June 1976; and 12 October 1976, respectively.
Alternately, the integrated circuit may be mounted in an upside down fashion with the terminal pads 18 of the circuit 13 thermo-compression bonded directly to the lead frame conductors 16 with the conductors 16 somewhat extended. Lead frame 10 also includes selectively positioned conductors 17 for connection of the display to the circuit, selectively positioned conductors 14 for connection of a variable capacitor in the circuit, and selectively positioned conductors 15 for connection of an oscillator crystal in the circuit. Selected lead frame con-ductors which extend to the periphery of the lead frame are provided for connection of tim~ setting and/or display demand ~witches to the battery and circuit and for connection of one or more batteries to the circuit.
~ .
~"~
.
.~ ' ' , ' : ' .I-5874/5883/58~0/6000 1058312 Next, as illustrated in FIGURE 3, the lead frame is plastic encapsulated with the plastic 21 being formed to completely en-capsulate integrated circuit chip 13 and conductor wires 19 within the plastic. The plastic encapsulation is preferably by transfer injection molding techniques utilizing, for example, epoxy novolak, a well known material utilized in the injection molding of integrated circuit packages. For example, the transfer injection molding takes place with the molds maintained at about 180C under about 50-125 ton pressure with the novolak injected at about 200 psi. The carrier portion of strip 11 and the portion 47 of metal which supports conductors 17 until the injection molding process is complete are then removed resulting in the structure of FIGURE -~
4.
Referring to FIGURE 4, the upper mold is formed to provide, in the injected plastic, cavity 24 for support of the display with an opening exposing the conductors 17 in the display cavity to which the display is to be ohmically connected, opening 14 exposing selectively positioned conductors 22 and opening 23 exposing selectively positioned conductors 15.
Referring to FIGURE 5, the lower mold is formed to provide in the injected plastic a mechanical support cavity 25 for the variable capacitor, mechanical support cavity 26 for the oscillator crystal and mechanical support cavities 28 for the batteries. The lower mold also provides an opening 44 in the injected plastic exposing the opposite surface of the conductors 17 to which the display is to be connected. The cavities 25 and 26 extend to the lead frame exposing the conductors 14 and 15 to which the capacitor and crystal are to be ohmically connected while the battery cavities 28 are shallower and do not extend to the lead frame. The peripheral conductors 20 are bent down ;.
from the position shown in FIGURE 4 to the position shown in FIGURE 5. Battery contacts 29 are mounted in electrical connection with selected conductors 30 of the ., .. . . ~ . . . . . .
105~31Z
peripheral conductors 20 or contacts 29 may be portions of -conductors 30 which are bent over into cavities 28. ~ -As illustrated in FIGURE 6, an oscillator crystal 33 and a micro-miniature variable capacitor 34 are inserted into the cavities 26 and 25 respectively, and ohmically connected to the selectively positioned lead frame conductors 15 and 14 from the openings 23 and 22 provided in the upper surface of the structure by, for example, soldering techniques.
As illustrated in FIGURE 7, the display 35 is then mounted in cavity 24 on the upper surface of the molded lead frame and selectively electrically connected to lead frame contacts 17 from the opening 44 in the bottom surface of the structure. The dis-play 15 is comprised, for example, of a plurality of segmented light emitting diode chips 36 mounted on a ceramic substrate 37.
The segments 36 are connected to conductors on the ceramic with common segment conductors and common digit conductors 38 terminating on the underside of substrate 37. The conductors 38 mate up with respective conductors 17 of the lead frame and are ohmically bonded by thermocompression bonding or soldering techniques through opening 44.
The module may then be mounted within a cavity 45 of a watch case 40. The watch case includes, for example, a filtering lens 41 for a light emitting diode display. Single pole, single throw pushbutton switches 42 and 43 are inserted in the watch case 40 to make contact with selected ones of the lead frame conductors 20 extending out of the encapsulating material along the periphery of the module, to provide the time setting and/or display demand function control signals to the circuit.
The completed module is, for example, about 1 inch or .less in diameter and may be fitted in a large variety of cases.
Although an LED type display is illustrated, it is contemplated that other displays such as liquid crystal or electro-chromic display devices may be utilized in place rI-S874/5883/589o/6ooo 105~312 of the LED display.
In another example, an electronic watch is fabricated utilizing the techniques embodied in the preSellt invention by providing a single metal lead frame 10 as shown in FIGURE 8.
This lead frame 10 is, for example, stamped out of a strip 11 of .010 inch thick iron-cobalt-nickel alloy such as Kovar. A number of the lead frames 10 are conveniently stamped out of a single strip 11 with a portion of the strip 11 utilized as a carrier to facilitate handling in process. Another portion 47 of the strip is also left in place to hold some of the lead frame conductors in place through processing.
A mounting pad 12 is provided by the lead frame 10 upon which a semiconductor integrated circuit chip 13 is mounted, as ~-shown in FIGURE 9. Connectors such as ball bonded gold wires 19 selectively connect terminal pads 18 on the integrated circuit chip to selected lead frame conductors 16. The semiconductor chip 13 is preferably of the bipolar injection logic type incor-porating all of the electronic circuitry necessary to compute time and to drive a display similar to that described with respect to the watch module of FIGURES 1-7. Alternately, the integrated circuit may be mounted in an upside down fashion with the terminal pads 18 of the circuit 13 thermocompression bonded directly to the lead frame conductors 16 with the conductors 16 somewhat extended. Lead frame 10 also includes selectively positioned conductors 17 for connection of the display to the circuit, selectively positioned conductors 14 for connection of a variable capacitor in the circuit, and selectively positioned conductors ~ ~ -15 for connection of an oscillator crystal in the circuit. -Selectively positioned conductors 20 are provided for connection of time setting and/or display demand switches to the battery and circuit with selectively positioned conductors 30 being provided . . .,: . ~ :
~05831Z
~or connection of one or more batteries to the circuit.
- Next, as illustrated in FIGURE 10, the lead frame is plastic encapsulated with the plastic 21 being formed to com-pletely encapsulate integrated circuit chip 13 and conductor wires 19 within the plastic. The plastic encapsulation is preferably by transfer injection molding techniques utilizing, for example, the epoxy novolak material described above. The plastic may be transparent or translucent and may be colorless or of any desired color as it is here desirable for the resulting product to be visually aesthetically pleasing. The carrier portion of strip 11 and the portion 47 of metal which supports conductors 17 until the injection molding process is complete are then removed resulting in the structure of FIGURE 11 As shown in FIGURE 10, the upper mold is formed to provide, in the injected plastic, cavity 24 for support of the display with the cavity extending to provide an opening exposing the conductors 17 to which the display is to be ohmically connected and a ridge 24A for support of a lens or filter. The upper mold is also formed to provide in the injected plastic selectively shaped openings 22 and 23 exposing selectively positioned conductors 14, 15, 20 and 30.
