FR1605382A - Metallisation of insulating substrates esp for printed - Google Patents
Metallisation of insulating substrates esp for printedInfo
- Publication number
- FR1605382A FR1605382A FR112285A FR112285A FR1605382A FR 1605382 A FR1605382 A FR 1605382A FR 112285 A FR112285 A FR 112285A FR 112285 A FR112285 A FR 112285A FR 1605382 A FR1605382 A FR 1605382A
- Authority
- FR
- France
- Prior art keywords
- resin
- catalytic
- printed
- metallisation
- esp
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1605—Process or apparatus coating on selected surface areas by masking
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/427—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in metal-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0209—Inorganic, non-metallic particles
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0203—Fillers and particles
- H05K2201/0206—Materials
- H05K2201/0236—Plating catalyst as filler in insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
- H05K3/426—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates without metal
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Manufacturing Of Printed Wiring (AREA)
- Chemically Coating (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Laminated Bodies (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Formed substrate for use in the prodn. of metallised articles consists of an insulating base which is internally catalytic for the electroless deposition of metal, while the whole outer surface or a part of it, is non-catalytic. The formed substrate is particularly useful in the manufacture of printed circuits. The substrates have a very good bond between the metal film and the resin layers. The insulating base may consist of paper, wood, glass fibres, polyester fibres, etc. impregnated with a resin in which the catalytic substance, pref. a Group VIII metal compd. is dispersed. The resin may be an epoxy, phenolic, polyvinyl acetal, or similar resin.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US56112366A | 1966-06-28 | 1966-06-28 |
Publications (1)
Publication Number | Publication Date |
---|---|
FR1605382A true FR1605382A (en) | 1975-02-28 |
Family
ID=24240722
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
FR112285A Expired FR1605382A (en) | 1966-06-28 | 1967-06-28 | Metallisation of insulating substrates esp for printed |
Country Status (8)
Country | Link |
---|---|
JP (3) | JPS5031940B1 (en) |
AT (2) | AT314010B (en) |
CH (1) | CH504830A (en) |
DE (1) | DE1665374B1 (en) |
ES (1) | ES342451A1 (en) |
FR (1) | FR1605382A (en) |
GB (1) | GB1186558A (en) |
NL (1) | NL162816C (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2001647A1 (en) * | 1968-02-07 | 1969-09-26 | Photocircuits Corp |
Families Citing this family (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5026022B1 (en) * | 1970-11-16 | 1975-08-28 | ||
JPS5914882U (en) * | 1982-07-19 | 1984-01-28 | 川上 規久雄 | drainage device |
JPS60190403U (en) * | 1984-05-30 | 1985-12-17 | 川崎製鉄株式会社 | Roll cooling device |
US4767665A (en) * | 1985-09-16 | 1988-08-30 | Seeger Richard E | Article formed by electroless plating |
GB2188194A (en) * | 1986-03-21 | 1987-09-23 | Plessey Co Plc | Carrier for high frequency integrated circuits |
CA1318416C (en) * | 1987-01-14 | 1993-05-25 | Kollmorgen Corporation | Bonding compositions for the manufacture of additive printed wiring boards and articles made with the bonding composition |
JPH0748583B2 (en) * | 1989-04-03 | 1995-05-24 | 喜平 大津 | Method for manufacturing electrical inspection jig board for high-density printed wiring board |
EP1843649A3 (en) | 1998-09-03 | 2007-10-31 | Ibiden Co., Ltd. | Multilayered printed circuit board and manufacturing method therefor |
US10765012B2 (en) * | 2017-07-10 | 2020-09-01 | Catlam, Llc | Process for printed circuit boards using backing foil |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
GB938365A (en) * | 1959-01-08 | 1963-10-02 | Photocircuits Corp | Method of making printed circuits |
US3143484A (en) * | 1959-12-29 | 1964-08-04 | Gen Electric | Method of making plated circuit boards |
US3171756A (en) * | 1961-05-04 | 1965-03-02 | Ibm | Method of making a printed circuit and base therefor |
-
1967
- 1967-06-27 AT AT598867A patent/AT314010B/en not_active IP Right Cessation
- 1967-06-27 DE DE19671665374 patent/DE1665374B1/en active Pending
- 1967-06-27 CH CH908067A patent/CH504830A/en not_active IP Right Cessation
- 1967-06-27 AT AT629371A patent/AT310843B/en not_active IP Right Cessation
- 1967-06-28 FR FR112285A patent/FR1605382A/en not_active Expired
- 1967-06-28 GB GB2982467A patent/GB1186558A/en not_active Expired
- 1967-06-28 ES ES342451A patent/ES342451A1/en not_active Expired
- 1967-06-28 NL NL6709035A patent/NL162816C/en not_active IP Right Cessation
-
1970
- 1970-09-16 JP JP8117570A patent/JPS5031940B1/ja active Pending
- 1970-09-16 JP JP8117470A patent/JPS5110329B1/ja active Pending
-
1979
- 1979-08-17 JP JP10545779A patent/JPS5746679B1/ja active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2001647A1 (en) * | 1968-02-07 | 1969-09-26 | Photocircuits Corp |
Also Published As
Publication number | Publication date |
---|---|
AT310843B (en) | 1973-10-25 |
NL162816B (en) | 1980-01-15 |
CH504830A (en) | 1971-03-15 |
NL6709035A (en) | 1967-12-29 |
NL162816C (en) | 1980-06-16 |
JPS5031940B1 (en) | 1975-10-16 |
GB1186558A (en) | 1970-04-02 |
JPS5110329B1 (en) | 1976-04-03 |
ES342451A1 (en) | 1968-07-16 |
AT314010B (en) | 1974-03-11 |
DE1665374B1 (en) | 1971-09-09 |
JPS5746679B1 (en) | 1982-10-05 |
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