Referring to FIGURE 11, the lower mold is formed to provide in the injected plastic a mechanical support cavity 25 for the variable capacitor, mechanical support cavity 26 for the oscillator crystal and mechanical support cavities 28 for the batteries. The lower mold also provides an opening 44 in the injected plastic exposing the opposite surface of the conductors 17 to which the display is to be connected. The cavities 25 and 26 extend to the lead frame exposing the conductors 14 and 15 to which the capacitor and crystal are to be ohmically connected while the battery cavities 28 are shallower and do not extend to the lead frame. Battery contact extensions 29 may be bonded in electrical connection with the selected r~ TI-5874/5883/5890/6000 `` 105831Z
lead frame conductors 30 or the lead frame conductors 30 may be made of sufficient length to extend into the cavities 28 to directly connect a pole '~-of the battery.
As illustrated in FIGURE 12, an oscillator crystal 33 and a micro-miniaturc variable capacitor 34 are inserted into the cavities 26 and Z5 respectively, and ohmically connected to the selectively positioned lead ~h .S
frame conductors 15 and 14 from the openings 23 and 22 provided in the upper surface of the structure by, for example, soldering techniques.
The display 35 is then mounted in cavity 24 on the upper surface of-the molded structure and selectively electrically connected to the lead frame contacts 17 from the corresponding opening 44 in the bottom surface of the structure, as shown in FIGURE 11. The display 15 is comprised, for example, o a plurality of segmented light emitting diode chips 36 mounted on a ceramic substrate 37. The segmente 36 are connected to ' conductors on the ceramic with common segment conductors and common digit conductors 38 terminating on the underside of substrate 37. The conductors 38 mate up with respective conductors 17 of the lead frame and are ohmically bonded by thermocompression bonding or soldering techniques.
Single pole, single throw pushbutton switches 42 and 43 are in-serted in the watch case 40 to make ohmic connection with selected of the lead frame cohductors 20 to provide the time setting and/or display demand function control signals to the circuit. The openings 22 and 23 .
are then plugged with design coordinated plastic plugs 22a and 23a, respectively. The plugs 22a and 23a may be fastened to the watch face ~ . . ~.
by means of any appropriate adhesive. The watch case also includes, for examplej a filtering lens 41 adherently mounted in the ridge 24a for : .
filtering the light emitted by the diode display 35. A top view of the .
~I-S874/5883/5890/600~
completcd watch is shown in FIGUR~ 13, In still a further example, a magnetic bubble chip is package(l in accordancc: ~ith techniques of the present invention by providin~ a single metal lead rame 10 as shown in FIGURE 14, The lead Irame 10 is, for example, stamped out of a strip of ,010 inch thick copper or other ~netal having nonmagnetic properties, A number of the lead frames ~,~f~
10 are conveniently stamped out of a single strip with a portion 11 of the strip utilized as a carrier to facilitate handling in process. Other portions 47 of the strip are also left in place to support some of the lead rame con-_;
ductors through processing. -~
A mounting pad lZ is provided by the lead frame 10 upon which a magnetic bubble chip such as a magnetic bubble memory chip 13A is mounted by means of an adhesive such as epoxy, The pad 12 may be bent around a line 12A to a lower elevation than the remainder of the lead frame. Connectors such as wires 19 selectively connect the terminal pads 18 on the magnetic bubble chip to selected lead frame conductors 16 as shown in FIGURE 15. The wires are bonded by either thermocompres-sion or ultrasonic bonding techniques, Lead frame 10 also includes selec-tively positioned conductors 17A-C which provide external terminals to magnetic field producing coils also mounted on the package as will honce-forth be described.
-- ~;
NexS, as illustrated in FIGURE 16, the lead frame is plastic en- ;-capsulated with the plastic being formed to completely seal the magnetic bubble chip 13, conductors 16 and connectors 19 while providing in the same step a pair of mechanical support channels for X and Y magnetic field coils, The plastic encapsulation is again preferably accomplished by tran~fer injection molding techniques utilizing, for example, epoxy ~-5874/5883/57go/6000 ~0583~Z
novolak. The carrier strip 11 and tlle portions 47 which support Lhe CO;I-ductors 16 and 17A-C until the injection molding process is complcte are j~:
then removed resulting in the structure of FIGURE 17.
As shown in FIGURES 16 and 17, the mold is formed to provide in the injected plastic the X and Y channels which extend perpendicularly to oach other around the package and openinf~s 14A-C exposing the selcc-tivcly poYitioned conductors 17A-C, respectively, of the lead frame. The oponings 14A-C arc provided in both upper and lower major suraces of the package so that the conductor ends of the coils may be inserted rom 10 one major surface and ohmically connected to the conductors 17A-C by , soldering techniques, for example, from the opposite major surface.
FIGURE 18 shows the encapsulated magnetic bubble chip 13A
in cross-section. It should be noted, as discussed above, the lead frame pad 12 upon which the magnetic bubble chip 13A is mounted is preferably positioned in a plane displaced from the plane of the remainder of the lcad frame conductors so that the upper major surface o the ma~netic bubble chip 13A is in approxin~ately the same plane as the surface oL
conductors 16, This facilitates the connection of wires between the con-ductors 16 and the input/output terminal pads 18 of the chip 13A.
Referring now to FIGURE 19, the X coil 25A is next wound about the encapsulated magnetic bubble chip within the X channel provided therefor. The ends of the coil are ohrnically connected to the selectively positioned terminal conductors 17A and C by means of the openings 14A
and C, respectively. Next, as shown in I'IGURE 20, thc Y magnetic ield producin~ coil 26A i9 wrapped about the encapsulated magnetic bubble chip over the coil 25A within the Y channel provided therfor. The ends of the coil 26A are ohmically connected to the selectively positioned terminal conductors 17A and B by means of the openings 14A and B, respectively.
. .
~ TI-5874/5883/5790/6000 .
~0583~Z
The Z magnetic field is provided by permanent bar magnets 28A and B which are positioned at opposite ends of the assembly as shown in FIGURE 21. Magnetic spreading plates Z9A and B are then positioned over the top and bottom major surfaces of the structure parallel to the plane of the magnetic bubble chip to provide a uniform constant z magnetic field from magnets 25A and B. The permanent magnets 28A and B and the magnetic spreading plates 29A
and B may be adhesively bonded to the molded encapsulating material and/or to each other. The X and Y magnetic coils may be connected to external electrical excitation signals by means of terminals 15A-C shown in FIGURE 17. The input and output signals to the magnetic bubble chip are provided on external terminals 16A.
Various embodiments of the invention have now been described in detail. Since it is obvious that many additional changes and modifications can be made to the above described details without departing from the nature and spirit of the invention, it is understood that the invention is not to be limited to said details except as set forth in the appended claims.
.
Claims (78)
1. A circuit module for an electronic watch comprising:
(a) display means responsive to electrical signals for displaying time;
(b) an integrated circuit chip having circuitry for driving said display means with decoded electrical timekeeping signals;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said display moans to said integrated circuit chip; and (d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said display means being supported within said cavity.
(a) display means responsive to electrical signals for displaying time;
(b) an integrated circuit chip having circuitry for driving said display means with decoded electrical timekeeping signals;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said display moans to said integrated circuit chip; and (d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said display means being supported within said cavity.
2. The circuit module for an electronic watch according to Claim I wherein an opening is provided in said encapsulating means opposite said cavity, said opening exposing a portion of said plurality of lead conductors to facilitate the ohmic connection of said display means to said lead conductors.
3. The circuit module for an electronic watch according to Claim I wherein said display means includes a plurality of light emitting diode elements selectively positioned on a substrate member for generating a visual representation of a plurality of digits representative of time.
4. The circuit module for an electronic watch according to Claim 3 wherein said substrate is comprised of a ceramic material with the diode elements mounted on one major surface thereof and including a plurality of conductor members on an opposite major surface thereof, said conductor members being positioned to mate with said plurality of lead conductors.
5. The circuit module for an electronic watch according to Claim 1 wherein said encapsulating means is comprised of a molded plastic material.
6. A circuit module for an electronic watch comprising:
(a) an integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals;
(b) an oscillator crystal for providing a timekeeping standard to said integrated circuit chip;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip; and (d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said oscillator crystal means being supported within said cavity.
(a) an integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals;
(b) an oscillator crystal for providing a timekeeping standard to said integrated circuit chip;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip; and (d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said oscillator crystal means being supported within said cavity.
7. A circuit module for an electronic watch according to Claim 6 wherein an opening is provided in said encapsulating means opposite said cavity, said opening exposing a portion of said plurality of lead conductors to facilitate the ohmic connection of said oscillator crystal to said lead conductors.
8. A circuit module for an electronic watch according to Claim 6 wherein said encapsulating means is comprised of a molded plastic material.
9. A circuit module for an electronic watch comprising:
(a) an integrated circuit chip having timekeeping circuitry for generating timekeeping signals and for driving a display means with decoded electrical signals corresponding to said timekeeping signals;
(b) a variable capacitor device for adjusting the timekeeping signals generated by said timekeeping circuitry;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip; and (d) means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said capacitor device being supported within said cavity exposed at an opening of said cavity for adjustment of said capacitor device.
(a) an integrated circuit chip having timekeeping circuitry for generating timekeeping signals and for driving a display means with decoded electrical signals corresponding to said timekeeping signals;
(b) a variable capacitor device for adjusting the timekeeping signals generated by said timekeeping circuitry;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip; and (d) means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said capacitor device being supported within said cavity exposed at an opening of said cavity for adjustment of said capacitor device.
10. The circuit module for an electronic watch according to Claim 9 wherein an opening is provided in said encapsulating means opposite said cavity exposing a portion of said plurality of lead conductors to facilitate the connection of said capacitor device to said lead conductors.
11. The circuit module for an electronic watch according to Claim 9 wherein said encapsulating means is comprised of a molded plastic material.
12. A circuit module for an electronic watch comprising:
(a) an integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals;
(b) a metal lead frame having a plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip; and (c) means completely encapsulating said integrated circuit chip, said encapsulating means having at least one cavity selectively positioned with respect to said plurality of lead conductors for supporting at least one battery within said at least one cavity.
(a) an integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals;
(b) a metal lead frame having a plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip; and (c) means completely encapsulating said integrated circuit chip, said encapsulating means having at least one cavity selectively positioned with respect to said plurality of lead conductors for supporting at least one battery within said at least one cavity.
13. The circuit module for an electronic watch according to Claim 12 wherein at least one of said plurality of lead conductors extends beyond the periphery of said encapsulating material and is bent around extending into said at least one cavity for ohmically contacting a pole of a battery supported within said cavity.
14. A circuit module for an electronic watch according to Claim 12 wherein said encapsulating means is comprised of a molded plastic material.
15. A circuit module for an electronic watch comprising:
(a) display means responsive to electrical signals for displaying time;
(b) an integrated circuit chip having circuitry for driving said display means with decoded electrical timekeeping signals;
(c) an oscillator crystal;
(d) a capacitor device;
(e) a metal lead frame extending essentially in a single plane, said lead frame including:
(i) a first plurality of lead conductors ohmically coupling said display means to said integrated circuit chip, (ii) a second plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip, (iii) a third plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip, and (iv) a fourth plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip; and (f) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having:
15. A circuit module for an electronic watch comprising:
(a) display means responsive to electrical signals for displaying time;
(b) an integrated circuit chip having circuitry for driving said display means with decoded electrical timekeeping signals;
(c) an oscillator crystal;
(d) a capacitor device;
(e) a metal lead frame extending essentially in a single plane, said lead frame including:
(i) a first plurality of lead conductors ohmically coupling said display means to said integrated circuit chip, (ii) a second plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip, (iii) a third plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip, and (iv) a fourth plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip; and (f) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having:
15. (f) (continued) (i) a first cavity selectively positioned with respect to said first plurality of lead conductors with said display means being supported within said first cavity, (ii) a second cavity selectively positioned with respect to said second plurality of lead conductors with said oscillator crystal means being supported within said second cavity, (iii) a third cavity selectively positioned with respect to said third plurality of lead conductors with said capacitor device being supported within said third cavity, and (iv) at least one additional cavity selectively positioned with respect to said fourth plurality of lead conductors for supporting at least one battery within said at least one additional cavity.
16. A circuit module for an electronic watch according to Claim 15 wherein said encapsulating means is comprised of a molded plastic material.
17. The circuit module for an electronic watch according to Claim 15 wherein an opening is provided in said encapsulating means opposite each of said first, second and third cavities, said openings respectively exposing a portion of said first, second and third pluralities of lead conductors to facilitate the ohmic connection of said display means, oscillator crystal and capacitor device to said lead conductors.
18. The circuit module for an electronic watch according to Claim 15 wherein said display means includes a plurality of light emitting diode elements selectively positioned on a substrate member for generating a visual representation of a plurality of digits representative of time.
19. The circuit module for an electronic watch according to Claim 18 wherein said substrate is comprised of a ceramic material with the diode elements mounted on one major surface thereof and including a plurality of conductor members on an opposite major surface thereof, said conductor members being positioned to mate with said plurality of lead conductors.
20. The circuit module for an electronic watch according to Claim 15 wherein at least one of said fourth plurality of lead conductors extends beyond the periphery of said encapsulating material and is bent around extending into said at least one cavity for ohmically contacting a pole of a battery supported within said cavity.
21. A circuit module for an electronic watch comprising:
(a) a metal lead frame having upper and lower opposite major surfaces;
(b) an integrated circuit chip mounted on the upper surface of said lead frame and selectively ohmically coupled to lead conductors of said lead frame, said integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals, said lead frame including:
21. (b) (continued) (i) a first plurality of lead conductors for ohmically coupling a display means to said integrated circuit chip, (ii) a second plurality of lead conductors for ohmically coupling an oscillator crystal to said integrated circuit chip, and (iii) a third plurality of lead conductors for ohmically coupling a capacitor device to said integrated circuit chip; and (c) encapsulating means completely encapsulating said integrated circuit means, said encapsulating means having:
(i) a first cavity selectively positioned with respect to said first plurality of lead conductors with a portion of said first plurality of lead conductors being exposed within said first cavity, said first cavity for mechanically supporting said display means in a position such that said display means is in ohmic contact with said portion of said first plurality of lead conductors, (ii) a second cavity selectively positioned with respect to said second plurality of lead conductors with a portion of said second plurality of lead conductors being exposed within said second cavity, said second cavity for mechanically supporting said oscillator crystal in a position such that said oscillator crystal is in ohmic contact with said portion of said second plurality of lead conductors, and
21. A circuit module for an electronic watch comprising:
(a) a metal lead frame having upper and lower opposite major surfaces;
(b) an integrated circuit chip mounted on the upper surface of said lead frame and selectively ohmically coupled to lead conductors of said lead frame, said integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals, said lead frame including:
21. (b) (continued) (i) a first plurality of lead conductors for ohmically coupling a display means to said integrated circuit chip, (ii) a second plurality of lead conductors for ohmically coupling an oscillator crystal to said integrated circuit chip, and (iii) a third plurality of lead conductors for ohmically coupling a capacitor device to said integrated circuit chip; and (c) encapsulating means completely encapsulating said integrated circuit means, said encapsulating means having:
(i) a first cavity selectively positioned with respect to said first plurality of lead conductors with a portion of said first plurality of lead conductors being exposed within said first cavity, said first cavity for mechanically supporting said display means in a position such that said display means is in ohmic contact with said portion of said first plurality of lead conductors, (ii) a second cavity selectively positioned with respect to said second plurality of lead conductors with a portion of said second plurality of lead conductors being exposed within said second cavity, said second cavity for mechanically supporting said oscillator crystal in a position such that said oscillator crystal is in ohmic contact with said portion of said second plurality of lead conductors, and
21. (c) (continued) (iii) a third cavity selectively positioned with respect to said third plurality of lead conductors with a portion of said third plurality of lead conductors being exposed within said third cavity, said third cavity for mechanically supporting said capacitor device in a position such that said capacitor device is in ohmic contact with said third plurality of lead conductors.
22. A circuit module for an electronic watch according to Claim 21 wherein said encapsulating means is comprised of a molded plastic material.
23. The circuit module for an electronic watch according to Claim 21 wherein an opening is provided in said encapsulating means opposite each of said first, second and third cavities, said openings respectively exposing the opposite surfaces of the portions of said first, second and third pluralities of lead conductors to facilitate the ohmic connection of said display means, oscillator crystal and capacitor device to said lead conductors.
24. A circuit module for an electronic watch according to Claim 21 including a fourth plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip, said encapsulating means having at least one additional cavity selectively positioned with respect to said fourth plurality of lead conductors for mechanically supporting at least one battery within said at least one additional cavity with a pole of such battery in contact with at least one of said fourth plurality of lead conductors or an extension thereof.
25. The circuit module for an electronic watch according to Claim 21 wherein said encapsulating means has upper and lower opposite major surfaces corresponding to the upper and lower opposite major surfaces of said metal lead frame and wherein said first cavity is formed in said encapsulating means extending from the upper major surface of said encapsulating means to the upper major surface of said lead frame and wherein said second and third cavities are formed in said encapsulating means extending from the lower major surface of said encapsulating means to the lower major surface of the metal lead frame.
26. The circuit module for an electronic watch according to Claim 21 wherein selected lead conductors of said lead frame are ohmically connected to said integrated circuit chip and extend beyond the periphery of said encapsulating means for connection of time setting and/or display switches to said integrated circuit chip.
27. An electronic watch comprising:
(a) a watch housing having upper and lower major surfaces and a cavity therein extending from said upper major surface to said lower major surface with a lens member sealing said cavity at said upper major surface;
(b) a circuit module including:
(i) display means responsive to electrical signals for displaying time, (ii) an integrated circuit chip having circuitry for driving said display means with decoded electrical timekeeping signals, (iii) an oscillator crystal, 27. (b) (continued) (iv) a variable capacitor device, (v) a metal lead frame including a first plurality of lead conductors ohmically coupling said display means to said integrated circuit chip, a second plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip, a third plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip, a fourth plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip, and a fifth plurality of lead conductors for ohmically coupling one or more switch means to said integrated circuit chip, and (vi) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a first cavity selectively positioned with respect to said first plurality of lead conductors with said display means being supported within said first cavity, a second cavity selectively positioned with respect to said second plurality of lead conductors with said oscillator crystal means being supported within said second cavity, a third cavity selectively positioned with respect to said third plurality of lead conductors with said capacitor device being supported within said third cavity, and at least one additional cavity selectively positioned with respect to said fourth plurality of lead conductors for supporting at least one battery within said at least one additional cavity, said circuit module being positioned within the
27. An electronic watch comprising:
(a) a watch housing having upper and lower major surfaces and a cavity therein extending from said upper major surface to said lower major surface with a lens member sealing said cavity at said upper major surface;
(b) a circuit module including:
(i) display means responsive to electrical signals for displaying time, (ii) an integrated circuit chip having circuitry for driving said display means with decoded electrical timekeeping signals, (iii) an oscillator crystal, 27. (b) (continued) (iv) a variable capacitor device, (v) a metal lead frame including a first plurality of lead conductors ohmically coupling said display means to said integrated circuit chip, a second plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip, a third plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip, a fourth plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip, and a fifth plurality of lead conductors for ohmically coupling one or more switch means to said integrated circuit chip, and (vi) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a first cavity selectively positioned with respect to said first plurality of lead conductors with said display means being supported within said first cavity, a second cavity selectively positioned with respect to said second plurality of lead conductors with said oscillator crystal means being supported within said second cavity, a third cavity selectively positioned with respect to said third plurality of lead conductors with said capacitor device being supported within said third cavity, and at least one additional cavity selectively positioned with respect to said fourth plurality of lead conductors for supporting at least one battery within said at least one additional cavity, said circuit module being positioned within the
27. (b) (vi) (continued) cavity of said watch housing with said display means being visible from outside of said housing through said lens member;
(c) at least one time setting and/or display demand switch mounted in said housing and ohmically coupled to said fifth plurality of lead conductors; and (d) a removable back member at least coincidental with said at least one additional cavity for sealing the cavity of said watch housing at said lower major surface.
(c) at least one time setting and/or display demand switch mounted in said housing and ohmically coupled to said fifth plurality of lead conductors; and (d) a removable back member at least coincidental with said at least one additional cavity for sealing the cavity of said watch housing at said lower major surface.
28. The electronic watch according to Claim 27 wherein said display means include a plurality of light emitting diode elements selectively positioned on a substrate member for generating a visual representation of a plurality of digits representative of time and wherein said lens member is of such color as to substantially only transmit light of the wavelength emitted by said light emitting diodes.
29. A method of fabricating an electronic watch module comprising:
(a) mounting a semiconductor integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals on a mounting pad of a metal lead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display means to said integrated circuit chip, a second plurality of lead conductors for ohmically coupling an oscillator crystal to said integrated circuit chip, a third plurality of lead conductors for ohmically coupling a capacitor device to said integrated circuit chip, 29. (a) (continued) and a fourth plurality of lead conductors for ohmically coupling one or more batteries to said integrated circuit chip;
(b) bonding wire connectors between terminal pads on said integrated circuit chip and selected ones of said lead frame conductors;
(c) placing the lead frame between upper and lower molds having mold cavities;
(d) injecting a plastic material into the cavities of said upper and lower molds to completely encapsulate said integrated circuit chip, the upper mold being formed to provide in the injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities and a third opening exposing a portion of the opposite surface of said first plurality of lead conductors;
(e) removing the encapsulated lead frame from said mold;
(f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening;
29. A method of fabricating an electronic watch module comprising:
(a) mounting a semiconductor integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals on a mounting pad of a metal lead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display means to said integrated circuit chip, a second plurality of lead conductors for ohmically coupling an oscillator crystal to said integrated circuit chip, a third plurality of lead conductors for ohmically coupling a capacitor device to said integrated circuit chip, 29. (a) (continued) and a fourth plurality of lead conductors for ohmically coupling one or more batteries to said integrated circuit chip;
(b) bonding wire connectors between terminal pads on said integrated circuit chip and selected ones of said lead frame conductors;
(c) placing the lead frame between upper and lower molds having mold cavities;
(d) injecting a plastic material into the cavities of said upper and lower molds to completely encapsulate said integrated circuit chip, the upper mold being formed to provide in the injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities and a third opening exposing a portion of the opposite surface of said first plurality of lead conductors;
(e) removing the encapsulated lead frame from said mold;
(f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening;
29. (continued) (g) inserting an oscillator crystal in said second cavity and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first opening; and (h) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third plurality of lead conductors through said second opening.
30. The method according to Claim 29 wherein said plastic material is an epoxy material.
31. The method according to Claim 29 including the step of bending at least one lead conductor of said fourth plurality of lead conductors into an opening in said one or more battery cavities to provide a contact means for connection of one pole of a battery to said integrated circuit chip.
32. A method of fabricating an electronic watch module comprising:
(a) selectively positioning a semiconductor integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals upside down on a metal lead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display means to selected terminal pads of said integrated circuit chip, a second plurality of lead conductors for ohmically
32. A method of fabricating an electronic watch module comprising:
(a) selectively positioning a semiconductor integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals upside down on a metal lead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display means to selected terminal pads of said integrated circuit chip, a second plurality of lead conductors for ohmically
32. (a) (continued) coupling an oscillator crystal to selected terminal pads of said integrated circuit chip, a third plurality of lead conductors for ohmically coupling a capacitor device to selected terminal pads of said integrated circuit chip, and a fourth plurality of lead conductors for ohmically coupling one or more batteries to selected terminal pads of said integrated circuit chip;
(b) thermocompression bonding the terminal pads on said integrated circuit chip to contacted portions of said lead frame conductors;
(c) placing the lead frame between upper and lower molds having mold cavities;
(d) injecting a plastic material into the cavities of said upper and lower molds to completely encapsulate said integrated circuit chip, the upper mold being formed to provide in the injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities and a third opening exposing a portion of the opposite surface of said first plurality of lead conductors;
(e) removing the encapsulated lead frame from said mold;
32, (continued) (f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening;
(g) inserting an oscillator crystal in said second cavity and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first opening; and (h) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third plurality of lead conductors through said second opening.
(b) thermocompression bonding the terminal pads on said integrated circuit chip to contacted portions of said lead frame conductors;
(c) placing the lead frame between upper and lower molds having mold cavities;
(d) injecting a plastic material into the cavities of said upper and lower molds to completely encapsulate said integrated circuit chip, the upper mold being formed to provide in the injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities and a third opening exposing a portion of the opposite surface of said first plurality of lead conductors;
(e) removing the encapsulated lead frame from said mold;
32, (continued) (f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening;
(g) inserting an oscillator crystal in said second cavity and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first opening; and (h) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third plurality of lead conductors through said second opening.
33. The method according to Claim 32 wherein said plastic material is an epoxy material.
34. The method according to Claim 32 including the step of bending at least one lead conductor of said fourth plurality of lead conductors into an opening in said one or more battery cavities to provide a contact means for connection of one pole of a battery to said integrated circuit chip.
35. An electronic watch comprising:
(a) display means responsive to electrical signals for displaying time;
(b) a lens member;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said display means to said integrated circuit chip; and (d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a ridged cavity selectively positioned with respect to said plurality of lead conductors with said display means being supported within said cavity and said lens member being supported in spaced relation from said display means within said ridge.
(a) display means responsive to electrical signals for displaying time;
(b) a lens member;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said display means to said integrated circuit chip; and (d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a ridged cavity selectively positioned with respect to said plurality of lead conductors with said display means being supported within said cavity and said lens member being supported in spaced relation from said display means within said ridge.
36. The electronic watch according to Claim 35 wherein an opening is provided in said encapsulating means opposite said cavity, said opening exposing a portion of said plurality of lead conductors to facilitate the ohmic connection of said display means to said lead conductors.
37. The electronic watch according to Claim 35 wherein said display means includes a plurality of light emitting diode elements selectively positioned on a substrate member for generating a visual representation of a plurality of digits representative of time and wherein said lens member is of such color as to substantially only transmit light of the wavelength emitted by said light emitting diodes.
38. The electronic watch according to Claim 37 wherein said substrate is comprised of a ceramic material with the diode elements mounted on one major surface thereof and including a plurality of con-ductor members on an opposite major surface thereof, said conductor members being positioned to mate with said plurality of lead conductors.
39. The electronic watch according to Claim 35 wherein said encapsulating means is comprised of a molded plastic material.
40. An electronic watch comprising:
(a) an integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals;
(b) an oscillator crystal for providing a timekeeping standard to said integrated circuit chip;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip;
(d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said oscillator crystal being supported within said cavity and an opening opposite said cavity, said opening exposing a portion of said plurality of lead conductors to facilitate the ohmic connection of said oscillator crystal to said lead conductors; and (e) means for sealing said opening with said oscillator crystal connected in place.
(a) an integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals;
(b) an oscillator crystal for providing a timekeeping standard to said integrated circuit chip;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip;
(d) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said oscillator crystal being supported within said cavity and an opening opposite said cavity, said opening exposing a portion of said plurality of lead conductors to facilitate the ohmic connection of said oscillator crystal to said lead conductors; and (e) means for sealing said opening with said oscillator crystal connected in place.
41. The electronic watch according to Claim 40 wherein said encapsulating means is comprised of a molded plastic material.
42. The electronic watch according to Claim 40 wherein said encapsulating means includes a plurality of extension members for connection of a band to said watch.
43. An electronic watch comprising:
(a) an integrated circuit chip having timekeeping circuitry for generating timekeeping signals and for driving a display means with decoded electrical signals corresponding to said timekeeping signals;
(b) a variable capacitor device for adjusting the timekeeping signals generated by said timekeeping circuitry;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip;
(d) means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said capacitor device being supported within said cavity exposed at an opening of said cavity for adjustment of said capacitor device and an opening opposite said cavity exposing a portion of said plurality of lead conductors to facilitate the connection of said capacitor device to said lead conductors;
and (e) means for sealing said opening with said capacitor device in place.
(a) an integrated circuit chip having timekeeping circuitry for generating timekeeping signals and for driving a display means with decoded electrical signals corresponding to said timekeeping signals;
(b) a variable capacitor device for adjusting the timekeeping signals generated by said timekeeping circuitry;
(c) a metal lead frame having a plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip;
(d) means completely encapsulating said integrated circuit chip, said encapsulating means having a cavity selectively positioned with respect to said plurality of lead conductors with said capacitor device being supported within said cavity exposed at an opening of said cavity for adjustment of said capacitor device and an opening opposite said cavity exposing a portion of said plurality of lead conductors to facilitate the connection of said capacitor device to said lead conductors;
and (e) means for sealing said opening with said capacitor device in place.
44. The electronic watch according to Claim 43 wherein said encapsulating means is comprised of a molded plastic material.
45. The electronic watch according to Claim 43 wherein said encapsulating means includes a plurality of extension members for connection of a band to said watch.
46. An electronic watch comprising:
(a) display means responsive to electrical signals for displaying time;
(b) an integrated circuit chip having circuitry for driving said display means with decoded electrical timekeeping signals;
(c) an oscillator crystal;
(d) a capacitor device;
(e) a metal lead frame extending essentially in a single plane, said lead frame including:
(i) a first plurality of lead conductors ohmically coupling said display means to said integrated circuit chip, (ii) a second plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip, (iii) a third plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip, and (iv) a fourth plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip;
46. An electronic watch comprising:
(a) display means responsive to electrical signals for displaying time;
(b) an integrated circuit chip having circuitry for driving said display means with decoded electrical timekeeping signals;
(c) an oscillator crystal;
(d) a capacitor device;
(e) a metal lead frame extending essentially in a single plane, said lead frame including:
(i) a first plurality of lead conductors ohmically coupling said display means to said integrated circuit chip, (ii) a second plurality of lead conductors ohmically coupling said oscillator crystal to said integrated circuit chip, (iii) a third plurality of lead conductors ohmically coupling said capacitor device to said integrated circuit chip, and (iv) a fourth plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip;
46. (continued) (f) encapsulating means completely encapsulating said integrated circuit chip, said encapsulating means having:
(i) a first cavity selectively positioned with respect to said first plurality of lead conductors with said display means being supported within said first cavity, (ii) a second cavity selectively positioned with respect to said second plurality of lead conductors with said oscillator crystal means being supported within said second cavity, (iii) a third cavity selectively positioned with respect to said third plurality of lead conductors with said capacitor device being supported within said third cavity, (iv) at least one additional cavity selectively positioned with respect to said fourth plurality of lead conductors for supporting at least one battery within said at least one additional cavity, and (v) first and second openings opposite each of said second and third cavities, said openings respectively exposing a portion of said second and third pluralities of lead conductors to facilitate the ohmic connection of said oscillator crystal and capacitor device to said lead conductors; and (g) a plurality of plug members for sealing said openings with said oscillator crystal and capacitor device in place.
(i) a first cavity selectively positioned with respect to said first plurality of lead conductors with said display means being supported within said first cavity, (ii) a second cavity selectively positioned with respect to said second plurality of lead conductors with said oscillator crystal means being supported within said second cavity, (iii) a third cavity selectively positioned with respect to said third plurality of lead conductors with said capacitor device being supported within said third cavity, (iv) at least one additional cavity selectively positioned with respect to said fourth plurality of lead conductors for supporting at least one battery within said at least one additional cavity, and (v) first and second openings opposite each of said second and third cavities, said openings respectively exposing a portion of said second and third pluralities of lead conductors to facilitate the ohmic connection of said oscillator crystal and capacitor device to said lead conductors; and (g) a plurality of plug members for sealing said openings with said oscillator crystal and capacitor device in place.
47. The electronic watch according to Claim 46 wherein a third opening is provided in said encapsulating material opposite said first cavity, said third opening exposing a portion of said first plurality of lead conductors to facilitate the ohmic connection of said display means to said lead conductors.
48. The electronic watch according to Claim 46 wherein said encapsulating means is comprised of a molded plastic material.
49. The electronic watch according to Claim 46 wherein said encapsulating means includes a plurality of extension members for connection of a band to said watch.
50. The electronic watch according to Claim 46 including a removable back member for retaining said at least one battery in said at least one additional cavity.
51. The electronic watch according to Claim 50 wherein a third opening is provided in said encapsulating material opposite said first cavity, said third opening exposing a portion of said first plurality of lead conductors to facilitate the ohmic connection of said display means to said lead conductors and wherein said at least one battery opening is at least partially coincident with said third opening and wherein said removable back member seals both said at least one battery opening and said third opening.
52. The electronic watch according to Claim 46 wherein said display means includes a plurality of light emitting diode elements selectively positioned on a substrate member for generating a visual representation of a plurality of digits representative of time.
53. The electronic watch according to Claim 52 wherein said substrate is comprised of a ceramic material with the diode elements mounted on one major surface thereof and including a plurality of conductor members on an opposite major surface thereof, said conductor members being positioned to mate with said plurality of lead conductors.
54. The electronic watch according to Claim 46 wherein at least one of said fourth plurality of lead conductors is bent around extending into said at least one additional cavity for ohmically contacting a pole of a battery supported within said cavity.
55. The electronic watch according to Claim 46 wherein said first cavity includes a ridge, the periphery of which is larger than the periphery of said first cavity and wherein a lens member is provided, said lens member being supported in spaced relation from said display means within said ridge.
56. The electronic watch according to Claim 51 wherein said display means Includes a plurality of light emitting diode elements selectively positioned on a substrate member for generating a visual representation of a plurality of digits representative of time and wherein said lens member is of such color as to substantially only transmit light of the wavelength enmitted by said light emitting diodes.
57. An electronic watch comprising:
(a) a metal lead frame having upper and lower opposite major surfaces;
(b) an integrated circuit chip mounted on the upper surface of said lead frame and selectively ohmically coupled to lead conductors of said lead frame, said integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals, said lead frame including:
(i) a first plurality of lead conductors for ohmically coupling a display means to said integrated circuit chip, (ii) a second plurality of lead conductors for ohmically coupling an oscillator crystal to said integrated circuit chip, and (iii) a third plurality of lead conductors for ohmically coupling a capacitor device to said integrated circuit chip;
(c) molded plastic encapsulating means encapsulating said integrated circuit means and said lead frame, said encapsulating means having:
(i) a ridged first cavity selectively positioned with respect to said first plurality of lead conductors with a portion of said first plurality of lead conductors being exposed within said first cavity, said first cavity for mechanically supporting said display means in a position such that said display means is in ohmic contact with said portion of said first plurality of lead conductors and said ridge for supporting a lens member is spaced relation from
57. An electronic watch comprising:
(a) a metal lead frame having upper and lower opposite major surfaces;
(b) an integrated circuit chip mounted on the upper surface of said lead frame and selectively ohmically coupled to lead conductors of said lead frame, said integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals, said lead frame including:
(i) a first plurality of lead conductors for ohmically coupling a display means to said integrated circuit chip, (ii) a second plurality of lead conductors for ohmically coupling an oscillator crystal to said integrated circuit chip, and (iii) a third plurality of lead conductors for ohmically coupling a capacitor device to said integrated circuit chip;
(c) molded plastic encapsulating means encapsulating said integrated circuit means and said lead frame, said encapsulating means having:
(i) a ridged first cavity selectively positioned with respect to said first plurality of lead conductors with a portion of said first plurality of lead conductors being exposed within said first cavity, said first cavity for mechanically supporting said display means in a position such that said display means is in ohmic contact with said portion of said first plurality of lead conductors and said ridge for supporting a lens member is spaced relation from
57. (Continued) said display means;
(ii) a second cavity selectively positioned with respect to said second plurality of lead conductors with a portion of said second plurality of lead conductors being exposed within said second cavity, said second cavity for mechanically supporting said oscillator crystal in a position such that said oscillator crystal is in ohmic contact with said portion of said second plurality of lead conductors, and (iii) a third cavity selectively positioned with respect to said third plurality of lead conductors with a portion of said third plurality of lead conductors being exposed within said third cavity, said third cavity for mechanically supporting said capacitor device in a position such that said capacitor device is in ohmic contact with said third plurality of lead conductors, (iv) first, second and third openings opposite each of said first, second and third cavities respectively, said openings respectively exposing the opposite surfaces of the portions of said first, second and third pluralities of lead conductors to facilitate the ohmic connection of said display means, oscillator crystal and capacitor device to said lead conductors and (v) a plurality of protruding end members for connection of a band to said watch.
(ii) a second cavity selectively positioned with respect to said second plurality of lead conductors with a portion of said second plurality of lead conductors being exposed within said second cavity, said second cavity for mechanically supporting said oscillator crystal in a position such that said oscillator crystal is in ohmic contact with said portion of said second plurality of lead conductors, and (iii) a third cavity selectively positioned with respect to said third plurality of lead conductors with a portion of said third plurality of lead conductors being exposed within said third cavity, said third cavity for mechanically supporting said capacitor device in a position such that said capacitor device is in ohmic contact with said third plurality of lead conductors, (iv) first, second and third openings opposite each of said first, second and third cavities respectively, said openings respectively exposing the opposite surfaces of the portions of said first, second and third pluralities of lead conductors to facilitate the ohmic connection of said display means, oscillator crystal and capacitor device to said lead conductors and (v) a plurality of protruding end members for connection of a band to said watch.
58. The electronic watch according to Claim 57 including a fourth plurality of lead conductors for ohmically coupling battery means to said integrated circuit chip, said encapsulating means having at least one additional cavity selectively positioned with respect to said fourth plurality of lead conductors for mechanically supporting at least one battery within said at least one additional cavity with a pole of such battery in contact with at least one of said fourth plurality of lead conductors or an extension thereof.
59. The electronic watch according to Claim 58 including a removable back member for retaining said at least one battery in said at least one additional cavity.
60. The electronic watch according to Claim 57 wherein said encapsulating means has upper and lower opposite major surfaces corresponding to the upper and lower opposite major surfaces of said metal lead frame and wherein said ridged first cavity is formed in said encapsulating means extending from the upper major surface of said encapsulating means to the upper major surface of said lead frame with the ridged portion closest to the upper major surface of said encapsulating means and wherein said second and third cavities are formed in said encapsulating means extending from the lower major surface of said encapsulating means to the lower major surface of the metal lead frame.
61. The electronic watch according to Claim 57 including means for sealing said second and third openings with oscillator crystal and capacitor device connected in place.
62. The electronic watch according to Claim 61 wherein said means for sealing said second and third openings are comprised of design coordinated plastic plug members in a shape which mates with the shape of said openings.
63. The electronic watch according to Claim 57 including a lens member which fits in the ridge of said first cavity for filtering and protecting a display.
64. The electronic watch according to Claim 63 wherein said display means includes a plurality of light emitting diode elements selectively positioned on a substrate member for generating a visual representation of a pluralityt of digits representative of time and wherein said lens member is of such color as to substantially only transmit light of the wavelength emitted by said light emitting diodes.
65. A method of fabricating an electronic watch comprising:
(a) mounting a semiconductor integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals on a mounting pad of a metal lead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display means to said integrated circuit chip, a second plurality of lead conductors for ohmically coupling an oscillator crystal to said integrated circuit chip, a third plurality of lead conductors for ohmically coupling a capacitor device to said integrated circuit chip, and a fourth plurality of lead conductors for ohmically coupling one or more batteries to said integrated circuit chip;
65.(Continued) (b) bonding wire connectors between terminal pads on said integrated circuit chip and selected ones of said lead frame conductors;
(c) placing the lead frame between upper and lower molds having mold cavities;
(d) injecting a plastic material into the cavities of said upper and lower molds to encapsulate said integrated circuit chip and lead frame, the upper mold being formed to provide in the injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities, a third opening exposing a portion of the opposite surface of said first plurality of lead conductors and a plurality of protrusions for the connection of a band to the watch, (e) removing the encapsulated lead frame from said mold;
(f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening;
(g) inserting an oscillator crystal in said second cavity and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first 65.(Continued) opening;
(h) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third plurality of lead conductors through said second opening, and (i) sealing said second and third openings.
(a) mounting a semiconductor integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals on a mounting pad of a metal lead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display means to said integrated circuit chip, a second plurality of lead conductors for ohmically coupling an oscillator crystal to said integrated circuit chip, a third plurality of lead conductors for ohmically coupling a capacitor device to said integrated circuit chip, and a fourth plurality of lead conductors for ohmically coupling one or more batteries to said integrated circuit chip;
65.(Continued) (b) bonding wire connectors between terminal pads on said integrated circuit chip and selected ones of said lead frame conductors;
(c) placing the lead frame between upper and lower molds having mold cavities;
(d) injecting a plastic material into the cavities of said upper and lower molds to encapsulate said integrated circuit chip and lead frame, the upper mold being formed to provide in the injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities, a third opening exposing a portion of the opposite surface of said first plurality of lead conductors and a plurality of protrusions for the connection of a band to the watch, (e) removing the encapsulated lead frame from said mold;
(f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening;
(g) inserting an oscillator crystal in said second cavity and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first 65.(Continued) opening;
(h) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third plurality of lead conductors through said second opening, and (i) sealing said second and third openings.
66. The method according to Claim 65 wherein said plastic material is an epoxy material.
67. The method according to Claim 65 wherein said second and third openings are sealed with an epoxy filler material.
68. The method according to Claim 65 wherein said second and third openings are sealed with plastic plugs adherently bonded to said encapsulating material in said second and third openings.
69. The method according to Claim 65 wherein said first cavity is formed to include a ridge and wherein a lens member is adherently bonded to said encapsulating material in said ridge in spaced relation from said display means.
70. The method according to Claim 65 wherein a removable back member is formed which attaches to said encapsulated plastic for retaining said at least on battery on said at least one additional battery opening.
71. The method according to Claim 65 including the step of bending at least one conductor of said fourth plurality of lead conductors into an opening in said one or more battery cavities to provide a contact means for coupling one pole of a battery to said integrated circuit chip.
72. A method of fabricating an electronic watch comprising:
(a) selectively positioning a semiconductor integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals upside down on a metallead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display means to selected terminal pads of said integrated circuit chip, a second plurality of lead conductors for ohmically coupling an oscillatory crystal to selected terminal pads of said integrated circuit chip, a third plurality of lead conductors for ohmically coupling a capacitor device to selected terminal pads of said integrated circuit chip, and a fourth plurality of lead conductors for ohmically coupling one or more batteries to selected terminal pads of said integrated circuit chip;
(b) thermocompression bonding the terminal pads on said integrated circuit chip to contacted portions of said lead frame conductors;
(c) placing the lead frame between upper and lower molds having mold cavities;
(d) injecting a plastic material into the cavities of said upper and lower molds to encapsulate said integrated circuit chip and lead frame, the upper mold being formed to provide in the
72. A method of fabricating an electronic watch comprising:
(a) selectively positioning a semiconductor integrated circuit chip having circuitry for driving a display means with decoded electrical timekeeping signals upside down on a metallead frame, said lead frame including a first plurality of lead conductors for ohmically coupling a display means to selected terminal pads of said integrated circuit chip, a second plurality of lead conductors for ohmically coupling an oscillatory crystal to selected terminal pads of said integrated circuit chip, a third plurality of lead conductors for ohmically coupling a capacitor device to selected terminal pads of said integrated circuit chip, and a fourth plurality of lead conductors for ohmically coupling one or more batteries to selected terminal pads of said integrated circuit chip;
(b) thermocompression bonding the terminal pads on said integrated circuit chip to contacted portions of said lead frame conductors;
(c) placing the lead frame between upper and lower molds having mold cavities;
(d) injecting a plastic material into the cavities of said upper and lower molds to encapsulate said integrated circuit chip and lead frame, the upper mold being formed to provide in the
72. (Continued) injected plastic a first cavity extending to one surface of said first plurality of lead conductors for the mechanical support of said display and first and second openings respectively exposing a portion of one surface of said second and third pluralities of lead conductors and the lower mold being formed to provide in the injected plastic second and third cavities for the mechanical support of said crystal and said capacitor extending to the opposite surface of said second and third pluralities of lead conductors respectively, one or more battery cavities, a third opening exposing a portion of the opposite surface of said first plurality of lead conductors and a plurality of protrusions for the connection of a band to the watch, (e) removing the encapsulated lead frame from said mold;
(f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening;
(g) inserting an oscillator crystal in said second cavity and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first opening;
(h) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third plurality of lead conductors through said second opening, and (i) sealing said second and third openings.
(f) inserting a display means in the display cavity and ohmically bonding said display means to said lead frame through said third opening;
(g) inserting an oscillator crystal in said second cavity and ohmically connecting said oscillator crystal to said second plurality of lead conductors through said first opening;
(h) inserting said capacitor device in said third opening and electrically connecting said capacitor device to said third plurality of lead conductors through said second opening, and (i) sealing said second and third openings.
73. The method according to Claim 72 wherein said plastic material is an epoxy material.
74. The method according to Claim 72 wherein said second and third openings are sealed with an epoxy filler material.
75. The method according to Claim 72 wherein said second and third openings are sealed with plastic plugs adherently bonded to said encapsulating material in said second and third openings.
76. The method according to Claim 72 wherein said first cavity is formed to include a ridge and wherein a lens member is adherently bonded to said encapsulating material in said ridge in spaced relation from said dlsplay means.
77. The method according to Claim 72 wherein a removable back member is formed which attaches to said encapsulated plastic for retaining said at least on battery on said at least one additional battery opening.
78. The method according to Claim 72 including the step of bending at least one conductor of said fourth plurality of lead conductors into an opening in said one or more battery cavities to provide a contact means for coupling one pole of a battery to said integrated circuit chip.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CA317,855A CA1067195A (en) | 1975-05-29 | 1978-12-13 | Modular circuit packaging arrangement and method |
| CA317,854A CA1067194A (en) | 1975-05-29 | 1978-12-13 | Circuit device package assembly |
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US58162075A | 1975-05-29 | 1975-05-29 | |
| US05/581,605 US4012723A (en) | 1975-05-29 | 1975-05-29 | Magnetic bubble memory packaging arrangement and its method of fabrication |
| US05/581,604 US3986334A (en) | 1975-05-29 | 1975-05-29 | Electronic watch and its method of fabrication |
| US05/581,603 US3986335A (en) | 1975-05-29 | 1975-05-29 | Electronic watch module and its method of fabrication |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CA1058312A true CA1058312A (en) | 1979-07-10 |
Family
ID=27504954
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CA251,202A Expired CA1058312A (en) | 1975-05-29 | 1976-04-27 | Circuit device packaging technique |
Country Status (7)
| Country | Link |
|---|---|
| JP (1) | JPS51145370A (en) |
| BR (1) | BR7603423A (en) |
| CA (1) | CA1058312A (en) |
| DE (1) | DE2623715A1 (en) |
| FR (1) | FR2356339A1 (en) |
| GB (1) | GB1555364A (en) |
| IT (1) | IT1062029B (en) |
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5227555A (en) * | 1975-08-27 | 1977-03-01 | Seiko Instr & Electronics | Electronic timekeeper |
| US4064552A (en) * | 1976-02-03 | 1977-12-20 | Angelucci Thomas L | Multilayer flexible printed circuit tape |
| GB2072891B (en) * | 1977-06-20 | 1982-08-25 | Hitachi Ltd | Electronic device and method of fabricating the same |
| JPS5424673A (en) * | 1977-07-27 | 1979-02-24 | Seiko Epson Corp | Electronic wristwatch |
| CH623452B (en) * | 1977-12-14 | Fontainemelon Horlogerie | METHOD OF MANUFACTURING AN ELECTRONIC CLOCK PART MODULE AND CLOCK PART MODULE OBTAINED BY IMPLEMENTATION OF THIS PROCESS. | |
| JPS56122972U (en) * | 1980-02-19 | 1981-09-18 | ||
| EP0105841A1 (en) * | 1982-10-05 | 1984-04-18 | Ebauches Electroniques S.A. | Strip used for manufacturing supports of components for watches |
| US5124782A (en) * | 1990-01-26 | 1992-06-23 | Sgs-Thomson Microelectronics, Inc. | Integrated circuit package with molded cell |
| GB9615164D0 (en) * | 1996-07-19 | 1996-09-04 | Delta Schoeller Ltd | Electrical circuit |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3611061A (en) * | 1971-07-07 | 1971-10-05 | Motorola Inc | Multiple lead integrated circuit device and frame member for the fabrication thereof |
| US3784725A (en) * | 1972-07-24 | 1974-01-08 | Solitron Devices | Electronic hybrid package |
-
1976
- 1976-04-27 CA CA251,202A patent/CA1058312A/en not_active Expired
- 1976-05-17 GB GB20209/76A patent/GB1555364A/en not_active Expired
- 1976-05-26 IT IT49680/76A patent/IT1062029B/en active
- 1976-05-26 DE DE19762623715 patent/DE2623715A1/en not_active Ceased
- 1976-05-28 BR BR3423/76A patent/BR7603423A/en unknown
- 1976-05-28 JP JP51062158A patent/JPS51145370A/en active Pending
- 1976-05-31 FR FR7616344A patent/FR2356339A1/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| FR2356339B1 (en) | 1983-03-04 |
| DE2623715A1 (en) | 1977-01-20 |
| BR7603423A (en) | 1976-12-21 |
| JPS51145370A (en) | 1976-12-14 |
| IT1062029B (en) | 1983-06-25 |
| GB1555364A (en) | 1979-11-07 |
| FR2356339A1 (en) | 1978-01-20 |
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